JP2011502341A - 光モジュールパッケージ - Google Patents

光モジュールパッケージ Download PDF

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Publication number
JP2011502341A
JP2011502341A JP2009530976A JP2009530976A JP2011502341A JP 2011502341 A JP2011502341 A JP 2011502341A JP 2009530976 A JP2009530976 A JP 2009530976A JP 2009530976 A JP2009530976 A JP 2009530976A JP 2011502341 A JP2011502341 A JP 2011502341A
Authority
JP
Japan
Prior art keywords
light
module package
optical module
ceramic layer
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009530976A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011502341A5 (enrdf_load_stackoverflow
Inventor
ベルント アケルマン
ハンス ヘルムート ベヒテル
アーヒム ヒルゲルス
マティアス ヴェント
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2011502341A publication Critical patent/JP2011502341A/ja
Publication of JP2011502341A5 publication Critical patent/JP2011502341A5/ja
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F55/00Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
    • H10F55/20Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
    • H10F55/25Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
    • H10F55/255Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices formed in, or on, a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/40Optical elements or arrangements
    • H10F77/496Luminescent members, e.g. fluorescent sheets
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/35Non-linear optics
    • G02F1/355Non-linear optics characterised by the materials used
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/851Wavelength conversion means
    • H10H20/8514Wavelength conversion means characterised by their shape, e.g. plate or foil

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
JP2009530976A 2006-10-05 2007-09-20 光モジュールパッケージ Pending JP2011502341A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06121788 2006-10-05
PCT/IB2007/053819 WO2008041150A2 (en) 2006-10-05 2007-09-20 A light module package

Publications (2)

Publication Number Publication Date
JP2011502341A true JP2011502341A (ja) 2011-01-20
JP2011502341A5 JP2011502341A5 (enrdf_load_stackoverflow) 2011-03-03

Family

ID=39148559

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009530976A Pending JP2011502341A (ja) 2006-10-05 2007-09-20 光モジュールパッケージ

Country Status (9)

Country Link
US (1) US7947947B2 (enrdf_load_stackoverflow)
EP (1) EP2074656A2 (enrdf_load_stackoverflow)
JP (1) JP2011502341A (enrdf_load_stackoverflow)
KR (1) KR20090082378A (enrdf_load_stackoverflow)
CN (1) CN101523599B (enrdf_load_stackoverflow)
BR (1) BRPI0718194A2 (enrdf_load_stackoverflow)
RU (1) RU2437182C2 (enrdf_load_stackoverflow)
TW (1) TW200824160A (enrdf_load_stackoverflow)
WO (1) WO2008041150A2 (enrdf_load_stackoverflow)

