JP2011171168A5 - - Google Patents

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Publication number
JP2011171168A5
JP2011171168A5 JP2010034886A JP2010034886A JP2011171168A5 JP 2011171168 A5 JP2011171168 A5 JP 2011171168A5 JP 2010034886 A JP2010034886 A JP 2010034886A JP 2010034886 A JP2010034886 A JP 2010034886A JP 2011171168 A5 JP2011171168 A5 JP 2011171168A5
Authority
JP
Japan
Prior art keywords
contact
pad
socket
forming surface
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010034886A
Other languages
English (en)
Japanese (ja)
Other versions
JP5561470B2 (ja
JP2011171168A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2010034886A priority Critical patent/JP5561470B2/ja
Priority claimed from JP2010034886A external-priority patent/JP5561470B2/ja
Priority to US13/029,822 priority patent/US8272880B2/en
Publication of JP2011171168A publication Critical patent/JP2011171168A/ja
Publication of JP2011171168A5 publication Critical patent/JP2011171168A5/ja
Application granted granted Critical
Publication of JP5561470B2 publication Critical patent/JP5561470B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010034886A 2010-02-19 2010-02-19 ソケット、該ソケットと電子装置との接続構造、および半導体装置 Expired - Fee Related JP5561470B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2010034886A JP5561470B2 (ja) 2010-02-19 2010-02-19 ソケット、該ソケットと電子装置との接続構造、および半導体装置
US13/029,822 US8272880B2 (en) 2010-02-19 2011-02-17 Socket and semiconductor device including socket and semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010034886A JP5561470B2 (ja) 2010-02-19 2010-02-19 ソケット、該ソケットと電子装置との接続構造、および半導体装置

Publications (3)

Publication Number Publication Date
JP2011171168A JP2011171168A (ja) 2011-09-01
JP2011171168A5 true JP2011171168A5 (enExample) 2013-02-14
JP5561470B2 JP5561470B2 (ja) 2014-07-30

Family

ID=44476882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010034886A Expired - Fee Related JP5561470B2 (ja) 2010-02-19 2010-02-19 ソケット、該ソケットと電子装置との接続構造、および半導体装置

Country Status (2)

Country Link
US (1) US8272880B2 (enExample)
JP (1) JP5561470B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014216123A (ja) * 2013-04-24 2014-11-17 タイコエレクトロニクスジャパン合同会社 電気コネクタ組立体及びその実装構造
JP6596810B2 (ja) * 2014-07-24 2019-10-30 セイコーエプソン株式会社 電子部品、電子部品の製造方法、電子機器、および移動体
CN113130432B (zh) 2019-12-30 2022-12-27 华为机器有限公司 一种电子模块及电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1610375A3 (en) * 1995-05-26 2008-11-05 FormFactor, Inc. Contact carriers for populating substrates with spring contacts
JP4248649B2 (ja) * 1998-12-18 2009-04-02 株式会社エンプラス 電気部品用ソケット
US6994565B2 (en) * 2003-07-14 2006-02-07 Fci Americas Technology, Inc. Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element
US7563107B2 (en) * 2004-07-19 2009-07-21 Hon Hai Precision Ind. Co., Ltd. Electrical connector with dual-function protrusions
JP4516901B2 (ja) * 2005-03-18 2010-08-04 アルプス電気株式会社 検査装置および検査方法
CN100440628C (zh) * 2005-10-17 2008-12-03 富士康(昆山)电脑接插件有限公司 电连接器
JP2007141614A (ja) * 2005-11-17 2007-06-07 Yamaichi Electronics Co Ltd 電子回路素子接続具

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