JP2011192969A - Development processor and development processing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a dissolved product or contamination caused by a substrate treatment surface from contaminating the backside of a substrate by preventing misalignment caused by dirt on the backside of the substrate during exposure. <P>SOLUTION: This development processor includes a rotary base 2 that rotationally holds a substrate G, a runup stage 3 that can rotate with the rotary base, surrounds the outer periphery of the substrate held by the rotary base, and forms a continuous liquid film from the front side of the substrate, a flat part 4 that has a flat surface facing the substrate with a fixed gap, and a nozzle head 5 that moves along the surface of the substrate and simultaneously supplies and sucks a developing liquid to and from the substrate. The flat part is held with the fixed gap from the backside of the substrate and includes liquid supply holes 40 for supplying liquid into the gap and suction/discharge holes 41 that are disposed between the liquid supply holes to suck or discharge the liquid. Passage open/close valves V1 and V2 provided on pipes 42a and 42b connected to the liquid supply hole and the suction/discharge hole are opened or closed by a control unit 65. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a development processing apparatus and a development processing method for supplying a developer to a glass substrate for a photomask such as a reticle for processing.

  In general, in a semiconductor device manufacturing process, for example, a resist solution is applied to the surface of a semiconductor wafer, a glass substrate for LCD (hereinafter referred to as a wafer), and the circuit pattern is reduced by using an exposure device such as a stepper. A photolithographic technique is used in which a film is exposed and a developing solution is applied to the exposed wafer surface for development.

  In the exposure processing step, for example, an exposure apparatus such as a stepper (reduction projection exposure apparatus) is used, and a photomask such as a reticle is irradiated with light to reduce the original drawing of the circuit pattern drawn on the photomask. Is transferred onto the wafer.

  By the way, in this photomask manufacturing process, photolithography technology is used in the same manner as the wafer and the like, and a series of process steps including a resist coating process, an exposure process, and a development process are performed. Since this is an original drawing for projecting a circuit pattern onto a wafer or the like, the pattern dimensions such as the line width are required to have higher accuracy.

  In the conventional photomask development method, a glass substrate for photomask is sucked and held on a spin chuck and rotated at a low speed, and a developing process is performed while spraying a developer onto the glass substrate using a spray nozzle. There are known spray-type development methods, and paddle-type development methods in which the developer supplied from the scan nozzle is deposited on the glass substrate while the glass substrate and the scan nozzle are moved relative to each other, and development processing is performed in a stationary state. It has been.

  However, in spray development, the dissolved product produced by reacting with the developer flows to the sides and corners of the glass substrate by the centrifugal force due to rotation, so the reaction with the developer is suppressed at this part, There is a problem that pattern dimensions such as line width become non-uniform. In addition, in the paddle type development, the dissolved product does not flow to a specific place, and there is no problem like the spray type development. However, due to the difference in the geometrical structure of the pattern and the pattern density, There is a problem that a phenomenon called a loading effect in which the generation amount and the concentration of the developing solution are locally different and the etching rate and the like are changed, resulting in a non-uniform circuit pattern.

  Therefore, as a developing method that can reduce the consumption of the developer compared to the spray type and the paddle type and can improve the processing uniformity, the glass substrate and the scan nozzle are moved relative to each other while the glass substrate and the scan nozzle are moved relative to each other. A supply / suction method is employed in which the developer supplied to the substrate surface is sucked by the processing liquid suction means.

  In this supply / suction method, the substrate to be processed may be lifted by the suction by the processing liquid suction means during processing, and the flow of the processing liquid becomes unstable due to the floating of the substrate to be processed, and the processing uniformity. There was a problem that was damaged. For this reason, conventionally, a liquid processing apparatus capable of preventing floating and performing uniform liquid processing on a substrate to be processed has been employed (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 2006-222460

  However, in the liquid processing apparatus described in Japanese Patent Application Laid-Open No. 2006-222460, there is a concern that misalignment may occur due to dust on the back surface of the substrate in the exposure apparatus during exposure. In addition, it is difficult to remove dust adhering to the back surface, and there is a concern that soluble organisms and dirt generated from the substrate processing surface may be drawn into the back surface and contaminate the back surface of the substrate.

  The present invention has been made in view of the above circumstances, and prevents dust from adhering to the substrate holding portion to cause misalignment in the exposure apparatus during exposure, and also eliminates unwashed substrate backside and substrate contamination. It is an object of the present invention to provide a development processing apparatus and a development processing method that make it possible.

  In order to achieve the above object, a development processing apparatus of the present invention comprises a rotating base that rotatably holds a plate-like substrate to be processed, a substrate that is rotatable together with the rotating base, and is held on the rotating base. An outer peripheral plate that surrounds the outer peripheral portion of the processing substrate and forms a continuous liquid film from the surface of the substrate to be processed, and is movable along the surface of the substrate to be processed that is held on the rotating base. A nozzle head that simultaneously supplies and sucks the developing solution to the processing substrate, a flat portion having a flat surface facing the substrate to be processed, which is held on the rotating base, with a certain clearance, and the rotating the flat portion A moving mechanism that moves up and down relatively with respect to the base; a plurality of liquid supply holes that are provided on the opposite side of the planar portion of the substrate to be processed and that supply liquid to the gap; and the plurality of liquids Sandwiched between the position where the supply hole is placed As described above, the suction / discharge hole for sucking and discharging the liquid provided at a predetermined interval from the liquid supply hole, and the supply of the liquid from the liquid supply hole and the suction / discharge by the suction / discharge hole are controlled. And a control unit.

