JP2011243876A - Printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed wiring board in which a portion (intersection) of the printed wiring board near the intersection of feed lines can be prevented from rising due to the difference of linear thermal expansion coefficient between a material used in the feed line and a material used in an electronic device when the electronic device is mounted on the printed wiring board.SOLUTION: The printed wiring board 10 comprises external connection electrodes 11, electronic device connection terminals (bumps) 12, a circuit pattern 13, and feed lines 14. The feed lines 14 includes feed line cross portions 14a centering on an intersection O, linear X-direction feed line portions 14b on the dicing line 20 in the X direction, and linear Y-direction feed line portions 14c on the dicing line 20 in the Y direction, which are separated by X-direction gaps Xs and Y-direction gaps Ys each provided in the X direction and Y direction near the intersection O of the dicing lines 20 in the X direction and Y direction.

Description

  The present invention relates to a printed wiring board. In particular, the present invention relates to a flexible printed wiring board that can be cut into individual electronic devices after a plurality of electronic devices are mounted and collectively molded.

  In recent years, electronic devices represented by mobile phones, digital cameras, and liquid crystal displays have been used as substrates for mounting electronic devices such as semiconductor chips mounted on these electronic devices because of demands for miniaturization, thinning, and high functionality. A flexible printed wiring board having flexibility is used.

  Conventionally, when a resin is used as a base material in a printed wiring board, a power supply line for plating is formed when the wiring pattern is formed by plating (see, for example, Patent Document 1).

  This power supply line is not necessary after the end of plating formation, but in order to simplify the manufacturing process, multiple electronic devices are mounted on a printed wiring board, molded together, and then cut into individual electronic devices. When dicing, they are removed together.

  FIG. 9 is a schematic plan view showing a conventional printed wiring board 90. FIG. 10 is a schematic plan view showing a state in which a semiconductor chip (electronic device) 91 is mounted on the printed wiring board 90. As shown in FIGS. 9 and 10, the printed wiring board 90 has a circuit pattern 93 formed in a section 92 corresponding to each semiconductor chip 91. In addition, a plurality of dicing lines 94 are set in two orthogonal directions (X direction and Y direction) for cutting into sections 92 corresponding to the respective semiconductor chips 91, and the power supply line 95 extends along the dicing lines 94. Are formed by a plurality of line-shaped wirings in the X direction and the Y direction.

JP 2004-336075 A

  However, there is a difference between the coefficient of thermal expansion of the material used for the power supply line 95 (such as copper) and the coefficient of thermal expansion of the material used for the semiconductor chip 91 (such as silicon). Due to the difference, for example, when the semiconductor chip 91 is mounted on the printed wiring board 90 by solder bonding the electrodes of the semiconductor chip 91 and the electronic device connection terminals of the printed wiring board 90, the printed wiring in which the power supply line 95 is formed. The portion of the substrate 90 is greatly extended, and the portion of the printed wiring board 90 (the vicinity of the intersection) 90a in the vicinity where the X-direction and Y-direction feed lines 95 where the elongation is concentrated has been raised. In particular, when the elastic modulus of the tape base material of the printed wiring board 90 is 10 (GPa) or less, the above-described bulging of the intersection 90a occurs. Further, the rise of the intersection vicinity 90a may cause the corner portion 91a of the nearby semiconductor chip 91 to come into contact with a part of the circuit pattern 93, resulting in malfunction.

  Therefore, the present invention has been made to solve the above-described problems, and when mounting an electronic device on a printed wiring board, a material used for a power supply line and a material used for the electronic device. It is an object of the present invention to provide a printed wiring board capable of preventing the rise of the portion of the printed wiring board in the vicinity where the power supply lines intersect (the vicinity of the intersection), which is generated due to the difference in the thermal linear expansion coefficient.

前記距離ｄ１及び前記距離ｄ２は、

の関係式を満たし、
前記距離ｄ３及び前記距離ｄ４は、

の関係式を満たし、
前記Ｘ方向隙間Ｘｓ及び前記Ｙ方向隙間Ｙｓは、

の関係式を満たしていることを特徴とする。 The following invention is provided to solve the above-mentioned conventional problems.
A printed wiring board according to a first aspect of the present invention is a printed wiring board in which a circuit pattern is formed in the section, which is used by mounting a plurality of electronic devices and then cutting the section into a section corresponding to the electronic device. An external connection electrode for electrical connection with an external electrode, an electronic device connection terminal for electrical connection with the electronic device, and the circuit pattern for conducting the external connection electrode and the electronic device connection terminal And a feed line electrically connected to the circuit pattern, provided on a plurality of dicing lines set in the X direction and the Y direction, which are two orthogonal directions for cutting into the section,
The feed line includes an X-direction gap Xs provided on the dicing line in the X direction at a distance d1 and a distance d2 in the + X direction and the −X direction from the intersection, and in the + Y direction and the −Y direction from the intersection. A feeding line cross section having the intersection as the center of intersection, separated by a Y-direction gap Ys provided on the dicing line in the Y direction, which is separated by a distance d3 and a distance d4, respectively, and an X-direction feeding in a linear X direction A line part and a Y-direction power supply line part in the Y direction of the line shape,
The width of the power supply line is W, the coefficient of thermal expansion of the material of the electronic device is α1 (1 / ° C.), the coefficient of thermal expansion of the material of the power supply line is α2 (1 / ° C.), and the X of the electronic device The length in the direction is X1 (μm), the length in the Y direction is Y1 (μm), the length in the X direction of the section is X2 (μm), the length in the Y direction is Y2 (μm), ΔT (° C.) is the temperature change of each of the electronic device and the power supply line when the electronic device is mounted on the compartment via the electronic device connection terminal.

