JP2011181642A5 - - Google Patents

Download PDF

Info

Publication number
JP2011181642A5
JP2011181642A5 JP2010043715A JP2010043715A JP2011181642A5 JP 2011181642 A5 JP2011181642 A5 JP 2011181642A5 JP 2010043715 A JP2010043715 A JP 2010043715A JP 2010043715 A JP2010043715 A JP 2010043715A JP 2011181642 A5 JP2011181642 A5 JP 2011181642A5
Authority
JP
Japan
Prior art keywords
wiring
layer
wiring board
conductor
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010043715A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011181642A (ja
JP5413597B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010043715A priority Critical patent/JP5413597B2/ja
Priority claimed from JP2010043715A external-priority patent/JP5413597B2/ja
Publication of JP2011181642A publication Critical patent/JP2011181642A/ja
Publication of JP2011181642A5 publication Critical patent/JP2011181642A5/ja
Application granted granted Critical
Publication of JP5413597B2 publication Critical patent/JP5413597B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2010043715A 2010-03-01 2010-03-01 配線基板 Active JP5413597B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010043715A JP5413597B2 (ja) 2010-03-01 2010-03-01 配線基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010043715A JP5413597B2 (ja) 2010-03-01 2010-03-01 配線基板

Publications (3)

Publication Number Publication Date
JP2011181642A JP2011181642A (ja) 2011-09-15
JP2011181642A5 true JP2011181642A5 (fi) 2013-02-14
JP5413597B2 JP5413597B2 (ja) 2014-02-12

Family

ID=44692866

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010043715A Active JP5413597B2 (ja) 2010-03-01 2010-03-01 配線基板

Country Status (1)

Country Link
JP (1) JP5413597B2 (fi)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5833398B2 (ja) 2011-06-27 2015-12-16 新光電気工業株式会社 配線基板及びその製造方法、半導体装置
JP6226779B2 (ja) 2014-03-10 2017-11-08 株式会社東芝 磁気メモリ、磁気メモリ装置、及び磁気メモリの動作方法
JP6220292B2 (ja) 2014-03-11 2017-10-25 株式会社東芝 磁気メモリ、磁気メモリの再生方法、および磁気メモリの記録方法
JP6193190B2 (ja) 2014-08-25 2017-09-06 株式会社東芝 磁気記憶素子および磁気メモリ
JP6523666B2 (ja) 2014-12-02 2019-06-05 東芝メモリ株式会社 磁気記憶素子および磁気メモリ
KR20200109028A (ko) * 2019-03-12 2020-09-22 에스케이하이닉스 주식회사 인쇄 회로 기판을 포함하는 반도체 모듈

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002217240A (ja) * 2001-01-19 2002-08-02 Nec Tohoku Ltd フリップチップ実装構造及び配線方法
JP3872712B2 (ja) * 2002-04-18 2007-01-24 日本特殊陶業株式会社 多層配線基板
JP2004273480A (ja) * 2003-03-05 2004-09-30 Sony Corp 配線基板およびその製造方法および半導体装置

Similar Documents

Publication Publication Date Title
JP2011181642A5 (fi)
JP2013225610A5 (fi)
US10375816B2 (en) Printed-circuit board, printed-wiring board, and electronic apparatus
JP2011003906A5 (fi)
JP2015532570A5 (fi)
JP2012129443A5 (fi)
KR20150073350A (ko) 전자기간섭 차폐층을 갖는 반도체 패키지 및 그 제조방법
KR101860735B1 (ko) 배선 기판
JP2012503866A5 (fi)
JP2012047823A5 (fi)
JP2012504318A5 (fi)
TWI434638B (zh) 線路基板製程
TWI536879B (zh) 軟性電路板及其製造方法
JP2011023528A5 (fi)
JP2010153831A5 (ja) 配線基板および半導体装置
JP2014007390A5 (fi)
JP2010109180A5 (fi)
TWI472275B (zh) 一種使用金屬線路片之電子線路板及其電子封裝模組
US8592690B2 (en) Circuit board having circumferential shielding layer
JP2013012528A (ja) プリント基板
JP2009109472A5 (fi)
TWI706518B (zh) 佈線基板
JP5915743B2 (ja) 実装基板および発光装置
TW200705630A (en) Electrical connection structure of semiconductor chip in carrier board and method for fabricating the same
JP2021005586A5 (fi)