JP2011203710A - Defect correction device, defect tracking method, and defect tracking program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To repair a defect, while suppressing increase of the number of processes and redundancy of a working time.SOLUTION: This defect correction device 100 including a microscope part 110 for acquiring an image in which a part of a workpiece W 10 is enlarged, and a laser repair head 120 for irradiating the workpiece W 10 with laser light spatially modulated for defect repair based on an image acquired by the microscope part 110, also includes a control part 101 for determining whether a defect D included in the image acquired by the microscope part 110 is extended to the outside of the image, tracking the defect so that a part extended to the outside of the image is drawn into a visual filed region R1 of the microscope part 110, when the defect D is extended to the outside of the image, and setting one or more shot regions to the defect D included in the image acquired by the microscope part 110. The control part 101 sets one or more shot regions to the defect D included in the image acquired by the microscope part 110 after tracking.

Description

  The present invention relates to a defect correction apparatus, a defect tracking method, and a defect tracking program, and more particularly to a defect correction apparatus, a defect tracking method, and a defect tracking for repairing a patterning error (defect) that occurs during a patterning process on various substrates. Regarding the program.

  Conventionally, a liquid crystal display (LCD), a plasma display panel (PDP), an organic EL (Electro Luminescence) display, a surface-electric electron-emitting device display (SED: Surface-conduction Electro-Plate (Electro-Emitter Electro-Plate), etc.) Display) In the manufacture of various substrates such as substrates, semiconductor wafers, and printed circuit boards, in order to improve the yield, after each patterning process, patterning errors such as wiring short-circuits, connection failures, disconnections, and pattern failures are successively generated. Whether there is a patterning error or not is checked at any time. In the following description, patterning errors are simply referred to as defects.

  As a technique for repairing such a defect, there is a so-called laser repair technique that corrects a defective portion by irradiating a laser beam (see, for example, Patent Documents 1 and 2 below). According to this laser repair technology, it is possible to remove not only the above-described defects but also foreign matters such as particles and resist attached to the substrate surface. In the following description, it is assumed that the foreign matter is also included in the defect. In addition to the laser repair technique, there is a technique for repairing a defect by applying a correction material to the defect with a probe such as a dispenser or a needle (see, for example, Patent Documents 3 and 4 shown below).

JP 2005-103581 A JP 2009-262161 A JP 2006-136864 A JP 2001-166129 A

  By the way, in a normal defect correction technique, the substrate surface after the patterning process is imaged, and an image obtained thereby is analyzed, thereby specifying a defect existing region on the substrate surface. In addition, one or more correction areas to be repaired are allocated to the identified defect area, and repair processing such as laser light irradiation for defect repair and application of correction material by a dispenser or a needle is performed according to this allocation. Is called. Here, in order to specify the defect area more accurately, it is necessary to capture the substrate surface at a relatively high magnification to obtain a high-resolution image. On the other hand, in order to identify a defect area with a light load, it is effective to reduce the number of images to be processed by imaging at a relatively low magnification. Therefore, conventionally, an image of a region that is slightly larger than a repair region (hereinafter referred to as a shot region) that is repaired by a single repair process is taken, and by analyzing the obtained image, a defect region on the substrate surface can be identified. It was specified.

  However, one defect obtained as a repair target is not always included in one image obtained by one photographing. This is because the defect itself is larger than the field of view of the imaging unit, or the defect coordinate system given from the outside and the coordinate system of the imaging unit are displaced due to the positional deviation of the substrate. . In order to repair the entire defect that cannot be captured by one imaging as described above, for example, as in Patent Document 1 described above, the position and range of the entire defect is grasped and the height of the substrate surface is detected in advance. After repairing the defect by the first laser irradiation, the height of the substrate surface is detected again, and it is determined whether or not there is a remaining defect by comparing the height after repair with the height before repair. If there is a defect, it is necessary to take a procedure of repairing the remaining defect by the second and subsequent laser irradiations.

  However, as described above, in the conventional defect correction technology, there is a repair process divided into at least two processes for repairing a defect that cannot be captured by one imaging, and the presence or absence of residual defects that are performed between the processes of the two repair processes. As a result, there has been a problem that the number of processes is greatly increased and the operation becomes complicated, and the time required for the process becomes long.

  Accordingly, the present invention has been made in view of the above problems, and provides a defect correction apparatus, a defect tracking method, and a defect tracking program capable of repairing a defect while suppressing an increase in the number of processes and redundancy in work time. The purpose is to provide.

  In order to achieve such an object, the defect correction apparatus according to the present invention performs an repair process on the target substrate based on an imaging unit that acquires an image obtained by enlarging a part of the target substrate, and the image acquired by the imaging unit. A defect correction device comprising: a defect correction unit; a determination unit that determines whether a defect included in the image acquired by the imaging unit extends to the outside of the image; and the defect When extending outside the image, a tracking unit that tracks a portion that extends outside the image, and one or more correction areas for defects included in the image acquired by the imaging unit A setting unit configured to set the one or more correction regions for defects included in an image acquired by the imaging unit after tracking by the tracking unit. .

  In addition, the defect correction method according to the present invention includes an imaging step of acquiring an enlarged image of a part of the target substrate, and a determination step of determining whether or not the defect included in the image extends outside the image. And a tracking step of tracking a portion extending out of the image when the defect extends out of the image.

  The defect tracking program according to the present invention includes an imaging unit that acquires an image obtained by enlarging a part of an inspection target, and a control unit that controls the relative position between the inspection target and the imaging unit based on the image acquired by the imaging unit. Is a defect tracking program for causing the image capturing unit to acquire an image obtained by enlarging a part of the target substrate, and whether or not the defect included in the image extends beyond the image. The control unit is caused to execute a determination process for determining whether or not the defect extends outside the image, and a tracking process for tracking a portion extending outside the image.

  According to the present invention, it becomes possible to allocate a laser beam irradiation area for defect repair to a defect after tracking a portion outside the visual field area in the defect, so it is necessary to divide the laser beam irradiation process into a plurality of processes. Thus, it is possible to realize a defect correcting device, a defect tracking method, and a defect tracking program capable of repairing a defect while suppressing an increase in the number of steps and an increase in work time.

FIG. 1 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in a defect correction apparatus according to Embodiment 1 of the present invention. FIG. 2 is a block diagram showing a schematic configuration of the defect correction apparatus according to the first embodiment. FIG. 3 is a flowchart showing a schematic flow of the defect tracking method according to the first embodiment. FIG. 4 is a flowchart showing a schematic flow of the tracking process according to the first embodiment. FIG. 5 is a conceptual diagram for explaining an outline of the fall tracking method when integration processing is required in the first embodiment. FIG. 6A is a diagram illustrating an example of the integration processing result according to the first embodiment. FIG. 6B is a diagram illustrating another example of the integration processing result according to the first embodiment. FIG. 7 is a conceptual diagram for explaining an outline of the defect tracking method incorporated in the defect correcting apparatus according to the second embodiment of the present invention. FIG. 8 is a flowchart showing a schematic flow of the defect tracking method according to the second embodiment. FIG. 9 is a flowchart showing a schematic flow of the tracking process according to the second embodiment. FIG. 10 is a conceptual diagram for explaining an outline of the defect tracking method incorporated in the defect correcting apparatus according to the third embodiment of the present invention. FIG. 11 is a flowchart showing a schematic flow of the defect tracking method according to the third embodiment. FIG. 12 is a flowchart showing a schematic flow of the tracking process according to the third embodiment. FIG. 13 is a conceptual diagram for explaining the outline of the defect tracking method incorporated in the defect correcting apparatus according to the fourth embodiment of the present invention. FIG. 14 is a flowchart showing a schematic flow of the defect tracking method according to the fourth embodiment. FIG. 15 is a flowchart showing a schematic flow of the tracking process according to the fourth embodiment. FIG. 16 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in a defect correction apparatus according to Embodiment 5 of the present invention (part 1). FIG. 17 is a conceptual diagram for explaining the outline of the defect tracking method incorporated in the defect correcting apparatus according to the fifth embodiment (No. 2). FIG. 18 is a conceptual diagram for explaining the outline of the defect tracking method incorporated in the defect correcting apparatus according to the fifth embodiment (No. 3). FIG. 19 is a flowchart showing a schematic flow of the defect tracking method according to the fifth embodiment. FIG. 20 is a flowchart showing a schematic flow of the tracking process according to the fifth embodiment. FIG. 21 is a conceptual diagram for explaining an outline of the defect tracking method incorporated in the defect correcting apparatus according to the modified example 5-1 of the fifth embodiment. FIG. 22 is a conceptual diagram for explaining the outline of the defect tracking method incorporated in the defect correcting apparatus according to the sixth embodiment. FIG. 23 is a flowchart showing a schematic flow of the defect tracking method according to the sixth embodiment. FIG. 24 is a flowchart showing a schematic flow of the tracking process according to the sixth embodiment. FIG. 25 is a schematic flowchart showing a part of the defect tracking method according to the seventh embodiment of the present invention. FIG. 26 is a diagram illustrating an example of an inspection image according to the seventh embodiment. FIG. 27 is a diagram showing an example of repair coordinates set for the defect shown in FIG. FIG. 28 is a diagram showing an example of a GUI image according to the seventh embodiment. FIG. 29 is a diagram showing an example of a shot area set for the defect shown in FIG. FIG. 30 is a diagram showing an example of a shot area according to the seventh embodiment. FIG. 31 is a schematic diagram showing an example of the prohibited area according to the eighth embodiment of the present invention. FIG. 32 is a schematic flowchart showing a part of the defect tracking method according to the eighth embodiment. FIG. 33 is a diagram showing an example of a laser irradiation shape calculated in the eighth embodiment. FIG. 34 is a diagram showing an example of a shot area according to the eighth embodiment. FIG. 35 is a diagram showing an example of a mask image according to the ninth embodiment of the present invention. FIG. 36 is a diagram showing a flow when assigning a shot area to a defect in the ninth embodiment (No. 1). FIG. 36 is a diagram showing a flow when assigning a shot area to a defect in the ninth embodiment (No. 2). FIG. 38 is a diagram showing an example of a shot area set for a defect in the ninth embodiment. FIG. 39 is a diagram illustrating an overlap between an inspection image to which a shot area is assigned and a reference image including a prohibited area according to the ninth embodiment. FIG. 40 is a diagram showing an example of a shot area according to the ninth embodiment. FIG. 41 is a diagram showing an example of an inspection image according to the eleventh embodiment of the present invention. FIG. 42 is a diagram in which shot areas are superimposed on the inspection image shown in FIG. FIG. 43 is a diagram showing an example of a reference image according to the eleventh embodiment. FIG. 44 is a diagram showing an example of a shot area according to the eleventh embodiment.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings. In the following description, each drawing only schematically shows the shape, size, and positional relationship to the extent that the contents of the present invention can be understood. Therefore, the present invention is illustrated in each drawing. It is not limited to only the shape, size, and positional relationship. Moreover, the numerical value illustrated below is only a suitable example of this invention, Therefore, this invention is not limited to the illustrated numerical value.

(Embodiment 1)
Hereinafter, a defect correction device, a defect tracking method, and a defect tracking program according to Embodiment 1 of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in the defect correction apparatus 100 (see FIG. 2) according to the first embodiment. In the first embodiment, defect coordinates specified by an external inspection unit such as an AOI (AUTOMATED OPTICAL INSPECTION) system are input to the defect correction apparatus 100. In order to distinguish this coordinate from other coordinates, it is called a defect coordinate. One defect coordinate is given to one defect. In the following description, the coordinate is 2 on the workpiece surface or the stage upper surface where the origin is the reference position provided on the upper surface of the stage on which the substrate (hereinafter referred to as a workpiece) is placed or the casing that supports the stage. Dimensional coordinates.

  In the defect tracking method executed by the defect correction apparatus 100 according to the first embodiment, as shown in FIG. 1A, first, a work is based on the input defect coordinates on the surface of a repair target substrate (hereinafter referred to as a work). And the stage 116 is controlled so that the defect appears in the visual field region R1 of the microscope unit in the defect correcting apparatus 100. Subsequently, the microscope unit analyzes the image obtained by imaging the visual field region R1, thereby specifying the region (recognition defect region) D1 of the defect D contained in the image. However, the region to be analyzed may be a specific recognition region R2 smaller than the visual field region R1 corresponding to the entire image, not the entire image. A plurality of recognition regions R2 may be set in the visual field region R1.

  Further, in this defect tracking method, the coordinates of the center of gravity C1 of the recognized defect area D1 specified above are specified (see FIG. 1A), and subsequently, outside the visual field area R1 (or recognition area R2) of the defect D. A tracking process S1 for tracking a portion extending to (unrecognized defect area D2) is executed. In the first embodiment, as the tracking process S1, as shown in FIG. 1B, the center of gravity C1 specified in FIG. 1A is drawn into the center of the visual field region R1 by the microscope unit of the defect correction apparatus 100. Take the case of performing as an example. As shown in FIG. 1 (b), at least part or all of the non-recognized defect area D2 outside the visual field area R1 of the defect D is drawn into the visual field area R1 due to the pulling in. Laser repair for the part becomes possible. However, this tracking process S1 may be executed only when, for example, the calculated coordinates of the center of gravity C1 are included near the outer end of the recognition region R2, that is, within the recognition region R2 and other than the center region R3.