  With this configuration, the flat portion is held with a certain gap from the back surface of the substrate, and suction is performed while supplying liquid, for example, pure water, to the back surface of the substrate. Since the negative pressure region can be created, the substrate can be prevented from being lifted. Further, since the liquid supply hole and the suction / discharge hole do not contact the back surface of the substrate, dust adhering to the back surface of the substrate can be reduced, and misalignment at the time of sucking the substrate can be prevented. In addition, since pure water is supplied to the backside of the substrate, the backside of the substrate can be cleaned, and a liquid suction hole is arranged so that a suction / discharge hole is sandwiched between the plurality of liquid supply holes. Therefore, it is possible to prevent the developer or the dissolved product on the back surface of the substrate from being drawn into the back surface of the substrate and sucked.

  In this invention, it is preferable that the opening of the liquid supply hole is communicated by a communication groove surrounding the outside of the suction / discharge hole.

  By comprising in this way, it can prevent that the liquid outside a plane part enters into a suction discharge hole.

  In addition, the suction / discharge hole preferably has a shape including a linear opening base and an opening auxiliary portion bent from the end of the opening base toward the outer periphery of the substrate to be processed.

  With this configuration, the suction force of the outer peripheral portion of the substrate to be processed can be increased, and the liquid supply from the liquid supply hole and the liquid suction from the suction discharge hole can be efficiently performed.

  Moreover, it is preferable that the opening surface portion of the suction / discharge hole in the flat portion is formed higher than the opening surface portion of the liquid supply hole.

  With this configuration, the suction area can be increased to increase the suction force, and the suction force on the outer peripheral side of the substrate to be processed can be increased to perform efficient suction.

  In addition, the flat portion includes a gap holding pin for holding the substrate to be processed by contacting the back surface of the substrate to be processed with a gap between the flat portion and an auxiliary holding pin having a height lower than the gap holding pin. It is preferable to have

  With this configuration, the substrate to be processed can be held by the auxiliary holding pins when the substrate to be processed is bent, and contact between the substrate to be processed and the flat portion can be prevented. Further, by holding the substrate to be processed by the auxiliary holding pins, the distance between the substrate to be processed and the flat portion can be reduced, so that a strong suction force can be obtained and the liquid supply amount can be reduced. it can.

  Further, it is preferable that a plurality of the planar portions are provided to face the back surface of the substrate to be processed.

  With such a configuration, the plurality of flat portions hold the back surface of the substrate to be processed, so that the substrate can be stably held with a constant gap.

  In addition, the flat portion is provided inside the bottomed container, and when the rotating base is moved to the opening peripheral edge of the bottomed container, the flat part is attached to the entire circumference of the back surface of the outer peripheral plate. And a through hole is provided in the bottom of the bottomed container, and the rotation shaft of the rotating base is inserted into the through hole so as to be rotatable and vertically movable. It is preferable to close the gap between the rotating shafts with the second annular seal member and form a liquid storage space for storing the liquid in a gas-watertight manner.

  With this configuration, the first annular seal member is in close contact with the entire circumference of the back surface of the outer peripheral plate, and the second annular seal member rotates with the through hole provided in the bottom of the bottomed container. A liquid storage space with high air-water tightness can be formed by closing the gap between the rotation shafts of the base.

  Moreover, it is preferable that the bottomed container includes a drain port provided at the bottom.

  By comprising in this way, the liquid stored by the liquid storage space can be discharged | emitted from the drainage port provided in the bottom part of the bottomed container.

  In addition to the liquid supply hole, the liquid stored in the liquid storage space includes a first cleaning liquid supply nozzle for supplying a cleaning liquid to the substrate held on the rotating base, and a bottom portion of the bottomed container. It is preferable that the liquid is one of the liquids supplied by at least one of the second cleaning liquid supply nozzles.

  By comprising in this way, a liquid can be efficiently supplied to liquid storage space.

  The liquid supply hole and the suction / discharge hole are formed in a straight line, and the plurality of the suction / discharge holes are arranged in parallel with the liquid supply hole at a position sandwiched between the plurality of liquid supply holes, It is preferable that the controller alternately switches the suction of the liquid supplied between the substrate to be processed and the planar portion. In this case, it is preferable to provide a switching valve that is connected to the pipe line of the suction / discharge hole and alternately switches the suction of the liquid supplied between the substrate to be processed and the flat portion.

  With this configuration, it is possible to periodically switch the suction of the liquid from the suction / discharge hole, prevent the generation of bubbles between the flat portion and the back surface of the substrate, and further reduce substrate contamination. .

  In addition, it is preferable that the pipe connected to the suction / discharge hole is provided with an internal rotator for alternately switching the suction of the liquid through the plurality of suction / discharge holes. In this case, the internal rotator is connected to the plurality of suction / discharge holes, and is rotatably disposed in a conduit merging portion connected to the liquid supply hole, and is connected to the downstream of the liquid supply hole. It is preferable to provide a groove that is rotated by the liquid supplied from the supply source and switches the suction of the liquid from the plurality of suction / discharge holes to one of them.

  With this configuration, it is possible to switch the liquid suction from the plurality of suction / discharge holes without using the control device, thereby reducing the cost.

  The development processing method of the present invention includes a step of holding a plate-like substrate to be processed on a rotary base that holds the plate-like substrate in a rotatable manner, and a moving mechanism that moves the flat portion up and down relative to the rotary base. And a step of providing a certain gap between the flat portion having a flat surface and the substrate to be processed at the position moved by the step, and then supplying a liquid to the gap provided on the flat portion facing the substrate to be processed. For sucking and discharging the liquid provided at a predetermined interval from the supply hole so as to be sandwiched between the plurality of liquid supply holes arranged for the purpose and the position where the plurality of liquid supply holes are arranged A step of supplying and discharging liquid from each of the suction / discharge holes, and simultaneously supplying and sucking the developer to the substrate to be processed along the surface of the substrate to be processed held on the rotating base. Work to move the nozzle Characterized in that it comprises a and.

