JP2011192943A5 - - Google Patents
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- Publication number
- JP2011192943A5 JP2011192943A5 JP2010060165A JP2010060165A JP2011192943A5 JP 2011192943 A5 JP2011192943 A5 JP 2011192943A5 JP 2010060165 A JP2010060165 A JP 2010060165A JP 2010060165 A JP2010060165 A JP 2010060165A JP 2011192943 A5 JP2011192943 A5 JP 2011192943A5
- Authority
- JP
- Japan
- Prior art keywords
- chip
- holding member
- circuit board
- semiconductor
- transfer device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 4
- 239000002313 adhesive film Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010060165A JP5558874B2 (ja) | 2010-03-17 | 2010-03-17 | チップ搬送装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010060165A JP5558874B2 (ja) | 2010-03-17 | 2010-03-17 | チップ搬送装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011192943A JP2011192943A (ja) | 2011-09-29 |
| JP2011192943A5 true JP2011192943A5 (enrdf_load_stackoverflow) | 2013-04-18 |
| JP5558874B2 JP5558874B2 (ja) | 2014-07-23 |
Family
ID=44797529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010060165A Active JP5558874B2 (ja) | 2010-03-17 | 2010-03-17 | チップ搬送装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5558874B2 (enrdf_load_stackoverflow) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5973753B2 (ja) * | 2012-03-08 | 2016-08-23 | 東レエンジニアリング株式会社 | チップ受け渡し治具およびチップ受け渡し方法 |
| KR101900477B1 (ko) * | 2012-04-20 | 2018-09-19 | (주)큐엠씨 | 전자 소자 분류장치 |
| JP2014053517A (ja) * | 2012-09-10 | 2014-03-20 | Hitachi High-Tech Instruments Co Ltd | 受渡用ステージ及びダイピックアップ装置並びにダイボンディング装置 |
| JP6266275B2 (ja) * | 2013-09-09 | 2018-01-24 | ファスフォードテクノロジ株式会社 | ダイボンダ及びボンディング方法 |
| CN108511329B (zh) * | 2018-06-15 | 2024-03-15 | 德阳帛汉电子有限公司 | 一种芯片清洗装置 |
| CN115692272A (zh) * | 2021-07-21 | 2023-02-03 | 久元电子股份有限公司 | 转移设备 |
-
2010
- 2010-03-17 JP JP2010060165A patent/JP5558874B2/ja active Active
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