The distance d1 and the distance d2 are

Satisfy the relational expression of
The distance d3 and the distance d4 are

Satisfy the relational expression of
The X-direction gap Xs and the Y-direction gap Ys are:

It satisfies the following relational expression.

  Here, in the power supply line cross section, the shape is the closest to the end in the X direction of the printed wiring board and the closest to the end in the Y direction, that is, around the intersection. When there is a section corresponding to two electronic devices, it has a T shape with the intersection as the center of intersection. Further, when it is closest to the corner of the printed wiring board, that is, when there is a section corresponding to one electronic device around the intersection, it is a right-angled V shape with the intersection as the center of intersection. Further, when there is a section corresponding to four electronic devices around the intersection, the cross shape has the intersection as the center of intersection. Further, the positions separated by the distance d1, the distance d2, the distance d3, and the distance d4 indicate positions where the center positions of the X-direction gap Xs and the Y-direction gap Ys are provided. Further, the X-direction gap Xs and the Y-direction gap Ys may be provided at positions that satisfy the above-described distance d1, distance d2, distance d3, and distance d4, but the cross-shaped power supply line cross portion is a dicing line. It is more desirable that the shape is axisymmetric with respect to the X-direction and Y-direction axes passing through the intersection. Further, it is more desirable that the T-shaped power supply line cross portion has an axisymmetric shape with respect to an axis in the X direction or the Y direction corresponding to a T-shaped vertical line passing through the intersection of dicing lines.

前記距離ｄ１及び前記距離ｄ２は、

の関係式を満たし、
前記距離ｄ３及び前記距離ｄ４は、

の関係式を満たし、
前記Ｘ方向隙間Ｘｓ及び前記Ｙ方向隙間Ｙｓは、

の関係式を満たしていることを特徴とする。 A printed wiring board according to a second aspect of the present invention is a printed wiring board in which a circuit pattern is formed in the section, which is used by being cut into a section corresponding to the electronic device after mounting a plurality of electronic devices. An external connection electrode for electrical connection with an external electrode, an electronic device connection terminal for electrical connection with the electronic device, and the circuit pattern for conducting the external connection electrode and the electronic device connection terminal And a feed line electrically connected to the circuit pattern, provided on a plurality of dicing lines set in the X direction and the Y direction, which are two orthogonal directions for cutting into the section,
The feed line includes an X-direction gap Xs provided on the dicing line in the X direction at a distance d1 and a distance d2 in the + X direction and the −X direction from the intersection, and in the + Y direction and the −Y direction from the intersection. A feeding line cross section having the intersection as the center of intersection, separated by a Y-direction gap Ys provided on the dicing line in the Y direction, which is separated by a distance d3 and a distance d4, respectively, and an X-direction feeding in a linear X direction A line part and a Y-direction power supply line part in the Y direction of the line shape,
The width of the power supply line is W, the coefficient of thermal expansion of the material of the electronic device is α1 (1 / ° C.), the coefficient of thermal expansion of the material of the power supply line is α2 (1 / ° C.), and the X of the electronic device The length in the direction is X1 (μm), the length in the Y direction is Y1 (μm), the length in the X direction of the section is X2 (μm), the length in the Y direction is Y2 (μm), The temperature change of each of the electronic device and the power supply line when the electronic device is mounted in the compartment via the electronic device connection terminal is defined as ΔT (° C.), and the interval between the adjacent electronic devices in the X direction Is Dx, and the interval in the Y direction between the adjacent electronic devices is Dy,

The distance d1 and the distance d2 are

Satisfy the relational expression of
The distance d3 and the distance d4 are

Satisfy the relational expression of
The X-direction gap Xs and the Y-direction gap Ys are:

It satisfies the following relational expression.

の関係式を満たしていることを特徴とする。 The printed wiring board according to the third aspect of the present invention is the printed wiring board according to the first or second aspect of the present invention, wherein the X-direction gap Xs and the Y-direction gap Ys are:

It satisfies the following relational expression.

  A printed wiring board according to a fourth aspect of the present invention is the printed wiring board according to any one of the first to third aspects of the present invention described above, wherein the circuit pattern and the feeder line are the same metal layer. It is formed.

  A printed wiring board according to a fifth aspect of the present invention is the printed wiring board according to any one of the first to fourth aspects of the present invention described above, wherein the electronic device connection terminal is formed by plating. Features.

