JP2011199331A - Vibration piece, vibrator, and oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small vibration piece which attains a low frequency and a high Q value.SOLUTION: The vibration arm 20 has a base 21 in which a pair of cuts 31 is formed, and a pair of vibration arms 22 mutually extending in parallel from one end side of a first portion of the base 21. Each vibration arm 22 has a general part 23 being a main vibration part, and a weight 29 that is wider than the general part 23 at a tip side opposite from a root to the base 21 of the vibration arm 22. Furthermore, a long groove with a bottom having an opening along at least one principal plane of both principal planes of each vibration arm 22 and the weight 29 that is wider than the root to the base at the tip side opposite from the root to the base of the vibration arm are formed. The weight 29 is formed in the longitudinal direction of the vibration arm 22 so that the length ratio of the weight 29 occupying the length from the root with the base 21 to the tip side is within a range of 35 to 41%.

Description

  The present invention relates to a vibrating piece such as a bending vibrating piece that vibrates in a bending vibration mode, and a vibrator or an oscillator using the same.

  Conventionally, for a vibrating piece that vibrates in a bending vibration mode, for example, a pair of vibrating arms are extended in parallel from the base portion of a base material made of a piezoelectric material such as quartz, and approached or separated from each other in the horizontal direction. Tuning fork-type flexural vibrating pieces that vibrate in the direction of movement are widely used. When the vibration arm of the tuning-fork type bending vibration piece is excited, if the vibration energy is lost, it causes a decrease in the performance of the vibration piece, such as an increase in CI (Crystal Impedance) value and a decrease in Q value. Therefore, various ideas have been conventionally made in order to prevent or reduce such loss of vibration energy.

  For example, there are known tuning-fork type crystal vibrating pieces in which cut portions or cuts (cut grooves) having a predetermined depth are formed on both sides of a base portion from which a vibrating arm extends (for example, Patent Document 1 and Patent Document 2). reference). This tuning-fork type crystal resonator element controls the Q value by enhancing the confinement effect of vibration energy by mitigating the leakage of vibration from the base by cutting when the vibration of the vibrating arm also includes a vertical component. In addition, variations in the Q value between the resonator elements are prevented.

In the resonator element, not only the loss of mechanical vibration energy as described above, but also the temperature generated between the compressive portion where the compressive stress of the vibrating arm which is bent and acting and the extension portion where the tensile stress acts. It is also caused by heat conduction due to the difference. This decrease in the Q value caused by heat conduction is called a thermoelastic loss effect.
In order to prevent or suppress a decrease in the Q value due to the thermoelastic loss effect, a tuning-fork type vibration piece in which a groove or a hole is formed on the center line of a vibrating arm (vibrating beam) having a rectangular cross section is disclosed in Patent Document 3, for example. It has been introduced.

By the way, various products to which a vibration device including a resonator element can be attached, such as a small information device such as an HDD (hard disk drive), a mobile computer, or an IC card, a mobile phone, a car phone, or a paging system In recent years, miniaturization of mobile communication devices such as mobile communication devices and vibration gyro sensors has been progressing more and more. In connection with this, the request | requirement of size reduction of the vibration device attached to those products and the vibration piece accommodated in the vibration device has increased further.
Among the demands for downsizing of the resonator element, in particular, reducing the length of the vibrating arm has a high contribution rate, and accordingly, it is required to reduce the cross-sectional area of the vibrating arm. . For this reason, it is known that it is difficult to lower the frequency of the resonator element, and the vibration characteristics of the resonator element are likely to become unstable due to the occurrence of a higher-order vibration mode. As a resonating piece that can suppress the occurrence of such higher-order vibration modes and can reduce the frequency and stabilize vibration characteristics, the tip of the resonating arm is wider than the general part (arm part) of the resonating arm. For example, Patent Literature 4 introduces a resonator element in which a weight portion is formed.