  Subsequently, in this defect tracking method, as shown in FIG. 1C, the recognition defect area D1a included in the image obtained by imaging the visual field area R1 after being pulled in is specified, and this recognition defect area A repair coordinate calculation process S2 for calculating center coordinates (repair coordinates) c1 to c5 of one or more shot areas (correction areas) p1 to p5 allocated to D1a is executed. Thereafter, as shown in FIG. 1 (d), a repair process S3 for repairing a defective portion on the workpiece surface is performed by sequentially irradiating the defect D with a laser according to the calculated repair coordinates c1 to c5.

  Through the operation as described above, in the first embodiment, after the portion outside the visual field region R1 in the defect D is drawn into the visual field region R1, the shot regions p1 to p5 with respect to the defect D (repair coordinates c1 to c5). Can be allocated. As a result, even when the entire defect D cannot be captured by one imaging, it becomes possible to continuously irradiate the entire defect D with a laser, resulting in an increase in the number of strokes and a redundant work time. It is possible to repair the entire defect D while suppressing it.

  Next, the defect correction apparatus 100 according to the first embodiment will be described in detail with reference to the drawings. FIG. 2 is a block diagram showing a schematic configuration of the defect correction apparatus according to the first embodiment. As shown in FIG. 2, the defect correction apparatus 100 is placed on a stage 116 that can move in an XY plane as a moving unit, a stage control unit 104 that controls horizontal movement of the stage 116, and the stage 116. Various types of image processing are performed on image data acquired by the microscope unit 110 for observing the workpiece W10 from above, a laser repair head 120 for outputting laser light for defect repair that irradiates the workpiece W10, and the microscope unit 110 The image processing unit 102, a storage unit 107 that stores various programs including various defect tracking programs, which are programs for realizing the defect tracking method according to the first embodiment, various parameters, and the like, various programs read from the storage unit 107, and By executing the parameters, the defect tracking method according to the first embodiment is realized and defect repair is performed. A control unit 101 that controls each part in the apparatus 100, and a light beam cross-sectional shape of a laser beam for defect repair output from the laser repair head 120 under the control of the control unit 101 (a cross section perpendicular to the optical axis of the laser light) A user interface including an area setting unit 103 that adjusts the shape), a display unit 105 that displays images and various information acquired by the microscope unit 110, and an input unit 106 that allows a user to input various operations and settings to the defect correction apparatus 100. And comprising.

  In the above configuration, the work W10 to be repaired is, for example, an FPD glass substrate, a semiconductor substrate, a printed circuit board, or the like. The workpiece W10 is placed on the stage 116. Innumerable holes are provided on the mounting surface of the stage 116. These countless holes are held on the stage 116 by a fixing member (not shown) in a state where the workpiece W10 is floated by a gas supplied from a pump (not shown). Alternatively, the infinite number of holes can be connected to a vacuum pump (not shown), and the work W10 placed on the stage 116 can be sucked and fixed to the stage 116 by suction from the infinite number of holes. is there. In addition to the above, mechanical means such as a support pin and a clamp mechanism may be used as the holding means for holding the workpiece W10 on the stage 116 as described above.

  The microscope unit 110 includes a light source 112 that illuminates the workpiece W10 on the stage 116, and an imaging element 111 such as a CCD sensor or a CMOS sensor that images the illuminated workpiece W10, and a part of the workpiece W10 that is a target substrate. It functions as an imaging unit that acquires an enlarged image. Illumination light output from the light source 112 of the microscope unit 110 passes through the relay lens M16 and is reflected by the half mirror M14, and then passes through the objective lens M15 as light coaxial with the observation optical axis AX with respect to the work W10. Illuminate. Further, the image of the workpiece W10 illuminated in this way is imaged by the observation optical system including the objective lens M15, the half mirror M14, the relay lens M13, and the imaging lens M12 arranged along the observation optical axis AX. For example, the image is magnified several times to several tens of times on the light receiving surface 111. Note that the field of view of the image sensor 111 through this observation optical system corresponds to the field of view R1 shown in FIG. This visual field region R1 is wider than one shot region. Furthermore, the area illuminated by the light source 112 is at least wider than the visual field area R1. Furthermore, at least the visual field region R1 is illuminated substantially uniformly from above by illumination light from the light source 112.

  Image data acquired by the image sensor 111 is input to the image processing unit 102. The image processing unit 102 performs various types of image processing on the input image data, and then inputs the processed image data to the display unit 105. Thereby, the image of the visual field region R1 acquired by the microscope unit 110 is displayed on the display unit 105, for example, in substantially real time.

  In addition, the stage control unit 104 controls the coordinates (defect coordinates, barycentric coordinates, repair coordinates, etc.) input from the control unit 101 under the control of the control unit 101 to be positioned at the center in the visual field region R1 of the microscope unit 110. Next, the stage 116 is moved horizontally. Accordingly, the relative position between the microscope unit 110 and the workpiece W10 is controlled so that the coordinates (defect coordinates, barycentric coordinates, repair coordinates, etc.) input from the control unit 101 are positioned at the center in the visual field region R1 of the microscope unit 110. Is done.

  The laser repair head 120 outputs a laser light source 121 that outputs a laser beam (hereinafter referred to as a repair laser beam) applied to the workpiece W10, and a light beam sectional shape (hereinafter referred to as a laser sectional shape) of the laser light from the laser light source 121. As a light beam shaping means for shaping into a desired shape, a micromirror array 123 that is a spatial light modulator, repair laser light from the laser light source 121, and light for adjusting the field of view of the observation optical system (hereinafter referred to as guide light) LED 122 that outputs, and functions as a laser irradiation unit that irradiates the workpiece W10 with laser light spatially modulated for defect repair based on the image acquired by the microscope unit 110. The guide light from the LED 122 is reflected by the half mirror M <b> 21 so that its optical axis coincides with the optical axis of the laser light source 121. Further, the repair laser light from the laser light source 121 and the guide light from the LED 122 are reflected by the half mirror M24 after passing through the high reflection mirror M22, the minute mirror array 123, and the high reflection mirror M23. The axis coincides with the observation optical axis AX. Therefore, the repair laser light and the guide light reflected by the half mirror M24 are irradiated from above onto the workpiece W10 on the stage 116 along the observation optical axis AX via the relay lens M13, the half mirror M14, and the objective lens M15. . For example, DMD (Digital Micromirror Device: registered trademark of Texas Instruments) may be used for the micromirror array 123.

  Note that the micromirror array 123 that is a spatial light modulator has a configuration in which micromirrors that are one of microdevices are arranged in a two-dimensional array, for example. The reflection angle of each micromirror can be switched to at least one of an on angle and an off angle under the control of the control unit 101. The on-angle is an angle at which the repair laser beam reflected by the micromirror in this state is projected onto the work W10 on the stage 116, and the off-angle is a repair laser reflected by the micromirror in this state. This is an angle at which light is irradiated to a laser damper (not shown) such as a light shielding member or an absorption member (not shown) provided outside the optical path as unnecessary light. Therefore, the cross-sectional shape of the repair laser beam projected onto the workpiece W10 can be controlled by switching the reflection angle of each of the micromirrors arranged in a two-dimensional array to either the on angle or the off angle. It is. Thereby, it becomes possible to adjust the cross-sectional shape of the repair laser beam from the laser light source 121 to the shape of the repair pattern and to irradiate the workpiece W10. This repair pattern is a repair pattern that irradiates a repair laser beam in addition to the normal wiring pattern. For example, when repairing a defect such as a defective pattern removal, a minute pattern corresponding to a normal wiring area in the shot area is used. The pattern is such that the mirror is turned off and the micromirrors corresponding to other regions are turned on.

  The setting of the repair pattern may be set in accordance with the defect shape in addition to the setting according to the normal wiring pattern as described above. In this case, the cross-sectional shape of the repair laser beam is adjusted to the defect shape, the minute mirror corresponding to the defect region is set to the on angle, and the minute mirror corresponding to the region other than the defect region is set to the off angle.

  The region setting unit 103 controls the cross-sectional shape of the repair laser light to the shape of the repair pattern by controlling the reflection angles of the micro mirrors of the micro mirror array 123 according to the repair location pattern input from the control unit 101. .

  Further, as described above, the control unit 101 executes the various programs and parameters read from the storage unit 107, thereby realizing the defect tracking method according to the first embodiment and controlling each unit in the defect correction apparatus 100. . Here, the defect tracking method executed by the control unit 101 will be described in detail with reference to the drawings. FIG. 3 is a flowchart showing a schematic flow of the defect tracking method according to the first embodiment.

  As shown in FIG. 3, in this defect tracking method, the control unit 101 first selects one of one or more defect coordinates input from the outside (step S101), and sets the selected defect coordinates as the selected defect coordinates. Based on this, the stage control unit 104 controls the stage 116 and moves the defect so that it enters the visual field region R1 of the microscope unit 110 (step S102). Note that the defect coordinate selection order is, for example, a list order of defect coordinates inputted from outside as a list, an order close to the origin in the coordinate system of the microscope unit 110, and an optical axis position (current position) of the microscope unit 110. Various modifications can be made, for example, in order.

  Next, the control unit 101 causes the image processing unit 102 to read out the electric charges accumulated in the imaging device 111 of the microscope unit 110, thereby acquiring image data of the visual field region R1 after the stage movement (step S103). The acquired image data is input to the control unit 101 after image processing by the image processing unit 102. Subsequently, the control unit 101 analyzes the input image data to recognize a defect area (recognized defect area D1) included in the image data (step S104), and the identified recognized defect area D1. The coordinates of the center of gravity C1 are calculated (step S105: center of gravity specifying unit / center of gravity specifying step / center of gravity specifying).

  Next, the control unit 101 determines whether or not the defect D needs to be drawn, that is, whether or not the calculated coordinates of the center of gravity C1 need to be drawn into the center of the visual field region R1 (step S106: determination unit / Determination step / determination process). This determination corresponds to determining whether or not the defect D included in the image acquired by the microscope unit 110 extends to the outside of the image. For example, the coordinates of the center of gravity C1 are the center region in the recognition region R2. This can be done based on whether it is located outside R3. As a result of the determination in step S106, when the defect D needs to be pulled in (Yes in step S106), the control unit 101 performs a tracking process (corresponding to the tracking process S1 in FIG. 1) that pulls the coordinates of the center of gravity C1 into the center of the visual field region R1. ) Is executed (step S107: tracking unit / tracking step / tracking process). The details of the tracking process will be described later with reference to FIG.

  Next, the control unit 101 calculates one or more repair coordinates so that the entire defect area (recognized defect area D1a) recognized by the tracking process is covered by one or more shot areas without a gap. A calculation process (corresponding to the repair coordinate calculation process S2 in FIG. 1) is executed (step S108: setting unit / setting step / setting process), and the calculated repair coordinates are stored in the storage unit 107 (step S109). The repair coordinates calculated in step S108 are coordinates in the coordinate system set for the stage 116 or the entire workpiece W10. Further, adjacent shot areas allocated to the recognition defect area D1a may partially overlap each other. Furthermore, it is preferable that the shot area to be allocated covers a wide area around the recognition defect area D1a. As a result, it is possible to set a defect portion that cannot be specified by image recognition in the vicinity of the defect D as a laser repair target.

  Next, the control unit 101 newly calculates the coordinates of the centroid C1 of the recognition defect area D1a after being pulled in (step S110: centroid specifying unit / centroid specifying step / centroid specifying process), and the coordinates of the new centroid C1. As in step S106, it is determined whether or not the defect D needs to be drawn (step S111: determination unit / determination step / determination process). As a result of this determination, if the defect D needs to be pulled in (Yes in step S111), the control unit 101 returns to step S107, pulls the new coordinates of the center of gravity C1 into the center of the visual field region R1, and the subsequent processing Execute. On the other hand, if it is not necessary to pull in the defect D as a result of the determination in step S111 (No in step S111), the control unit 101 integrates adjacent repair coordinates among the repair coordinates stored in the storage unit 107. A coordinate integration process is executed (step S112: integration unit / integration step / integration process). The coordinate integration process will be described in detail later with reference to FIGS. 5, 6A, and 6B.

  Next, the control unit 101 determines the repair coordinates after integration as the final repair coordinates (step S113), and then sequentially selects the final repair coordinates, with the repair coordinates as the center. By irradiating the shot area with the repair laser beam spatially modulated by the micromirror array 123, the repair process (corresponding to the repair process S3 in FIG. 1) for the entire recognition defect area D1a is executed (step S114).

  If it is not necessary to pull in the defect D as a result of the determination in step S106 (No in step S106), the control unit 101 calculates one or more repair coordinates for repairing the entire recognized defect area D1 (step S116). ), Which is stored in the storage unit 107 (step S117), the process proceeds to step S114, and a repair process (corresponding to the repair process S3 in FIG. 1) is performed on the entire recognition defect area D1.

  In addition, after step S114, the control unit 101 determines whether or not the processing for all the defect coordinates input from the outside is completed (step S115). When the processing is completed (Yes in step S115), this operation is performed. Exit. On the other hand, when the processing for all the defect coordinates has not been completed (No in step S115), the control unit 101 returns to step S101, selects one of the unselected defect coordinates, and thereafter the same. Perform the action.