  A printed wiring board according to a sixth aspect of the present invention is the printed wiring board according to any one of the first to fifth aspects of the present invention described above, wherein the external connection electrode is formed by plating. And

  According to the present invention, the power supply line is provided due to the difference in the coefficient of thermal expansion between the material used for the power supply line generated when the electronic device is mounted on the printed wiring board and the material used for the electronic device. The X- and Y-directions are absorbed by absorbing the extension of the printed wiring board part that is present in the part (gap part) of the printed wiring board in which the gap (X-direction gap Xs and Y-direction gap Ys) is provided. As a result, it is possible to prevent the occurrence of swell in the portion of the printed wiring board in the vicinity where the power supply lines intersect (near the intersection), and to prevent the occurrence of cracks and wrinkles in the tape base material of the printed wiring board.

  Therefore, it is possible to prevent contact between a corner portion of an electronic device near the intersection and a part of the circuit pattern formed on the printed wiring board caused by the rise of the intersection, and to prevent malfunction caused by this contact. Can do.

  Further, the stress concentrated on the gap portion is not left as a residual stress, and an adverse effect due to the residual stress on the electronic device to be mounted or the circuit pattern of the printed wiring board can be prevented.

(A) is a schematic partial plan view which shows an example of the printed wiring board 10 which concerns on embodiment of this invention, (b) is an enlarged plan view of A part of Fig.1 (a). FIG. 2 is a schematic partial plan view showing an example of a state in which an electronic device is mounted on the printed wiring board 10 according to the embodiment of the present invention shown in FIG. 1. It is a figure for demonstrating the position of the X direction clearance gap Xs provided in the electric power feeding line 14 of the printed wiring board 10 which concerns on embodiment of this invention, and the Y direction clearance gap Ys. (A) is a schematic partial top view which shows an example of another printed wiring board 60 which concerns on embodiment of this invention, (b) is an enlarged plan view of A part of Fig.4 (a). It is a figure for demonstrating the position of the X direction clearance Xs provided in the electric power feeding line 14 of the printed wiring board 60, and the Y direction clearance Ys. It is a figure for demonstrating the manufacturing method of the printed wiring board 10 of FIG. FIG. 7 is a diagram subsequent to FIG. 6 for illustrating the method for manufacturing the printed wiring board 10 of FIG. 1. It is a figure following FIG. 7 for demonstrating the manufacturing method of the printed wiring board 10 of FIG. FIG. 10 is a schematic plan view showing a conventional printed wiring board 90. It is a schematic plan view which shows the state which mounted the semiconductor chip 91 on the conventional printed wiring board 90. FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
First, a printed wiring board according to an embodiment of the present invention will be described. FIG. 1A is a schematic partial plan view showing an example of a printed wiring board 10 according to the embodiment of the present invention, and FIG. 1B is an enlarged plan view of a portion A in FIG. . FIG. 2 is a schematic partial plan view showing an example in which an electronic device is mounted on the printed wiring board 10 according to the embodiment of the present invention shown in FIGS. FIG. 3 is a view for explaining the positions of the X-direction gap Xs and the Y-direction gap Ys provided in the power supply line 14 of the printed wiring board 10 according to the embodiment of the present invention. Hereinafter, a semiconductor chip will be described as an example of the electronic device.

  As shown in FIGS. 1A, 1B, 2 and 3, the printed wiring board 10 according to the embodiment of the present invention is electrically connected to an external electrode (for example, an electrode of a motherboard). The external connection electrode 11, the electronic device connection terminal (bump) 12 electrically connected to the semiconductor chip 30, the circuit pattern 13 that conducts the external connection electrode 11 and the bump 12, and the power supply line 14 (14 a, 14 b, 14c).

  The external connection electrode 11 and the circuit pattern 13 are formed by plating in a plurality of sections 21 divided by a plurality of dicing lines 20 in two orthogonal directions (X direction and Y direction) set on the printed wiring board 10. Yes.

  The bumps 12 are mounted on the printed wiring board 10 by bonding (for example, solder bonding) to the electrodes of the semiconductor chip 30. The bumps 12 are formed by plating via the circuit pattern 13 and the power supply line 14.

  The power supply line 14 is formed by plating along the dicing line 20, that is, on the dicing line 20. The power supply line 14 is preferably formed of the same metal layer as the circuit pattern 13. The power supply lines 14 (14 a, 14 b, 14 c) are connected to the sections 21 along the dicing line 20 after the semiconductor chip 30 is mounted on the printed wiring board 10 (see FIG. 2). The width W of the power supply line 14 is smaller than the thickness of a dicing blade (not shown) that cuts the printed wiring board 10 and is removed together when cutting. Note that the power supply line 14 may be cut off by dicing both sides of the power supply line 14.

  The feed line 14 is a gap in the X direction provided on the dicing line 20 in the X direction that is a distance d1 and a distance d2 away in the + X direction and the −X direction from each intersection O where the dicing line 20 in the X direction and the Y direction intersect. A feeding line having the intersection O as the intersection center, separated by Xs and the Y-direction gap Ys provided on the dicing line 20 in the Y direction, which is separated from the intersection O in the + Y direction and the −Y direction by the distance d3 and the distance d4, respectively. A cross portion 14a, a linear X-direction power supply line portion 14b on the X-direction dicing line 20, and a linear Y-direction power supply line portion 14c on the Y-direction dicing line 20 are provided.