JP 2002-261575 A Japanese Patent Laid-Open No. 2004-260718 Japanese Utility Model Publication No. 2-3322 Japanese Utility Model Publication No. 2005-5896

  However, in the case of a configuration having a vibrating arm that has both a long groove and a weight portion, if the occupation ratio of the length of the weight portion with respect to the entire length in the longitudinal direction of the vibrating arm is too small or too large, the weight portion decreases. The inventor has found that the effect of suppressing thermoelastic loss due to frequency and long grooves cannot be achieved at a desired level. Further, the inventor has a desired Q value due to a desired low frequency and a thermoelastic loss suppression effect when the occupation ratio of the length of the weight portion with respect to the entire length in the longitudinal direction of the vibrating arm is within a certain range. It was found that it can be secured.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A vibrating piece according to this application example includes a base and a vibrating arm extending from the base, and the vibrating arm includes at least one of both main surfaces of the vibrating arm. A long groove with a bottom having an opening along the main surface, and a weight portion having a width wider than the base side of the vibrating arm on the tip side of the vibrating arm on the side opposite to the base of the vibrating arm And the length ratio of the weight part in the length from the base to the tip side in the longitudinal direction of the vibrating arm is in the range of 35% to 41%. To do.

  According to this configuration, the vibration efficiency is improved and the CI value is reduced by the long groove provided in the vibrating arm, and the length of the vibrating arm is increased by the weight portion of the tip portion of the vibrating arm serving as a weight. The inventor has found that the effect of sufficiently suppressing the frequency can be obtained without reducing the temperature, and that the thermoelastic loss can be reduced and the reduction of the Q value can be sufficiently suppressed. Accordingly, it is possible to provide a resonator element having excellent vibration characteristics while achieving a reduction in frequency while achieving a reduction in size and suppressing a decrease in the Q value.

  Application Example 2 In the resonator element according to the application example, two vibrating arms extending in parallel with each other from the base portion are provided, and a supporting arm is provided between the two vibrating arms of the base portion. It is characterized by being provided to extend in parallel with.

According to this configuration, since the supporting arm is provided between the pair of vibrating arms, when each vibrating arm vibrates, particularly when each vibrating arm vibrates in a direction approaching each other, each vibrating arm It is possible to suppress changes in the operating parameters of the resonator element caused by the air being disturbed.
In addition, various problems that occur when the base is supported and fixed to a package or the like with the base as a support, for example, the tip of the vibrating piece can be prevented from tilting downward and touching the package or the impact on the package can be prevented. Therefore, it is possible to avoid an abnormal operation that may occur by being directly transmitted to the vibrating arm via the arm, and to provide a vibrating piece with stable vibration characteristics.

  Application Example 3 The resonator element according to the above application example is characterized in that the resonator element is a crystal resonator element formed of quartz.

  According to this configuration, it is possible to provide a quartz crystal resonator element having high vibration resistance and excellent vibration characteristics in which a decrease in Q value due to thermoelastic loss is suppressed.

  Application Example 4 The vibration piece according to the application example described above is a bending vibration piece exhibiting a bending vibration mode.

  According to this configuration, the inventor has found that the bending vibration piece exhibiting the bending vibration mode exhibits the effect of suppressing the decrease in the Q value at the same time as lowering the frequency.

  Application Example 5 A vibrator according to this application example includes the resonator element according to any one of the application examples described above and a package that accommodates the resonator element.

  According to this configuration, since the resonator element according to the above application example is provided, the vibration efficiency is improved by the long groove, the CI value is reduced, the frequency is reduced by the weight portion, and the thermoelastic loss is further reduced. Therefore, it is possible to provide a small-sized vibrator having excellent vibration characteristics in which the Q value is prevented from being lowered.

  Application Example 6 An oscillator according to this application example includes the resonator element according to the application example, a circuit element including an oscillation circuit that oscillates the resonator element, and a package that accommodates the resonator element and the circuit element. It is characterized by including.