  With this configuration, development is performed while holding the substrate with a certain gap from the back surface of the substrate, so that the temperature influence from the flat surface is less likely to be transmitted to the substrate, and the temperature change of the developer on the substrate can be prevented. In this plane, the occurrence of processing unevenness caused by the temperature difference of the developer is suppressed, and the uniformity of the development processing can be improved.

  According to the present invention, since it is configured as described above, it has the following excellent effects.

  The flat portion has a certain gap from the back surface of the substrate, holds the substrate, and can create a negative pressure region by sucking while supplying the liquid to the gap, so that the substrate can be prevented from rising. it can. Further, since the liquid supply hole and the suction / discharge hole do not contact the back surface of the substrate, dust adhering to the back surface of the substrate can be reduced, and misalignment at the time of sucking the substrate can be prevented. In addition, by supplying a liquid such as pure water to the back surface of the substrate, the back surface of the substrate can also be cleaned, and liquid suction is performed so that a suction / discharge hole is sandwiched between the plurality of liquid supply holes. Since the holes are arranged, it is possible to prevent the developer or the dissolved product on the back surface of the substrate from being drawn into the back surface of the substrate and sucked.

1 is a schematic cross-sectional view showing a first embodiment of a development processing apparatus according to the present invention. It is a schematic plan view of the development processing apparatus. It is sectional drawing which shows the nozzle head in this invention. It is an enlarged perspective view (b) which shows the I section of (a) and (a) of the rotation base in this invention. It is a perspective view which shows the bottomed container which has a plane part in this invention. It is a schematic plan view which shows the said plane part and a bottomed container. It is sectional drawing (a) of the bottomed container in alignment with the II-II line | wire of FIG. 5, and sectional drawing (b) of another location of a bottomed container. It is the graph (a) which shows the pressure distribution of the liquid supply hole of the plane part in this invention, and a suction discharge hole, and the schematic sectional drawing (b) of a liquid supply hole and a suction discharge hole. It is a schematic sectional drawing which shows the holding state of the to-be-processed substrate by the clearance gap holding pin and auxiliary | assistant holding pin in this invention. It is the top view (a) which shows the plane part in this invention, and the expanded sectional view (b) of the negative pressure area of a plane part. It is sectional drawing which shows the 1st annular seal member in this invention. It is the schematic plan view (a) and schematic sectional drawing (b) which show the carrying-in state of the board | substrate in the image development processing apparatus concerning this invention. It is the schematic plan view (a) and schematic sectional drawing (b) which show the receiving state of the board | substrate in the image development processing apparatus concerning this invention. It is the schematic plan view (a) and schematic sectional drawing (b) which show the state after receiving the board | substrate in the image development processing apparatus concerning this invention. It is the schematic plan view (a) and schematic sectional drawing (b) which show the angle adjustment state of the board | substrate in the image development processing apparatus concerning this invention. FIG. 2 is a schematic plan view (a) and a schematic cross-sectional view (b) showing a liquid filling state in the development processing apparatus according to the present invention. It is the schematic plan view (a) and schematic sectional drawing (b) which show the liquid film formation state in the image development processing apparatus concerning this invention. It is the schematic plan view (a) and schematic sectional drawing (b) which show the development processing state in the development processing apparatus concerning this invention. It is the schematic plan view (a) and schematic sectional drawing (b) which show the liquid draining state in the image development processing apparatus concerning this invention. It is a flowchart which shows the process of the developing device which concerns on this invention. It is the top view (a) of the plane part in 2nd Embodiment of the developing device which concerns on this invention, sectional drawing (b) of (a), and schematic sectional drawing (c) of the negative pressure area of a plane part. It is the schematic sectional drawing (a) which shows 3rd Embodiment of the image development processing apparatus concerning this invention, and the perspective view (b) of the rotor in this invention. It is a schematic sectional drawing which shows the principal part of 4th Embodiment of the developing device which concerns on this invention.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In this embodiment, a case will be described in which the development processing apparatus according to the present invention is applied to a development processing apparatus that performs development processing on a substrate to be processed for a photomask, for example, a glass substrate for a reticle.

  As shown in FIGS. 1 and 2, the development processing apparatus according to the present invention includes a casing 1, and a rotating base that rotatably holds a glass substrate G (hereinafter referred to as a substrate G) in the casing 1. 2 and a liquid film that can rotate with the rotating base 2 and that surrounds the outer periphery of the substrate G held on the rotating base 2 on the same plane of the surface of the substrate G from the surface of the substrate G. An outer peripheral plate 3 (hereinafter referred to as a “running stage 3”) for forming, a flat portion 4 having a plane facing the substrate G with a certain gap, and a movable surface along the surface of the substrate G. And a nozzle head 5 that simultaneously supplies and sucks the developer.

  The rotating base 2, the run-up stage 3 and the flat part 4 are formed so as to be accommodated in the cup 6, and are held by the rotating base 2 and the flat part 4 on the outer side of the cup 6. A rinse nozzle 8 that is a first cleaning liquid supply nozzle that supplies a cleaning liquid (rinsing liquid) such as pure water (DIW) toward the substrate G and a liquid storage space 7 to be described later is disposed.

  In this case, as shown in FIG. 4, the rotary base 2 has horizontal support pieces 12 extending at four locations on the outer periphery of the disk-shaped base 11 connected to the rotary shaft 10, and an annular horizontal plate at the tip of the horizontal support piece 12. A pair of positioning pins 15 that respectively hold the corners of the substrate G are erected on the tops of the first support pillars 14 that are formed by connecting the pieces 13 and are erected at four positions of the annular horizontal piece 13. It becomes. In addition, second support column pieces 16 are erected at four positions in the annular horizontal piece 13 which are deviated from the first support column pieces 14 by about 45 degrees, and the run-up stage 3 is horizontally arranged by each second support column piece 16. Supported by the state. The rotary base 2 is connected to a rotary drive mechanism 17 such as a motor via a rotary shaft 10 and can rotate at a predetermined rotational speed with the rotary shaft 10 as a central axis. The rotary base 2 may be formed so as to be movable up and down (lifted / lowered) by the rotation drive mechanism 17.

