JP2011247543A - 平板式ヒートパイプ構造及びその製造方法 - Google Patents
平板式ヒートパイプ構造及びその製造方法 Download PDFInfo
- Publication number
- JP2011247543A JP2011247543A JP2010123136A JP2010123136A JP2011247543A JP 2011247543 A JP2011247543 A JP 2011247543A JP 2010123136 A JP2010123136 A JP 2010123136A JP 2010123136 A JP2010123136 A JP 2010123136A JP 2011247543 A JP2011247543 A JP 2011247543A
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- Prior art keywords
- heat pipe
- plate portion
- pipe structure
- chamber
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000004519 manufacturing process Methods 0.000 title claims description 22
- 239000012530 fluid Substances 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 22
- 229910052802 copper Inorganic materials 0.000 claims description 21
- 239000010949 copper Substances 0.000 claims description 21
- 238000007789 sealing Methods 0.000 claims description 18
- 230000000903 blocking effect Effects 0.000 claims description 14
- 238000005245 sintering Methods 0.000 claims description 11
- 239000000835 fiber Substances 0.000 claims description 7
- 238000005187 foaming Methods 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 238000005304 joining Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 description 14
- 238000001704 evaporation Methods 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 230000008020 evaporation Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 3
- 239000011148 porous material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010123136A JP2011247543A (ja) | 2010-05-28 | 2010-05-28 | 平板式ヒートパイプ構造及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010123136A JP2011247543A (ja) | 2010-05-28 | 2010-05-28 | 平板式ヒートパイプ構造及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011247543A true JP2011247543A (ja) | 2011-12-08 |
| JP2011247543A5 JP2011247543A5 (enExample) | 2012-06-21 |
Family
ID=45413014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010123136A Pending JP2011247543A (ja) | 2010-05-28 | 2010-05-28 | 平板式ヒートパイプ構造及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011247543A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5180385B1 (ja) * | 2012-03-08 | 2013-04-10 | 株式会社Welcon | ベーパチャンバ |
| JP2014134347A (ja) * | 2013-01-10 | 2014-07-24 | Welcon:Kk | ベーパチャンバ |
| KR101506907B1 (ko) * | 2014-11-18 | 2015-03-30 | (주)위너스라이팅 | 상변화 방열 장치 |
| WO2024045736A1 (zh) * | 2022-08-29 | 2024-03-07 | 广州力及热管理科技有限公司 | 具有两种工作流体两相流循环的均温板组件 |
| CN118555808A (zh) * | 2024-07-17 | 2024-08-27 | 西安朗远宏昇电子科技有限公司 | 一种高导热变频组件 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116647A (enExample) * | 1973-03-12 | 1974-11-07 | ||
| JPH09210582A (ja) * | 1995-12-01 | 1997-08-12 | Fujikura Ltd | ヒートパイプ |
| JP2001091172A (ja) * | 1999-09-21 | 2001-04-06 | Fujikura Ltd | 平板状ヒートパイプ |
| JP2002062072A (ja) * | 2000-08-21 | 2002-02-28 | Fujikura Ltd | 平板状ヒートパイプおよびその製造方法 |
| JP2005308387A (ja) * | 2004-04-23 | 2005-11-04 | Taida Electronic Ind Co Ltd | ヒートパイプおよびその製造方法 |
| JP2006140435A (ja) * | 2004-11-11 | 2006-06-01 | Taiwan Microloops Corp | 金属ワイヤメッシュの微小構造を備えた屈曲可能なヒートスプレッダーとヒートスプレッダーの製造方法 |
| JP2006292355A (ja) * | 2005-04-08 | 2006-10-26 | Asustek Computer Inc | ヒートパイプの製造方法 |
-
2010
- 2010-05-28 JP JP2010123136A patent/JP2011247543A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49116647A (enExample) * | 1973-03-12 | 1974-11-07 | ||
| JPH09210582A (ja) * | 1995-12-01 | 1997-08-12 | Fujikura Ltd | ヒートパイプ |
| JP2001091172A (ja) * | 1999-09-21 | 2001-04-06 | Fujikura Ltd | 平板状ヒートパイプ |
| JP2002062072A (ja) * | 2000-08-21 | 2002-02-28 | Fujikura Ltd | 平板状ヒートパイプおよびその製造方法 |
| JP2005308387A (ja) * | 2004-04-23 | 2005-11-04 | Taida Electronic Ind Co Ltd | ヒートパイプおよびその製造方法 |
| JP2006140435A (ja) * | 2004-11-11 | 2006-06-01 | Taiwan Microloops Corp | 金属ワイヤメッシュの微小構造を備えた屈曲可能なヒートスプレッダーとヒートスプレッダーの製造方法 |
| JP2006292355A (ja) * | 2005-04-08 | 2006-10-26 | Asustek Computer Inc | ヒートパイプの製造方法 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5180385B1 (ja) * | 2012-03-08 | 2013-04-10 | 株式会社Welcon | ベーパチャンバ |
| JP2014134347A (ja) * | 2013-01-10 | 2014-07-24 | Welcon:Kk | ベーパチャンバ |
| KR101506907B1 (ko) * | 2014-11-18 | 2015-03-30 | (주)위너스라이팅 | 상변화 방열 장치 |
| WO2024045736A1 (zh) * | 2022-08-29 | 2024-03-07 | 广州力及热管理科技有限公司 | 具有两种工作流体两相流循环的均温板组件 |
| CN118555808A (zh) * | 2024-07-17 | 2024-08-27 | 西安朗远宏昇电子科技有限公司 | 一种高导热变频组件 |
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