  According to this configuration, since the resonator element according to the above application example is provided, the vibration efficiency is improved by the long groove, the CI value is reduced, the frequency is reduced by the weight portion, and the thermoelastic loss is further reduced. Therefore, it is possible to provide an oscillator having excellent oscillation characteristics in which a decrease in Q value due to the above is suppressed.

(A) is the top view of one main surface side explaining typically one Embodiment of a vibration piece, (b) is a cross-sectional enlarged view which shows the AA cross section of (a). Fig. 4 is a graph showing the relationship between the weight portion occupancy rate of the vibrating piece and the high performance index. (A) is a schematic plan view explaining one Embodiment of the vibrator | oscillator provided with the said vibration piece from the top, (b) is the BB sectional drawing of (a). FIG. 4A is a schematic plan view illustrating an embodiment of an oscillator including the resonator element as viewed from above, and FIG. 4B is a cross-sectional view taken along the line CC of FIG.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of a resonator element according to the invention and a vibrator or an oscillator using the resonator element will be described with reference to the drawings.

[Vibration piece]
First, the resonator element according to the invention will be described.
1A and 1B schematically illustrate a resonator element according to the present embodiment. FIG. 1A is a plan view of one main surface side, and FIG. 1B is a cross-sectional view taken along line AA in FIG. It is a cross-sectional enlarged view.
In FIG. 1A, the resonator element 20 of the present embodiment is a resonator element exhibiting a bending vibration mode made of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate. When the resonator element 20 is made of quartz, the quartz wafer is cut out by rotating it in the range of 0 to 5 degrees clockwise around the Z axis in an orthogonal coordinate system consisting of the X, Y, and Z axes. A crystal Z plate obtained by cutting and polishing to a predetermined thickness is used. The resonator element 20 according to the present embodiment includes a base portion 21 formed by processing the quartz crystal Z plate and a pair of base portions 21 extending in parallel with each other from one end side (upper end side in the drawing). A so-called tuning fork-shaped outer shape including the vibrating arm 22 is formed.

The base portion 21 is formed with a pair of cuts 31 in the opposing direction along one straight line so that a shape confined to both the main surfaces appears. The base portion 21 includes a first portion 21a and a second portion 21b that are located on both sides of the pair of cuts 31, and a connection portion that connects the first portion 21a and the second portion 21b between the pair of cuts 31. 21c. In the vibrating piece 20 of the present embodiment, the transmission of vibration of each vibrating arm 22 is blocked by the notch 31, so that so-called vibration leakage that the vibration is transmitted to the outside via the base 21 and the support arm 30 is suppressed, An increase in CI value can be prevented.
In addition, it is desirable that each notch 31 is adjusted to an optimal width and length after securing the strength against dropping of the vibrating piece 20 to minimize vibration leakage.

As shown in FIG. 1A, the pair of vibrating arms 22 extends from the first portion 21 a of the base portion 21 in parallel to both main surfaces (upper and lower surfaces in the drawing). Each resonating arm 22 has both the main surfaces and both side surfaces connecting the main surfaces on both sides.
Each vibrating arm 22 has a general portion 23 that is a main vibrating portion in the vibrating arm 22 at the center thereof. In addition, each vibrating arm 22 is gradually widened at the base portion connected to the base portion 21 from the general portion 23 toward the base portion 21 side, and is widest at the base portion with the base portion 21. A wide portion 24 is provided. Thus, since each vibrating arm 22 has the wide portion 24, it is connected to the base portion 21 with a wide width, so that rigidity is increased and impact resistance and the like are improved.