  Next, the tracking process shown in step S107 of FIG. 3 will be described in detail with reference to the drawings. FIG. 4 is a flowchart showing a schematic flow of the tracking process according to the first embodiment. As shown in FIG. 4, in the tracking process according to the first embodiment, first, the control unit 101 makes the coordinates of the center of gravity C1 specified in step S105 of FIG. 3 be the center of the visual field region R1 of the microscope unit 110. Then, the stage 116 is moved via the stage control unit 104 (step S1071). Subsequently, as in step S103 of FIG. 3, the control unit 101 causes the image processing unit 102 to read out the electric charges accumulated in the imaging device 111 of the microscope unit 110, thereby causing the image data of the visual field region R1 after the stage movement. Is acquired (step S1072). The acquired image data is input to the control unit 101 after image processing by the image processing unit 102. Subsequently, the control unit 101 analyzes the input image data to recognize a defect area (recognized defect area D1a) included in the image data (step S1073), and then returns to the operation of FIG. To do.

  With this tracking process, in the first embodiment, it becomes possible to draw a defect portion outside the visual field area R1 at the previous imaging into the visual field area R1. That is, it is possible to track and recognize even a defect that was outside the recognition area. As a result, the repair process for the entire defect D can be performed.

  Next, the coordinate integration process shown in step S112 of FIG. 3 will be described in detail with reference to the drawings. FIG. 5 is a conceptual diagram for explaining an outline of the defect tracking method when coordinate integration processing is required in the first embodiment. FIG. 6A is a diagram illustrating an example of the coordinate integration processing result according to the first embodiment, and FIG. 6B is a diagram illustrating another example of the coordinate integration processing result according to the first embodiment.

  First, as shown in FIG. 5A, the centroid C11 of the recognized defect area D11 included in the previous visual field area R1 that has moved the stage 116 based on the defect coordinates input from the outside is the center area in the recognition area R2. When positioned outside R3, the control unit 101 executes a tracking process S11 that draws the center of gravity C11 into the center of the visual field region R1 (corresponding to step S107 in FIG. 3). As a result, as shown in FIG. 5B, the center of gravity C11 is located at the center of the visual field region R1, and a portion outside the visual field region R1 in the defect D is newly included in the visual field region R1. Recognized as a defective area D12. Subsequently, as illustrated in FIG. 5C, the control unit 101 executes repair coordinate calculation processing S <b> 12 for calculating the repair coordinates c <b> 11 to c <b> 13 of the shot area to be allocated to the recognized defect area D <b> 12 recognized after the pull-in. (Corresponding to step S108 in FIG. 3). The repair coordinates c11 to c13 calculated by the repair coordinate calculation process S12 are stored in the storage unit 107 (corresponding to step S109 in FIG. 3).

  Next, as shown in FIG. 5D, the control unit 101 executes a center-of-gravity coordinate calculation process S13 for calculating the coordinates of the center of gravity C12 with respect to the recognition defect area D12 after the pull-in (Step S110 in FIG. 3). Equivalent). Since the centroid C12 calculated by the centroid coordinate calculation processing S13 is located outside the central region R3 in the recognition region R2 (corresponding to Yes in step S111 in FIG. 3), the control unit 101 uses the centroid C12 as the visual field region R1. A tracking process S14 for drawing in the center of is performed (corresponding to step S107 in FIG. 3). As a result, as shown in FIG. 5 (e), the center of gravity C12 is located at the center of the visual field region R1, and the portion of the defect D that is outside the visual field region R1 is newly included in the visual field region R1. Recognized as a defective area D13. Subsequently, as shown in FIG. 5F, the control unit 101 executes a repair coordinate calculation process S15 for calculating the repair coordinates c21 to c24 of the shot area to be allocated to the recognized defect area D13 recognized after the pull-in. (Corresponding to step S108 in FIG. 3), the repair coordinates c21 to c24 calculated thereby are stored in the storage unit 107 (corresponding to step S109 in FIG. 3).

  Next, as shown in FIG. 5G, the control unit 101 executes a center-of-gravity coordinate calculation process S16 for calculating the coordinates of the center of gravity C13 for the recognition defect area D13 after the pull-in (in step S110 of FIG. 3). Equivalent). Here, since the center of gravity C13 calculated by the center-of-gravity coordinate calculation processing S16 is located in the center region R3 in the recognition region R2 (corresponding to No in step S111 in FIG. 3), the control unit 101 uses the storage unit described above. The coordinate integration process S17 for integrating the repair coordinates c11 to c13 and c21 to c24 stored in 107 is executed again (corresponding to step S112 in FIG. 3). Thereby, as shown in FIG. 5 (h), the repair coordinates that are close to each other among the repair coordinates stocked in the storage unit 107 are integrated to obtain final repair coordinates c31 to c34.

  Next, the coordinate integration process S17 (corresponding to step S112 in FIG. 3) in FIG. 5 will be described in detail with reference to the drawings. In the example shown in FIG. 5, as a result of the operation shown in FIGS. 5A to 5G, the repair coordinates c11 to c13 obtained by the repair coordinate calculation process S12 and the repair coordinates obtained by the repair coordinate calculation process S15 are stored in the storage unit 107. c21 to c24 are stored. Here, paying attention to the repair coordinates c11 and c21, as shown in FIG. 6A, they are close to each other. Whether or not two or more repair coordinates are close to each other can be determined by, for example, setting a threshold value for the separation distance between the repair coordinates in advance. It can be configured to determine that they are close.

  Therefore, in the coordinate integration process S17 according to the first embodiment, the repair coordinates c11 and c21 are integrated. As a result, one final repair coordinate c31 is derived from the repair coordinates c11 and c21. For example, as shown in FIG. 6A, various methods such as a method of using the midpoint of these connecting line segments as the repair coordinates after integration can be applied to the integration of the repair coordinates of the two points. Further, in addition to the repair coordinates c11 and c21, three or more repair coordinates including the repair coordinates c41 are integrated, for example, as shown in FIG. 6B, the coordinates of the center of gravity of a polygon formed by connecting the points. Various methods such as a method of setting the repair coordinate c51 after integration, and a method of using the center or the center of gravity of the existence range of a plurality of repair coordinates as the repair coordinates after integration are applicable.

(Embodiment 2)
Hereinafter, a defect correction device, a defect tracking method, and a defect tracking program according to Embodiment 2 of the present invention will be described in detail with reference to the drawings. In the above-described first embodiment, as the tracking process, the coordinates of the center of gravity C1 of the recognition defect area D1 in the visual field area R1 are obtained, and the defect extending outside the visual field area R1 is drawn into the center of the visual field area R1. An example of tracking D is given. On the other hand, in the second embodiment, repair coordinates are allocated to a portion previously recognized as a defect in the visual field region R1, and the defect D extending outside the visual field region R1 is tracked by drawing in the repair coordinates. An example is given below.

  FIG. 7 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in the defect correction apparatus 100 (see FIG. 2) according to the second embodiment. In the second embodiment, the defect correction apparatus 100 is the same as the defect correction apparatus 100 (see FIG. 2) according to the first embodiment.

  In the defect tracking method executed by the defect correction apparatus 100 according to the second embodiment, as shown in FIG. 7A, first, the vicinity of the input defect coordinates on the surface of the workpiece W10 is within the visual field region R1 of the microscope unit 110. After imprinting, the microscope unit 110 analyzes the image obtained by imaging the visual field region R1 to identify the recognition defect region D21 in the visual field region R1, and then identifies the recognition defect region D21. By executing the repair coordinate calculation process, one or more repair coordinates C201 and C202 are allocated.

  Next, in this defect tracking method, one of the repair coordinates C201 and C202 (repair coordinates C201) set for the recognized defect area D21 is selected, and then the defect portion extends outside the visual field area R1. The tracking process S21 for tracking is executed. In the second embodiment, as the tracking process S21, the selected repair coordinate C201 is drawn into the center of the visual field region R1 of the microscope unit 110. By this drawing, as shown in FIG. 7B, at least a part or the whole of the portion of the defect D outside the visual field region R1 is drawn into the visual field region R1. However, this tracking process S21 may be executed only when, for example, the selected repair coordinate C201 is included near the outer end of the recognition region R2, that is, within the recognition region R2 and other than the central region R3.

  Subsequently, in this defect tracking method, as shown in FIG. 7C, the recognition defect area D201 included in the image obtained by imaging the visual field area R1 after being pulled in is specified, and this recognition defect area A repair coordinate calculation process S22 for calculating center coordinates (repair coordinates) c201 to c205 of one or more shot areas p201 to p205 allocated to D201 is executed. The calculated repair coordinates c201 to c205 are stored in the storage unit 107.

  Further, in this defect tracking method, an unselected repair coordinate (repair coordinate C202) is selected from the repair coordinates C201 and C202 set for the recognized defect area D21 in FIG. The tracking process S23 (see FIG. 7D) and the repair coordinate calculation process S24 (see FIG. 7E) are executed on the repair coordinates C202 in the same manner as described above. Thereby, one or more repair coordinates c211 to c215 are set for the recognition defect area D202 included in the image obtained by imaging the visual field area R1 after being pulled in, and stored in the storage unit 107. The

  After that, when there are no unselected repair coordinates in the repair coordinates (repair coordinates C201 and C202) set for the recognition defect area D21, the repair coordinates c201 to c205 and c211 to c215 stored in the storage unit 107 are used. The coordinate integration process S25 to be integrated is executed. As a result, as shown in FIG. 7F, the adjacent repair coordinates among the repair coordinates stocked in the storage unit 107 are integrated to obtain final repair coordinates c221 to c225. The coordinate integration process S25 is the same as the process described with reference to FIGS. 5, 6A, and 6B in the first embodiment.

  By the operation as described above, in the second embodiment, as in the first embodiment, the portion outside the visual field region R1 in the defect D is tracked to capture the whole image, and then the shot region p221 is taken with respect to the defect D. ~ P225 (repair coordinates c221 to c225) can be allocated. As a result, even when the entire defect D cannot be captured by one imaging, it becomes possible to continuously irradiate the entire defect D with a laser, resulting in an increase in the number of strokes and a redundant work time. It is possible to repair the entire defect D while suppressing it.

  Next, the defect tracking method executed by the control unit 101 in the second embodiment will be described in detail with reference to the drawings. FIG. 8 is a flowchart showing a schematic flow of the defect tracking method according to the second embodiment. However, in the following description, the same steps as those in FIG. 3 are referred to, and redundant description is omitted.

  As shown in FIG. 8, in this defect tracking method, the control unit 101 first identifies the recognition defect region D21 in the visual field region R1 by going through steps similar to steps S101 to S104 shown in FIG. Subsequently, the control unit 101 assigns one or more repair coordinates C201 and C202 by executing a repair coordinate calculation process for the identified recognition defect area D21 (step S201), and then continues to the repair coordinates. Of C201 and C202, repair coordinates within the recognition area R2 and outside the center area R3 are registered in the storage unit 107 as repair coordinates to be pulled in (hereinafter referred to as tracking target repair coordinates) (step S202). In this example, as illustrated in FIG. 7A, both the repair coordinates C201 and C202 are registered as tracking target repair coordinates.

  Next, the control unit 101 determines whether it is necessary to pull in the defect D, that is, whether the tracking target repair coordinates are registered in the storage unit 107 (step S203: determination unit / determination step / determination process). . This determination corresponds to determining whether or not the defect D included in the image acquired by the microscope unit 110 extends beyond the image. As a result of this determination, when it is necessary to pull in the defect D (Yes in step S203), the control unit 101 selects one of the repair coordinates C201 and C202 that are tracking target repair coordinates (here, the repair coordinates C201). Is selected (step S204), and a tracking process (corresponding to the tracking process S21 in FIG. 7) for drawing the selected repair coordinates C201 into the center of the visual field region R1 is executed (step S205: tracking unit / tracking step / tracking process). . Details of the tracking process will be described later with reference to FIG.

  Next, the control unit 101 performs a repair coordinate calculation process (repair coordinate calculation process S22 in FIG. 7) for the recognized defect area D201 recognized by the tracking process through the same steps as steps S108 and S109 shown in FIG. (Step S108), and the calculated repair coordinates c201 to c205 are stored in the storage unit 107 (step S109).

  Next, the control unit 101 registers the repair coordinates c204 and c205 that need to be drawn in the repair coordinates c201 to c205 calculated in step S108 in the storage unit 107 as tracking target repair coordinates (step S206). Subsequently, the control unit 101 determines whether or not the tracking process for all of the tracking target repair coordinates registered in the storage unit 107 has been completed (step S207: determination unit / determination step / determination process). If not (No in step S207), the process returns to step S204 to select unselected tracking target repair coordinates (repair coordinates C202, c204, or c205). Thereafter, similarly to the repair coordinates C201, a tracking process (corresponding to the tracking process S23 in FIG. 7) and a repair coordinate calculating process (corresponding to the repair coordinate calculating process S24 in FIG. 7) are executed, and the obtained repair coordinates c211 to c215 are obtained. Is stored in the storage unit 107 (steps S204 to S109), and the repair coordinates c212 and c215 that need to be pulled in are registered in the storage unit 107 as tracking target repair coordinates (step S206).