  As shown in FIG. 2, the run-up stage 3 has a thin plate shape that is circular when viewed from above, and a square opening 3 a that accommodates the substrate G is formed at the center. Thus, by forming the outer shape of the run-up stage 3 in a circular shape, turbulence is prevented from being formed in the vicinity of the outer periphery of the run-up stage 3 when the run-up stage 3 is rotated. In this case, the run-up stage 3 is fixed on the same plane as the surface of the substrate G or at a slightly higher position, for example, a position 200 to 400 μm higher. Thereby, a continuous liquid film can be formed on the same plane extending from the surface of the substrate G to the surface of the run-up stage 3. The opening 3 a of the running stage 3 is slightly larger than the substrate G, and a gap 9 for transferring the substrate G is formed between the substrate G and the running stage 3.

  Further, as shown in FIGS. 5, 5A, 6, 6A, and 6B, the plane portion 4 is a plane that faces the substrate G with a certain gap s provided inside the cylindrical bottomed container 20. have. And in order to avoid interference with the four horizontal support pieces 12 of the rotation base 2, it arrange | positions on the circumference | surroundings into 4 divisions along the peripheral area | region of the board | substrate G back surface. By dividing the flat surface portion 4 into four, the flat surface portion 4 divided into four holds the back surface of the substrate G, so that the substrate G can be stably held at a constant interval.

  Further, as shown in FIGS. 5, 5A, 6 and 7, a liquid supply hole 40 for supplying a liquid, for example, pure water, to the gap between the substrate G and the flat portion 4 is provided on the upper surface side of the flat portion 4. Two suction holes 41 for sucking and discharging the liquid are arranged at two positions, and at a position between the positions where the liquid supply holes 40 are provided. In this case, the opening surface portion 4A having the opening 41a portion of the suction / discharge hole 41 includes a straight portion 4a parallel to one side of the substrate G and an orthogonal portion 4b bent about 90 degrees from one end portion of the straight portion 4a. The suction / discharge hole 41 has a linear opening base 41b provided at the center of the straight part 4a, and approximately 90 from the end of the opening base 41b to the center of the orthogonal part 4b. It is formed in a substantially L shape comprising an opening auxiliary portion 41c that is bent and extended. The substantially L-shaped suction / discharge hole 41 formed in this way is formed from an opening base 41b parallel to one side of the substrate G and an opening auxiliary portion 41c parallel to one other side adjacent to the one side of the substrate G. Accordingly, the suction force of the outer peripheral portion of the substrate G can be increased, and the liquid supply from the liquid supply hole 40 and the liquid suction from the suction discharge hole 41 can be efficiently performed.

  Further, the opening surface portion 4A of the suction / discharge hole 41 in the flat surface portion 4 is formed to be, for example, about 0.5 mm higher than the opening surface portion 4B having the opening 40a portion of the liquid supply hole 40. The liquid supply hole 40 is provided in the vicinity of the boundary between the opening surface portion 4A of the suction / discharge hole 41 and the opening surface portion 4B of the liquid supply hole 40, and the opening portions of both the liquid supply holes 40 are located outside the suction / discharge hole 41. It communicates with the communication groove 40b surrounding the direction. In addition, the groove 40 b is provided along the boundary of the opening surface portion 4 </ b> A of the suction / discharge hole 41, similarly to the liquid supply hole 40.

  As described above, the opening of the liquid supply hole 40 communicates with the communication groove 40b surrounding the outside of the suction / discharge hole 41, so that the liquid outside the flat surface portion 4, that is, the bottomed container 20 described later is accumulated. It is possible to prevent the pure water used for cleaning from entering the suction / discharge hole 41.

  Further, by forming the opening surface portion 4A of the suction / discharge hole 41 higher than the opening surface portion 4B of the liquid supply hole 40, the suction area can be increased to increase the suction force, and the suction force on the outer peripheral side of the substrate G can be increased. And efficient suction can be performed (see FIG. 6A).

  In addition, the flat surface portion 4 is in limited contact with the back surface of the substrate G and has a gap holding pin 45 for holding the substrate G with a gap between the flat surface portion and an auxiliary member having a height lower than the clearance holding pin 45. A holding pin 46 is provided (see FIGS. 5A, 6B, and 7A).

  As described above, the gap holding pins 45 that hold the substrate G in a limited manner on the back surface of the substrate G and leave a gap between the flat portions and the auxiliary holding pins 46 having a height lower than the gap holding pins 45 are provided. Thus, when the substrate G is bent by the suction action of the suction / discharge hole 41, the substrate G can be held by the auxiliary holding pins 46, and contact between the substrate G and the flat portion 4 can be prevented. In addition, since the substrate G is held by the auxiliary holding pins 46, the distance between the substrate G and the flat portion 4 can be reduced, so that a strong suction force can be obtained and the liquid supply amount can be reduced. it can.

  In this case, the liquid supply source 43 and the suction / discharge device 44 are connected to the pipelines 42a and 42b respectively connected to the liquid supply hole 40 and the suction / discharge hole 41 via the channel opening / closing valves V1 and V2 which are switching valves. ing. Further, a control unit 65 is electrically connected to the flow path opening / closing valves V1 and V2, and by controlling the opening and closing of the flow path based on a control signal from the control unit 65, supply of liquid and suction and discharge of liquid are performed. It is configured so that the timing can be individually set.

  The top surface 24a of the cylindrical side wall 24 of the bottomed container 20 is provided with a first circumferential groove 24b for fitting a first annular seal member 25a described later.

