JP2011509525A - 電子部品及び電子部品を製造する方法 - Google Patents
電子部品及び電子部品を製造する方法 Download PDFInfo
- Publication number
- JP2011509525A JP2011509525A JP2010541736A JP2010541736A JP2011509525A JP 2011509525 A JP2011509525 A JP 2011509525A JP 2010541736 A JP2010541736 A JP 2010541736A JP 2010541736 A JP2010541736 A JP 2010541736A JP 2011509525 A JP2011509525 A JP 2011509525A
- Authority
- JP
- Japan
- Prior art keywords
- plastic
- frame
- electronic component
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10272—Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
Abstract
Description
Claims (10)
- 電子部品(15)であって、導電性のコンタクト(2)とプリント基板(7)とが設けられていて、該プリント基板(7)が、第1のプラスチックから成る周壁(16)によって被覆されている形式のものにおいて、導電性のコンタクト(2)が、第2のプラスチックから成るフレーム(4)によって取り囲まれていることを特徴とする電子部品。
- 第2のプラスチックから成るフレーム(4)が、プリント基板(7)を取り囲んでいる、請求項1記載の電子部品。
- フレーム部分(11)のフレーム面(12)が、プリント基板(7)の周面(14)に向けられている、請求項2記載の電子部品。
- フレーム(4)がプリント基板(7)に対して間隔をおいて位置している、請求項2記載の電子部品。
- フレーム(4)とプリント基板(7)との間の間隔が、導電性のコンタクト(2)を用いて規定可能である、請求項4記載の電子部品。
- 第2のプラスチックが熱可塑性樹脂である、請求項1記載の電子部品。
- 第1のプラスチックから成る周壁(16)と、第2のプラスチックから成るフレーム(4)とが同一平面を成している、請求項1記載の電子部品。
- 導電性のコンタクトの間における結合部材(3)が、フレーム(4)の内側及び外側に配置されている、請求項1記載の電子部品。
- フレーム(4)が突出部(5,6)を有している、請求項1記載の電子部品。
- 導電性のコンタクト(2)とプリント基板(7)とを備えていて、該プリント基板(7)が、第1のプラスチックから成る周壁(16)によって被覆されている形式の電子部品(15)を製造する方法であって、以下に記載の方法ステップ、すなわち、
導電性のコンタクト(2)と結合部材(3)とを備えたグリッド(1)を製造し、
該グリッド(1)を、第2のプラスチックから成るフレーム(4)内において固定し、
グリッド(1)の結合部材(3)を除去し、
プリント基板(7)を、フレーム(4)内に挿入し、グリッド(1)の導電性のコンタクト(2)に載置し、
プリント基板(7)を第1のプラスチックによって被覆する
という方法ステップを特徴とする、電子部品を製造する方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008003790A DE102008003790A1 (de) | 2008-01-10 | 2008-01-10 | Elektronisches Bauteil und Verfahren zur Herstellung des elektronischen Bauteils |
PCT/EP2008/067820 WO2009087035A1 (de) | 2008-01-10 | 2008-12-18 | Elektronisches bauteil und verfahren zur herstellung des elektronischen bauteiles |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011509525A true JP2011509525A (ja) | 2011-03-24 |
Family
ID=40473638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010541736A Pending JP2011509525A (ja) | 2008-01-10 | 2008-12-18 | 電子部品及び電子部品を製造する方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20110292619A1 (ja) |
EP (1) | EP2243342B1 (ja) |
JP (1) | JP2011509525A (ja) |
DE (1) | DE102008003790A1 (ja) |
WO (1) | WO2009087035A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013208543A1 (de) | 2013-05-08 | 2014-11-13 | Robert Bosch Gmbh | Verfahren zum Herstellen einer elektronischen Baueinheit |
DE102019216723A1 (de) * | 2019-10-30 | 2021-05-06 | Robert Bosch Gmbh | Mold-Modul |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09289360A (ja) * | 1996-04-19 | 1997-11-04 | Matsushita Electric Ind Co Ltd | 配線板とその製造方法 |
JP2000340718A (ja) * | 1999-05-31 | 2000-12-08 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2002203940A (ja) * | 2001-01-04 | 2002-07-19 | Mitsubishi Electric Corp | 半導体パワーモジュール |
JP2004228126A (ja) * | 2003-01-20 | 2004-08-12 | Denso Corp | 電子回路用ハウジング |
JP2004266015A (ja) * | 2003-02-28 | 2004-09-24 | Shindengen Electric Mfg Co Ltd | 電装ユニット |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3501582A (en) | 1968-04-18 | 1970-03-17 | Burroughs Corp | Electrical assembly |
JP3353526B2 (ja) | 1995-03-23 | 2002-12-03 | 株式会社デンソー | 半導体パッケージ及びその製造方法 |
JPH1070376A (ja) | 1996-08-27 | 1998-03-10 | Fujitsu Ten Ltd | 防水パッキン構造 |
US7249978B1 (en) * | 2005-10-24 | 2007-07-31 | Super Talent Electronics, Inc. | Reduced-length, low-profile USB device and card-like carrier |
US7394661B2 (en) * | 2004-06-30 | 2008-07-01 | Super Talent Electronics, Inc. | System and method for providing a flash memory assembly |
US6807731B2 (en) * | 2002-04-02 | 2004-10-26 | Delphi Technologies, Inc. | Method for forming an electronic assembly |
JP2005191147A (ja) | 2003-12-24 | 2005-07-14 | Sanyo Electric Co Ltd | 混成集積回路装置の製造方法 |
JP4270095B2 (ja) * | 2004-01-14 | 2009-05-27 | 株式会社デンソー | 電子装置 |
JP4413054B2 (ja) | 2004-03-29 | 2010-02-10 | 三洋電機株式会社 | 混成集積回路装置の製造方法 |
JP4548199B2 (ja) | 2005-04-22 | 2010-09-22 | 株式会社デンソー | 電子回路装置の製造方法 |
-
2008
- 2008-01-10 DE DE102008003790A patent/DE102008003790A1/de not_active Withdrawn
- 2008-12-18 WO PCT/EP2008/067820 patent/WO2009087035A1/de active Application Filing
- 2008-12-18 JP JP2010541736A patent/JP2011509525A/ja active Pending
- 2008-12-18 EP EP08869592.9A patent/EP2243342B1/de active Active
- 2008-12-18 US US12/812,276 patent/US20110292619A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09289360A (ja) * | 1996-04-19 | 1997-11-04 | Matsushita Electric Ind Co Ltd | 配線板とその製造方法 |
JP2000340718A (ja) * | 1999-05-31 | 2000-12-08 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2002203940A (ja) * | 2001-01-04 | 2002-07-19 | Mitsubishi Electric Corp | 半導体パワーモジュール |
JP2004228126A (ja) * | 2003-01-20 | 2004-08-12 | Denso Corp | 電子回路用ハウジング |
JP2004266015A (ja) * | 2003-02-28 | 2004-09-24 | Shindengen Electric Mfg Co Ltd | 電装ユニット |
Also Published As
Publication number | Publication date |
---|---|
WO2009087035A1 (de) | 2009-07-16 |
EP2243342A1 (de) | 2010-10-27 |
EP2243342B1 (de) | 2019-03-20 |
DE102008003790A1 (de) | 2009-07-16 |
US20110292619A1 (en) | 2011-12-01 |
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