JP2011252773A5 - - Google Patents
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- JP2011252773A5 JP2011252773A5 JP2010126314A JP2010126314A JP2011252773A5 JP 2011252773 A5 JP2011252773 A5 JP 2011252773A5 JP 2010126314 A JP2010126314 A JP 2010126314A JP 2010126314 A JP2010126314 A JP 2010126314A JP 2011252773 A5 JP2011252773 A5 JP 2011252773A5
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- substrate
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- protrusion
- wiring
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Description
本半導体検査装置は、検査対象物である半導体装置を検査するための電気信号を入出力する半導体検査装置であって、第１基板と、弾性変形可能な接合部を介して前記第１基板と接合された第２基板と、を有し、前記第１基板は、前記第１基板を貫通して形成された貫通孔の一端を弾性変形可能な樹脂で封止し、前記第２基板側に開口する凹部と、前記凹部の内側面に形成された配線と、該配線と電気的に接続される配線パターンと、前記凹部内に収容され、前記配線と接触して導通している導電性ボールと、を備え、前記第２基板は、一方の面に、前記第１基板の前記凹部に対応する位置に形成され、一端が前記導電性ボールと接触して導通する導電性の第１突起部と、他方の面に、前記第２基板を貫通する貫通電極を介して、前記第１突起部と電気的に接続される導電性の第２突起部と、を備えていることを要件とする。 The semiconductor inspection apparatus is a semiconductor inspection apparatus that inputs and outputs an electrical signal for inspecting a semiconductor device that is an inspection object, and includes a first substrate and the first substrate via an elastically deformable joint. A second substrate bonded, and the first substrate is sealed with an elastically deformable resin at one end of a through hole formed so as to penetrate the first substrate, and on the second substrate side. An opening recess, a wiring formed on the inner surface of the recess, a wiring pattern electrically connected to the wiring, and a conductive ball housed in the recess and in contact with and in conduction with the wiring And the second substrate is formed on one surface at a position corresponding to the concave portion of the first substrate, and one end of the first substrate is in contact with the conductive ball and is conductive. If, on the other side, via a through electrode penetrating the second substrate, the first collision A second projection of the conductive which is electrically connected to the part, in that it comprises a requirement.
Claims (9)
第１基板と、弾性変形可能な接合部を介して前記第１基板と接合された第２基板と、を有し、
前記第１基板は、
前記第１基板を貫通して形成された貫通孔の一端を弾性変形可能な樹脂で封止し、前記第２基板側に開口する凹部と、
前記凹部の内側面に形成された配線と、
該配線と電気的に接続される配線パターンと、
前記凹部内に収容され、前記配線と接触して導通している導電性ボールと、を備え、
前記第２基板は、
一方の面に、前記第１基板の前記凹部に対応する位置に形成され、一端が前記導電性ボールと接触して導通する導電性の第１突起部と、
他方の面に、前記第２基板を貫通する貫通電極を介して、前記第１突起部と電気的に接続される導電性の第２突起部と、を備えていることを特徴とする半導体検査装置。 A semiconductor inspection apparatus that inputs and outputs electrical signals for inspecting a semiconductor device that is an inspection object,
A first substrate, and a second substrate joined to the first substrate via an elastically deformable joint,
The first substrate is
One end of a through-hole formed through the first substrate is sealed with an elastically deformable resin, and a recess opening to the second substrate side;
Wiring formed on the inner surface of the recess;
A wiring pattern electrically connected to the wiring;
A conductive ball housed in the recess and in electrical contact with the wiring,
The second substrate is
A conductive first protrusion formed on one surface at a position corresponding to the concave portion of the first substrate and having one end in contact with the conductive ball and conducting;
A semiconductor inspection , comprising: a conductive second protrusion that is electrically connected to the first protrusion via a through electrode penetrating the second substrate on the other surface. apparatus.
第１基板と、弾性変形可能な接合部を介して前記第１基板と接合された第２基板と、を有し、
前記第１基板は、
前記第１基板を貫通せずに前記第２基板側に開口し、内底面に弾性変形可能な樹脂が配置されている凹部と、
前記凹部の内側面に形成された配線と、該配線と電気的に接続される配線パターンと、
前記凹部内に収容され前記配線と接触して導通している導電性ボールと、を備え、
前記第２基板は、
一方の面に、前記第１基板の前記凹部に対応する位置に形成され、一端が前記導電性ボールと接触して導通する導電性の第１突起部と、
他方の面に、前記第２基板を貫通する貫通電極を介して、前記第１突起部と電気的に接続される導電性の第２突起部と、を備えていることを特徴とする半導体検査装置。 A semiconductor inspection apparatus that inputs and outputs electrical signals for inspecting a semiconductor device that is an inspection object,
A first substrate, and a second substrate joined to the first substrate via an elastically deformable joint,
The first substrate is
Open to the second substrate side without penetrating the first substrate, and the recess that are elastically deformable resin is disposed on the inner bottom surface,
Wiring formed on the inner surface of the recess, a wiring pattern electrically connected to the wiring,
A conductive ball housed in the recess and in contact with the wiring to conduct,
The second substrate is
A conductive first protrusion formed on one surface at a position corresponding to the concave portion of the first substrate and having one end in contact with the conductive ball and conducting;
A semiconductor inspection , comprising: a conductive second protrusion that is electrically connected to the first protrusion via a through electrode penetrating the second substrate on the other surface. apparatus.