  The first annular seal member 25 a fitted into the first circumferential groove 24 b of the bottomed container 20 is formed so as to be able to be in close contact over the entire circumference of the back surface of the running stage 3. In this case, the first annular seal member 25a is excellent in chemical resistance containing, for example, a flexible resin such as PCTFE (polychlorotrifluoroethylene), PTFE (polytetrafluoroethylene), or silicon. A rubber material or the like is used, and each has a flexible sealing piece 25c extending in an inclined manner toward the back side of the run-up stage 3 to be in close contact. Thus, by providing the first annular seal member 25a with the flexible seal piece 25c extending in an inclined manner toward the back surface side of the run-up stage 3, the contact area with the back surface of the run-up stage 3 can be increased. It can be widened and adjustment can be facilitated.

  In addition, a drainage port 26 is provided at one location of the bottom portion 22 of the bottomed container 20, and a bottom surface 22 a of the bottom portion 22 is formed in a downward slope toward the drainage port 26 side. Thereby, the drainage of the liquid adhering to the bottom surface 22a of the bottom part 22 can be made favorable.

  A through hole 21 is provided at the center of the bottom 22 of the bottomed container 20. The rotary shaft 10 is inserted into the through hole 21 so as to be able to rotate and move up and down (up and down). And the rotary shaft 10 are formed in a gas-watertight manner by the second annular seal member 25b (see FIG. 1).

  Further, a passage 22b through which the rinsing liquid sprayed from the back rinse nozzle 70 as the second cleaning liquid supply nozzle is circulated is provided at a timely position on the bottom 22 of the flat portion 4 (see FIG. 6B). .

  While holding the substrate G with a certain gap s by the flat portion 4 formed as described above, the bottomed container 20 and the run-up stage 3 are in close contact via the first annular seal member 25a. A liquid storage space 7 having high air-water tightness is formed. In addition, the substrate G is formed to be rotatable together with the rotating base 2 and the running stage 3 in a state where the suction by the flat portion 4 and the close contact by the first annular seal member 25a are released. Therefore, since the rotation base 2 and the run-up stage 3 are rotated without rotating the plane portion 4, the power of the rotation drive mechanism 17 can be reduced.

  Note that the flat portion 4 is provided with three through holes 27 corresponding to the outer peripheral portion of the substrate G and penetrating in the vertical direction. In each through-hole 27, a support pin 28 that supports and lifts the substrate G is inserted so as to be able to move up and down. The support pin 28 can be moved up and down by a lift drive unit 29 such as a cylinder, for example, and can protrude from the rotary base 2 to transfer the substrate G to the rotary base 2.

  Further, the rotary base 2 and the flat portion 4 are accommodated in a cup 6 for receiving and collecting the liquid scattered or dropped from the substrate G. The cup 6 is formed, for example, in a substantially cylindrical shape having a rectangular shape with the lower surface closed and the upper surface opened so as to cover the sides and the lower side of the rotary base 2 and the flat portion 4. The lower surface of the cup 6 is connected to, for example, a discharge pipe 6a that communicates with a liquid discharge section of a factory, and the liquid collected in the cup 6 can be discharged to the outside of the development processing apparatus.

  As shown in FIG. 2, a first standby portion 61 is provided on the negative side of the cup 6 in the Y direction (left direction in FIG. 2). In the first standby section 61, the nozzle head 5 that supplies and sucks the developer and the cleaning liquid (rinsing liquid) can wait. The nozzle head 5 has, for example, a substantially rectangular parallelepiped shape along the X direction that is at least equal to or longer than the dimension of the side of the substrate G. The nozzle head 5 is supported by a portal-type head arm 5b, and at least the cup 6 is moved from the first standby unit 61 by a horizontal movement mechanism 5c including, for example, a ball screw and its rotation motor to which the head arm 5b is attached. Are formed such that they can be moved horizontally (scanned) to the vicinity of the end on the positive side in the Y direction (right direction in FIG. 2). Further, the nozzle head 5 is formed to be movable in the vertical direction by an elevating drive mechanism (not shown) including, for example, a ball screw attached to the head arm 5b and its rotation motor.

As shown in FIG. 3, the lower surface 5 a of the nozzle head 5 is formed horizontally so as to be parallel to the surface of the substrate G. A developer discharge port 30 is formed at the center in the Y direction, which is the traveling direction of the nozzle head 5, on the lower surface 5 a of the nozzle head 5. The developer discharge port 30 is formed, for example, in a slit shape that is longer than the side of the substrate G along the longitudinal direction (X direction) of the nozzle head 5, and can discharge the developer in a strip shape. The developer discharge port 30 communicates with a first reservoir 31 formed inside the nozzle head 5, and the first reservoir 31 is connected to the developer supply pipe 3.
3 is connected to a developer supply source 32 installed outside the development processing apparatus. The developer supply source 32 can supply a predetermined flow rate of developer to the nozzle head 5 through the developer supply pipe 33. The nozzle head 5 is configured to temporarily store the supplied developer in the first storage unit 31 and adjust the pressure, and then uniformly discharge the developer from the developer discharge port 30.

On both sides of the lower surface 5a of the nozzle head 5 across the developer discharge port 30, a developer suction port 34 for sucking the developer on the substrate G is provided. For example, the developer suction port 34 is formed in a slit shape parallel to the developer discharge port 30. The developer suction port 34 is, for example, the nozzle head 5.
The second reservoir 35 is communicated with the second reservoir 35 formed inside the suction reservoir 37.
Is connected to a suction device 36 installed outside the casing 1. The suction device 36 can perform suction at a predetermined pressure through the suction tube 37. Therefore, the developer supplied onto the substrate G from the developer discharge port 30 can be sucked at a predetermined pressure from the developer suction ports 34 on both sides of the developer discharge port 30. As a result, on the surface of the substrate G, a developer flow from the developer discharge port 30 toward the developer suction port 34 can be formed.

