JP2011222791A - Method for manufacturing module substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a module substrate that can surely connect terminal electrodes thereon maintaining coplanarity without short circuit.SOLUTION: There is provided a method for manufacturing a module substrate 1 having at least one surface mounted with a plurality of electronic components 12, 12, .... A plurality of terminal connection substrates 14, 14, ... are mounted on one surface of the module substrate 1, in which a plurality of terminal electrodes 142, 142, ... passing through two opposing surfaces of an insulator 141 are arranged and one end of the terminal electrodes 142, 142, ... protrudes from one surface of the insulator 141 by a predetermined length. The one end of the terminal electrodes 142, 142, ... is polished so that all portions of the plurality of terminal electrodes 142, 142, ... protruding from the one surface of the insulator 141 are set equal in height from the surface of the module substrate 1.

Description

  The present invention relates to a method of manufacturing a module substrate by dividing a collective substrate on which a plurality of electronic components are mounted on one side or both sides and cutting out a plurality of module substrates from the collective substrate.

  In recent years, with the reduction in size and weight of electronic devices, the module substrate itself mounted on the electronic device is also required to be reduced in size and weight. For this reason, electronic components are mounted on both sides of the module substrate using lead terminals, solder balls, cavity structures, and the like, thereby reducing the size and weight.

  Patent Document 1 discloses a method for manufacturing a semiconductor device that can be inexpensively mounted on both sides without forming a cavity structure or the like. That is, a plurality of connection electrodes integrated by a connecting plate are stacked and fixed on a module substrate on which electronic components are mounted, and the connecting plate is removed by polishing to form a connecting electrode. Accordingly, even when the connecting plate is inclined because a plurality of connection electrodes are fixed to the module substrate by solder or the like, for example, the coplanarity of the module substrate is maintained by polishing until the connecting plate is removed. be able to.

Japanese Patent No. 3960479

  However, in the method of manufacturing a semiconductor device disclosed in Patent Document 1, since it is necessary to remove the connecting plate by polishing, if the connecting plate cannot be sufficiently polished, There was a problem that connection failure might occur.

  Further, the connection plate has a relatively long connection electrode exposed, and the connection electrode may be deformed in handling such as a taping process before the connection plate is mounted on the module substrate. For this reason, there is a possibility that adjacent connection electrodes may be short-circuited.

  This invention is made | formed in view of such a situation, and it aims at providing the manufacturing method of the module board which can connect reliably, without short-circuiting terminal electrodes, maintaining coplanarity.

  In order to achieve the above object, a method for manufacturing a module substrate according to a first aspect of the present invention is a method for manufacturing a module substrate in which a plurality of electronic components are mounted on at least one surface, and a plurality of terminal electrodes penetrating two opposing surfaces of an insulator. A first step of mounting a plurality of terminal connection substrates on one surface of the module substrate, each terminal electrode projecting a predetermined length from one surface of the insulator, and a plurality of the terminal electrodes. And a second step of grinding one end of the terminal electrode so that a portion protruding from one surface of the insulator has the same height from the one surface of the module substrate.

  In the module substrate manufacturing method according to the second invention, in the first invention, the predetermined length is a length obtained by subtracting a height of the insulator from a design height from one surface of the module substrate. It is the above.

  The module substrate manufacturing method according to a third aspect of the present invention is characterized in that, in the first or second aspect, the terminal connection substrate has a resist printed between the plurality of terminal electrodes.

  According to a fourth aspect of the present invention, there is provided a method for manufacturing a module substrate according to any one of the first to third aspects, wherein the plurality of modules are mounted on the module substrate after the first step, instead of the second step. The electronic component and the terminal connection substrate are sealed with a resin, and a polishing step of polishing an upper surface of the sealed resin and one end side of the terminal electrode is included.

  According to a fifth aspect of the present invention, there is provided a method for manufacturing a module substrate according to the fourth aspect, further comprising a step of forming an NC electrode with a conductive paste after the polishing step.