It should be noted that the shape of the power supply line cross portion 14a is closest to the end portion in the X direction of the printed wiring board 10 (14a ₁ ) and closest to the end portion in the Y direction (14a ₂ ). That is, when there are two sections 21 around the intersection O, it has a T-shape with the intersection O as the center of intersection. When the printed wiring board 10 is closest to the corner, that is, when there is one section 21 around the intersection O (14a ₃ ), a right-angled V-shape with the intersection O as the intersection center. It is. Further, when there are four sections 21 around the intersection O as shown in FIG. 1A (14a ₄ ), the cross shape has the intersection O as the center of intersection.

  Further, the above-mentioned distance d1, distance d2, distance d3, and distance d4 satisfy the following relational expressions (1), (2), (3), and (4), and the above-described X-direction gap Xs ( μm) and the Y-direction gap Ys (μm) satisfy the following relational expressions (5) and (6). More preferably, the following relational expressions (7) and (8) are satisfied. The width of the power supply line 14 is W, the coefficient of thermal expansion of the material of the semiconductor chip 30 is α1 (1 / ° C.), the coefficient of thermal expansion of the material of the power supply line 14 is α2 (1 / ° C.), and the semiconductor chip 30 The length in the X direction is X1 (μm), the length in the Y direction is Y1 (μm), the length in the X direction of the section 21 is X2 (μm), and the length in the Y direction is Y2 (μm). The temperature changes of the semiconductor chip 30 and the power supply line 14 when the semiconductor chip 30 is mounted on the partition 21 via the bumps 12 are both ΔT (° C.). ΔX and ΔY satisfy the following relational expressions (9) and (10).

Here, the positions separated by the distance d1, the distance d2, the distance d3, and the distance d4 indicate positions where the center positions of the X-direction gap Xs and the Y-direction gap Ys are provided.
Further, the X-direction gap Xs and the Y-direction gap Ys may be provided at the positions satisfying the above-described distance d1, distance d2, distance d3, and distance d4, but d1≈d2≈d3≈d4. It is more desirable to provide the X direction gap Xs and the Y direction gap Ys. That is, in the case of the feed line cross portion 14a ₄ shown in FIGS. 1A and 1B, the cross shape is substantially axisymmetric with respect to the X-direction and Y-direction axes passing through the intersection O. More preferably, the X-direction gap Xs and the Y-direction gap Ys are provided. In the case of the T-shaped power supply line cross portions 14a ₁ and 14a ₂ , the T-shape is axisymmetric with respect to the X-direction or Y-direction axis corresponding to the T-shaped vertical line passing through the intersection O. It is more desirable to provide the X-direction gap Xs and the Y-direction gap Ys so that

  If a gap (X-direction gap Xs and Y-direction gap Ys) is provided so as to include the intersection O at the center of the gap, that is, if a gap is provided so as not to form the cross-shaped power supply line cross portion 14a, FIG. In addition to the rectangular portion 15 having a width W in the center of the feed line cross portion 14a as a gap, a gap of ΔX and ΔY must be provided in the ± X direction and ± Y direction of the rectangular portion 15, respectively. Disappear. That is, a large gap is formed in which the X-direction gap Xs between the X-direction feed line portions 14b is (W + 2 × ΔX) or more and the Y-direction gap Ys between the Y-direction feed line portions 14c is (W + 2 × ΔY) or more. . Thus, when the portion (gap part) of the printed wiring board 10 without the power supply line 14 is large, the tape base material of the printed wiring board 10 is greatly deformed, and the tape base material of the printed wiring board 10 is cracked or wrinkled. Will occur.

  Therefore, in the feed line 14, the above-described relational expressions (5) and (6) are more preferably within the range satisfying the above-described relational expressions (1) to (4), and more preferably the above-described relational expressions (7) and (7). 8) An X-direction gap Xs and a Y-direction gap Ys satisfying 8) are provided, and a feed line cross portion 14a, a linear X-direction feed line portion 14b, and a linear Y-direction feed line portion 14c with the intersection O as the intersection center, Is formed by soldering the electrodes of the semiconductor chip 30 and the bumps 12 of the printed wiring board 10 and mounting the semiconductor chip 30 on the printed wiring board 10 (the material used for the power supply line 14 ( For example, a printed wiring board provided with a power supply line 14 due to a difference in thermal linear expansion coefficient between a material used for the semiconductor chip 30 (for example, copper) and the like. 10 is absorbed by the portion (gap portion) of the printed wiring board 10 provided with the X-direction gap Xs and the Y-direction gap Ys, and further, cracks and wrinkles in the tape base material of the printed wiring board 10 are absorbed. Prevent occurrence.

  That is, by providing the X-direction gap Xs and the Y-direction gap Ys in the power supply line 14, the extension of the portion of the printed wiring board 10 on which the power supply line 14 is provided due to the difference in the thermal expansion coefficient is not concentrated in the vicinity of the intersection O. In this manner, the swell of the vicinity of the intersection O of the printed wiring board 10 is prevented, and cracks and wrinkles in the tape base material of the printed wiring board 10 are prevented. Therefore, the contact between the corner portion 30a of the semiconductor chip 30 and a part of the circuit pattern 13, which is generated by the rising of the portion in the vicinity of the intersection O of the printed wiring board 10, is prevented, and the malfunction caused by the contact is prevented. be able to.