  A rinsing liquid discharge port 50 for discharging a rinsing liquid such as pure water is formed on the outer surface of each developing solution suction port 34 on the lower surface 5 a of the nozzle head 5. The rinse liquid discharge port 50 is formed in a slit shape parallel to the developer discharge port 30, for example, and can discharge the rinse liquid in a strip shape along the X direction. The rinse liquid discharge port 50 communicates with a third reservoir 51 formed inside the nozzle head 5, and is connected to a rinse liquid supply source 52 installed outside the casing 1 via a rinse liquid supply pipe 53. It is connected. The rinsing liquid supply source 52 can supply a rinsing liquid at a predetermined flow rate to the nozzle head 5 through the rinsing liquid supply pipe 53. The nozzle head 5 can temporarily store the supplied rinse liquid in the third storage unit 51 to adjust the pressure, and then uniformly discharge it from the rinse liquid discharge port 50.

  Further, as shown in FIG. 2, a second standby unit 62 is provided on the positive side of the cup 6 in the Y direction. In the second standby section 62, a rinse nozzle 8 that is a cleaning liquid supply nozzle can be standby. The rinse nozzle 8 is supported, for example, at the tip of a nozzle arm 8b attached to the rotary drive shaft 8a, and from above the central portion of the substrate G in the cup 6 from the second standby portion 62 by the rotation of the rotary drive shaft 8a. Can move up to. The rinse nozzle 8 is connected to, for example, a rinse liquid supply source 63 installed outside the casing 1 by a rinse liquid supply pipe 64, and the rinse liquid (pure water) supplied from the rinse liquid supply source 63 is directed downward. Can be discharged toward.

  In addition to the rotation drive mechanism 17 and the lift drive unit 29, the controller 100 includes a drive unit such as a horizontal movement mechanism 5c of the nozzle head 5 and a lift drive mechanism (not shown), a drive unit of the rinse nozzle 8, and the like. It is electrically connected, and is configured to control the rotation drive mechanism 17, the lift drive unit 29, the drive unit of the nozzle head 5, the drive unit of the rinse nozzle 8, and the like based on a program stored in advance. .

  Next, development processing of the development processing apparatus configured as described above will be described with reference to explanatory diagrams shown in FIGS. 9A to 9H and a flowchart shown in FIG.

  First, when the substrate G transported by the transport arm 80 outside the development processing apparatus is carried into the development processing apparatus, the substrate G is transferred to the support pins 28 that have been raised in advance, and the support pins 28 are lowered. It is mounted on the rotary base 2 and positioned by the positioning pin 15 (S-1; see FIGS. 9A, 9B, and 9C).

  Next, the rotation base 2 that is driven by the rotation drive mechanism 17 and holds the substrate G is rotated by a predetermined angle, the angle of the substrate G on the horizontal plane is adjusted, and the plane portion 4 is relative to the rotation base 2. And the substrate is placed on the flat portion 4 (S-2, S-3; see FIG. 9D). The bottomed container 20 and the run-up stage 3 are in close contact with each other through the first annular seal member 25a in a state where the flat portion 4 and the substrate G have a certain gap s, thereby forming a liquid storage space. Then, the rinse liquid is discharged from the liquid supply hole 40 or the back rinse nozzle 70, and the rinse liquid (pure water) is stored in the liquid storage section 7 (S-4; see FIG. 9E). Then, the rinsing nozzle 8 moves to above the center of the substrate G and discharges pure water downward to form a liquid film L on the surface of the substrate G and the surface of the run-up stage 3 to be liquid-filled (S-4). See FIG. 9F). Thus, the pre-wet process which improves the wettability of the surface of the board | substrate G is performed. After completion of the liquid filling, the rinse nozzle 8 returns to the second standby unit 62.

  Note that the rinse liquid (pure water) supplied into the liquid storage space 7 may be further added by the rinse nozzle 8. In this case, simultaneously with the discharge of the liquid supply hole 40 or the back rinse nozzle 70, the rinse liquid is discharged from the rinse nozzle 8 that has moved up to the center of the substrate G.

  Note that the rinse liquid (pure water) supplied into the liquid storage space 7 may be performed only by the rinse nozzle 8. That is, the supply of the rinse liquid into the liquid storage space 7 may be performed by at least one of the liquid supply hole 40, the back rinse nozzle 70, and the rinse nozzle 8. By doing in this way, the rinse liquid (pure water) can be efficiently supplied in the liquid storage space 7.

  Next, the nozzle head 5 that has been waiting in the first standby portion 61 moves to the run-up stage 3 on the negative side in the Y direction from the substrate G, and the rinse liquid discharge port 50 and the developer discharge port of the nozzle head 5 are moved. 30 and a lower surface 5 a having a developer suction port 34 are arranged on the run-up stage 3. Then, the nozzle head 5 descends and comes close to the surface of the running stage 3 that is the start position. Next, the rinsing liquid is discharged from the rinsing liquid discharge port 50 and the developing liquid is discharged from the developing discharge port 30, and the rinsing liquid and the developing liquid are sucked from the developing solution suction port 34 and moved to the Y direction positive direction side (S-). 5; see FIG. 9G). At this time, the space between the lower surface 5a of the nozzle head 5 and the surface of the run-up stage 3 is always filled with the rinsing liquid and the developer, and the bubble biting phenomenon to the lower surface 5a of the nozzle head 5 is prevented. When the nozzle head 5 advances to the Y direction positive direction side and moves on the surface of the substrate G, the developer discharged onto the substrate G from the developer discharge port 30 is forward in the direction of travel of the nozzle head 5. The developer is sucked from the developer suction ports 34 on the side and the rear side, and a belt-like flow of the developer is formed in a partial region of the surface of the substrate G. The surface of the substrate G is developed by this developer flow. The dissolved product generated by development is immediately discharged from the developer suction port 34.