  According to a sixth aspect of the present invention, there is provided the method for manufacturing a module substrate according to the fourth or fifth aspect, further comprising a step of rewiring the upper surface of the sealed resin after the polishing step.

  According to a seventh aspect of the present invention, there is provided the method for manufacturing a module substrate according to any one of the fourth to sixth aspects, wherein the resin that seals the plurality of electronic components has the same composition as the insulator of the terminal connection substrate. It is characterized by being.

  In the first invention, a terminal connection substrate is prepared in which a plurality of terminal electrodes penetrating two opposing surfaces of an insulator are arranged, and one end side of the terminal electrode protrudes from a surface of the insulator by a predetermined length. Electronic components are mounted on one or both sides of the module substrate, and a plurality of terminal connection substrates are mounted on one surface of the module substrate. The one end side of the terminal electrode is ground so that the portions protruding from one surface of the insulator of the plurality of terminal electrodes have the same height from the one surface of the module substrate. When the terminal electrode is ground, since the terminal electrode is supported by the insulator, the terminal electrode can be stably ground and the coplanarity can be maintained. Moreover, since the terminal electrode is supported by the insulator, the terminal electrode is not easily deformed, and there is little possibility that adjacent terminal electrodes are short-circuited.

  In the second invention, the predetermined length at which the one end side of the terminal electrode protrudes from one surface of the insulator is equal to or longer than the design height from one surface of the module substrate minus the height of the insulator. Thus, it is possible to secure a grinding allowance and maintain coplanarity.

  In the third invention, since the terminal connection substrate has a resist printed between the plurality of terminal electrodes, the terminal electrodes are not easily deformed by grinding, and there is little possibility that adjacent terminal electrodes are short-circuited. Further, the step between the terminal electrodes on the side where the terminal electrodes of the terminal connection substrate protrude can be filled, and the attraction during mounting is enhanced.

  In the fourth invention, the plurality of electronic components mounted on the module substrate and the terminal connection substrate are resin-sealed, and the coplanarity is maintained by simultaneously polishing the upper surface of the sealed resin and one end side of the terminal electrode. It becomes possible. Moreover, the drop strength is improved by resin sealing, and the reliability of the entire module substrate is improved.

  In the fifth invention, after the upper surface of the sealed resin is polished, the NC electrode is formed with a conductive paste, so that the impact when the module substrate is dropped can be dispersed and the drop strength can be improved. It becomes.

  In the sixth invention, after polishing the upper surface of the sealed resin, wiring is again performed on the upper surface of the resin, so that the position of the external electrode can be arranged at a position different from the position of the terminal electrode of the terminal connection board. Become.

  In the seventh invention, since the resin for sealing a plurality of electronic components has the same composition as the insulator of the terminal connection substrate, the mutual adhesion is strong and the strength of the entire module substrate is improved.

  According to the above configuration, when the terminal electrode is ground, since the terminal electrode is supported by the insulator, it can be ground stably and coplanarity can be maintained. Moreover, since the terminal electrode is supported by the insulator, the terminal electrode is not easily deformed, and there is little possibility that adjacent terminal electrodes are short-circuited.