  Next, another printed wiring board 60 according to the embodiment of the present invention will be described. 4A is a schematic partial plan view showing an example of another printed wiring board 60 according to the embodiment of the present invention, and FIG. 4B is an enlarged plan view of a portion A in FIG. 4A. It is. FIG. 5 is a diagram for explaining the positions of the X-direction gap Xs and the Y-direction gap Ys provided in the power supply line 14 of the printed wiring board 60.

  As shown in FIGS. 4A and 4B, the printed wiring board 60 is electrically connected to the external connection electrode 11 for electrically connecting to an external electrode (for example, an electrode of a mother board) and the semiconductor chip 30. A bump 12 to be connected, a circuit pattern 13 for conducting the external connection electrode 11 and the bump 12, and a power supply line 14 (14a, 14b, 14c) are provided.

  Further, the feed line 14 is provided on the X-direction dicing line 20 which is separated from each intersection O where the X-direction and Y-direction dicing lines 20 intersect by a distance d1 and a distance d2 in the + X direction and the −X direction, respectively. The intersection O, which is separated by the direction gap Xs and the Y-direction gap Ys provided on the dicing line 20 in the Y direction that is separated from the intersection O in the + Y direction and the −Y direction by the distance d3 and the distance d4, respectively, is the intersection center. A feed line cross portion 14a, a linear X-direction feed line portion 14b on the X-direction dicing line 20, and a linear Y-direction feed line portion 14c on the Y-direction dicing line 20 are provided.

  The difference between the printed wiring board 60 and the above-described printed wiring board 10 (see FIGS. 1A and 1B) is that X provided in the power supply line 14 of the printed wiring board 60 as shown in FIG. The range of the positions of the direction gap Xs and the Y direction gap Ys satisfies the following relational expressions (11) to (14). A symbol Dx indicates an interval in the X direction between adjacent semiconductor chips 30 and Dx = X2−X1. Reference sign Dy indicates the interval in the Y direction between adjacent semiconductor chips 30 and Dy = Y2−Y1.

  As shown in FIG. 5, the X-direction gap Xs and the Y-direction are within a rectangular area 25 in which the X-direction length is Dx and the Y-direction length is Dy, which are areas where the semiconductor chips 30 are not adjacent to each other in the X-direction or Y-direction. A gap Ys is provided. If the X direction gap Xs and the Y direction gap Ys are provided in the power supply line 14 adjacent to the semiconductor chip 30 in the X direction or the Y direction, that is, outside the rectangular region 25, the X direction gap Xs and the Y direction gap are provided. There is a risk that stress concentrates on the portion (gap portion) of the printed wiring board 60 provided with Ys and remains as residual stress, which adversely affects the adjacent semiconductor chip 30 and the circuit pattern.

  Therefore, in the feed line 14, the above-described relational expressions (5) and (6) are more preferably within the range satisfying the above-described relational expressions (11) to (14), and more preferably the above-described relational expressions (7) and (7). 8) An X-direction gap Xs and a Y-direction gap Ys satisfying 8) are provided, and a feed line cross portion 14a, a linear X-direction feed line portion 14b, and a linear Y-direction feed line portion 14c with the intersection O as the intersection center, The material used for the feeder line 14 generated when the semiconductor chip 30 is mounted on the printed wiring board 60 by soldering the electrodes of the semiconductor chip 30 and the bumps 12 of the printed wiring board 60 by forming The elongation of the portion of the printed wiring board 60 where the power supply line 14 is provided due to the difference in the coefficient of thermal expansion from the material used for the semiconductor chip 30 is expressed as the gap X in the X direction. And Y direction gap Ys is can be absorbed by the portion of the printed wiring board 60 which is provided (gap portion), even if there are still residual stress, because the chip is not adjacent, is not affected.

  Next, a method for manufacturing a printed wiring board according to an embodiment of the present invention will be described in detail with reference to FIGS. Note that the printed wiring board according to the embodiment of the present invention is not limited to the manufacturing method described below.

  A printed wiring board according to an embodiment of the present invention is manufactured by a roll-to-roll method in which a circuit pattern is formed and wound into a roll again in the process of feeding and transporting a long base material wound in a roll. . Hereinafter, the printed wiring board 10 in which the BB ′ cross section of the printed wiring board 10 illustrated in FIG. 1B and the end of the printed wiring board 10 are described will be described as an example.

  As shown in FIG. 6, first, a printed wiring board in which an ultrathin copper foil 45c having a thickness of 5 μm, which is a metal ultrathin foil, is bonded to a copper foil 45a having a thickness of 35 μm, which is a metal foil, via a peeling layer 45b. Peelable copper foil 45 which is a carrier layer of the printed wiring board 10 with carrier) 10 is prepared, and holes 51 for locking the peelable copper foil 45 to the rollers for sending out and transporting the peelable copper foil 45 are provided at both ends of the peelable copper foil 45 in the short direction. Opened at predetermined intervals by punching (step 1: S1).

  Next, a photosensitive coverlay 52 having a thickness of 50 μm is laminated on the surface (L1 surface) of the peelable copper foil 45 (step 2: S2). Then, the photosensitive coverlay 52 is exposed and developed with a mask having a pattern corresponding to the external connection electrode 11, thereby removing the photosensitive coverlay 52 at the position 53 where the external connection electrode 11 is formed. The photosensitive cover lay 52 is completely cured by performing UV curing and heating curing (step 3: S3). Thereby, the insulating layer 47 is formed on the surface (L1 surface) of the peelable copper foil 45.