  On the other hand, when the tracking process for all of the tracking target repair coordinates registered in the storage unit 107 has been completed (Yes in Step S207), the control unit 101, like Steps S112 and S113 illustrated in FIG. A coordinate integration process (corresponding to the coordinate integration process S25 in FIG. 7) is performed on the repair coordinates stored in the storage unit 107 (step S112), and the repair coordinates after integration are determined as final repair coordinates. (Step S113). Subsequently, the control unit 101 sequentially selects the final repair coordinates, and irradiates the shot area centered on the repair coordinates with the repair laser light spatially modulated by the micromirror array 123. Repair processing is executed on the entire recognition defect area D1a (step S114).

  As a result of the determination in step S203, if it is not necessary to pull in the defect D (No in step S203), the control unit 101 stores the repair coordinates calculated in step S201 in the storage unit 107 (step S117), and then step The process proceeds to S114, and a repair process is performed on the entire recognition defect area D1. Thereafter, similarly to step S115 in FIG. 3, the control unit 101 determines whether or not the processing for all the defect coordinates input from the outside is completed (step S115), and if completed (Yes in step S115). ), This operation ends. On the other hand, when the processing for all the defect coordinates has not been completed (No in step S115), the control unit 101 returns to step S101, selects one of the unselected defect coordinates, and thereafter the same. Perform the action.

  Next, the tracking process shown in step S205 of FIG. 8 will be described in detail with reference to the drawings. FIG. 9 is a flowchart showing a schematic flow of the tracking process according to the second embodiment. However, in the following description, the same steps as those in FIG. 4 are referred to, and redundant description is omitted.

  As shown in FIG. 9, in the tracking process according to the second embodiment, first, the control unit 101 sets the stage so that the repair coordinates selected in step S <b> 204 in FIG. 8 are the center of the visual field region R <b> 1 of the microscope unit 110. The stage 116 is moved via the control unit 104 (step S2051). Subsequently, similarly to steps S1072 and S1073 shown in FIG. 4, the control unit 101 acquires image data from the image sensor 111 of the microscope unit 110 (step S1072), and then analyzes the acquired image data. Thus, the defect area (recognized defect area D1a) included in the image data is recognized (step S1073), and then the process returns to the operation of FIG.

  With this tracking process, in the second embodiment, it is possible to draw a defect portion outside the visual field area R1 at the previous imaging into the visual field area R1. That is, it is possible to track and recognize even a defect that was outside the recognition area. As a result, the repair process for the entire defect D can be performed.

(Embodiment 3)
Hereinafter, a defect correction device, a defect tracking method, and a defect tracking program according to Embodiment 3 of the present invention will be described in detail with reference to the drawings. In the third embodiment, as tracking processing, by drawing in the center coordinates (hereinafter referred to as side center coordinates) of the line segment where the defect D and each of the four sides of the visual field area R1 (corresponding to an image) intersect, the visual field area R1 is drawn. An example in which the defect D extending outside is tracked will be described.

  FIG. 10 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in the defect correction apparatus 100 (see FIG. 2) according to the third embodiment. In the third embodiment, the defect correction apparatus 100 is the same as the defect correction apparatus 100 (see FIG. 2) according to the first embodiment.

  In the defect tracking method executed by the defect correction apparatus 100 according to the third embodiment, as shown in FIG. 10A, first, the vicinity of the input defect coordinates on the surface of the workpiece W10 is within the visual field region R1 of the microscope unit 110. The center coordinates of the line segment where the defect D and each of the four sides of the visual field region R1 (image) intersect each other by analyzing the image obtained by the microscope unit 110 imaging the visual field region R1. C301 and C302 are calculated.

  Next, in this defect tracking method, one of the calculated side center coordinates C301 and C302 (side center coordinates C301) is selected, and then a tracking process for tracking a defect portion extending outside the visual field region R1. S31 is executed. In the third embodiment, as the tracking process S31, the selected side center coordinate C301 is drawn into the center of the visual field region R1 of the microscope unit 110. By this drawing, as shown in FIG. 10B, at least a part or the whole of the portion of the defect D outside the visual field region R1 is drawn into the visual field region R1. In the tracking process according to the third embodiment, for example, a side that has not intersected with the defect D at least once among the four sides of the visual field region R1 may be excluded from the target. Thereby, it is possible to prevent the tracking process for a large defect that cannot be accommodated in the visual field region R1 at once from being infinitely looped.

  Subsequently, in this defect tracking method, as shown in FIG. 10C, the recognition defect area D301 included in the image obtained by imaging the visual field area R1 after being pulled in is specified, and this recognition defect area A repair coordinate calculation process S32 for calculating center coordinates (repair coordinates) c301 to c305 of one or more shot areas p301 to p305 allocated to D301 is executed. The calculated repair coordinates c301 to c305 are stored in the storage unit 107.

  In this defect tracking method, an unselected side center coordinate (side center coordinate C302) is selected from the side center coordinates C301 and C302 calculated in FIG. 10A, and then the selected side center coordinates C302 is selected. In the same manner as described above, the tracking process S33 (see FIG. 10D) and the repair coordinate calculation process S34 (see FIG. 10E) are executed. Thereby, one or more repair coordinates c311 to c315 are set for the recognition defect area D302 included in the image obtained by imaging the visual field area R1 after being pulled in, and stored in the storage unit 107. The

  Thereafter, when there are no unselected side center coordinates in the side center coordinates (side center coordinates C301 and C302) calculated in FIG. 10A, the repair coordinates c301 to c305 and c311 stored in the storage unit 107 are stored. A coordinate integration process S35 for integrating c315 is executed. As a result, as shown in FIG. 10 (f), adjacent repair coordinates among the repair coordinates stocked in the storage unit 107 are integrated to obtain final repair coordinates c 321 to c 325. The coordinate integration process S35 is the same as the process described with reference to FIGS. 5, 6A, and 6B in the first embodiment.

  By the operation as described above, in the third embodiment, as in the first and second embodiments, a portion outside the visual field region R1 in the defect D is tracked to capture the whole image, and then shot against the defect D. Areas p321 to p325 (repair coordinates c321 to c325) can be allocated. As a result, even when the entire defect D cannot be captured by one imaging, it becomes possible to continuously irradiate the entire defect D with a laser, resulting in an increase in the number of strokes and a redundant work time. It is possible to repair the entire defect D while suppressing it.

  Next, a defect tracking method executed by the control unit 101 in the third embodiment will be described in detail with reference to the drawings. FIG. 11 is a flowchart showing a schematic flow of the defect tracking method according to the third embodiment. However, in the following description, the same steps as those in FIG. 3 are referred to, and redundant description is omitted.

  As shown in FIG. 11, in this defect tracking method, the control unit 101 first identifies a recognized defect region in the visual field region R1 by going through steps similar to steps S101 to S104 shown in FIG. Subsequently, the control unit 101 detects a line segment where the identified recognition defect area intersects with the four sides of the image (field-of-view area R1), and calculates side center coordinates C301 and C302 of the detected line segment (step S102). S301: Center coordinate calculation unit / center coordinate calculation step / center coordinate calculation processing), and the calculated side center coordinates are registered in the storage unit 107 (step S302). Further, the control unit 101 excludes a side that does not intersect with the defect D at the present time from the subsequent processing targets (step S303).

  Next, the control unit 101 determines whether or not the defect D needs to be drawn, that is, whether or not the side center coordinates are registered in the storage unit 107 (step S304: determination unit / determination step / determination process). . This determination corresponds to determining whether or not the defect D included in the image acquired by the microscope unit 110 extends beyond the image. As a result of this determination, when the defect D needs to be pulled in (Yes in step S304), the control unit 101 selects one of the registered side center coordinates C301 and C302 (here, the side center coordinates C301). A tracking process (corresponding to the tracking process S31 in FIG. 10) for pulling the selected side center coordinates C301 into the center of the visual field region R1 is executed (step S306: tracking unit / tracking step / tracking process). . Details of the tracking process will be described later with reference to FIG.

  Next, the control unit 101 performs a repair coordinate calculation process (repair coordinate calculation process S32 in FIG. 10) for the recognized defect area D301 recognized by the tracking process through the same process as steps S108 and S109 shown in FIG. (Step S108), and the calculated repair coordinates c301 to c305 are stored in the storage unit 107 (Step S109).

  Next, the control unit 101 excludes the side that does not intersect with the defect D at the present time from the subsequent processing targets (step S307), and then excludes the recognized defect area recognized by the tracking process in step S306. A line segment intersecting with the four sides of the non-image (field-of-view region R1) is detected, and the center coordinate of the detected line segment is calculated (step S308: center coordinate calculation unit / center coordinate calculation step / center coordinate calculation process) The calculated side center coordinates are registered in the storage unit 107 (step S309). Subsequently, the control unit 101 determines whether or not the tracking process has been completed for all of the side center coordinates registered in the storage unit 107 (step S310: determination unit / determination step / determination process). If not (No in step S310), the process returns to step S305 to select an unselected side center coordinate (side center coordinate C302). Thereafter, similarly to the side center coordinates C301, a tracking process (corresponding to the tracking process S33 in FIG. 10) and a repair coordinate calculating process (corresponding to the repair coordinate calculating process S34 in FIG. 10) are executed, and the obtained repair coordinates c311 to c311 are obtained. c315 is stored in the storage unit 107 (steps S306 to S109), and then the side that does not intersect with the defect D is excluded from the detection target (step S307), and the side center coordinates are calculated (step S308). Is registered in the storage unit 107 (step S309).

  On the other hand, when the tracking processing has been completed for all of the side center coordinates stored in the storage unit 107 (Yes in step S310), the control unit 101 stores the same as in steps S112 and S113 illustrated in FIG. A coordinate integration process (corresponding to the coordinate integration process S25 in FIG. 10) is performed on the repair coordinates stored in the unit 107 (step S112), and the repair coordinates after the integration are determined as final repair coordinates ( Step S113). Subsequently, the control unit 101 sequentially selects the final repair coordinates, and irradiates the shot area centered on the repair coordinates with the repair laser light spatially modulated by the micromirror array 123. Repair processing is executed on the entire recognition defect area D1a (step S114).

  If it is not necessary to pull in the defect D as a result of the determination in step S304 (No in step S304), the control unit 101 performs repair for repairing the recognized defect area D1 as in steps S116 and S117 in FIG. One or more coordinates are calculated (step S116) and stored in the storage unit 107 (step S117). Then, the process proceeds to step S114, and the repair process for the entire recognized defect area D1 (corresponding to the repair process S3 in FIG. 1). ). Thereafter, similarly to step S115 in FIG. 3, the control unit 101 determines whether or not the processing for all the defect coordinates input from the outside is completed (step S115), and if completed (Yes in step S115). ), This operation ends. On the other hand, when the processing for all the defect coordinates has not been completed (No in step S115), the control unit 101 returns to step S101, selects one of the unselected defect coordinates, and thereafter the same. Perform the action.

  Next, the tracking process shown in step S306 of FIG. 11 will be described in detail with reference to the drawings. FIG. 12 is a flowchart showing a schematic flow of the tracking process according to the third embodiment. However, in the following description, the same steps as those in FIG. 4 are referred to, and redundant description is omitted.

  As shown in FIG. 12, in the tracking process according to the third embodiment, first, the control unit 101 sets the side center coordinates selected in step S305 in FIG. 11 to the center of the visual field region R1 of the microscope unit 110. The stage 116 is moved via the stage control unit 104 (step S3061). Subsequently, similarly to steps S1072 and S1073 shown in FIG. 4, the control unit 101 acquires image data from the image sensor 111 of the microscope unit 110 (step S1072), and then analyzes the acquired image data. Thus, the defect area (recognized defect area D1a) included in the image data is recognized (step S1073), and then the process returns to the operation of FIG.

  With this tracking process, in the third embodiment, it is possible to draw a defect portion outside the visual field area R1 at the previous imaging into the visual field area R1. That is, it is possible to track and recognize even a defect that was outside the recognition area. As a result, the repair process for the entire defect D can be performed.

(Embodiment 4)
Hereinafter, a defect correction device, a defect tracking method, and a defect tracking program according to Embodiment 4 of the present invention will be described in detail with reference to the drawings. In the fourth embodiment, as the tracking process, the visual field region R1 (corresponding to an image) is divided into several regions in advance, and a reference point that is a reference for drawing is set in advance in the divided regions. In the case where at least a part of the defect D is included in the divided area, a case where the defect D extending outside the visual field area R1 is traced by drawing in the reference points of the divided area will be described as an example.

  FIG. 13 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in the defect correction apparatus 100 (see FIG. 2) according to the fourth embodiment. In the fourth embodiment, the defect correction apparatus 100 is the same as the defect correction apparatus 100 (see FIG. 2) according to the first embodiment.

  In the defect tracking method executed by the defect correction apparatus 100 according to the fourth embodiment, as shown in FIG. 13A, the visual field region R1 is divided in advance into a plurality of divided regions r1 to r9. Reference points C401 to C408 are set in the divided areas r1 to r8 located in the outer peripheral portion of r1 to r9 as the reference for pull-in. Therefore, when defect coordinates are input from the outside, in this defect tracking method, first, the vicinity of the input defect coordinates on the surface of the workpiece W10 is copied into the visual field region R1 of the microscope unit 110. By analyzing the image obtained by imaging the visual field region R1, the divided regions r3 and r4 including the defect D among the divided regions r1 to r9 are specified, and the divided regions r3 and r4 are set in advance. The coordinates of the determined reference points C403 and C404 are specified.