It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line which shows the structure of the terminal connection board arrange | positioned at the module board which concerns on Embodiment 1 of this invention. It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line which shows the manufacturing process of the terminal connection board arrange | positioned at the module board which concerns on Embodiment 1 of this invention. It is a perspective view which shows an example of the division position of the terminal connection board arrange | positioned at the module board which concerns on Embodiment 1 of this invention. It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line which shows the structure at the time of the resist printing of the terminal connection board | substrate arrange | positioned at the module board which concerns on Embodiment 1 of this invention. It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line which shows the structure in the case of using a thick copper foil on both surfaces of the terminal connection board | substrate arrange | positioned at the module board which concerns on Embodiment 1 of this invention. Section in the surface which cut | disconnects the terminal electrode located in a line which shows the structure when the thick copper foil of the terminal-connection board | substrate arrange | positioned at the module board | substrate which concerns on Embodiment 1 of this invention is embedded in the insulator. FIG. It is a perspective view which shows the manufacturing process of the module board which concerns on Embodiment 1 of this invention. It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line which shows the grinding process of the module substrate which concerns on Embodiment 1 of this invention. It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line which shows the manufacturing process of the terminal connection board arrange | positioned at the module board which concerns on Embodiment 2 of this invention. It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line which shows the manufacturing process of the module board which concerns on Embodiment 2 of this invention. It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line which shows the process in the case of forming NC electrode of the module board which concerns on Embodiment 2 of this invention. It is sectional drawing in the surface which cut | disconnects the terminal electrode located in a line in the case of giving rewiring to the module board which concerns on Embodiment 2 of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Embodiment 1)
FIG. 1 is a cross-sectional view of a terminal connection substrate arranged on a module substrate according to Embodiment 1 of the present invention, taken along a plane cutting terminal electrodes arranged in a row. The terminal connection substrate 14 according to the first exemplary embodiment of the present invention includes an insulator 141 made of ceramic, glass, epoxy resin, or the like, and a plurality of rows arranged in a row through two opposing surfaces of the insulator 141. Terminal electrodes 142, 142,...

  FIG. 2 is a cross-sectional view of the terminal electrodes 142, 142,... Arranged in a row, showing a manufacturing process of the terminal connection substrate 14 arranged on the module substrate according to the first embodiment of the present invention. is there. First, as shown in FIG. 2A, through holes 32, 32,... Are formed by laser processing at desired positions on an insulating substrate 31 made of ceramic, glass, epoxy resin, or the like. Then, the wall surfaces of the formed through holes 32, 32,... Are plated by electroless copper plating, and the plated through holes 32, 32,.

  Next, as shown in FIG. 2 (b), copper foils 33, 34 having a predetermined thickness are attached to both surfaces having openings of through holes 32, 32,. In the first embodiment, the thickness of the copper foil 34 is 38 μm, and the thickness of the copper foil 33 is 250 μm. Note that in the case where the insulating substrate 31 is formed of an epoxy resin or the like, it may be a highly rigid substrate or a flexible substrate. Further, the copper foils 33 and 34 are not limited to pure copper, but may be copper alloys such as phosphor bronze and brass. Since it is more workable than pure copper, burrs, elongation, etc. are unlikely to occur when cutting with a dicer or grinding the top surface.

  Further, the thick copper foil 33 may be formed by plating. For example, it is sufficient to apply a copper foil 33 having a thickness of about 150 μm and to perform plating on the copper foil 33 to a thickness of 200 to 400 μm. The thickness of the copper foil 33 is preferably 100 to 500 μm, particularly preferably 200 to 400 μm. When the thickness is 500 μm or more, the grinding amount on the upper surface becomes excessive, and a considerable processing time is required, so that it is difficult to reduce the cost.

  When the thickness of the copper foil 33 is 200 μm or more, since the height difference between both ends of the terminal connection substrate 14 due to the inclination of the terminal connection substrate 14 at the time of mounting is larger, the terminal electrodes 142 and 142 even when the upper surface is ground. ... will not disappear. When the thickness of the copper foil 33 is 400 μm or less, the height protruding from the insulating substrate 31 is relatively low, so that the terminal electrode 142 is not easily deformed.

  Next, as shown in FIG. 2 (c), etching is performed so as to form terminal electrodes 142, 142,... At the same positions of the attached copper foils 33,. In the first embodiment, columnar terminal electrodes 142, 142,... Whose cross-sectional shape is a rectangle having a side of 0.3 mm are formed and arranged at intervals of 0.6 mm.