  Next, prior to electroplating, a protective dry film that protects plating from being attached to the surface (L surface) opposite to the surface (L1 surface) of the peelable copper foil 45 on which the insulating layer 47 is formed. 54 is laminated (step 4: S4). Then, a copper metal layer is formed by electroplating at a position 53 where the external connection electrode 11 is formed (step 5: S5), whereby the surface electrode layer 46 of the external connection electrode 11 is formed.

  Next, as shown in FIG. 7, a nickel-chromium alloy is sputtered on the surface electrode layer 46 and the insulating layer 47 of the external connection electrode 11 to form a second metal underlayer. A metal underlayer 49 composed of the first metal underlayer and the second metal underlayer is formed by sputtering copper to form a first metal underlayer (step 6: S6). The metal underlayer 49 is not limited to sputtering, and may be formed by electroless plating, for example.

  Thereafter, the dry film 55 is laminated on the surface of the metal base layer 49 (step 7: S7), the pattern corresponding to the desired wiring pattern 48 is masked, the dry film 55 is exposed and developed, and the inside of the section 21 The dry film 55a corresponding to the part without the wiring of the circuit pattern 13 and the dry film 55b corresponding to the part that becomes the X-direction gap Xs and the Y-direction gap Ys of the power supply line 14 are left (step 8: S8). Here, the wiring composed of the circuit pattern 13 and the power supply line 14 (14a, 14b, 14c) is referred to as a wiring pattern 48. Therefore, the mask of the pattern corresponding to the desired wiring pattern 48 corresponds to the pattern corresponding to the circuit pattern 13 and the power supply line 14 (14a, 14b, 14c) provided with the X-direction gap Xs and the Y-direction gap Ys. It is a mask of the pattern to be performed. (S8) in FIG. 7 shows the Y-direction gap Ys of the power supply line 14 provided in the BB ′ cross section of the printed wiring board 10 shown in FIG. 1B, and the dry film 55a is The dry film 55 b corresponds to a portion that becomes the Y-direction gap Ys of the power supply line 14.

  Next, copper 56 is plated by electroplating (step 9: S9). Then, the dry films 55a and 55b formed on the surface of the metal underlayer 49 are removed (step 10: S10), and further, formed on the surface of the insulating layer 47 at the position where the dry films 55a and 55b are removed. The metal underlayer 49 is removed (step 11: S11). Thereby, a desired wiring pattern 48 is formed.

  Next, as shown in FIG. 8, a dry film 57 is laminated on the surfaces of the wiring pattern 48 and the insulating layer 47 (step 12: S12). The dry film 57 is exposed and developed using a mask having a pattern corresponding to the position where the bumps 12 are formed, and the protective dry film 54 laminated on the back surface (M surface) of the peelable copper foil 45 in step 4 is applied. A bump 12 is formed by exposing and developing, and further forming a tin-silver alloy layer by electroplating at a position where the dry film 57 is removed (step 13: S13).

  Thereafter, the dry film 57 and the protective dry film 54 are peeled off and removed to thereby provide the power supply line 14 (14a, 14b, 14c) and the circuit pattern 13 provided with the X-direction gap Xs and the Y-direction gap Ys. A substrate (printed wiring substrate with carrier) 10 is formed (step 14: S14). Thereby, the printed wiring board 10 according to the embodiment of the present invention is manufactured. (S14) in FIG. 8 shows the Y-direction gap Ys of the power supply line 14 provided in the BB ′ cross section of the printed wiring board 10 shown in FIG. Ys, the power supply line crossing part 14a, and a part of the two Y-direction power supply line parts 14c are shown.

(Example)
Next, examples of the present invention will be described, but the present invention is not limited to these examples. The effect of the printed wiring board according to the above-described embodiment of the present invention will be described clearly by way of examples of the present invention.

(Production of printed wiring board)
First, it is used for Examples 1 to 3 and Comparative Examples 1 to 5 having a power supply line provided with an X-direction gap Xs and a Y-direction gap Ys shown in Table 1 below by the method shown in FIGS. A printed wiring board to be manufactured was prepared. Next, bumps provided in each section (corresponding to the section 21 in FIG. 1A) of the manufactured printed wiring board and solder chip electrodes were soldered, and the semiconductor chip was mounted on the printed wiring board. .

  Specifically, the power supply line of the printed wiring board used in Example 1, Example 2, and Comparative Examples 1 to 3 is the power supply of the printed wiring board 10 shown in FIGS. Similarly to the line 14, the feed line cross part (corresponding to the reference numeral 14 a in FIG. 1B) separated by the X direction gap Xs and the Y direction gap Ys shown in Table 1 below, and the X direction feed line part (see FIG. 1 (b) corresponding to reference numeral 14b) and a Y-direction power supply line portion (corresponding to reference numeral 14c in FIG. 1 (b)).

