JP2011245559A - Cutting blade - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cutting blade capable of securing dimensional accuracy, and performing stable cutting work by being enhanced in wear resistance.SOLUTION: In this cutting blade where a base material forming a disc-like shape and including a resin phase with superabrasives dispersed and arranged therein is rotated around an axis, and a cutting object material is subjected to cutting work by a blade edge at an outer peripheral edge of the base material, the resin phase is formed of an epoxy resin-silica hybrid hardened material.

Description

  The present invention relates to a cutting blade used for precision cutting of hard and brittle materials such as quartz and quartz.

  Conventionally, high precision is required for the processing of grooving or cutting into pieces of hard and brittle materials (materials to be cut) such as quartz and quartz used in semiconductor products. For such groove processing and cutting processing (hereinafter referred to as “cutting processing”), a circular thin plate-shaped cutting blade is used. In particular, when cutting a hard and brittle material such as quartz, which is susceptible to chipping, as a material to be cut, in order to relieve the impact of the processing load on the material to be cut, an elastic resin phase is used. Chipping is suppressed by using a cutting blade made of a resin bond grindstone in which diamond abrasive grains (super abrasive grains) are dispersed. On the other hand, when it is desired to ensure sufficient wear resistance, a cutting blade made of a metal phase such as a metal bond grindstone or an electroformed bond grindstone is used.

Among these cutting blades, epoxy resin, phenol resin, or the like is used as the resin phase of the resin bond grindstone. When an epoxy resin is used, since the curing shrinkage is small, warping and cracking during production are unlikely to occur, and a cutting blade having excellent dimensional accuracy can be obtained. Moreover, when a phenol resin is used, abrasion resistance improves compared with what consists of an epoxy resin. In addition, the one using a polyurea resin such as a cutting blade shown in Patent Document 1 is also known.
For such a cutting blade, there is a demand for an ultra-thin blade having a thickness of, for example, about 0.1 mm for the purpose of improving the product yield of semiconductor components.

JP 2004-209580 A

  However, when an epoxy resin is used as the resin phase of the resin bond grindstone, it cannot be said that the wear resistance is sufficient, and there is a problem in terms of tool life. That is, the epoxy resin has a relatively low glass transition point, and when the cutting edge temperature of the cutting blade rises due to friction with the material to be cut, it softens and cannot secure wear resistance. In addition, when a phenol resin is used, curing shrinkage during production is large, and it is difficult to ensure product quality (dimensional accuracy). Further, when a polyurea resin is used, rigidity cannot be ensured when it is formed into an ultrathin blade, which is not suitable for use.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a cutting blade capable of ensuring dimensional accuracy, having improved wear resistance, and capable of stable cutting. .

In order to achieve the above object, the present invention proposes the following means.
That is, in the present invention, a base material having a disk shape and having a resin phase in which superabrasive grains are dispersed is rotated about an axis, and the material to be cut is cut at the edge of the outer peripheral edge of the base material. The cutting blade is characterized in that the resin phase is made of an epoxy resin-silica hybrid cured product.

  According to the cutting blade according to the present invention, since the resin phase is made of an epoxy resin-silica hybrid cured product, the cutting blade has sufficient dimensional accuracy and improved wear resistance. Specifically, since the epoxy resin-silica hybrid cured product has small curing shrinkage, the cutting blade is prevented from warping or cracking during production, and has excellent dimensional accuracy and product quality. .

In addition, it is known that the epoxy resin-silica hybrid cured product does not have a glass transition point (Tg), and even when the cutting temperature rises due to friction with the material to be cut during the cutting process, The epoxy resin-silica hybrid cured product forming the cutting edge is not softened from an amorphous state to a rubbery state (or liquid state). That is, conventionally, when the resin phase forming the cutting edge becomes high temperature, the resin phase is softened or deteriorated, and the superabrasive grains of the cutting edge easily fall off, so that the wear resistance cannot be secured. It was. On the other hand, according to the cutting blade of the present invention, since the resin phase does not soften or deteriorate even when the cutting edge becomes hot, the cutting edge strength is sufficiently secured and the wear resistance is enhanced. Thus, stable cutting can be performed.
Such an epoxy resin-silica hybrid cured product can be obtained by curing a methoxy group-containing silane-modified epoxy resin obtained by subjecting a bisphenol type epoxy resin and a methoxysilane partial condensate to a demethanol reaction.

  In the cutting blade according to the present invention, the base material may include a plurality of layers laminated in the thickness direction of the base material, and at least one of the layers may be the resin phase.

  According to the cutting blade according to the present invention, the substrate is composed of a plurality of layers, and at least one of these layers is composed of a resin phase. For example, the metal phase composed of a conventional metal bond grindstone or an electroformed bond grindstone, etc. It is possible to meet various demands such as increasing the rigidity of the base material by laminating the resin phase.