  Then, as shown in FIG. 2D, plating films 35, 35,... Are formed on the surfaces of the terminal electrodes 142, 142,. As shown in FIG. 2F, the insulating substrate 31 is divided by a dicer at the dividing positions 36, 36,... So as to have a predetermined number of terminal electrodes 142, 142,. A suitable terminal connection board 14 is cut out. The cut out terminal connection board 14 is mounted at a predetermined position on the module board. The plating films 35, 35,... Are formed by wet plating or the like of Ni / Sn or Ni / Au. Moreover, you may give a rust prevention process. This is because the progress of oxidation of copper used for the terminal electrode 142 can be suppressed, and the solder wettability during mounting can be improved.

  FIG. 3 is a perspective view showing an example of a dividing position of the terminal connection board 14 arranged on the module board according to Embodiment 1 of the present invention. As shown in FIG. 3A, terminal electrodes 142, 142,... Are arranged in a matrix on the insulating substrate 31, and divided according to the desired number and arrangement of terminal electrodes. As a result, not only the terminal connection substrate 14 (FIG. 3B) in which the terminal electrodes 142, 142,. d)) Cutting out an arbitrary terminal connection board 14 such as a terminal connection board 14 in which terminal electrodes 142, 142,... are arranged in a plurality of rows, a rectangular terminal connection board 14 (FIG. 3E), and the like. Is possible.

  A resist may be printed between the terminal electrodes 142 and 142. FIG. 4 shows a configuration at the time of resist printing of the terminal connection substrate 14 arranged on the module substrate according to the first embodiment of the present invention, on a surface for cutting the terminal electrodes 142, 142,. It is sectional drawing. As shown in FIG. 4, resists 143, 143,... Are printed so as to fill in the space between the terminal electrodes 142, 142,. By doing in this way, the level | step difference between the terminal electrodes 142 and 142 becomes small, and the attraction | suction at the time of mounting of the terminal connection board | substrate 14 increases. Since the resists 143, 143,... Are printed, the resists 143, 143,... Are also ground together with the terminal electrodes 142, 142,.

  Further, thick copper foils 33 and 33 may be attached to both surfaces having openings of through holes 32, 32,... Formed in the insulating substrate 31. FIG. 5 shows a configuration in the case where thick copper foils 33, 33 are used on both surfaces of the terminal connection substrate 14 arranged on the module substrate according to the first embodiment of the present invention, and the terminal electrodes 142, 142,. .. Is a cross-sectional view taken along the plane of cutting.

  As shown in FIG. 5, the both sides of the terminal connection substrate 14 are etched using thick copper foils 33 and 33. Since the copper foils 33 and 33 on both sides have the same thickness, it is not necessary to change the etching conditions on each side. Etching is enough. Therefore, the manufacturing cost can be reduced. Of course, the copper foils 33 and 33 are not limited to pure copper, and may be copper alloys such as phosphor bronze and brass. Since the workability is higher than that of pure copper, burrs, stretches, etc. are unlikely to occur when cutting with a dicer or polishing the top surface.

  Further, the terminal electrodes 142, 142,... May be partially embedded in the insulator 141. FIG. 6 is a row showing a configuration in which the terminal electrodes 142, 142,... Of the terminal connection substrate 14 arranged on the module substrate according to the first embodiment of the present invention are partially embedded in the insulator 141. It is sectional drawing in the surface which cut | disconnects the terminal electrodes 142, 142, ... located in a line.

  As shown in FIG. 6, the terminal electrodes 142, 142,... On one side of the terminal connection substrate 14 are partially embedded in the insulator 141. In this way, the adhesion between the terminal electrodes 142, 142,... And the insulator 141 is increased, and the drop strength of the module substrate is improved.

  FIG. 7 is a perspective view showing a manufacturing process of the module substrate according to Embodiment 1 of the present invention. First, as shown in FIG. 7A, solder is printed on a desired surface electrode among the surface electrodes of the base substrate 10. The base substrate 10 is not particularly limited, such as an LTCC (Low Temperature Co-fired Ceramics) substrate or an organic substrate.

