JP2011202973A5 - - Google Patents
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- JP2011202973A5 JP2011202973A5 JP2010067843A JP2010067843A JP2011202973A5 JP 2011202973 A5 JP2011202973 A5 JP 2011202973A5 JP 2010067843 A JP2010067843 A JP 2010067843A JP 2010067843 A JP2010067843 A JP 2010067843A JP 2011202973 A5 JP2011202973 A5 JP 2011202973A5
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- JP
- Japan
- Prior art keywords
- parameter
- plasma processing
- impedance
- current value
- voltage value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005259 measurement Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 4
- 239000003990 capacitor Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010067843A JP5498217B2 (ja) | 2010-03-24 | 2010-03-24 | 高周波測定装置、および、高周波測定装置の校正方法 |
| US13/048,104 US8686711B2 (en) | 2010-03-24 | 2011-03-15 | High-frequency measuring device and high-frequency measuring device calibration method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010067843A JP5498217B2 (ja) | 2010-03-24 | 2010-03-24 | 高周波測定装置、および、高周波測定装置の校正方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011202973A JP2011202973A (ja) | 2011-10-13 |
| JP2011202973A5 true JP2011202973A5 (enExample) | 2013-03-14 |
| JP5498217B2 JP5498217B2 (ja) | 2014-05-21 |
Family
ID=44655645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010067843A Expired - Fee Related JP5498217B2 (ja) | 2010-03-24 | 2010-03-24 | 高周波測定装置、および、高周波測定装置の校正方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8686711B2 (enExample) |
| JP (1) | JP5498217B2 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5524796B2 (ja) * | 2010-09-30 | 2014-06-18 | 株式会社ダイヘン | 高周波測定装置、および、高周波測定装置の校正方法 |
| DE102011084143B4 (de) * | 2011-10-07 | 2024-07-04 | Rohde & Schwarz GmbH & Co. Kommanditgesellschaft | Messsoftware unterstütztes Messsystem und Messverfahren |
| JP6037688B2 (ja) * | 2012-07-09 | 2016-12-07 | 東京エレクトロン株式会社 | マイクロ波導入モジュールにおける異常検知方法 |
| US9041480B2 (en) * | 2013-03-15 | 2015-05-26 | Mks Instruments, Inc. | Virtual RF sensor |
| US9412670B2 (en) * | 2013-05-23 | 2016-08-09 | Lam Research Corporation | System, method and apparatus for RF power compensation in plasma etch chamber |
| KR101570171B1 (ko) * | 2014-07-25 | 2015-11-20 | 세메스 주식회사 | 플라즈마 발생 유닛 및 그를 포함하는 기판 처리 장치 |
| JP6441604B2 (ja) * | 2014-07-30 | 2018-12-19 | 株式会社ダイヘン | 高周波測定装置、および、高周波測定装置の校正方法 |
| CN104597321B (zh) * | 2015-01-28 | 2018-04-27 | 常洪山 | 基于四条离散傅里叶复数谱线的信号频率测量方法及装置 |
| US9754769B2 (en) * | 2015-09-15 | 2017-09-05 | Lam Research Corporation | Metrology methods to detect plasma in wafer cavity and use of the metrology for station-to-station and tool-to-tool matching |
| CN109659215B (zh) * | 2017-10-10 | 2021-03-09 | 东京毅力科创株式会社 | 等离子体处理装置和检测电路 |
| JP7209483B2 (ja) * | 2017-10-10 | 2023-01-20 | 東京エレクトロン株式会社 | プラズマ処理装置および測定回路 |
| KR102003942B1 (ko) * | 2017-11-07 | 2019-07-25 | 한국원자력연구원 | 정합 장치를 포함하는 플라즈마 발생 장치 및 임피던스 정합 방법 |
| JP2021103641A (ja) * | 2019-12-25 | 2021-07-15 | 東京エレクトロン株式会社 | プラズマ発生源の検査方法及び負荷 |
| US11961712B2 (en) * | 2021-04-26 | 2024-04-16 | Advanced Energy Industries, Inc. | Combining the determination of single and mutual, preset preserving, impedance loads with advances in single and double sensor calibration techniques in the application of single and pairwise calibration of sensors |
| US12372565B2 (en) * | 2022-07-12 | 2025-07-29 | Texas Instruments Incorporated | Methods and apparatus for determining parasitic capacitances |
| US12272524B2 (en) * | 2022-09-19 | 2025-04-08 | Applied Materials, Inc. | Wideband variable impedance load for high volume manufacturing qualification and on-site diagnostics |