  The nozzle head 5 moves (scans) to the vicinity of the end of the run-up stage 3 on the positive side in the Y direction while continuously supplying and sucking the developer, for example. By doing so, the region where the developer flows is gradually moved, and the entire surface of the substrate G is developed. When the nozzle head 5 moves to the vicinity of the end of the run-up stage 3 on the Y direction positive direction side, the supply and suction of the developer and the rinsing liquid are stopped, and the nozzle head 5 is returned to the first standby unit 61.

  After the development processing is completed as described above, the liquid stored in the liquid storage space 7 (mixed liquid of the developer and the rinse liquid) is discharged to the outside from the liquid discharge port 26 (S-6; FIG. 9H). reference). Subsequently, the discharge of the rinsing liquid from the liquid supply hole 40 and the rinsing liquid suction from the suction / discharge hole 41 are released, the flat portion 4 is lowered relative to the rotating base 2, and the substrate G is placed. (S-7). At this time, the cup 6 rises.

  Subsequently, the rinse nozzle 8 that has been waiting in the second standby unit 62 moves to above the center of the substrate G, and the substrate G is rotated together with the running stage 3 by the rotation base 2. A rinse liquid is discharged onto the substrate G rotated from the rinse nozzle 8 to clean the substrate G (S-8). At this time, the cleaning liquid may be discharged from the liquid supply hole 40 or the back rinse nozzle 70 to supply the cleaning liquid to the back surface of the substrate G.

  As described above, after the substrate G is cleaned for a predetermined time, the substrate G is rotated at a high speed and the substrate G is dried (S-9). When the substrate G is dried, the support pins 28 are raised again to lift the substrate G and are carried out of the substrate processing apparatus by the transfer arm 80 outside the development processing apparatus.

  According to the above embodiment, the liquid is stored in the liquid storage space 7 and the liquid film is continuously formed on the surface of the substrate G and the surface of the run-up stage 3 before the development process. It is possible to prevent foam from being bitten into the developer during supply and suction of the solution.

  In addition, during the development process and the cleaning process, the flat part 4 holds the substrate G in a non-contact manner or in a limited contact with the gap holding pins 45 so that the back surface of the substrate and the flat part 4 can be cleaned. . As a result, dust adhering to the back surface of the substrate G can be reduced.

  In the above-described embodiment, the case where one suction / discharge hole 41 is disposed at a position where the liquid supply hole 40 provided in the flat portion 4 is sandwiched is described. However, as illustrated in FIG. The first suction / discharge hole 41 </ b> A and the second suction / discharge hole 41 </ b> B may be arranged in parallel at the position where 40 is sandwiched. In this case, each opening 41a is formed in a substantially L shape. In the embodiment shown in FIG. 11, the other parts are the same as those in the above embodiment, so the same parts are denoted by the same reference numerals and the description thereof is omitted. Then, the channel 42b connected to the opening 41a is provided with channel opening / closing valves V3, V4, and the controller 65 connected to the plurality of channel opening / closing valves V3, V4 controls the channel opening / closing valves V3, V4. It is comprised so that opening and closing of may be controlled.

  Specifically, first, based on the control signal from the control unit 65, only the flow path opening / closing valve V3 is opened, and the liquid in the gap between the back surface of the substrate G and the flat portion 4 is sucked and discharged from the first suction / discharge hole 41A. To do. Next, after a predetermined time has elapsed, the flow path opening / closing valve V3 is closed and the flow path opening / closing valve V4 is opened simultaneously, and the liquid is sucked and discharged from the second suction / discharge hole 41B. Further, after a predetermined time has elapsed, the flow path opening / closing valve V3 is opened and the flow path opening / closing valve V4 is closed simultaneously, and the liquid is sucked and discharged from the first suction / discharge hole 41A. By repeating this operation, the liquid is sucked from one of the plurality of suction / discharge holes 41A and 41B.

  With this configuration, as shown in FIG. 11C, the generation of bubbles B between the back surface of the substrate G and the flat portion 4 is prevented, and contamination of the flat portion 4 and the back surface of the substrate G is further reduced. Can be made.

  Next, a third embodiment will be described below. As shown in FIG. 12, a plurality of suction / discharge holes 41A and 41B are arranged between the positions where the liquid supply holes 40 are provided, and the pipes merge part 90 connected in common to the suction / discharge holes 41A and 41B. The rotor 91 is rotatably arranged. The rotor 91 has a plurality of grooves 92 formed on a cylindrical surface (see FIG. 12B), and further in the middle of a pure water supply line from a pure water supply tank (not shown) as a liquid supply source. By arranging, the rotor 91 is rotated by the flow of pure water (DIW). In this case, since the groove 92 is formed so that only one of the plurality of suction / discharge conduits passes through the liquid flow, the liquid from the first suction / discharge hole 41A and the second suction / discharge hole 41B is formed. The suction can be switched alternately.

  With this configuration, the suction of the liquid through the suction / discharge holes 41A and 41B can be switched periodically, thereby preventing the generation of bubbles in the liquid storage space 7 and reducing the contamination of the flat surface portion 4 and the back surface of the substrate G. Can be made. Further, since the liquid suction from the suction / discharge holes 41A and 41B can be switched without using the control device, the cost can be suppressed.

  In the second and third embodiments, the case has been described in which the first suction / discharge hole 41B and the second suction / discharge hole 41B are arranged in parallel at the position where the liquid supply hole 40 is sandwiched. As shown in FIG. 13, the liquid supply hole 40 is disposed between the first suction / discharge hole 41 </ b> A and the second suction / discharge hole 41 </ b> B, and the first suction is provided at a position sandwiched between the liquid supply holes 40. The discharge hole 41A and the second suction / discharge hole 41B may be arranged. In this case, the first suction / discharge hole 41 </ b> A and the second suction / discharge hole 41 </ b> B are surrounded by a communication groove 40 b communicating with the liquid supply hole 40.

  With this configuration, the suction force of the outer peripheral portion of the substrate G can be increased, and the suction force of the entire back surface of the substrate can be increased.