  According to the cutting blade of the present invention, dimensional accuracy can be ensured, wear resistance is improved, and stable cutting can be performed.

1 is a plan view showing a cutting blade according to an embodiment of the present invention. FIG. It is a sectional side view which shows the AA cross section of FIG. It is a partial sectional side view which expands and shows the B section of FIG. It is a graph which contrasts the Example of this invention, and the conventional comparative example. It is a graph which contrasts the Example of this invention, and the conventional comparative example.

  The cutting blade 10 of this embodiment is used for precision cutting of a material to be cut made of a hard and brittle material such as quartz or quartz. As shown in FIGS. 1 to 3, the cutting blade 10 includes a circular thin plate-like substrate 1, and a circular mounting hole 2 is formed at the center of the substrate 1. The cutting blade 10 is mounted on a main shaft of a cutting processing apparatus (not shown) using the mounting hole 2. Then, the cutting blade 10 is rotated about its central axis (hereinafter referred to as “axis”) O and sent out in a direction perpendicular to the axis O, whereby the cutting edge 1A at the outer peripheral edge of the substrate 1 is used as a material to be cut. Cut and cut.

  Specifically, the cutting blade 10 has, for example, an outer diameter of about 58 mm, an inner diameter of the mounting hole 2 of about 40 mm, and a thickness dimension T along the axis O direction set in a range of 100 to 1000 μm. .

  The substrate 1 comprises a resin phase 4 in which diamond abrasive grains (superabrasive grains) 3 and fillers (not shown) made of glass fibers are dispersedly arranged. The resin phase 4 is formed of an epoxy resin-silica hybrid cured product. ing. The average grain size of the diamond abrasive grains 3 is set within a range of 37 μm to 513 μm (grain size # 400 to # 30), and the degree of concentration of the diamond abrasive grains 3 is set within a range of 25 to 150. Yes. Moreover, the ratio (volume%) which the said filler occupies for the resin phase 4 is set in the range of 1 vol%-50 vol%.

  This base material 1 has an elastic modulus (Young's modulus) set within a range of 25000 to 30000 MPa. The epoxy resin-silica hybrid cured product constituting the resin phase 4 is prepared by curing a methoxy group-containing silane-modified epoxy resin obtained by demethanol reaction of a bisphenol type epoxy resin and a methoxysilane partial condensate.

  The resin phase 4 of this embodiment uses, for example, Japan Epoxy Resin Co., Ltd. biphenyl type epoxy resin YX4000 as the main epoxy resin, and Arakawa Chemical Industries Co., Ltd. Composeran (registered trademark) P501 as the curing agent. These are mixed with the diamond abrasive grains 3 and the filler and then sintered. Further, the combination of the main agent and the curing agent described above may be used. For example, Arakawa Chemical Industries Co., Ltd./Composeran (registered trademark) E103 is used as the epoxy resin of the main agent, and Japan Epoxy Resin Co., Ltd. Any one of chain type 171N, Japan Epoxy Resin Co., Ltd., polyfunctional group type 157S70, and Arakawa Chemical Industries Co., Ltd./Composeran (registered trademark) P501 may be used.

  As described above, according to the cutting blade 10 of the present embodiment, since the resin phase 4 is made of an epoxy resin-silica hybrid cured product, the cutting blade 10 has sufficient dimensional accuracy, Abrasion resistance is improved. Specifically, since the epoxy resin-silica hybrid cured product has small curing shrinkage, the cutting blade 10 is prevented from warping, cracking, and the like during manufacturing, and has excellent dimensional accuracy and product quality. Yes.

  Further, it is known that the epoxy resin-silica hybrid cured product does not have a glass transition point (Tg), and the temperature of the cutting edge 1A is, for example, about 300 ° C. due to friction with the material to be cut during the cutting process. Even when the temperature rises and becomes high, the epoxy resin-silica hybrid cured product forming the cutting edge 1A does not soften from an amorphous state to a rubber state (or liquid state). That is, conventionally, when the resin phase forming the cutting edge becomes high temperature, the resin phase is softened or deteriorated, and the diamond abrasive grains of the cutting edge easily fall off, so that the wear resistance cannot be secured. It was. On the other hand, according to the cutting blade 10 of the present embodiment, since the resin phase 4 does not soften or deteriorate even when the cutting edge 1A becomes high temperature, the cutting edge strength is sufficiently ensured and the wear resistance is increased. The property is enhanced and stable cutting can be performed.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in this embodiment, diamond abrasive grains are used as the superabrasive grains 3 dispersedly arranged in the resin phase 4, but cBN (cubic boron nitride) abrasive grains may be used instead of diamond abrasive grains. Moreover, the said filler is not limited to the thing of glass fiber.