Further, a weight portion 29 having a width wider than that of the general portion 23 is formed on the distal end side of the vibrating arm 22 opposite to the base of the base portion 21. As described above, since the weight portion 29 is provided at the tip portion of each vibrating arm 22, the tip portion functions as a weight, so that the frequency can be lowered without increasing the length of the vibrating arm 22. it can.
Further, in the longitudinal direction of each vibrating arm 22 of the vibrating piece 20 (in this example, the direction in which each vibrating arm 22 extends from the first portion 21a of the base portion 21), the length from the base to the distal end side with the base portion 21 is long. The length l of the weight portion 29 occupying the length L is adjusted to be in the range of 35% to 41%. By adopting such a configuration, the vibration piece 20 has a sufficiently low frequency without increasing the length of the vibrating arm 22 because the weight portion 29 at the tip of each vibrating arm 22 functions as a weight. The inventor has found that the effect of being suppressed can be obtained and the effect of sufficiently reducing the decrease in the Q value by reducing the thermoelastic loss (details will be described later).

One main surface of each vibrating arm 22 is provided with one bottomed long groove 26a along each longitudinal direction. Further, as shown in FIG. 1B, one long groove is also formed along the longitudinal direction of the vibrating arm 22 on the other main surface of one vibrating arm 22 (on the left side in FIG. 1A). 26b is provided. Similarly, although not shown, one bottomed groove 26b is also provided on the other main surface of the other vibrating arm 22 (the vibrating arm on the right side in the drawing).
As described above, the long grooves 26a and 26b provided in each vibration arm 22 reduce the rigidity and easily vibrate, and the vibration arm 22 can efficiently vibrate and exhibit good vibration characteristics. Further, the long grooves 26a and 26b are caused by the temperature rise and the temperature drop generated at the jetty portions 25 on both side surfaces of the vibrating arm 22 due to the distortion caused by the vibration in the vicinity of the base portion of the vibrating arm 22 with the base 21. Since the heat flow path is narrowed, the effect of reducing heat elastic loss by suppressing heat transfer is exhibited, and as a result, adverse effects due to thermoelastic loss such as an increase in CI value and a decrease in Q value can be suppressed.

  The vibration piece 20 of the present embodiment has a pair of support arms 30 extending from the second portion 21 b of the base portion 21. The pair of support arms 30 intersect with the direction in which the pair of vibrating arms 22 extend from the base portion 21 and extend in opposite directions to each other, and then bend at a substantially right angle at the bent portion 32. The vibrating arm 22 extends in a direction parallel to the extending direction. By bending in this way, the vibration piece 20 having the support arm 30 can be reduced in size. The support arm 30 includes a fixed region that is attached to a package or the like, as will be described later, on the tip side of the bent portion 32 (the weight portion 29 side of the vibrating arm 22). By attaching so as to support, the vibrating arm 22 and the base portion 21 can be lifted from the fixed surface of the vibrating piece 20.

  Excitation electrodes 33 and 34 are formed on the surfaces including the long grooves 26a and 26b and the both side surfaces of the vibrating arms 22 (see FIG. 1B). In one vibrating arm 22, the vibrating arm 22 is vibrated by applying a voltage between the excitation electrodes 33 and 34 to expand and contract both side surfaces of the vibrating arm 22. The excitation electrodes 33 and 34 are formed by etching the quartz crystal to form an outer shape including the long grooves 26a and 26b of the resonator element 20, and then depositing nickel (Ni) or chromium (Cr) thereon as an underlayer, for example. Alternatively, an electrode layer made of, for example, gold (Au) can be formed by sputtering and then patterned by photolithography. Here, it is known that chromium has high adhesion to quartz, and gold has low electrical resistance and is difficult to oxidize.