  Further, the power supply line of the printed wiring board used in Example 3 and Comparative Example 4 is as shown in Table 1 below, similarly to the power supply line 14 of the printed wiring board 60 shown in FIGS. 4 (a) and 4 (b). The feed line cross part (corresponding to reference numeral 14a in FIG. 4B) and the X-direction feed line part (corresponding to reference sign 14b in FIG. 4B) separated by the X-direction gap Xs and the Y-direction gap Ys shown in FIG. And a Y-direction power supply line portion (corresponding to reference numeral 14c in FIG. 4B).

  Further, the feed line of the printed wiring board used in Comparative Example 5 is an X-direction feed line without the feed line crossing portion (corresponding to reference numeral 14a in FIG. 1B) in FIGS. 1A and 1B. Section (corresponding to reference numeral 14b in FIG. 1B) and a Y-direction feeding line section (corresponding to reference numeral 14c in FIG. 1B), and the spacing between the X-direction feeding line sections is shown in Table 1 below. In the X-direction gap Xs shown in FIG. 2, the interval between the Y-direction power supply line portions is the Y-direction gap Ys shown in Table 1 below.

(Judgment of the state of the printed circuit board near the intersection)
In the printed wiring board on which the semiconductor chips according to Examples 1 to 3 and Comparative Examples 1 to 5 are mounted, the printed wiring board in the vicinity of the intersection where the dicing lines in the X direction and the Y direction intersect (hereinafter referred to as the intersection vicinity portion). The state was judged. If the corner of the semiconductor chip and the part of the circuit pattern are in contact with each other due to the rise in the vicinity of the intersection, or if the tape base material is cracked or wrinkled, the semiconductor chip Table 1 below shows the determination results, assuming that there is no contact between the corner portion of the substrate and the circuit pattern and there is no crack or wrinkle in the tape substrate, and that the case is good (◯).

  The material of the power supply line of the printed wiring board used in Examples 1 to 3 and Comparative Examples 1 to 5 is copper, and the material of the semiconductor chip used in Examples 1 to 3 and Comparative Examples 1 to 5 is Silicon. Further, the thickness, thermal linear expansion coefficient, and elastic modulus of the semiconductor chip, power supply line, and tape base material (corresponding to the insulating layer 47 in FIGS. 6 to 8) used in Examples 1 to 3 and Comparative Examples 1 to 5 are as follows. The results are shown in Table 2 below. Further, the X-direction length X1 of the semiconductor chips used in Examples 1 to 3 and Comparative Examples 1 to 5 was 4800 (μm), and the Y-direction length Y1 was 3910 (μm). Further, the X-direction length X2 of the section of the printed wiring board was 5100 (μm), and the Y-direction length Y2 was 4210 (μm). Further, the soldering temperature at the time of soldering was 260 ° C., and the temperature change ΔT from room temperature (20 ° C.) was 240 ° C. Further, the width W of the power supply line was set to 75 (μm).

  As shown in Table 1, in the printed wiring board on which the semiconductor chips according to Examples 1 to 3 were mounted, the state of the printed wiring board in the vicinity of the intersection was good (◯).

  Specifically, in the printed wiring board on which the semiconductor chip according to the first and second embodiments is mounted, the relational expression (5) described above is within a range that satisfies the relational expressions (1) to (4) described above. And an X-direction gap Xs and a Y-direction gap Ys that satisfy (6) are formed to form a feed line cross section, a linear X-direction feed line section, and a linear Y-direction feed line section with the intersection as the center of intersection. As a result, the swell in the vicinity of the intersection did not occur, and therefore contact between the corner portion of the semiconductor chip and the circuit pattern did not occur. Also, no cracks or wrinkles were generated on the tape base material.

  Further, in the printed wiring board on which the semiconductor chip according to the third embodiment is mounted, X satisfying the above relational expressions (7) and (8) in a range satisfying the above relational expressions (11) to (14). By providing the direction gap Xs and the Y direction gap Ys, and forming the feed line cross section with the intersection as the intersection center, the linear X-direction feed line section, and the linear Y-direction feed line section, the vicinity of the intersection Therefore, the contact between the corner portion of the semiconductor chip and the circuit pattern did not occur. Also, no cracks or wrinkles were generated on the tape base material.

  In the printed wiring board on which the semiconductor chip according to Comparative Examples 1 to 5 was mounted, the state of the printed wiring board in the vicinity of the intersection was defective (x).

  Specifically, in the printed wiring board on which the semiconductor chip according to Comparative Examples 1 to 3 is mounted, the relational expressions (5) and (6) are not satisfied, that is, the X-direction gap Xs and the Y-direction gap. Since Ys is narrow, the extension of the printed wiring board portion provided with the power supply line caused by the difference in thermal expansion coefficient cannot be absorbed by the gap portion of the printed wiring board, and the vicinity of the intersection of the printed wiring board rises. Oops. As a result, the corner portion of the semiconductor chip and the circuit pattern come into contact with each other.

  Further, in the printed wiring board on which the semiconductor chips according to Comparative Example 4 and Comparative Example 5 are mounted, the relational expressions (5) and (6) are not satisfied, that is, the X-direction gap Xs and the Y-direction gap Ys. Therefore, the tape base material of the printed wiring board is greatly deformed, and cracks and wrinkles are generated in the tape base material of the printed wiring board.