第１基板を製造する第１工程と、第２基板を製造する第２工程と、弾性変形可能な接合部を介して前記第１基板と前記第２基板とを接合する第３工程と、を有し、
前記第１工程は、
前記第１基板の基板本体を貫通する貫通孔を形成する工程と、
前記貫通孔の一端を弾性変形可能な樹脂で封止し、前記第１基板の基板本体に凹部を形成する工程と、
前記凹部の内側面に配線を形成する工程と、を備え、
前記第２工程は、
前記第２基板の基板本体を貫通する貫通電極を形成する工程と、
前記第２基板の基板本体の一方の面の、前記第１基板の前記凹部に対応する位置に、前記貫通電極と電気的に接続された導電性の第１突起部を形成する工程と、
前記第２基板の前記基板本体の他方の面に、前記貫通電極を介して、前記第１突起部と電気的に接続された導電性の第２突起部を形成する工程と、を備え、
前記第３工程は、
前記凹部内に前記配線と接触して導通するように導電性ボールを収容する工程と、
前記第１突起部の一端が前記導電性ボールと接触して導通するように前記接合部を介して前記第１基板と前記第２基板とを接合する工程と、を備えることを特徴とする半導体検査装置の製造方法。 A method for manufacturing a semiconductor inspection apparatus that inputs and outputs electrical signals for inspecting a semiconductor device that is an inspection object,
A first step of manufacturing a first substrate, a second step of manufacturing a second substrate, and a third step of bonding the first substrate and the second substrate through an elastically deformable joint. Have
The first step includes
Forming a through hole penetrating the substrate body of the first substrate;
Sealing one end of the through hole with an elastically deformable resin, and forming a recess in the substrate body of the first substrate;
Forming a wiring on the inner surface of the recess,
The second step includes
Forming a through electrode penetrating the substrate body of the second substrate;
Forming a conductive first protrusion electrically connected to the through electrode at a position corresponding to the concave portion of the first substrate on one surface of the substrate body of the second substrate;
Forming a conductive second protrusion electrically connected to the first protrusion via the through electrode on the other surface of the substrate body of the second substrate ,
The third step includes
Containing a conductive ball so as to be conductive in contact with the wiring in the recess;
Bonding the first substrate and the second substrate through the bonding portion so that one end of the first protruding portion is in contact with the conductive ball and is conductive. Manufacturing method of inspection device.
第１基板を製造する第１工程と、第２基板を製造する第２工程と、弾性変形可能な接合部を介して前記第１基板と前記第２基板とを接合する第３工程と、を有し、
前記第１工程は、
前記第１基板の基板本体に凹部を形成する工程と、
前記凹部の内底面に弾性変形可能な樹脂を配置する工程と、
前記凹部の内側面に配線を形成する工程と、を備え、
前記第２工程は、
前記第２基板の基板本体を貫通する貫通電極を形成する工程と、
前記第２基板の基板本体の一方の面の、前記第１基板の前記凹部に対応する位置に、前記貫通電極と電気的に接続された導電性の第１突起部を形成する工程と、
前記第２基板の前記基板本体の他方の面に、前記貫通電極を介して、前記第１突起部と電気的に接続された導電性の第２突起部を形成する工程と、を備え、
前記第３工程は、
前記凹部内に前記配線と接触して導通するように導電性ボールを収容する工程と、
前記第１突起部の一端が前記導電性ボールと接触して導通するように前記接合部を介して前記第１基板と前記第２基板とを接合する工程と、を備えることを特徴とする半導体検査装置の製造方法。 A method for manufacturing a semiconductor inspection apparatus that inputs and outputs electrical signals for inspecting a semiconductor device that is an inspection object,
A first step of manufacturing a first substrate, a second step of manufacturing a second substrate, and a third step of bonding the first substrate and the second substrate through an elastically deformable joint. Have
The first step includes
Forming a recess in the substrate body of the first substrate;
Placing an elastically deformable resin on the inner bottom surface of the recess;
Forming a wiring on the inner surface of the recess,
The second step includes
Forming a through electrode penetrating the substrate body of the second substrate;
Forming a conductive first protrusion electrically connected to the through electrode at a position corresponding to the concave portion of the first substrate on one surface of the substrate body of the second substrate;
Forming a conductive second protrusion electrically connected to the first protrusion via the through electrode on the other surface of the substrate body of the second substrate ,
The third step includes
Containing a conductive ball so as to be conductive in contact with the wiring in the recess;
Bonding the first substrate and the second substrate through the bonding portion so that one end of the first protruding portion is in contact with the conductive ball and is conductive. Manufacturing method of inspection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010126314A JP5383593B2 (en) | 2010-06-01 | 2010-06-01 | Semiconductor inspection apparatus and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010126314A JP5383593B2 (en) | 2010-06-01 | 2010-06-01 | Semiconductor inspection apparatus and manufacturing method thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011252773A JP2011252773A (en) | 2011-12-15 |
| JP2011252773A5 true JP2011252773A5 (en) | 2013-06-06 |
| JP5383593B2 JP5383593B2 (en) | 2014-01-08 |
Family
ID=45416825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010126314A Expired - Fee Related JP5383593B2 (en) | 2010-06-01 | 2010-06-01 | Semiconductor inspection apparatus and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5383593B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4467721B2 (en) * | 2000-06-26 | 2010-05-26 | 富士通マイクロエレクトロニクス株式会社 | Contactor and test method using contactor |
| JP2003066101A (en) * | 2001-08-21 | 2003-03-05 | Anritsu Corp | Contact sheet and measuring tool using the same |
| JP2003173853A (en) * | 2001-12-06 | 2003-06-20 | Sharp Corp | Socket for semiconductor integrated circuit |
| JP2009270835A (en) * | 2008-04-30 | 2009-11-19 | Shinko Electric Ind Co Ltd | Inspection method and device for semiconductor component |
-
2010
- 2010-06-01 JP JP2010126314A patent/JP5383593B2/en not_active Expired - Fee Related
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