Here, the effect of the resonator element 20 of the present embodiment will be described.
The inventor firstly occupies the occupancy ratio that can efficiently reduce the frequency when the occupancy ratio of the length l of the weight portion 29 to the length L from the base portion 21 to the tip end portion of the vibrating arm 22 is changed. The occupancy ratio that can efficiently reduce the decrease in the Q value converted to a constant frequency was obtained individually by simulation. As a result, the occupancy that can efficiently reduce the frequency does not match the occupancy that can efficiently reduce the decrease in the Q value.
Next, due to the occupancy ratio of the length of the weight portion 29 with respect to the length from the base to the tip of the base portion 21 of the vibrating arm 22, an element that improves the efficiency of reducing the frequency of the vibrating piece 20, The result shown in the graph of FIG. 2 was obtained as a result of multiplying by an element with a smaller elastic loss and further correcting to match the optimum value obtained by simulating with an equivalent model.
In FIG. 2, the horizontal axis represents the weight occupation ratio (%) occupied by the length l of the weight portion 29 with respect to the length L in the longitudinal direction from the base to the tip of the base portion 21 of the vibrating arm 22. The axis is a high performance index that is defined (after correction) as a value obtained by multiplying the low frequency index and the high Q index.
As shown in the graph of FIG. 2, the inventor has found that the high performance index after correction is highest when the weight occupation ratio is 35% to 41% centering on the weight occupation ratio 38%.

  Therefore, according to the resonator element 20 of the above-described embodiment, the vibration efficiency is improved and the CI value is reduced by the long grooves 26 a and 26 b provided in each vibration arm 22, and at the tip portion of each vibration arm 22. Since the length l in the longitudinal direction of the weight portion 29 is formed to be 35 to 41% of the total length L of the vibrating arm 22, the frequency without increasing the length of the vibrating arm 22. Can be suppressed sufficiently low, and the thermoelastic loss can be reduced to sufficiently suppress the decrease in the Q value.

[Vibrator]
Next, a vibrator using the vibrating piece 20 will be described.
FIGS. 3A and 3B illustrate an embodiment of a vibrator on which the resonator element 20 is mounted. FIG. 3A is a schematic plan view seen from above, and FIG. 3B is a cross-sectional view taken along line BB in FIG. It is. 3A illustrates a state in which a lid 119 (see FIG. 3B) provided above the vibrator 200 is removed for convenience of explaining the internal structure of the vibrator.

  In FIG. 3, the vibrator 200 has a package 110 provided with a recess having a step. The vibration piece 20 is joined to the concave bottom portion of the concave portion of the package 110, and a lid 119 as a lid is joined to the open upper end of the package 110.

  The package 110 is formed by laminating a rectangular annular second layer substrate 112 and a third layer substrate 113 having different opening sizes on a flat plate-like first layer substrate 111 in this order. A recess having an opening and a step in the interior is formed. As a material of the package 110, for example, ceramic, glass, or the like can be used.

In the recess of the package 110, a plurality of resonator element connection terminals 115 to which the resonator element 20 is bonded are provided on the step formed by the second layer substrate 112. Although not shown, external mounting terminals for joining to an external substrate are provided on the outer bottom surface of the first layer substrate 111 serving as the outer bottom surface of the package 110.
As described above, the various terminals provided in the package 110 are connected to each other by inter-layer wirings such as routing wirings and through holes (not shown).

  The resonator element 20 is bonded to the recess of the package 110. Specifically, the external connection electrode (not shown) provided on a part of the support arm 30 of the resonator element 20 and the step formed by the protrusion 112a of the second layer substrate 112 in the recess of the package 110 are provided. The vibration piece connection terminal 115 is aligned and joined by a conductive joining member 96 such as a silver paste and electrically connected. As a result, the resonator element 20 is fixed with the vibrating arm 22 as a free end while leaving a gap between the resonator element 20 and the first layer substrate 111 that is the concave bottom portion of the recess in the package 110.

  As shown in FIG. 3B, a lid 119 as a lid is disposed on the upper end of the package 110 to which the resonator element 20 is joined in the recess, and seals the opening of the package 110. As a material of the lid 119, for example, a metal such as 42 alloy (an alloy containing 42% nickel in iron) or Kovar (an alloy of iron, nickel, and cobalt), ceramics, glass, or the like can be used. For example, the lid 119 made of metal is joined to the package 110 by seam welding via a seal ring 118 formed by punching a Kovar alloy or the like into a rectangular ring shape. An internal space formed in the package 110 is a space for the vibration piece 20 to operate. The internal space is hermetically sealed in a reduced pressure space or an inert gas atmosphere.