  Next, in this defect tracking method, one of the specified reference points C403 and C404 (reference point C403) is selected, and then a tracking process S41 for tracking the defect portion extending outside the visual field region R1 is performed. Execute. In the fourth embodiment, as the tracking process S41, the selected reference point C403 is drawn into the center of the visual field region R1 of the microscope unit 110. By this drawing, as shown in FIG. 13B, at least a part or the whole of the portion of the defect D outside the visual field region R1 is drawn into the visual field region R1. In the tracking process according to the fourth embodiment, for example, a divided region that has not intersected with the defect D at least once among the divided regions 1 to r8 may be excluded from the target. Thereby, it is possible to prevent the tracking process for a large defect that cannot be accommodated in the visual field region R1 at once from being infinitely looped.

  Subsequently, in this defect tracking method, as shown in FIG. 13C, the recognition defect area D401 included in the image obtained by imaging the visual field area R1 after being pulled in is specified, and this recognition defect area A repair coordinate calculation process S42 for calculating center coordinates (repair coordinates) c401 to c405 of one or more shot areas p401 to p405 allocated to D401 is executed. The calculated repair coordinates c401 to c405 are stored in the storage unit 107.

  In this defect tracking method, an unselected reference point (reference point C404) is selected from the reference points C403 and C404 calculated in FIG. 13A, and then the selected reference point C404 is selected. Similarly to the above, the tracking process S43 (see FIG. 13D) and the repair coordinate calculation process S44 (see FIG. 13E) are executed. Thereby, one or more repair coordinates c411 to c414 are set for the recognition defect area D402 included in the image obtained by imaging the visual field area R1 after being pulled in, and stored in the storage unit 107. The

  Thereafter, when there are no unselected reference points at the reference points (reference points C403 and C404) specified in FIG. 13A, the repair coordinates c401 to c405 and c411 to c415 stored in the storage unit 107 in the above. A coordinate integration process S45 is performed to integrate. As a result, as shown in FIG. 13 (f), the adjacent repair coordinates among the repair coordinates stocked in the storage unit 107 are integrated to obtain final repair coordinates c421 to c425. The coordinate integration process S45 is the same as the process described with reference to FIGS. 5, 6A, and 6B in the first embodiment.

  By the operation as described above, in the fourth embodiment, as in the first and second embodiments, the portion outside the visual field region R1 in the defect D is tracked to capture the whole image, and then shot against the defect D. Areas p421 to p425 (repair coordinates c421 to c425) can be allocated. As a result, even when the entire defect D cannot be captured by one imaging, it becomes possible to continuously irradiate the entire defect D with a laser, resulting in an increase in the number of strokes and a redundant work time. It is possible to repair the entire defect D while suppressing it.

  Next, a defect tracking method executed by the control unit 101 in the fourth embodiment will be described in detail with reference to the drawings. FIG. 14 is a flowchart showing a schematic flow of the defect tracking method according to the fourth embodiment. However, in the following description, the same steps as those in FIG. 3 are referred to, and redundant description is omitted.

  As shown in FIG. 14, in this defect tracking method, the control unit 101 first identifies a recognized defect region in the visual field region R1 by going through steps similar to steps S101 to S104 shown in FIG. Subsequently, the control unit 101 identifies the divided areas r3 and r4 including the identified recognition defect area among the divided areas r1 to r8 that divide the visual field area R1, and is preset to the identified divided areas r3 and r4. The reference points C403 and C404 are specified (step S401), and the coordinates (reference point coordinates) of the specified reference points C403 and C404 are registered in the storage unit 107 (step S402). In addition, the control unit 101 excludes a divided region (non-contained region) that does not include the defect D at the present time from subsequent detection targets (step S403).

  Next, the control unit 101 determines whether or not the defect D needs to be drawn, that is, whether or not the reference point coordinates are registered in the storage unit 107 (step S404: determination unit / determination step / determination process). . This determination corresponds to determining whether or not the defect D included in the image acquired by the microscope unit 110 extends beyond the image. As a result of this determination, if it is necessary to pull in the defect D (Yes in step S404), the control unit 101 selects one of the registered reference points C403 and C404 (here, the reference point C403). (Step S405), a tracking process (corresponding to the tracking process S41 in FIG. 13) for drawing the selected reference point C403 into the center of the visual field region R1 is executed (step S406: tracking unit / tracking step / tracking process). Details of the tracking process will be described later with reference to FIG.

  Next, the control unit 101 performs a repair coordinate calculation process (repair coordinate calculation process S42 in FIG. 13) for the recognized defect area D401 recognized by the tracking process by going through steps similar to steps S108 and S109 shown in FIG. (Step S108), and the calculated repair coordinates c401 to c405 are stored in the storage unit 107 (Step S109).

  Next, the control unit 101 excludes the divided regions (non-containing regions) r1, r2, r5 to r8 that do not include the defect D at the present time from the subsequent detection targets (step S407), and then continues the division that is not excluded. Of the areas r3 and r4, a divided area including the recognized defect area D401 recognized after the pull-in is specified (step S408), and the coordinates of the reference point (reference point coordinates) set in advance are stored in the storage unit 107 (step S408). Step S409). Subsequently, the control unit 101 determines whether or not the tracking process for all the reference point coordinates registered in the storage unit 107 has been completed (step S410: determination unit / determination step / determination process), and is completed. If not (No in step S410), the process returns to step S405 to select an unselected reference point (reference point C404). Thereafter, similarly to the reference point C403, a tracking process (corresponding to the tracking process S43 in FIG. 13) and a repair coordinate calculating process (corresponding to the repair coordinate calculating process S44 in FIG. 13) are executed, and the obtained repair coordinates c411 to c414 are obtained. Are stored in the storage unit 107 (steps S406 to S109), and then a divided region (non-contained region) that does not include the recognized defect region D402 recognized after the pull-in is excluded from the processing target (step S407) and the pull-in is performed. A divided area not including the recognized defect area D402 recognized later is specified (step S408), and the reference point coordinates thereof are registered in the storage unit 107 (step S409).

  On the other hand, when the tracking process for all the reference points registered in the storage unit 107 is completed (Yes in step S410), the control unit 101 stores the storage unit in the same manner as in steps S112 and S113 illustrated in FIG. A coordinate integration process (corresponding to the coordinate integration process S45 in FIG. 13) is executed on the repair coordinates stored in 107 (step S112), and the repair coordinates after integration are determined as final repair coordinates (step S112). S113). Subsequently, the control unit 101 sequentially selects the final repair coordinates, and irradiates the shot area centered on the repair coordinates with the repair laser light spatially modulated by the micromirror array 123. Repair processing is executed on the entire recognition defect area D1a (step S114).

  If it is not necessary to pull in the defect D as a result of the determination in step S404 (No in step S404), the control unit 101 performs repair for repairing the recognized defect area D1 as in steps S116 and S117 in FIG. One or more coordinates are calculated (step S116) and stored in the storage unit 107 (step S117). Then, the process proceeds to step S114, and the repair process for the entire defect area D1 (corresponding to the repair process S3 in FIG. 1). Execute. Thereafter, similarly to step S115 in FIG. 3, the control unit 101 determines whether or not the processing for all the defect coordinates input from the outside is completed (step S115), and if completed (Yes in step S115). ), This operation ends. On the other hand, when the processing for all the defect coordinates has not been completed (No in step S115), the control unit 101 returns to step S101, selects one of the unselected defect coordinates, and thereafter the same. Perform the action.

  Next, the tracking process shown in step S406 of FIG. 14 will be described in detail with reference to the drawings. FIG. 15 is a flowchart showing a schematic flow of the tracking process according to the fourth embodiment. However, in the following description, the same steps as those in FIG. 4 are referred to, and redundant description is omitted.

  As shown in FIG. 15, in the tracking process according to the fourth embodiment, first, the control unit 101 sets the stage so that the reference point selected in step S405 of FIG. The stage 116 is moved via the control unit 104 (step S4061). Subsequently, similarly to steps S1072 and S1073 shown in FIG. 4, the control unit 101 acquires image data from the image sensor 111 of the microscope unit 110 (step S1072), and then analyzes the acquired image data. Thus, the defect area (recognized defect area D1a) included in the image data is recognized (step S1073), and then the process returns to the operation of FIG.

  According to the tracking process, in the fourth embodiment, it is possible to draw a defect portion outside the visual field area R1 at the previous imaging into the visual field area R1. That is, it is possible to track and recognize even a defect that was outside the recognition area. As a result, the repair process for the entire defect D can be performed.

(Embodiment 5)
Hereinafter, a defect correction apparatus, a defect tracking method, and a defect tracking program according to Embodiment 5 of the present invention will be described in detail with reference to the drawings. In the above-described first to fourth embodiments, as the tracking process, the coordinates indicating the position information of the defect D, such as the barycentric coordinates, the repair coordinates, the side center coordinates, and the reference point coordinates, are drawn into the center of the field of view region R1. The case where the defect D outside the region R1 is recognized to enable a wide range of laser repair is taken as an example. On the other hand, in the fifth embodiment, as a tracking process, a case where laser repair is possible for the entire defect D by connecting a plurality of images to generate an image of the entire defect D will be described as an example.

  16 to 18 are conceptual diagrams for explaining an outline of a defect tracking method incorporated in the defect correction apparatus 100 (see FIG. 2) according to the fifth embodiment. In the fifth embodiment, the defect correction apparatus 100 is the same as the defect correction apparatus 100 (see FIG. 2) according to the first embodiment.

  In the defect tracking method executed by the defect correction apparatus 100 according to the fifth embodiment, the entire defect D is imaged over a plurality of images, and these images are connected to generate one image including the entire defect D. To do. The shot area for defect repair is allocated to the entire defect D included in the entire image generated by joining.

  Specifically, first, for example, by scanning a certain area or switching the objective lens to a low magnification, the entire image of the defect D is grasped, and along the imaging route in which the entire image is covered. Then, the entire defect D is imaged in a plurality of times. Thereby, as shown in FIGS. 16A to 16F, divided images R11 to R16 each including the divided defects D-1 to D-6 are obtained. A part of each of the divided images R11 to R16 is superimposed on an adjacent divided image. That is, each of the divided images R11 to R16 includes pasting regions RR1a to RR7a and RR1b to RR7b that overlap at the time of pasting. Therefore, by joining the divided images R11 to R16, as shown in FIG. 17, one whole image R100 that reflects the entire defect D is generated. In addition, this whole image R100 includes overlap regions RR1 to RR7 in which the bonding regions RR1a to RR7a and RR1b to RR7b overlap, respectively.

  Therefore, in the fifth embodiment, one or more shot areas are allocated to the defect D included in the entire image R100 generated as shown in FIG. 17, as shown in FIG. As a result, even when the entire defect D cannot be captured by one imaging, it is possible to allocate shot areas (repair coordinates) to the entire defect D at a time. As a result, it is possible to perform laser irradiation continuously at a time, and as a result, it is possible to repair the entire defect D while suppressing an increase in the number of strokes and redundancy in work time.

  Next, a defect tracking method executed by the control unit 101 in the fifth embodiment will be described in detail with reference to the drawings. FIG. 19 is a flowchart showing a schematic flow of the defect tracking method according to the fifth embodiment. However, in the following description, the same steps as those in FIG. 3 are referred to, and redundant description is omitted.

  As shown in FIG. 19, in this defect tracking method, the control unit 101 first identifies a recognition defect region in the visual field region R1 by going through steps similar to steps S101 to S104 shown in FIG. Subsequently, the control unit 101 determines whether or not the defect D needs to be drawn, that is, whether or not the defect D extends beyond the visual field region R1 (step S501: determination unit / determination step / determination). processing). This determination corresponds to determining whether or not the defect D included in the image acquired by the microscope unit 110 extends beyond the image. As a result of this determination, when it is necessary to pull in the defect D (Yes in step S501), the control unit 101 executes a tracking process to generate an entire image R100 including the entire defect D (step S502: tracking unit / Tracking step / tracking process). Details of the tracking process will be described later with reference to FIG.

  Next, the control unit 101 performs a repair coordinate calculation process for the entire defect D (corresponding to the repair coordinate calculation process S42 of FIG. 13) by performing the same process as steps S108 and S109 shown in FIG. ) Is executed (step S503), and the calculated repair coordinates are stored in the storage unit 107 (step S504). Subsequently, the control unit 101 selects the repair coordinates stored in the storage unit 107 in order, and irradiates a repair laser beam spatially modulated by the micro mirror array 123 onto the shot area centered on the repair coordinates. Thus, the repair process for the entire recognition defect area D1a is executed (step S114).

  Thereafter, similarly to step S115 in FIG. 3, the control unit 101 determines whether or not the processing for all the defect coordinates input from the outside is completed (step S115), and if completed (Yes in step S115). ), This operation ends. On the other hand, when the processing for all the defect coordinates has not been completed (No in step S115), the control unit 101 returns to step S101, selects one of the unselected defect coordinates, and thereafter the same. Perform the action.