  When producing the base substrate 10 using an LTCC substrate, first, a ceramic slurry is coated on a PET film and then dried to produce a ceramic green sheet having a thickness of 10 to 200 μm. A via hole having a diameter of about 0.1 mm is formed on the prepared ceramic green sheet from the PET film side by a mold, a laser, or the like.

  Next, an electrode paste kneaded with a metal powder containing silver or copper as a main component, a resin, and an organic solvent is filled in the via hole and dried. Then, an equivalent electrode paste is screen printed in a desired pattern on the ceramic green sheet and dried.

In this state, a plurality of ceramic green sheets are stacked and pressure-bonded at a pressure of 100 to 1500 kg / cm ² and a temperature of 40 to 100 ° C. After that, when the electrode paste is mainly composed of silver, it is fired at about 850 ° C. in air, and when copper is the main component, it is fired at about 950 ° C. in a nitrogen atmosphere. Alternatively, the base substrate 10 is formed by depositing Ni / Au or the like by wet plating or the like.

  Next, as shown in FIG. 7B, electronic components 12, 12,... Are mounted on the surface electrodes of the base substrate 10 on which the solder is printed, and the terminal connection substrates 14, 14,.・ I will also implement. The terminal connection substrates 14, 14,... Are arranged and mounted in the peripheral portion of the base substrate 10 and the gaps where the electronic components 12, 12,. Moreover, it cannot be overemphasized that the electronic components 12, 12, ... can be arrange | positioned not only on the surface of the base substrate 10 but on the back surface.

  Then, as shown in FIG. 7C, the terminal electrodes 142, 142,... Of the terminal connection board 14 are formed so as to have a design height from one surface of the module board 1 by using a roller blade 11 or the like. One end side (upper surface) of is ground. FIG. 8 shows a surface for cutting the terminal electrodes 142, 142,... Arranged in a row, showing a grinding process of the terminal electrodes 142, 142,... Of the terminal connection substrate 14 according to the first embodiment of the present invention. FIG.

  As shown in FIG. 8A, depending on the state of the solders 81, 81,..., The terminal connection substrate 14 having the terminal electrodes 142, 142,. Therefore, when the upper surfaces of the terminal electrodes 142, 142,... Are ground by the roller type blade 11 or the like, the height that can eliminate the height difference between the both ends of the terminal connection board 14 due to the inclination of the terminal connection board 14 is It is necessary that the electrodes 142, 142,.

  Therefore, in the first embodiment, one end side of each of the terminal electrodes 142, 142,... Is designed from the one surface of the insulator 141, and the length protruding from the one surface of the module substrate 1 (base substrate 10) is designed. The terminal connection substrate 14 is manufactured so as to be equal to or longer than the length obtained by subtracting the height of the insulator 141 from the height H. The design height H is higher than the height of the electronic component having the highest height among the electronic components 12, 12,. Thereby, the grinding allowance by the roller type blade 11 etc. can be secured, and the coplanarity can be maintained. Further, since the terminal electrodes 142, 142,... Are supported by the insulator 141, the terminal electrodes 142, 142,... Are not easily deformed, and the adjacent terminal electrodes 142, 142 may be short-circuited. Few.

  After grinding with the roller type blade 11 or the like, the module of the terminal electrodes 142, 142,... As shown in FIG. The height from one surface of the substrate 1 can be aligned with the design height H of the module substrate 1. That is, since the terminal electrodes 142, 142,... Have a predetermined height, they do not disappear even when the upper surface is ground by the roller blade 11 or the like.

  After grinding with the roller blade 11 or the like, copper is exposed on the upper surfaces of the terminal electrodes 142, 142,. 7 (d), the module substrate 1 is completed by applying Ni / Au plating to the tips of the terminal electrodes 142, 142,...

  As described above, according to the first embodiment, one end side of the terminal electrodes 142, 142,... Is designed from the one surface of the insulator 141 to the design height H from one surface of the module substrate 1 (base substrate 10). By manufacturing the terminal connection substrate 14 so as to project a length equal to or longer than the length obtained by reducing the height of the insulator 141, the grinding allowance can be secured and the coplanarity can be maintained. Therefore, one end side of the terminal electrodes 142, 142,... Can be ground to the height of the mounted electronic components 12, 12,..., And the module substrate 1 itself as a product can be downsized. It becomes possible.