  In addition, the said embodiment shows an example of this invention and this invention can take not only this example but a various aspect. For example, the present invention is not limited to a rectangular substrate such as a reticle, LCD, or FPD (flat panel display), but can be applied to other substrates such as a circular substrate such as a wafer.

G Glass substrate (substrate)
2 Rotating base 3 Running stage (outer plate)
4 Plane portion 4A Opening surface portion 4B having suction / discharge holes Opening surface portion 5 having liquid supply hole 5 Nozzle head 7 Liquid storage space 8 Rinse nozzle (first cleaning liquid supply nozzle)
17 rotational drive mechanism 20 bottomed container 22 bottom 24 side wall 25a annular seal member 26 drainage port 40 liquid supply hole 40a opening 40b communication groove 41, 41A, 41B suction discharge hole 41a opening 41b opening base 41c opening auxiliary part 45 gap holding pin 46 Auxiliary holding pins V1, V2, V3, V4 Flow path opening / closing valve (switching valve)
65 Control unit 70 Back rinse nozzle (second cleaning liquid supply nozzle)
90 Pipe junction 91 Rotor (internal rotating body)
92 groove

Claims (14)

A rotating base for rotatably holding a plate-like substrate to be processed;
An outer peripheral plate that is rotatable together with the rotation base and surrounds the outer peripheral portion of the substrate to be processed held on the rotation base, and forms a continuous liquid film from the surface of the substrate to be processed;
A nozzle head that is movable along the surface of the substrate to be processed held on the rotation base, and that simultaneously supplies and sucks the developer to the substrate to be processed;
A plane portion having a plane facing the substrate to be processed held on the rotation base with a certain gap therebetween;
A moving mechanism that moves the plane portion up and down relatively with respect to the rotation base;
Provided between the plurality of liquid supply holes provided on the opposite side of the planar substrate to be processed and arranged to supply liquid to the gap, and the positions where the plurality of liquid supply holes are arranged. A suction / discharge hole for sucking and discharging the liquid provided at a predetermined interval from the liquid supply hole;
A control unit for controlling supply of liquid from the liquid supply hole and suction and discharge by the suction and discharge hole;
A development processing apparatus comprising:   2. The development processing apparatus according to claim 1, wherein the opening of the liquid supply hole is communicated by a communication groove surrounding the outside of the suction / discharge hole.   3. The suction / discharge hole includes a linear opening base and an opening auxiliary portion bent from an end of the opening base toward the outer peripheral side of the substrate to be processed. Development processing equipment.   4. The development processing apparatus according to claim 1, wherein an opening surface portion of the suction / discharge hole in the flat portion is formed higher than an opening surface portion of the liquid supply hole.   The flat portion includes a gap holding pin for holding the substrate to be processed with a gap between the flat portion and an auxiliary holding pin having a height lower than the gap holding pin. The development processing apparatus according to any one of 1 to 4.   6. The development processing apparatus according to claim 1, wherein a plurality of the flat portions are provided to face the back surface of the substrate to be processed.   The flat portion is provided inside the bottomed container, and the first base capable of closely contacting the entire periphery of the back surface of the outer peripheral plate when the rotating base is moved to the opening periphery of the bottomed container. An annular sealing member is provided, and a through hole is provided in the bottom of the bottomed container, and the rotation shaft of the rotary base is inserted into the through hole so as to be rotatable and vertically movable. The developing processing apparatus according to claim 1, wherein the gap is closed by a second annular seal member to form a liquid storage space for storing the liquid in a gas-watertight manner.   The development processing apparatus according to claim 1, wherein the bottomed container includes a drain port provided in a bottom portion.   In addition to the liquid supply hole, the liquid stored in the liquid storage space is supplied to the first cleaning liquid supply nozzle for supplying the cleaning liquid to the substrate held on the rotating base and the bottom of the bottomed container. The development processing apparatus according to claim 7, wherein the developing processing apparatus is any liquid supplied by at least one of the second cleaning liquid supply nozzles arranged.   The liquid supply hole and the suction / discharge hole are formed in a straight line, and a plurality of the suction / discharge holes are arranged in parallel with the liquid supply hole at a position sandwiched between the plurality of liquid supply holes, and the control The development processing apparatus according to claim 1, wherein the unit alternately switches the suction of the liquid supplied between the substrate to be processed and the planar part.   The switching valve for alternately switching the suction of the liquid supplied between the substrate to be processed and the flat portion is provided in a pipe line connected to the suction / discharge hole. The development processing apparatus according to 1.   10. The internal rotating body for alternately switching the suction of the liquid through the plurality of suction / discharge holes is provided in a pipe line connected to the suction / discharge hole, according to claim 1. Development processing equipment.   The internal rotator is connected to the plurality of suction / discharge holes, and is rotatably disposed in a conduit junction portion connected to the liquid supply hole, and is supplied from a liquid supply source connected to the liquid supply hole. 13. The development processing apparatus according to claim 12, further comprising a groove that is rotated by the liquid to be switched and switches the suction of the liquid from the plurality of suction / discharge holes to any one of them. A step of holding a plate-like substrate to be rotated on a rotary base that holds the substrate;
A step of providing a certain gap between the planar portion having a plane and the substrate to be processed at a position where the planar portion is moved by a moving mechanism that moves up and down relatively with respect to the rotation base;
Next, the flat portion is sandwiched between a plurality of liquid supply holes provided on the opposite side of the substrate to be processed and arranged to supply liquid to the gap and a position where the plurality of liquid supply holes are arranged. Supplying and discharging the liquid from the supply hole and the suction / discharge hole for sucking and discharging the liquid provided at a predetermined interval,
Moving the nozzle along the surface of the substrate to be processed held on the rotating base while simultaneously supplying and sucking the developer to the substrate to be processed; and
A development processing method characterized by comprising:

Images