  According to the vibrator 200 having the above-described configuration, since the resonator element 20 having the above-described configuration is provided, the long grooves 26a and 26b provided in the vibrating arm 22 improve the vibration efficiency and reduce the CI value. Thus, it is possible to provide the vibrator 200 having excellent vibration characteristics in which the low frequency and the high Q value are achieved by the weight portion 29.

[Oscillator]
Next, an oscillator using the vibrating piece 20 will be described.
FIGS. 4A and 4B illustrate an embodiment of an oscillator on which the resonator element 20 is mounted. FIG. 4A is a schematic plan view seen from above, and FIG. 4B is a cross-sectional view taken along the line CC in FIG. is there. FIG. 4A shows a state in which the lid 219 provided above the oscillator 300 is removed for convenience of explaining the internal structure of the oscillator.

  In FIG. 4, the oscillator 300 has a package 210 provided with a recess having a step. The IC chip 150 and the vibrating piece 20 disposed above the IC chip 150 are joined to the concave bottom portion of the concave portion of the package 210, and a lid 219 as a lid is joined to the open upper end of the package 210. Has been.

  The package 210 is configured by laminating a rectangular-shaped second layer substrate 212, a third layer substrate 213, and a fourth layer substrate 214 having different opening sizes in this order on a flat first layer substrate 211. As a result, a recess having an opening on the upper surface side and having a step inside is formed. As a material of the package 210, for example, ceramic, glass, or the like can be used.

A die pad 215 on which the IC chip 150 is disposed is provided on the first layer substrate 211 which is a concave bottom portion of the concave portion of the package 210. Although not shown, an external mounting terminal for joining to an external substrate is provided on the outer bottom surface of the first layer substrate 211 that is the outer bottom surface of the package 210 (a surface different from the surface on which the die pad 215 is provided). ing.
A plurality of IC connection terminals 216 for electrical connection with the IC chip 150 are provided on the step formed by the second layer substrate 212 in the recess of the package 210.
Furthermore, a plurality of vibration piece connection terminals 217 to which the vibration piece 20 is bonded are provided on the step formed by the third layer substrate 213 in the recess of the package 210.
In the above-described various terminals provided in the package 210, corresponding terminals are connected to each other by an intra-layer wiring such as a lead wiring or a through hole (not shown).

  The IC chip 150 is a semiconductor circuit element including an oscillation circuit that oscillates the resonator element 20 and a temperature compensation circuit. The IC chip 150 is bonded and fixed to the die pad 215 provided at the bottom of the concave portion of the package 210 by, for example, a brazing material 95. In the present embodiment, the IC chip 150 and the package 210 are electrically connected using a wire bonding method. Specifically, a plurality of electrode pads 155 provided on the IC chip 150 and corresponding IC connection terminals 216 of the package 210 are connected by bonding wires 97.

  In the recess of the package 210, the resonator element 20 is bonded above the IC chip 150. Specifically, the external connection electrode (not shown) provided on a part of the support arm 30 of the resonator element 20 and the step formed by the protrusion 213a of the third layer substrate 213 in the recess of the package 210 are provided. The vibrating piece connection terminal 217 is aligned, and is joined and electrically connected by a conductive joining member 96 such as a silver paste. Accordingly, the vibrating piece 20 is fixed with the vibrating arm 22 as a free end while leaving a gap between the vibrating piece 20 and the IC chip 150 bonded downward in the package 210.

  As shown in FIG. 4B, a lid 219 is disposed at the upper end of the package 210 in which the IC chip 150 and the resonator element 20 are joined in the recess, and the opening of the package 210 is sealed. For example, when a lid 219 made of metal is used, it is joined to the package 210 by seam welding via a seal ring 218 formed by punching a Kovar alloy or the like into a rectangular ring shape. An internal space serving as a space for operating the resonator element 20 in the package 210 is hermetically sealed in a reduced pressure space or an inert gas atmosphere.