  Further, since the terminal electrodes 142, 142,... Are supported by the insulator 141, the terminal electrodes 142, 142,... Are not easily deformed, and the adjacent terminal electrodes 142, 142 may be short-circuited. Less.

  Further, since the solder wets up to the side surfaces of the terminal electrodes 142, 142,... And the contact area increases, it is possible to increase the bonding force with the mother board. The insulator 141 of the terminal connection substrate 14 also has an effect of preventing excessive solder wetting.

(Embodiment 2)
The configuration of the terminal connection board 14 arranged on the module board 1 according to the second embodiment of the present invention is the same as that of the first embodiment. The difference from the first embodiment is that a ceramic substrate 31 a is used as the insulating substrate 31. The other parts are denoted by the same reference numerals, and detailed description thereof is omitted. Moreover, after mounting the electronic components 12, 12,..., The resin sealing is performed, and the upper surface is polished.

  FIG. 9 is a cross-sectional view taken along a plane cutting the terminal electrodes 142, 142,... Arranged in a row, showing a manufacturing process of the terminal connection substrate 14 arranged on the module substrate 1 according to the second embodiment of the present invention. It is. First, a ceramic slurry is coated on a PET film and dried, and then a ceramic green sheet 91 having a thickness of 10 to 200 μm is formed. Moreover, after coating acrylic resin on PET film and making it dry, the resin sheet 92 of thickness 10-200 micrometers is created.

  The resin material to be coated is not limited to acrylic resin, but styrene acrylic, polyolefin, polyester, polypropylene, butyral, etc., resin that disappears when burned, or when it becomes hot It is sufficient to select at least one resin material from a resin that is decomposed into monomers. That is, these resin materials may be used alone or in combination.

  Next, the via holes 93 and 94 are penetrated from the PET film side by punching with a mold, laser processing or the like in the produced ceramic green sheet 91 and the resin sheet 92. The via holes 93, 93,... On the resin sheet 92 side form terminal electrodes 142, 142,. Therefore, it is processed to have a diameter of 0.2 to 0.4 mm.

  On the other hand, the via holes 94, 94,... On the ceramic green sheet 91 side need only be electrically connected, so that a diameter of 0.1 mm is sufficient. Of course, it may be processed so as to have a diameter of 0.2 to 0.4 mm, similarly to the via holes 93, 93,.

  Then, the processed via holes 93, 93,..., 94, 94,... Are filled with electrode paste 95 kneaded with metal powder, resin, and organic solvent mainly composed of silver or copper and dried. Thereafter, an equivalent electrode paste is printed on the ceramic green sheet 91 by screen printing or the like in a desired electrode pattern and dried.

The via holes 93, 93,... Filled with the electrode paste 95 and the via holes 94, 94,... Are overlapped with each other so that the ceramic green sheet 91 and the resin sheet 92 are positioned downward. And pressure-bonded at a pressure of 100 to 1500 kg / cm ² and a temperature of 40 to 100 ° C. FIG. 9A is a cross-sectional view showing a state in which the ceramic green sheet 91 and the resin sheet 92 are pressure-bonded.

  Thereafter, when the electrode paste 95 contains silver as a main component, the resin sheet 92 disappears by baking at about 850 ° C. in air and when the electrode paste 95 contains copper as a main component at about 950 ° C. in a nitrogen atmosphere. To do. Therefore, the electrode pastes 95, 95,... Filled in the via holes 93, 93,. FIG. 9B is a cross-sectional view showing a state in which the terminal electrodes 142, 142,... Are formed by firing.

  Then, as shown in FIG. 9C, Ni / Sn or Ni / Au or the like is formed on the terminal electrodes 142, 142,... On both the front and back surfaces by wet plating or the like, and a dicer (not shown) is used. The terminal connection board 14 having a desired number of terminal electrodes is cut out as shown in FIG.