  Moreover, in the above-mentioned embodiment, although the base material 1 consisted of the resin phase 4, it is not limited to this, The base material 1 is the several laminated | stacked by the thickness T direction of this base material 1 The at least one of these layers may be the resin phase 4. Specifically, the substrate 1 may be composed of three or more layers, and the resin phase 4 may be disposed on both outer sides along the thickness T direction. Or the resin phase 4 may be arrange | positioned inside the thickness T direction of the base material 1. FIG. In this case, for example, it is possible to meet various demands such as laminating a metal phase made of a conventional metal bond grindstone or electroformed bond grindstone and the resin phase 4 to increase the rigidity of the substrate 1.

  Hereinafter, the present invention will be specifically described by way of examples. However, the present invention is not limited to this embodiment.

[Example 1]
First, as Example 1 of the present invention, a cutting blade 10 was produced as follows.
Japan Epoxy Resin Co., Ltd. biphenyl type epoxy resin YX4000 is used as the main component (epoxy resin) of the epoxy resin-silica hybrid cured product constituting the resin phase 4, and Arakawa Chemical Industries Co., Ltd. (Trademark) P501 was used. And after mixing these main ingredients and hardening | curing agents with the diamond abrasive grain 3 (SDC230) and the said filler, it sintered, and finally gave the grinding | polishing and polishing process, and the base material 1 was produced.

Further, the degree of concentration of the diamond abrasive grains 3 in the resin phase 4 was set to 75, and the ratio of the filler was set to 30 vol%. The cutting blade 10 was formed to have a diameter (outer diameter) of 58 mm and an inner diameter of the mounting hole 2 of 40 mm. For the thickness dimension T, cutting blades 10 of 100 μm, 150 μm, 200 μm, 250 μm, and 300 μm were prepared.
Table 1 shows the main agent, the curing agent, the diamond abrasive grains 3 used in the resin phase 4, the concentration thereof, and the amount of filler (volume%).

(Measure warpage)
Using this cutting blade 10, the amount of warpage in the thickness T direction on the side surface 1B of the substrate 1 was measured. The results are shown in Table 2.

(Abrasion test, elastic modulus measurement)
Next, the cutting blade 10 was mounted on a cutting apparatus, and a wear test was performed using a WA: # 200 dress plate as a material to be cut. The test conditions were as follows: Dicer used: A-WD10A (manufactured by Tokyo Seimitsu Co., Ltd.), spindle rotation speed: 15000 m ⁻¹ , feed rate: 100 mm / S, cooling water: circumferential direction 1.21 / m, both sides 0. 81 / m, 30 grooving processes per SET were performed 5 SETs (that is, a total of 150 grooving processes). And the average abrasion amount of the radial direction in the cutting blade 10 after processing was measured. The results are shown in the graph of FIG.
In addition, at the time of the above-described test, a change in elastic modulus (Young's modulus) with an increase in temperature of the substrate 1 was measured (average value per 1 SET). The results are shown in the graph of FIG.

[Example 2]
Further, as Example 2, a cutting blade 10 using Arakawa Chemical Industries Co., Ltd./Composeran (registered trademark) E103 as the main component of the resin phase 4 and Japan Epoxy Resin Co., Ltd./linear type 171N as the curing agent. Was made. Otherwise, the cutting blade 10 was produced under the same conditions as in Example 1, and the tests and measurements were performed.

[Example 3]
Further, as Example 3, a cutting blade using Arakawa Chemical Industries Co., Ltd./Composeran (registered trademark) E103 as the main component of the resin phase 4 and Japan Epoxy Resin Co., Ltd./multifunctional group type 157S70 as the curing agent. 10 was produced. Otherwise, the cutting blade 10 was produced under the same conditions as in Example 1, and the tests and measurements were performed.

[Example 4]
Further, as Example 4, for cutting using Arakawa Chemical Industries, Ltd./Composeran (registered trademark) E103 as the main component of the resin phase 4, and Arakawa Chemical Industries, Ltd./Composeran (registered trademark) P501 as the curing agent. A blade 10 was produced. Otherwise, the cutting blade 10 was produced under the same conditions as in Example 1, and the tests and measurements were performed.

[Comparative Example 1]
On the other hand, as a conventional comparative example 1, a cutting blade using Japan Epoxy Resin Co., Ltd. biphenyl type epoxy resin YX4000 as the main component of the resin phase 4, and Japan Epoxy Resin Co., Ltd. linear type 171N as the curing agent. Was made. Other than that, a cutting blade was prepared under the same conditions as in Example 1, and the test and measurement were performed.

[Comparative Example 2]
In addition, as Comparative Example 2, a cutting blade was prepared using Japan Epoxy Resin Co., Ltd. biphenyl type epoxy resin YX4000 as the main component of the resin phase 4, and Japan Epoxy Resin Co., Ltd. polyfunctional group type 157S70 as the curing agent. Produced. Other than that, a cutting blade was prepared under the same conditions as in Example 1, and the test and measurement were performed.