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WO2009133502A2 (en) * 2008-04-29 2009-11-05 Philips Intellectual Property & Standards Gmbh Photo-detector
US9326346B2 (en) 2009-01-13 2016-04-26 Terralux, Inc. Method and device for remote sensing and control of LED lights
US8358085B2 (en) 2009-01-13 2013-01-22 Terralux, Inc. Method and device for remote sensing and control of LED lights
WO2010141235A1 (en) * 2009-06-01 2010-12-09 Nitto Denko Corporation Light-emitting divice comprising a dome-shaped ceramic phosphor
CN103025337B (zh) * 2009-11-17 2014-10-15 特锐拉克斯有限公司 Led电源的检测和控制
US8286886B2 (en) * 2009-12-23 2012-10-16 Hynix Semiconductor Inc. LED package and RFID system including the same
US9596738B2 (en) 2010-09-16 2017-03-14 Terralux, Inc. Communication with lighting units over a power bus
CA2810026A1 (en) 2010-09-16 2012-03-22 Terralux, Inc. Communication with lighting units over a power bus
US9357592B2 (en) * 2010-11-18 2016-05-31 Phoseon Technology, Inc. Light source temperature monitor and control
US8515289B2 (en) * 2011-11-21 2013-08-20 Environmental Light Technologies Corp. Wavelength sensing lighting system and associated methods for national security application
WO2013090904A1 (en) 2011-12-16 2013-06-20 Terralux, Inc. System and methods of applying bleed circuits in led lamps
US9265119B2 (en) 2013-06-17 2016-02-16 Terralux, Inc. Systems and methods for providing thermal fold-back to LED lights
KR102246296B1 (ko) * 2014-12-19 2021-04-30 삼성디스플레이 주식회사 표시 장치
EP3131077B1 (de) * 2015-08-13 2017-10-18 Siemens Schweiz AG Optische rauchdetektionseinheit für einen rauchmelder mit zwei miteinander optisch gekoppelten leuchtdioden und mit einer damit verbundenen steuereinheit zur ableitung einer alterungsinformation sowie rauchmelder
US10368411B2 (en) * 2016-09-20 2019-07-30 Bolb Inc. Ultraviolet light module having output power control mechanism
KR101989027B1 (ko) * 2018-08-31 2019-06-14 주식회사 아이씨에이치 고유전성 점착 필름
US11412598B2 (en) * 2019-02-11 2022-08-09 Nanogrid Limited Systems and methods for adjusting light output
US11790831B2 (en) 2019-03-29 2023-10-17 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US12142716B2 (en) 2019-03-29 2024-11-12 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US11727857B2 (en) 2019-03-29 2023-08-15 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US11776460B2 (en) 2019-03-29 2023-10-03 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US12198605B2 (en) 2019-03-29 2025-01-14 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US11694601B2 (en) 2019-03-29 2023-07-04 Creeled, Inc. Active control of light emitting diodes and light emitting diode displays
US11695102B2 (en) 2020-06-19 2023-07-04 Creeled, Inc. Active electrical elements with light-emitting diodes
US12014673B2 (en) 2022-02-07 2024-06-18 Creeled, Inc. Light-emitting diodes with mixed clock domain signaling
EP4476714A1 (en) 2022-02-07 2024-12-18 Creeled, Inc. Light-emitting diodes with mixed clock domain signaling
US12014677B1 (en) 2023-04-10 2024-06-18 Creeled, Inc. Light-emitting diode packages with transformation and shifting of pulse width modulation signals and related methods
CN117594586B (zh) * 2023-11-28 2025-07-29 杭州道铭微电子有限公司 一种多芯片dTOF封装结构及封装方法

Citations (4)

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JP2000502819A (ja) * 1996-01-09 2000-03-07 シーメンス アクチエンゲゼルシヤフト オプトエレクトロニクス送信モジュール
JP2002344031A (ja) * 2001-03-14 2002-11-29 Matsushita Electric Ind Co Ltd 照明装置
JP2004537173A (ja) * 2001-07-26 2004-12-09 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ パッケージ内の量及びスペクトル感知能力とデジタル信号出力とを有するマルチチップledパッケージ
WO2006087660A1 (en) * 2005-02-17 2006-08-24 Philips Intellectual Property & Standards Gmbh Illumination system comprising a green-emitting ceramic luminescence converter

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Publication number Priority date Publication date Assignee Title
JP2000502819A (ja) * 1996-01-09 2000-03-07 シーメンス アクチエンゲゼルシヤフト オプトエレクトロニクス送信モジュール
JP2002344031A (ja) * 2001-03-14 2002-11-29 Matsushita Electric Ind Co Ltd 照明装置
JP2004537173A (ja) * 2001-07-26 2004-12-09 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ パッケージ内の量及びスペクトル感知能力とデジタル信号出力とを有するマルチチップledパッケージ
WO2006087660A1 (en) * 2005-02-17 2006-08-24 Philips Intellectual Property & Standards Gmbh Illumination system comprising a green-emitting ceramic luminescence converter

Also Published As

Publication number Publication date
US7947947B2 (en) 2011-05-24
EP2074656A2 (en) 2009-07-01
BRPI0718194A2 (pt) 2013-11-05
KR20090082378A (ko) 2009-07-30
RU2009116458A (ru) 2010-11-10
CN101523599A (zh) 2009-09-02
RU2437182C2 (ru) 2011-12-20
WO2008041150A2 (en) 2008-04-10
US20090278034A1 (en) 2009-11-12
CN101523599B (zh) 2011-04-06
WO2008041150A3 (en) 2008-07-03
TW200824160A (en) 2008-06-01

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