  Similar to the first embodiment, the resin sheet 92 preferably has a thickness of 100 to 500 μm, particularly 200 to 400 μm. When the thickness is 500 μm or more, the amount of polishing after resin sealing becomes excessive, and a considerable processing time is required, which makes it difficult to reduce the cost.

  When the thickness of the resin sheet 92 is 200 μm or more, it is larger than the height difference between both ends of the terminal connection substrate 14 due to the inclination of the terminal connection substrate 14 at the time of mounting. The terminal electrodes 142, 142,. Further, when the thickness of the resin sheet 92 is 400 μm or less, the height protruding from the insulator 141 (ceramic sheet 91) is relatively low, so that the terminal electrode 142 is not easily deformed.

  FIG. 10 is a cross-sectional view taken along the line of the terminal electrodes 142, 142,... Arranged in a row, showing the manufacturing process of the module substrate 1 according to Embodiment 2 of the present invention. First, as shown in FIG. 10A, the electronic components 12, 12,... Are mounted on the surface electrodes of the base substrate 10 on which the solder is printed, and the terminal connection substrates 14, 14,. Also implement. Further, the electronic components 12, 12,... Can be arranged not only on the front surface of the base substrate 10, but also on the back surface. In the second embodiment, it is mounted on both the front and back sides. The terminal connection substrates 14, 14,... Are inclined and mounted depending on the degree of solder 81, 81,.

And as shown in FIG.10 (b), the resin sheets 100 and 100 are laminated on both front and back. As the resin sheet 100, one obtained by molding a composite resin on a PET film and semi-curing it is used. The composite resin is a composite material in which a thermosetting resin such as epoxy, phenol, or cyanate is mixed with an inorganic filler such as Al ₂ O ₃ , SiO ₂ , or TiO ₂ . When the resin sheets 100 and 100 are laminated, the thickness of the laminated resin layer can be ensured by arranging a spacer having a desired thickness around the module substrate 1 to be cut out. The base substrate 10 in this state is put in an oven, and the resin sheets 100 and 100 are completely cured.

  In the second embodiment, as described above, the resin sheets 100 and 100 are collectively laminated and cured on both the front and back surfaces, but the front and back sides may be separately laminated and cured.

  Next, as illustrated in FIG. 10C, the upper surface of the base substrate 10 that is resin-sealed with the resin sheets 100 and 100 is polished with a roller-type blade 11 or the like. The upper surfaces of the terminal connection substrates 14, 14,... Are polished even when the heights of the terminal electrodes 142, 142,. By doing so, coplanarity can be maintained.

  10 (d), Ni / Au plating 101, 101,... Is applied to the upper surfaces of the protruding terminal electrodes 142, 142,. Of course, the NC electrode may be formed using a conductive paste before the Ni / Au plating 101, 101,... By forming the NC electrode, the number of terminals connected to the mother board is increased, and the impact is easily dispersed when the module board 1 is dropped, so that the drop strength of the module board 1 is improved.

  FIG. 11 is a cross-sectional view taken along a plane that cuts terminal electrodes 142, 142,... Arranged in a row, showing a process for forming NC electrodes of module substrate 1 according to Embodiment 2 of the present invention. is there. As shown in FIG. 11, before performing Ni / Au plating on the upper surfaces of the protruding terminal electrodes 142, 142,..., The NC electrodes 111, 111,. As shown in FIG. 11, Ni / Au plating 112, 112,... Is formed on the upper surfaces of the protruding terminal electrodes 142, 142,. Apply. Thereby, since the number of terminals connected to the mother board can be increased, the strength against impact when the module board 1 is dropped is improved.