| US20250264567A1 (en) * | 2024-02-21 | 2025-08-21 | Rohde & Schwarz Gmbh & Co. Kg | Calibration system and interfacing method |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5467013A (en) * | 1993-12-07 | 1995-11-14 | Sematech, Inc. | Radio frequency monitor for semiconductor process control |
| US6174450B1 (en) * | 1997-04-16 | 2001-01-16 | Lam Research Corporation | Methods and apparatus for controlling ion energy and plasma density in a plasma processing system |
| US6449568B1 (en) * | 1998-02-27 | 2002-09-10 | Eni Technology, Inc. | Voltage-current sensor with high matching directivity |
| US6419801B1 (en) * | 1998-04-23 | 2002-07-16 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
| US6123983A (en) * | 1998-04-23 | 2000-09-26 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
| US6383402B1 (en) * | 1998-04-23 | 2002-05-07 | Sandia Corporation | Method and apparatus for monitoring plasma processing operations |
| US6368975B1 (en) * | 1999-07-07 | 2002-04-09 | Applied Materials, Inc. | Method and apparatus for monitoring a process by employing principal component analysis |
| US6509542B1 (en) * | 1999-09-30 | 2003-01-21 | Lam Research Corp. | Voltage control sensor and control interface for radio frequency power regulation in a plasma reactor |
| WO2001052302A1 (en) * | 2000-01-10 | 2001-07-19 | Tokyo Electron Limited | Segmented electrode assembly and method for plasma processing |
| US20030209518A1 (en) * | 2002-05-08 | 2003-11-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of detecting abnormal chamber conditions in etcher |
| JP4370789B2 (ja) * | 2002-07-12 | 2009-11-25 | 東京エレクトロン株式会社 | プラズマ処理装置及び可変インピーダンス手段の校正方法 |
| JP4363062B2 (ja) | 2003-02-17 | 2009-11-11 | 株式会社村田製作所 | 電気特性測定装置および電気測定装置の測定誤差校正方法 |
| US6781317B1 (en) * | 2003-02-24 | 2004-08-24 | Applied Science And Technology, Inc. | Methods and apparatus for calibration and metrology for an integrated RF generator system |
| JP4226597B2 (ja) * | 2003-03-04 | 2009-02-18 | 株式会社日立国際電気 | 基板処理装置およびデバイスの製造方法 |
| US7666464B2 (en) * | 2004-10-23 | 2010-02-23 | Applied Materials, Inc. | RF measurement feedback control and diagnostics for a plasma immersion ion implantation reactor |
| US20060258022A1 (en) * | 2005-05-13 | 2006-11-16 | Wright Timothy L | Method for the calibration of radio frequency generator output power |
| US7489145B2 (en) * | 2005-12-14 | 2009-02-10 | Daihen Corporation | Plasma processing system |
| JP4648179B2 (ja) | 2005-12-14 | 2011-03-09 | 株式会社ダイヘン | 高周波測定装置 |
| US20080029484A1 (en) * | 2006-07-25 | 2008-02-07 | Applied Materials, Inc. | In-situ process diagnostics of in-film aluminum during plasma deposition |
| US7776748B2 (en) * | 2006-09-29 | 2010-08-17 | Tokyo Electron Limited | Selective-redeposition structures for calibrating a plasma process |
| US7537671B2 (en) * | 2006-09-29 | 2009-05-26 | Tokyo Electron Limited | Self-calibrating optical emission spectroscopy for plasma monitoring |
| US8073646B2 (en) * | 2007-03-30 | 2011-12-06 | Tokyo Electron Limited | Plasma processing apparatus, radio frequency generator and correction method therefor |
| JP2009049382A (ja) * | 2007-07-26 | 2009-03-05 | Panasonic Corp | ドライエッチング方法およびドライエッチング装置 |
| JP5222598B2 (ja) * | 2008-03-25 | 2013-06-26 | 東京エレクトロン株式会社 | プラズマ処理装置及び給電棒 |
| JP5357091B2 (ja) * | 2010-03-23 | 2013-12-04 | 株式会社ダイヘン | 高周波測定装置、および、高周波測定装置の校正方法 |
| JP5524796B2 (ja) * | 2010-09-30 | 2014-06-18 | 株式会社ダイヘン | 高周波測定装置、および、高周波測定装置の校正方法 |
| JP5722681B2 (ja) * | 2011-03-30 | 2015-05-27 | 株式会社ダイヘン | 模擬負荷装置 |
-
2010
- 2010-03-24 JP JP2010067843A patent/JP5498217B2/ja not_active Expired - Fee Related
-
2011
- 2011-03-15 US US13/048,104 patent/US8686711B2/en active Active
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