  Next, the tracking process shown in step S502 of FIG. 19 will be described in detail with reference to the drawings. FIG. 20 is a flowchart showing a schematic flow of the tracking process according to the fifth embodiment. As shown in FIG. 20, in the tracking process according to the fifth embodiment, first, the control unit 101 images the vicinity of the defect coordinates selected in step S101 of FIG. 19 at a relatively low magnification (for example, several times). Thus, an image including the entire target defect D is acquired (step S5021). Subsequently, the control unit 101 analyzes the acquired low-magnification image to recognize the entire image of the defect D (step S5022), and calculates an imaging route that can be captured so as to cover the recognized entire image. (Step S5023).

  Next, the control unit 101 captures the entire defect D in a plurality of images by capturing images at a relatively high magnification (for example, about several tens of times) along the imaging route calculated in Step S5023 (Step S5023). S5024). Thereby, the divided images R11 to R16 as shown in FIG. 16 are acquired. Subsequently, the control unit 101 connects the acquired divided images R11 to R16 to generate an entire image R100 including the entire defect D as shown in FIG. 17 (step S5025), and then the operation of FIG. Return to

  According to this tracking process, in the fifth embodiment, even if a defect cannot fit in one image, an entire image of the defect can be generated by the tracking process, so that the repair process for the entire defect D is possible. It becomes.

(Modification 5-1)
Further, in the above-described fifth embodiment, as shown in FIG. 16, when the entire area of the defect D is divided into a plurality of divided images by imaging so that the existence area of the recognized defect D is scanned in a zigzag manner. Was given as an example. However, the present invention is not limited to this, for example, as shown in FIG. 21, the extension direction of the defect D is specified, and the defect D is imaged so as to scan along the defect D, whereby the entire defect D is divided into a plurality of divided images. You may shoot separately. FIG. 21 is a conceptual diagram for explaining an outline of the defect tracking method incorporated in the defect correcting apparatus according to the modified example 5-1 of the fifth embodiment. In addition, in this modified example 6-1, in step S5023 in the tracking process shown in FIG. 20, the zigzag imaging route as shown in FIG. 16 is not used, but along the extending direction of the defect D as shown in FIG. An imaging route is calculated. Other configurations, operations, and effects are the same as those in the above-described fifth embodiment or first to fourth embodiments, and therefore, a duplicate description is omitted here.

(Embodiment 6)
Hereinafter, a defect correction device, a defect tracking method, and a defect tracking program according to Embodiment 6 of the present invention will be described in detail with reference to the drawings. In the first to fifth embodiments described above, an example has been given in which a defect portion that cannot be captured by one imaging is traced by moving the visual field region r1 horizontally along the surface of the workpiece W10. On the other hand, in the sixth embodiment, when the defect D cannot be captured by one imaging, the defect extending outside the visual field region R1 by changing the magnification of the microscope unit 110 that is the imaging system and imaging again. Take the case of tracking D as an example.

  FIG. 22 is a conceptual diagram for explaining an outline of a defect tracking method incorporated in the defect correction apparatus 100 (see FIG. 2) according to the sixth embodiment. In the sixth embodiment, the defect correction apparatus 100 is the same as the defect correction apparatus 100 (see FIG. 2) according to the first embodiment.

  In the defect tracking method executed by the defect correction apparatus 100 according to the sixth embodiment, as shown in FIG. 22A, first, the vicinity of the input defect coordinates on the surface of the workpiece W10 is within the visual field region R1 of the microscope unit 110. Next, the microscope unit 110 analyzes the image obtained by imaging the visual field region R1 to determine whether or not the entire defect D is included in the visual field region R1. As a result of this determination, when the defect D extends outside the visual field region R1, in this defect tracking method, as shown in FIG. 22B, the magnification of the microscope unit 110 is changed to a low magnification. Then, a tracking process S61 for tracking a portion of the defect D outside the visual field region R1 is executed. In this example, for example, the magnification of the microscope unit 110 is reduced by a factor of two to track a defective portion outside the visual field region R1. However, the present invention is not limited to this, and various modifications such as one-third, one-fourth, and less are possible.

  Further, as shown in FIG. 22C, also in this defect tracking method, the tracking process of calculating the coordinates of the center of gravity C61 of the defect D included in the image captured at a low magnification and drawing this to the center of the visual field region R1. S62 may be executed. That is, the defect D tracking process (Embodiments 1 to 5) by horizontal movement of the visual field region R1 and the defect D tracking process (Embodiment 6) by changing the magnification of the microscope unit 110 are appropriately combined. Is possible.

  Thereafter, in this defect tracking method, as shown in FIG. 22 (d), the repair coordinate calculation process S63 is executed on the defect D included in the image obtained by tracking with the reduced magnification, and the entire defect D A repair coordinate for repairing the entire defect D is executed by calculating a repair coordinate with respect to and irradiating a laser according to the repair coordinate. In addition, when the whole defect D cannot be copied even by a single reduction in magnification, the reduction in magnification may be repeated until the entire defect D is captured.

  Through the operation as described above, in the sixth embodiment, as in the first to fifth embodiments, a portion outside the visual field region R1 in the defect D is tracked to capture the whole image, and then shot against the defect D. An area (repair coordinates) can be allocated. As a result, even when the entire defect D cannot be captured by one imaging, it becomes possible to continuously irradiate the entire defect D with a laser, resulting in an increase in the number of strokes and a redundant work time. It is possible to repair the entire defect D while suppressing it.

  Next, the defect tracking method executed by the control unit 101 in the sixth embodiment will be described in detail with reference to the drawings. FIG. 23 is a flowchart showing a schematic flow of the defect tracking method according to the sixth embodiment. However, in the following description, the same steps as those in FIG. 3 are referred to, and redundant description is omitted.

  As shown in FIG. 23, in this defect tracking method, the control unit 101 first identifies a recognized defect region in the visual field region R1 by going through steps similar to steps S101 to S104 shown in FIG. Subsequently, the control unit 101 determines whether or not the defect D needs to be drawn, that is, whether or not the defect D extends beyond the visual field region R1 (step S601: determination unit / determination step / determination). processing). This determination corresponds to determining whether or not the defect D included in the image acquired by the microscope unit 110 extends beyond the image. As a result of this determination, when it is necessary to pull in the defect D (Yes in step S601), the control unit 101 executes a tracking process to generate a low-magnification image including the entire defect D (step S602: tracking unit / Tracking step / tracking process). Details of the tracking process will be described later with reference to FIG.

  Next, the control unit 101 goes through the same process as steps S108 and S109 shown in FIG. 3 for the low-magnification image, so that the repair coordinate calculation process for the entire defect D (corresponding to the repair coordinate calculation process S63 in FIG. 22). ) Is executed (step S603), and the calculated repair coordinates are stored in the storage unit 107 (step S604). Subsequently, the control unit 101 selects the repair coordinates stored in the storage unit 107 in order, and irradiates a repair laser beam spatially modulated by the micro mirror array 123 onto the shot area centered on the repair coordinates. Thus, the repair process for the entire recognition defect area D1a is executed (step S114).

  Thereafter, similarly to step S115 in FIG. 3, the control unit 101 determines whether or not the processing for all the defect coordinates input from the outside is completed (step S115), and if completed (Yes in step S115). ), This operation ends. On the other hand, when the processing for all the defect coordinates has not been completed (No in step S115), the control unit 101 returns to step S101, selects one of the unselected defect coordinates, and thereafter the same. Perform the action.

  Next, the tracking process shown in step S602 of FIG. 23 will be described in detail with reference to the drawings. FIG. 24 is a flowchart showing a schematic flow of the tracking process according to the sixth embodiment. As shown in FIG. 24, in the tracking process according to the sixth embodiment, first, the control unit 101 changes the magnification of the microscope unit 110 to a lower magnification (for example, about several times to several tens of times) (step S7071). By capturing images at this magnification, an image including the portion of the defect D that was outside the visual field region R1 is acquired (step S1072). Subsequently, the control unit 101 analyzes the acquired low-magnification image to recognize the existence area of the defect D (step S1073), and the recognized defect extends outside the visual field area R1 after the reduction in magnification. It is determined whether or not it exists (step S7072). If the result of this determination is that the defect extends beyond the visual field region R1 (Yes in step S7073), the control unit 101 returns to step S7071 to lower the magnification of the microscope unit 110, and thereafter Execute the operation. On the other hand, when the defect does not extend outside the visual field region R1 after the reduction in magnification, that is, when the entire defect D is included in the visual field region R1 after the reduction in magnification (No in step S7072), control is performed. The unit 101 returns to the operation of FIG.

  According to this tracking process, in the sixth embodiment, even if a defect cannot fit in one image, an entire image of the defect can be generated by the tracking process, so that the repair process for the entire defect D is possible. It becomes.

(Embodiment 7)
Next, a defect correction device, a defect tracking method, and a defect tracking program according to Embodiment 7 of the present invention will be described in detail with reference to the drawings. In the first to sixth embodiments described above, adjacent shot regions may overlap each other. In this case, the repair laser beam is irradiated to the overlap area by the number of the overlapping shots. On the other hand, in the seventh embodiment, laser irradiation is not performed a plurality of times on the overlap region.

  The defect correction apparatus, defect tracking method, and defect tracking program according to the seventh embodiment may be any of the first to sixth embodiments described above. However, in the seventh embodiment, after calculating the repair coordinates for the defect D, processing described later is executed. Therefore, in the following, the first embodiment is cited for clarification of the explanation.

  FIG. 25 is a schematic flowchart showing a part of the defect tracking method according to the seventh embodiment. 26-30 is a figure for demonstrating the flow shown in FIG. In the seventh embodiment, first, through the steps S101 to S113 in FIG. 3, the final repair coordinates c1 to c1 as shown in FIG. 27 are obtained for the defect D included in the inspection image R7 shown in FIG. When c5 is determined, the control unit 101 subsequently calculates shot areas p1 to p5 for the determined repair coordinates c1 to c5 (step S701). Subsequently, the control unit 101 generates an image in which the images of the shot areas p1 to p5 are superimposed on the defect D in the inspection image R7, and this is generated as a GUI (Graphical User Interface) screen G8 as shown in FIG. The information is displayed on the display unit 105 (see FIG. 2) (step S702). The operator operates the pointer G3 on the screen of the display unit 105 using a pointing device such as a mouse to drag the repair objects c1 to c5 or the drawing objects in the shot areas p1 to p5 on the GUI screen G8. Thereby, the positions of the repair coordinates c1 to c5 and the shot areas p1 to p5 can be finely adjusted as necessary.

  Next, the control unit 101 determines whether a repair coordinate correction is input by the user (step S703). If there is an input (Yes in step S703), the final repair coordinates are recalculated based on the corrected repair coordinates (step S704), and then the process returns to step S701. On the other hand, when the determination button G2 is clicked instead of being corrected (No in step S703), the control unit 101 determines a repair order indicating the order of laser irradiation with respect to the current repair coordinates c71 to c75 (step S705). . This repair order may be, for example, the order itself input by the operator, or may be the order sorted from the upper left in the XY coordinate system. Or the order when the moving distance of the laser repair head 120 and / or the workpiece | work W10 becomes the shortest may be sufficient.

  Subsequently, the control unit 101 calculates the shapes (laser irradiation shapes) of the shot regions p71 to p75 in accordance with the repair order determined in step S705 (step S706). The shape of each shot region p71 to p75 may be obtained by subtracting the overlap region from the shape of the shot region whose repair order is later, for example, in the shot regions that overlap each other. FIG. 30 shows the laser irradiation shapes of the shot areas p71 to p75 when the repair order is the order of the repair coordinates c71 to c75. For example, as apparent from FIGS. 30A and 30B, the shape of the shot region p72 in the second repair order is the first repair from the circular mask image based on the maximum laser irradiation radius. The shape is obtained by subtracting the overlap area with the shot area p71 in the order. Similarly, for example, referring to FIGS. 30C to 30E, the shape of the fifth repair order shot region p75 is shot from a circular mask image based on the maximum laser irradiation radius. The shape is obtained by subtracting the overlap region with the region p73 and the overlap region with the shot region p74. In this example, the shot region p75 and the shot region p71 do not overlap each other. However, when the shot region p75 and the shot region p71 overlap, the overlap region is first irradiated with the maximum laser beam in the shot region p75. It is subtracted from a circular mask image based on the radius. When the shot area p75 and the shot area p72 overlap, the overlap area with the shot area p72 is subtracted after subtracting the overlap area with the shot area p71.

  Here, in order to prevent a gap from being generated between the shot areas after subtraction, shots whose repair order is later so that a small margin (for example, a band area of about 2 pixels) remains between the overlapping shot areas. The overlap area may be subtracted from the area shape.

  As described above, when the shapes of the shot areas p71 to p75 are calculated, the control unit 101 proceeds to step S114 shown in FIG. 3 and executes the repair process for the defect D. Note that the repair order determined in step S705 described above and the shape of each shot area calculated in step S706 (see FIG. 30) are determined in step S113 in FIG. 3 in the storage unit 107 shown in FIG. Corresponding to the final repair coordinates, it is stored as appropriate. Further, when the repair coordinates are recalculated in step S704, the repair coordinates in the storage unit 107 are appropriately updated with the recalculated repair coordinates.