  Further, rewiring may be performed before applying Ni / Au plating. The terminal electrodes 142, 142,... May be provided according to the position where the terminal connection substrate 14 is disposed. In this case, the peripheral edge of the module substrate 1 and the electronic components 12, 12,. The terminal electrodes 142, 142,. Therefore, rewiring is performed so that the terminal electrode 142 is disposed at a desired position from the peripheral portion of the module substrate 1 and the gap portion where the electronic components 12, 12,.

  The rewiring is formed on the upper surface of the sealed resin by screen printing, inkjet, or the like. Alternatively, the seed wiring pattern may be formed and then formed by electroless plating. A solder resist may be printed around the re-wired terminal electrodes 142, 142,... To form bumps for external connection.

  FIG. 12 is a cross-sectional view taken along a plane for cutting terminal electrodes 142, 142,... Arranged in a row when rewiring is performed on module substrate 1 according to Embodiment 2 of the present invention. As shown in FIG. 12, a solder resist 121 is printed around the rewiring pattern, and bumps 122, 122,... Are formed according to the rewiring pattern. As a result, the position of the external electrode is not limited to the position of the terminal electrodes 142, 142,.

  As described above, according to the second embodiment, one end side of the terminal electrodes 142, 142,... Is designed from the one surface of the insulator 141 to the design height H from one surface of the module substrate 1 (base substrate 10). By manufacturing the terminal connection substrate 14 so as to project a length equal to or longer than the length obtained by reducing the height of the insulator 141, the grinding allowance can be secured and the coplanarity can be maintained. Therefore, the upper surface of the resin-sealed resin can be polished to the height of the mounted electronic components 12, 12,..., And the module substrate 1 itself as a product can be downsized.

  Further, since the terminal electrodes 142, 142,... Are supported by the resin sheet 100, the terminal electrodes 142, 142,... Are not easily deformed, and the adjacent terminal electrodes 142, 142 may be short-circuited. Few.

  It should be noted that the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications and substitutions are possible within the scope of the gist of the present invention. For example, the insulator 141 of the terminal connection substrate 14 and the resin sheet 100 for resin-sealing the mounted electronic components 12, 12,... May have the same composition. In this case, the degree of adhesion with the resin sheet 100 for resin-sealing the mounted electronic components 12, 12,... Increases, and the strength of the module substrate 1 as a whole is improved.

DESCRIPTION OF SYMBOLS 1 Module substrate 10 Base substrate 12 Electronic component 14 Terminal connection substrate 141 Insulator 142 Terminal electrode 100 Resin sheet

Claims (7)

In a method for manufacturing a module substrate in which a plurality of electronic components are mounted on at least one side,
A plurality of terminal electrodes penetrating through two opposing surfaces of the insulator are arranged, and a terminal connection board in which one end side of the terminal electrode protrudes from the one surface of the insulator by a predetermined length is provided on one surface of the module substrate. A first step of mounting a plurality,
And a second step of grinding one end side of the terminal electrode so that the portions protruding from one surface of the insulator of the plurality of terminal electrodes have the same height from the one surface of the module substrate. A method for manufacturing a module substrate.   2. The method of manufacturing a module substrate according to claim 1, wherein the predetermined length is equal to or more than a length obtained by subtracting a height of the insulator from a design height from one surface of the module substrate. .   The method for manufacturing a module substrate according to claim 1, wherein a resist is printed between the terminal electrodes on the terminal connection substrate.   After the first step, instead of the second step, a plurality of electronic components mounted on the module substrate and the terminal connection substrate are resin-sealed, and the top surface of the sealed resin and one end of the terminal electrode The method for manufacturing a module substrate according to claim 1, further comprising a polishing step of polishing the side.   5. The method for manufacturing a module substrate according to claim 4, further comprising a step of forming an NC electrode with a conductive paste after the polishing step.   6. The method of manufacturing a module substrate according to claim 4, further comprising a step of performing wiring again on the upper surface of the sealed resin after the polishing step.   The method for manufacturing a module substrate according to claim 4, wherein the resin that seals the plurality of electronic components has the same composition as the insulator of the terminal connection substrate.

Images