[Comparative Example 3]
Further, as Comparative Example 3, a resin phase 4 using a general-purpose phenol resin instead of using the main agent / curing agent described above was prepared. Specifically, a cutting blade was prepared using Showa High Polymer Co., Ltd.'s phenol resin BRP5417 for grinding stones as the phenol resin. Other than that, a cutting blade was prepared under the same conditions as in Example 1, and the test and measurement were performed.

[Comparative Example 4]
Further, as Comparative Example 4, a cutting blade was produced using a polyurea resin instead of using the main agent / curing agent described above for the resin phase 4. Other than that, a cutting blade was prepared under the same conditions as in Example 1, and the test and measurement were performed.

(Evaluation of warpage)
As shown in Table 2, in Examples 1 to 4, even when the thickness dimension T of the cutting blade 10 is any of 100 μm to 300 μm, the amount of warpage is suppressed to less than 50 μm, and the dimensional accuracy is sufficiently ensured. It was.
On the other hand, in Comparative Examples 1 and 2, although the warp amount was suppressed to less than 50 μm when the thickness dimension T of the cutting blade was between 150 μm and 300 μm, the thickness dimension T was formed to be relatively thin with a thickness of 100 μm. In some cases, the amount of warpage increased to a range of 50 μm to 200 μm. In Comparative Example 3, the curing shrinkage of the resin phase was large, and when the thickness dimension T was 100 μm to 200 μm, the amount of warpage was 200 μm or more, and the dimensional accuracy could not be secured. In Comparative Example 4, it was found that although the dimensional accuracy was ensured when the thickness dimension T was 300 μm, the elastic deformation was relatively large and the rigidity could not be ensured.

(Evaluation of wear)
As shown in FIG. 4, in Examples 1 to 4, it was confirmed that the average wear amount was all suppressed to less than 80 μm and the wear resistance was sufficiently improved.
On the other hand, in Comparative Examples 1 and 2, the average wear amount was 105 μm or more, and the wear resistance could not be ensured. In Comparative Example 3, although the wear resistance was ensured as compared with Comparative Examples 1 and 2, the average amount of wear reached 98 μm. In Comparative Example 4, the progress of wear was the largest, and the average wear amount reached 196 μm.

(Evaluation of elastic modulus)
As shown in FIG. 5 and Table 3, in Examples 1 to 4, even when the temperature of the base material 1 reaches about 300 ° C., the elastic modulus of the base material 1 is ensured to be 23000 MPa or more, and the rigidity is sufficient. It was found that it was raised. That is, even when the cutting edge 1A of the substrate 1 becomes high temperature due to friction with the material to be cut, the cutting edge 1A is not softened, and the diamond abrasive grains 3 held by the cutting edge 1A are easily dropped off. It was found that the sharpness was stably secured. Further, as shown in the graph of FIG. 5, it was confirmed that the cutting blades 10 of Examples 1 to 4 did not have a glass transition point.

  On the other hand, in Comparative Examples 1 and 2, when the temperature of the base material is in the range of 20 ° C. to 60 ° C., the elastic modulus of the base material is secured at 19000 MPa or more, but when the temperature rises to 100 ° C., the base It was found that the elastic modulus of the material suddenly decreased to 10,000 MPa or less, and the resin phase of the base material reached the glass transition point and was softened. Further, in Comparative Example 3, the elastic modulus is ensured to be 30000 MPa or more in the range of the substrate temperature of 20 ° C. to 220 ° C., but the elastic modulus starts to decrease when the temperature of the substrate rises to about 260 ° C., Furthermore, when the temperature reached 300 ° C., it was confirmed that the elastic modulus of the base material decreased to about 6000 MPa. Specifically, in Comparative Example 3, it was found that discoloration due to scorching was observed when the temperature of the substrate exceeded 200 ° C., and it was impossible to ensure the strength of the substrate due to deterioration. In Comparative Example 4, the base material had an elastic modulus of 4000 MPa or less regardless of the temperature, and the rigidity could not be secured.

1 Base Material 1A Cutting Edge 3 Diamond Abrasive Grain (Super Abrasive Grain)
4 Resin phase 10 Cutting blade O Central axis (axis)

Claims (2)

A cutting blade that has a disk shape and includes a resin phase in which superabrasive grains are dispersed and is rotated about its axis, and cuts the workpiece with the cutting edge of the outer peripheral edge of the substrate. There,
The blade for cutting, wherein the resin phase is made of an epoxy resin-silica hybrid cured product. The cutting blade according to claim 1,
The base material includes a plurality of layers laminated in the thickness direction of the base material, and at least one of the layers is the resin phase.

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