  As described above, it is possible to reduce the possibility of damaging the workpiece W10 at the time of repair by avoiding that laser irradiation is performed a plurality of times in regions that overlap each other. Further, it is possible to optimize the power of laser irradiation once by avoiding laser irradiation to the same region a plurality of times. As a result, it is possible to suppress excessive damage to the workpiece W10 as much as possible. Furthermore, by leaving the margin of the laser irradiation region between adjacent shot regions, it is possible to reduce the occurrence of a gap between the actual laser irradiation regions, and to repair defects more reliably. Since other configurations, operations, and effects are the same as those of the above-described embodiment or its modification, detailed description thereof is omitted here.

(Embodiment 8)
In addition, each of the above-described embodiments can be configured to prevent a circuit pattern such as a wiring or an electrode from being irradiated with a laser during repair. Therefore, in the eighth embodiment, a region such as a circuit pattern where laser irradiation should be avoided is set as a prohibited region, and laser irradiation on this prohibited region is avoided. FIG. 31 is a schematic diagram showing an example of the prohibited area according to the eighth embodiment. In FIG. 31, the forbidden region R81 is shown in black. The image R8 including the forbidden region R81 can be created based on an inspection image R7 as shown in FIG. 26, for example, that does not include the defect D (reference numeral is R7). Is possible. Specifically, for example, when creating a recipe, a prohibited region R83 is set in advance for a reference image R82 of one picture element that does not have a defect. This setting may be manual operation by an operator or automatic processing by automatic recognition. Next, a plurality of reference images R82 are superimposed on the inspection image R7 using the inspection image R7 as a search target image and the reference image R82 as a model image. By applying the prohibited area R83 of the reference image R82 to the inspection image R7 based on the coordinates of the overlay result, the prohibited area R81 corresponding to each inspection image R7 can be created.

  Next, the defect tracking method according to the eighth embodiment will be described in detail with reference to the drawings. Note that the defect correction device, the defect tracking method, and the defect tracking program according to the eighth embodiment may be any of the first to seventh embodiments described above. However, in the eighth embodiment, the shape of each shot area is calculated as in the seventh embodiment, and the processing described later is executed. Therefore, in the following, the seventh embodiment is cited for clarity of explanation.

  FIG. 32 is a schematic flowchart showing a part of the defect tracking method according to the eighth embodiment. FIG. 33 is a diagram showing an example of a laser irradiation shape calculated in the eighth embodiment. In the eighth embodiment, first, the control unit 101 performs steps S101 to S113 shown in FIG. 3 and steps S701 to S706 shown in FIG. 25, so that the laser irradiation shapes of the shot regions p71 to p75 as shown in FIG. Is calculated. Subsequently, the control unit 101 determines the shape of the prohibited region R82 from the shape of each shot region p71 to p75 based on the repair coordinates c71 to c75 that are the center coordinates of the shot regions p71 to p75 and the coordinates of the prohibited region R82. Is subtracted (step S801). Thereby, for example, the laser irradiation shapes of the shot regions p81 to p85 shown in FIGS. 34 (a) to (e) are calculated from the laser irradiation shapes of the shot regions p71 to p75 shown in FIGS. 30 (a) to (e). The The calculated laser irradiation shapes of the shot regions p81 to p85 are stored in the storage unit 107 (see FIG. 2) or the like instead of the laser irradiation shapes of the shot regions p71 to p75 in the seventh embodiment.

  As described above, in the eighth embodiment, by taking the difference between each of the shot areas p71 to p75 and the prohibited area R82, the laser irradiation area is irradiated with the laser, and the laser irradiation is prohibited. No laser irradiation. As a result, laser irradiation can be performed without damaging the circuit pattern on the workpiece W10. After calculating the laser irradiation shapes of the shot areas p81 to p85, the control unit 101 proceeds to step S114 shown in FIG. 3 and executes a repair process for the defect D. Since other configurations, operations, and effects are the same as those of the above-described embodiment or its modification, detailed description thereof is omitted here.

(Embodiment 9)
Further, in each of the above-described embodiments, the shot area without the overlap area or the prohibited area is the circular mask image M1 based on the maximum laser irradiation radius (see, for example, FIG. 35). However, the present invention is not limited to this. For example, as shown in FIG. 35, the shot area may be a rectangular mask image M8.

  When the rectangular mask image M8 is used for the shot area, for example, as shown in FIG. 36, for example, the maximum coordinate YT and the minimum coordinate YB of the Y coordinate of the defect D included in the inspection image R7 are obtained. Subsequently, a coordinate (division coordinate YM) that divides between the maximum coordinate YT and the minimum coordinate YB by, for example, the length d1 of one side of the mask image M8 from the maximum coordinate YT side is specified. In the example shown in FIG. 36, one divided coordinate YM is specified between the maximum coordinate YT and the minimum coordinate YB. As a result, the defect D is divided into two divided regions D91 and D92.

  Subsequently, as shown in FIG. 37, the left end coordinates XL91 and XL92 of the defect D in each of the divided regions D91 and D92 are specified. Subsequently, as shown in FIG. 38, mask images M8 are arranged as shot areas p91 to p96 in order from the left end coordinates XL91 and LX92 with respect to the defect D in each of the divided areas D91 and D92. At this time, the center coordinates (= repair coordinates) of the respective shot areas p91 to p96 are obtained. Further, the repair order is determined for the obtained repair coordinates. The repair coordinates and the repair order are stored in the storage unit 107, for example.

  Next, as shown in FIG. 39, the prohibited region R81 as shown in FIG. 31 is superimposed on the inspection image R7 in which the shot regions p91 to p96 are arranged. Subsequently, the prohibited region R81 is subtracted from the laser irradiation shape (the shape of the mask image M8) of each of the shot regions p91 to p96. Thereby, as shown in FIG. 40, the shape of each shot area p91-p96 is calculated | required.

  As described above, by using the rectangular mask image M8 as the basic shape of the shot area, it is possible to arrange the shot areas so as not to overlap each other, so it is necessary to subtract the overlap area from the shot area. There is no. As a result, shot areas can be assigned using a simple algorithm. However, adjacent shot regions may be slightly overlapped (for example, about 2 pixels) as a margin. Since other configurations, operations, and effects are the same as those of the above-described embodiment or its modification, detailed description thereof is omitted here.

  In the ninth embodiment, the maximum coordinate, the minimum coordinate, and the left end coordinate of the defect D are specified using a coordinate system such as the workpiece W10 and the stage 116, but the present invention is not limited to this. For example, when the longitudinal direction of the defect D can be specified, the shot area may be assigned in the same manner as described above with the longitudinal direction as the X direction of the coordinate system.

(Embodiment 10)
In each of the above-described embodiments, the calculated laser irradiation shape of each shot area may be matched with the shape of the defect. That is, the shape of the shot area including the defect contour portion may be deformed in accordance with the contour portion. For example, the area of the defect D is identified from the inspection image R7 as shown in FIG. 26, and the AND of the two shot areas p71 to p75 is obtained by overlapping the shot area p71 to p75. It is possible to calculate the laser irradiation shape.

(Embodiment 11)
In the above-described Embodiments 7 to 10, the overlap area and the prohibition area are subtracted from the shape of each shot area based on the magnification at the time of defect detection. However, the present invention is not limited to this, and for example, the overlap area or the prohibition area may be subtracted from the shape of each shot area based on the magnification at the time of laser irradiation. In the following description, Embodiment 9 is cited, but the present invention is not limited to this, and any of the above-described embodiments may be used.

  For example, when the laser irradiation shape of each of the shot areas p91 to p96 for the entire defect D is calculated as in the seventh embodiment described above, according to the eleventh embodiment, according to the repair order set for the repair coordinates. Then, an inspection image RG1 (see FIG. 41) centered on each repair coordinate is acquired. As shown in FIG. 42, the imaging magnification at this time is the same as the magnification at the time of laser irradiation. What is necessary is just to image using the objective lens for laser irradiation.

  Subsequently, with respect to the inspection image RG1 acquired at a high magnification in this manner, the inspection image RG1 is used as a search target image and the reference image R9 as shown in FIG. Based on the coordinates of the superposition result, the forbidden area R91 of the reference image R9 is subtracted from the shape of the shot area p91, thereby removing the forbidden area R91 corresponding to the inspection image RG1 as shown in FIG. An irradiation shape p111 can be obtained. At this time, for example, if the magnification at the time of defect detection is 5 times and the magnification at the time of laser irradiation is 20 times, the accuracy is about 4 times that of the laser irradiation shape calculated based on the image acquired at the magnification at the time of defect detection. It becomes possible to obtain a laser irradiation shape. As a result, the boundary between the laser irradiation region and the prohibition region can be reproduced more accurately, so that more accurate laser repair can be performed. Further, even when a margin portion is provided between adjacent shot regions or between the laser irradiation region and the prohibition region, the margin portion can be made smaller. As a result, the damage given to the workpiece W10 can be further reduced. Since other configurations, operations, and effects are the same as those of the above-described embodiment or its modification, detailed description thereof is omitted here.

  In addition, the above-described embodiment and its modifications are merely examples for carrying out the present invention, and the present invention is not limited to these, and various modifications according to specifications and the like are within the scope of the present invention. Furthermore, it is obvious from the above description that various other embodiments are possible within the scope of the present invention. For example, it is needless to say that the modification examples illustrated as appropriate for each embodiment can be applied to other embodiments.

  For example, the defect correction apparatus 100 according to the above embodiment includes a stage 116 that can move in the XY plane and a stage control unit 104 that controls the horizontal movement of the stage 116, and the stage 116 moves the workpiece W 10 to the X-direction. In addition to this, the work W10 may be fixed on the stage, and the microscope unit 110 and the laser repair head 120 may be moved in the XY plane. That is, any configuration is possible as long as it is a moving unit that changes the relative positions of the microscope unit 110 and the laser repair head 120 and the workpiece W10 and a movement control unit that controls the moving unit.

  In the above embodiment, the minute mirror array 123, which is a spatial light modulator, is used as the light beam shaping unit. However, a variable slit, a liquid crystal shutter, or the like may be used as the other light beam shaping unit. That is, any configuration is applicable as long as the light beam shaping means shapes the cross-sectional shape of the laser beam into a desired shape.

  In the above embodiment, an example of a defect correction apparatus having a defect correction unit that performs defect repair by irradiating a laser beam to a defect has been described. However, the defect correction unit is not limited to such a defect correction unit that uses laser light. First, for example, a defect correction unit (collectively applied) that repairs a defect by applying, drawing, or transferring a correction material to the defect, such as a method using a probe such as a dispenser or a needle, an ink jet method, or a transfer method. Correction) or, for example, a defect correction unit that cuts, excises, and shapes the defect using a probe such as a needle. In this case, the repair process (repair execution) in the defect tracking method and the defect tracking program of the above embodiment is replaced with a repair process by, for example, application / drawing / transfer of a correction material from the repair process by laser irradiation. A defect tracking method and a defect tracking program common to the defect correction apparatus can be obtained.

  In addition, the defect tracking method and the defect tracking program of the present invention in the above embodiment do not necessarily require the device configuration as in the disclosed defect correcting device, and the defect correcting unit (in the defect correcting device in the above embodiment ( For example, the laser repair head) may be omitted. That is, various defect inspection devices and defect reviews such as optically acquiring inspection images including defects with a microscope or camera, determining the presence or absence of defects from the acquired inspection images, reviewing defects from inspection images, etc. The present invention can also be applied to known inspection apparatuses such as apparatuses.

DESCRIPTION OF SYMBOLS 100 Defect correction apparatus 101 Control part 102 Image processing part 103 Area setting part 104 Stage control part 105 Display part 106 Input part 107 Storage part 110 Microscope part 111 Image pick-up element 112 Light source 116 Stage 120 Laser repair head 121 Laser light source 122 LED
123 Micromirror array AX Observation optical axis C1, C11, C12, C13 Center of gravity C201, C202 Repair coordinates C301, C302 Side center coordinates C401-C408 Reference points c1-c5, c11-c13, c21-c24, c31-c34, c41, c51, c71 to c75, c201 to c205, c211 to c215, c221 to c225, c301 to c305, c311 to c315, c321 to c325, c401 to c405, c411 to c415, c421 to c425 repair coordinates D, D-1 to D -6 Defect D1, D1a, D11 to D13, D21, D201, D202, D301, D302, D401, D402 Recognized defect area D2 Unrecognized defect area D91, D92 Divided area G2 decision button G3 Pointer G8 GUI screen M1, M8 Disc M12 Imaging lens M13, M16 Relay lens M14, M21, M24 Half mirror M15 Objective lens M22, M23 High reflection mirror p1-p5, p71-p75, p81-p85, p91-p96, p201-p205, p221-p225 , P301 to p305, p321 to p325, p401 to p405, p421 to p425 shot region p111 laser irradiation shape R1 visual field region R2 recognition region R3 central region R7 inspection image R8 image R11 to R16 divided image R81, R83, R91 prohibited region R82, R9 Reference image R100 Overall image RR1 to RR7 Overlap area RR1a to RR7a, RR1b to RR7b Laminating area r1 to r9 Divided area W10 Workpiece XL91, XL92 Left end coordinate YB Minimum coordinate YM Divided coordinates YT Maximum coordinates

Claims (49)