  From the above, the power supply line is provided due to the difference in the coefficient of thermal expansion between the material used for the power supply line generated when the semiconductor chip is mounted on the printed wiring board and the material used for the electronic device. The expansion of the printed wiring board portion is absorbed by the gap portion of the printed wiring board by providing the X-direction gap Xs and the Y-direction gap Ys in the power supply line 14, thereby preventing the swell of the vicinity of the intersection. Can do. Therefore, it is possible to prevent contact between the corner portion of the semiconductor chip and a part of the circuit pattern, which is generated due to the rise in the vicinity of the intersection, and it is possible to prevent malfunction caused by this contact.

10, 60: Printed circuit board 11: External connection electrode 12: Electronic device connection terminal (bump)
13: Circuit pattern 14: Feed line 14a: Feed line cross section 14b: X direction feed line section 14c: Y direction feed line section 20: Dicing line 21: Section 30: Semiconductor chip 45: Peelable copper foil 46: Surface electrode layer 47 : Insulating layer 48: Wiring pattern 49: Metal base layer Xs: X direction gap Ys: Y direction gap

Claims (6)

A printed wiring board in which a circuit pattern is formed in the section, which is used by being cut into a section corresponding to the electronic device after mounting a plurality of electronic devices,
An external connection electrode for electrical connection with the external electrode;
An electronic device connection terminal electrically connected to the electronic device;
The circuit pattern for conducting the external connection electrode and the electronic device connection terminal;
A feed line electrically connected to the circuit pattern, provided on a plurality of dicing lines set in the X direction and the Y direction which are two orthogonal directions for cutting into the section;
With
The feed line includes an X-direction gap Xs provided on the dicing line in the X direction at a distance d1 and a distance d2 in the + X direction and the −X direction from the intersection, and in the + Y direction and the −Y direction from the intersection. A feeding line cross section having the intersection as the center of intersection, separated by a Y-direction gap Ys provided on the dicing line in the Y direction, which is separated by a distance d3 and a distance d4, respectively, and an X-direction feeding in a linear X direction A line part and a Y-direction power supply line part in the Y direction of the line shape,
The width of the power supply line is W,
The thermal linear expansion coefficient of the material of the electronic device is α1 (1 / ° C.), the thermal linear expansion coefficient of the material of the power supply line is α2 (1 / ° C.),
The length of the electronic device in the X direction is X1 (μm), the length in the Y direction is Y1 (μm),
The length in the X direction of the section is X2 (μm), the length in the Y direction is Y2 (μm),
ΔT (° C.) is the temperature change of each of the electronic device and the power supply line when the electronic device is mounted on the compartment via the electronic device connection terminal.

The distance d1 and the distance d2 are

Satisfy the relational expression of
The distance d3 and the distance d4 are

Satisfy the relational expression of
The X-direction gap Xs and the Y-direction gap Ys are:

A printed wiring board characterized by satisfying the relational expression: A printed wiring board in which a circuit pattern is formed in the section, which is used by being cut into a section corresponding to the electronic device after mounting a plurality of electronic devices,
An external connection electrode for electrical connection with the external electrode;
An electronic device connection terminal electrically connected to the electronic device;
The circuit pattern for conducting the external connection electrode and the electronic device connection terminal;
A feed line electrically connected to the circuit pattern, provided on a plurality of dicing lines set in the X direction and the Y direction which are two orthogonal directions for cutting into the section;
With
The feed line includes an X-direction gap Xs provided on the dicing line in the X direction at a distance d1 and a distance d2 in the + X direction and the −X direction from the intersection, and in the + Y direction and the −Y direction from the intersection. A feeding line cross section having the intersection as the center of intersection, separated by a Y-direction gap Ys provided on the dicing line in the Y direction, which is separated by a distance d3 and a distance d4, respectively, and an X-direction feeding in a linear X direction A line part and a Y-direction power supply line part in the Y direction of the line shape,
The width of the power supply line is W,
The thermal linear expansion coefficient of the material of the electronic device is α1 (1 / ° C.), the thermal linear expansion coefficient of the material of the power supply line is α2 (1 / ° C.),
The length of the electronic device in the X direction is X1 (μm), the length in the Y direction is Y1 (μm),
The length in the X direction of the section is X2 (μm), the length in the Y direction is Y2 (μm),
The temperature change of each of the electronic device and the power supply line when the electronic device is mounted in the compartment via the electronic device connection terminal is defined as ΔT (° C.), and the interval between the adjacent electronic devices in the X direction Is Dx, and the interval in the Y direction between the adjacent electronic devices is Dy,

The distance d1 and the distance d2 are

Satisfy the relational expression of
The distance d3 and the distance d4 are

Satisfy the relational expression of
The X-direction gap Xs and the Y-direction gap Ys are:

A printed wiring board characterized by satisfying the relational expression: The X-direction gap Xs and the Y-direction gap Ys are

The printed wiring board according to claim 1, wherein the relational expression is satisfied.   The printed circuit board according to claim 1, wherein the circuit pattern and the power supply line are formed of the same metal layer.   The printed circuit board according to claim 1, wherein the electronic device connection terminal is formed by plating.   The printed wiring board according to claim 1, wherein the external connection electrode is formed by plating.

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