  According to the oscillator 300 having the above-described configuration, since the resonator element 20 having the above-described configuration is provided, the long grooves 26a and 26b provided in the vibrating arm 22 improve the vibration efficiency and reduce the CI value. It is possible to provide the oscillator 300 having excellent oscillation characteristics by reducing the frequency and increasing the Q value by the weight portion 29.

  The embodiment of the present invention made by the inventor has been specifically described above, but the present invention is not limited to the above-described embodiment, and various modifications are made without departing from the scope of the present invention. Is possible.

  For example, in the above embodiment, the thermoelastic loss suppressing effect of the present invention has been described by taking the vibration piece 20 in the bending vibration mode as an example. However, the present invention is not limited to this, and even in a vibration piece having a vibration mode other than a bending vibration mode such as a torsional vibration mode or a shear mode, the same effect as that of the above embodiment can be obtained by providing the characteristic configuration of the present invention. .

  In the above-described embodiment, the so-called tuning-fork type vibrating piece 20 having the support arm 30 dedicated to the support extending from the base 21 and the two vibrating arms 22 extending in parallel from the base 21 is formed. An embodiment of the present invention has been described. However, the present invention is not limited to this, and a vibrating piece having no support arm 30 may be used, or a beam-type vibrating piece configured by only one vibrating arm having a base portion serving as a fixed end may be used. Even if the resonator element has three or more vibrating arms, the same effect as in the above embodiment can be obtained.

  In the above embodiment, the vibrating piece 20 made of a piezoelectric material such as quartz has been described. However, the present invention is not limited to this. For example, even a vibrating piece made of silicon can achieve the same effect as that of the above embodiment.

  20 ... vibrating piece, 21 ... base, 21a ... first part (base), 21b ... second part (base), 21c ... connection part, 22 ... vibrating arm, 23 ... general part, 24 ... Wide part, 25 ... Jetty part, 26a, 26b ... Long groove, 29 ... Weight part, 30 ... Support arm, 32 ... Bending part, 33, 34 ... Excitation electrode, 95 ... Brazing material, 96 ... Conductive joining member 97, bonding wire, 110, 210 ... package, 111, 211 ... first layer substrate, 112, 212 ... second layer substrate, 112a ... projection, 113, 213 ... third layer substrate, 115, 217 ... vibrating piece Connection terminals 118, 218 ... seal ring, 119, 219 ... lid, 150 ... IC chip, 155 ... electrode pad, 200 ... vibrator, 214 ... fourth layer substrate, 215 ... die pad, 300 ... oscillator.

Claims (6)

The base,
A vibrating arm extending from the base,
The resonating arm has a bottomed long groove having an opening along at least one main surface of both main surfaces of the resonating arm;
A weight portion having a width wider than the base side of the vibrating arm and the base side of the vibrating arm is provided on the tip side opposite to the base of the vibrating arm and the base portion,
In the longitudinal direction of the vibrating arm, the vibrating piece is characterized in that a length ratio of the weight portion occupying a length from a base to the base side to the tip side is in a range of 35% to 41%. The resonator element according to claim 1,
Two vibrating arms extending parallel to each other from the base are provided,
A vibrating piece, wherein a support arm is provided to extend in parallel with the vibrating arm from between the two vibrating arms of the base. In the resonator element according to claim 1 or 2,
A resonator element, wherein the resonator element is a crystal resonator element formed of quartz. In the resonator element according to any one of claims 1 to 3,
A vibration piece characterized by being a bending vibration piece exhibiting a bending vibration mode. The resonator element according to any one of claims 1 to 4,
And a package for housing the resonator element. The resonator element according to any one of claims 1 to 4,
A circuit element including an oscillation circuit for oscillating the resonator element;
An oscillator comprising: the resonator element; and a package accommodating the circuit element.

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