A defect correction apparatus comprising: an imaging unit that acquires an enlarged image of a part of a target substrate; and a defect correction unit that performs a repair process on the target substrate based on the image acquired by the imaging unit;
A determination unit that determines whether or not a defect included in the image acquired by the imaging unit extends outside the image;
If the defect extends outside the image, a tracking unit that tracks a portion extending outside the image;
A setting unit that sets one or more correction areas for defects included in the image acquired by the imaging unit;
With
The defect correction apparatus, wherein the setting unit sets the one or more correction regions for defects included in an image acquired by the imaging unit after tracking by the tracking unit.   When the defect included in the image acquired by the imaging unit after the previous tracking further extends outside the image, the tracking unit extends outside the image after the previous tracking. The defect correction apparatus according to claim 1, wherein the part is further traced. A storage unit for storing the center coordinates of the irradiation region set by the setting unit;
An integration unit that integrates adjacent central coordinates among the central coordinates stored in the storage unit;
With
The defect correction apparatus according to claim 1, wherein the defect correction unit performs the correction process on the defect according to the center coordinates after integration by the integration unit. A centroid specifying unit that specifies the centroid of the defect area included in the image acquired by the imaging unit,
The tracking unit controls a relative position between the imaging unit and the target substrate so that the center of gravity of the defect area is drawn to the center of the field area when the center of gravity of the defect area is located near the outer periphery of the field area. The defect correction apparatus according to any one of claims 1 to 3.   The tracking unit is configured such that a relative coordinate between the imaging unit and the target substrate is drawn so that a center coordinate of a correction region located near an outer periphery of the visual field region among the irradiation regions set by the setting unit is drawn to a center of the visual field region. The defect correction apparatus according to claim 1, wherein the position is controlled. A center coordinate calculation unit that calculates a center coordinate of a line segment where a defect region included in the image acquired by the imaging unit and a side of the image intersect;
The said tracking part controls the relative position of the said imaging part and the said target board | substrate so that the said center coordinate may be drawn in to the center of the said visual field area | region, The Claim 1 characterized by the above-mentioned. Defect correction device. The visual field area is previously divided into a plurality of divided areas,
A reference point is set in advance in each divided area,
The tracking unit controls a relative position between the imaging unit and the target substrate so that a reference point set in a divided region including at least a part of the defect among the reference points is drawn into a center of the visual field region. The defect correction apparatus according to any one of claims 1 to 3. The tracking unit tracks a portion extending to the outside of the image by causing the imaging unit to capture the defect over a plurality of images.
The defect correction apparatus according to claim 1, wherein the setting unit sets one or more of the irradiation areas for the defect included in an image generated by pasting the plurality of images. .   The tracking unit recognizes the entire image of the defect, sets an imaging route of the imaging unit based on the recognized overall image, and causes the imaging unit to image the defect along the imaging route. The defect correcting apparatus according to claim 8, wherein a portion extending beyond the image is tracked.   When the defect extends outside the image, the tracking unit tracks a portion extending outside the image by changing an enlargement magnification of the imaging unit. The defect correction apparatus as described in any one of Claims 1-3.   The defect repairing section performs any repair processing of defect repair laser light irradiation, repair material application, drawing and transfer, and cutting, excision, and shaping of the defect with a probe. The defect correction apparatus according to claim 1, wherein the defect correction apparatus is a part of the defect correction apparatus.   The setting unit, when there is an overlapping region in which two correction regions set for the defect overlap each other, removes the overlapping region from any one of the two correction regions The defect correction apparatus according to claim 1.   The said setting part removes the said superimposition area | region from either one of the said two correction area | regions, leaving the margin which the said two correction area | regions mutually overlap | superimpose minutely. Defect correction equipment.   The defect correction apparatus according to claim 1, wherein the setting unit excludes a prohibited area that prohibits the repair processing on the target substrate from a correction area set for the defect.   15. The defect correction apparatus according to claim 14, wherein the setting unit removes the prohibited area from the correction area at the same magnification as that used by the defect correction unit for the repair process.   The defect correction apparatus according to claim 1, wherein the correction area is rectangular.   The setting unit divides the defect in the image into a band shape having the same width as the first side of the rectangular correction region in a direction perpendicular to the first side, and the band shape of the defect obtained by the division is obtained. The defect correction apparatus according to claim 16, wherein the rectangular correction area is set in order in a direction perpendicular to the first side for each divided area. An imaging step of acquiring an enlarged image of a part of the target substrate;
A determination step of determining whether a defect included in the image extends outside the image; and
If the defect extends outside the image, a tracking step for tracking a portion extending outside the image;
A defect tracking method characterized by comprising:   In the tracking step, when a defect included in the image acquired in the imaging step after the previous tracking further extends outside the image, the tracking step extends outside the image after the previous tracking. The defect tracking method according to claim 18, further comprising tracking an existing portion. A setting step for setting one or more correction regions for the defect included in the image acquired in the imaging step;
A storage step of storing the center coordinates of the correction area set in the setting step;
An integration step of integrating adjacent center coordinates among the center coordinates stored in the storage step;
Including
The setting step sets one or more correction regions for each defect included in the image acquired in the imaging step before and after tracking by the tracking step,
20. The defect tracking method according to claim 18, wherein the integration step integrates center coordinates of the correction area set in the setting step before and after the tracking. A centroid specifying step of specifying the centroid of the defect area included in the image acquired in the imaging step,
In the tracking step, when the center of gravity of the defect area is located near the outer periphery of the field of view of the imaging unit in the imaging step, the center of gravity of the defect area is drawn into the center of the field of view,
21. The imaging step according to claim 18, wherein after the center of gravity of the defect area is drawn into the center of the visual field area, an image obtained by enlarging a part of the target substrate is acquired again. The defect tracking method as described in one. A setting step of setting one or more correction regions for the defect included in the image acquired in the imaging step;
The tracking step draws in the center coordinates of the irradiation area located near the outer periphery of the visual field area of the imaging unit in the imaging step among the correction areas set in the setting step,
In the imaging step, an image obtained by enlarging a part of the target substrate is obtained again after the center coordinates of the irradiation region located near the outer periphery of the visual field region are drawn into the center of the visual field region. The defect tracking method according to claim 18 or 19. A center coordinate calculating step of calculating a center coordinate of a line segment where a defect area included in the image acquired in the imaging step and a side of the image intersect;
The tracking step draws the center coordinates into the center of the field of view of the imaging unit,
21. The imaging step according to claim 18, wherein after the central coordinates are drawn into the center of the visual field region, an image obtained by enlarging a part of the target substrate is acquired again. Defect tracking method as described in. The visual field area in the imaging step is divided into a plurality of divided areas in advance,
A reference point is set in advance in each divided area,
In the tracking step, a reference point set in a divided region including at least a part of the defect among the reference points is drawn into the center of the visual field region,
21. The imaging step according to claim 18, wherein after the reference point is drawn into the center of the field of view of the imaging unit, an image obtained by enlarging a part of the target substrate is acquired again. The defect tracking method as described in any one. A setting step of setting one or more correction regions for the defect included in the image acquired in the imaging step;
The tracking step tracks a portion extending outside the image by causing the imaging step to capture the defect across a plurality of images,
The defect tracking method according to claim 18, wherein the setting step sets one or more correction regions for the defect included in an image generated by pasting the plurality of images. .   The tracking step recognizes the entire image of the defect, sets an imaging route in the imaging step based on the recognized overall image, and causes the imaging step to image the defect along the imaging route. 26. The defect tracking method according to claim 25, wherein a portion extending beyond the image is tracked.   In the tracking step, when the defect extends outside the image, the magnification extending in the imaging step is changed to track a portion extending outside the image. The defect tracking method according to any one of claims 18 to 20.   The setting step is characterized in that, when there is an overlapping area where two correction areas set for the defect overlap each other, the overlapping area is excluded from one of the two correction areas. The defect tracking method according to claim 20.   29. The setting step according to claim 28, wherein the superimposing area is excluded from one of the two correction areas while leaving a margin where the two correction areas are slightly overlapped with each other. Defect tracking method.   21. The defect tracking method according to claim 20, wherein the setting step excludes a prohibited area that prohibits the repair processing on the target substrate from a correction area set for the defect.   31. The defect tracking method according to claim 30, wherein the setting step excludes the prohibited area from the correction area at the same magnification as that used by the defect correction unit for the repair process.   The defect tracking method according to claim 20, wherein the correction area is rectangular.   The setting step divides the defect in the image into a band in the direction perpendicular to the first side with the same width as the first side of the rectangular correction region, and forms the band of the defect obtained by the division The defect tracking method according to claim 32, wherein the rectangular correction area is set in order in a direction perpendicular to the first side for each divided area. A defect tracking program for causing an imaging unit that acquires an image obtained by enlarging a part of an inspection target and a control unit that controls a relative position between the inspection target and the imaging unit based on the image acquired by the imaging unit. And
Imaging processing for causing the imaging unit to acquire an image obtained by enlarging a part of the target substrate;
A determination process for determining whether a defect included in the image extends beyond the image;
When the defect extends outside the image, a tracking process for tracking a portion extending outside the image;
A defect tracking program for causing the control unit to execute.   When the defect included in the image acquired by the imaging process after the previous tracking further extends outside the image, the tracking process extends outside the image after the previous tracking. The defect tracking program according to claim 34, further tracking a portion that is present. A setting process for setting one or more correction areas for the defect included in the image acquired by the imaging process;
A storage process for storing the center coordinates of the irradiation area set in the setting process;
An integration process for integrating adjacent center coordinates among the center coordinates stored in the storage process;
Is executed by the control unit,
The setting process sets one or more correction regions for each defect included in the image acquired by the imaging process before and after tracking by the tracking process,
36. The defect tracking program according to claim 34, wherein the integration process integrates center coordinates of the correction area set in the setting process before and after the tracking. Causing the control unit to execute a center-of-gravity specifying process for specifying the center of gravity of the defect area included in the image acquired by the imaging process;
The tracking process controls the relative position between the imaging unit and the target substrate so that the center of gravity of the defect area is drawn to the center of the field area when the center of gravity of the defect area is located near the outer periphery of the field area. And
The imaging process is characterized in that, after the center of gravity of the defective area is drawn into the center of the visual field area of the imaging unit, the imaging unit again acquires an image obtained by enlarging a part of the target substrate. Item 37. The defect tracking program according to any one of Items 34 to 36. Including a setting process for setting one or more correction regions for the defect included in the image acquired by the imaging process,
In the tracking process, the imaging unit and the target are drawn so that center coordinates of a correction area located near the outer periphery of the visual field area of the imaging unit among the correction areas set in the setting process are drawn into the center of the visual field area. Control the relative position with the substrate,
In the imaging process, after the center coordinates of the correction area located near the outer periphery of the visual field area are drawn into the center of the visual field area, the imaging unit again acquires an image obtained by enlarging a part of the target substrate. 36. The defect tracking program according to claim 34 or 35. Causing the control unit to execute a center coordinate calculation process for calculating a center coordinate of a line segment where a defect region included in the image acquired by the imaging process and a side of the image intersect;
The tracking process controls the relative position between the imaging unit and the target substrate so as to draw the center coordinates into the center of the field of view of the imaging unit,
37. The imaging process according to claim 34, further comprising causing the imaging unit to acquire an enlarged image of a part of the target substrate after the center coordinates are drawn into the center of the visual field region. The defect tracking program as described in any one. The visual field area of the imaging unit is divided into a plurality of divided areas in advance,
A reference point is set in advance in each divided area,
The tracking process controls a relative position between the imaging unit and the target substrate so that a reference point set in a divided region including at least a part of the defect among the reference points is drawn into a center of the visual field region. And
37. The imaging process according to claim 34, wherein after the reference point is drawn into the center of the visual field region, the imaging unit is made to acquire an image obtained by enlarging a part of the target substrate again. The defect tracking program as described in any one. Causing the control unit to execute a setting process for setting one or more correction areas for the defect included in the image acquired by the imaging process;
The tracking process tracks a portion extending to the outside of the image by causing the imaging unit to capture the defect over a plurality of images.
The defect tracking program according to claim 34, wherein the setting process sets one or more correction areas for the defect included in an image generated by pasting the plurality of images. .   The tracking process recognizes the entire image of the defect, sets an imaging route of the imaging unit based on the recognized overall image, and causes the imaging unit to image the defect along the imaging route. The defect tracking program according to claim 41, wherein a part extending beyond the image is tracked.   In the tracking process, when the defect extends outside the image, the part extending to the outside of the image is tracked by changing an enlargement magnification of the imaging unit. The defect tracking program according to any one of claims 34 to 36.   The setting process is characterized in that, when there is an overlapping area in which two correction areas set for the defect overlap each other, the overlapping area is excluded from one of the two correction areas. The defect tracking program according to claim 36.   45. The setting process according to claim 44, wherein the setting process removes the overlapping area from one of the two correction areas while leaving a margin where the two correction areas slightly overlap each other. Defect tracking program.   The defect tracking program according to claim 36, wherein the setting process excludes a prohibited area for prohibiting the repair process on the target substrate from a correction area set for the defect.   47. The defect tracking program according to claim 46, wherein the setting process excludes the prohibited area from the correction area at the same magnification as that used by the defect correction unit for the repair process.   The defect tracking program according to claim 36, wherein the correction area is rectangular.   The setting unit divides the defect in the image into a band shape having the same width as the first side of the rectangular correction region in a direction perpendicular to the first side, and the band shape of the defect obtained by the division is obtained. 49. The defect tracking program according to claim 48, wherein the rectangular correction area is set in order in a direction perpendicular to the first side for each divided area.

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