JP2011166042A - Substrate inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection method that can reliably inspect failure of a flexible substrate. <P>SOLUTION: When inspection signals are supplied between a pair of conductive layers 101 in a flexible substrate 100 having a plurality of conductive layers 101 (conductive layers 101a to 101d) formed of conductive patterns and insulating layers 102 disposed between the conductive layers 101, respectively so that a capacitance between both the conductive layers is measured, and a measured value of the capacitance and a predetermined reference value are compared so that presence of peeling between the conductive layers and the insulating layers is inspected, the capacitance is measured, while bending the flexible substrate 100. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a substrate inspection method for inspecting the presence or absence of peeling between a conductive layer and an insulating layer in a multilayer substrate having a plurality of conductive layers composed of conductive patterns and an insulating layer disposed between the conductive layers, and The present invention relates to a substrate inspection apparatus.

  A substrate inspection method for inspecting the quality of a substrate based on the measured capacitance (for example, a circuit substrate inspection method disclosed by the applicant in Japanese Patent Application Laid-Open No. 2005-17095) is known. In this type of substrate inspection method, a reference signal on which a substrate to be inspected is placed, and an inspection signal is supplied to the conductive pattern of the substrate to measure the capacitance between the reference electrode and the conductive pattern, It is determined whether a disconnection or a short circuit has occurred in the conductive pattern based on whether or not the measured value of the capacitance is within a predetermined allowable range (reference value). Also, when inspecting a substrate having a plurality of conductive layers composed of conductor patterns, an inspection signal is supplied to two of the conductive layers to measure the capacitance between the conductive layers, and the static The measured value of the capacitance and the reference value are compared to determine the presence or absence of disconnection or short circuit in the conductive pattern. In this case, in this type of inspection method, the substrate to be inspected is placed on a reference electrode or a mounting table having a flat placement surface, and the substrate is flattened for inspection.

JP 2005-17095 A (page 4-7, FIG. 1)

  However, the above-described conventional substrate inspection method has the following problems to be improved. That is, when a flexible substrate having a plurality of conductive layers and an insulating layer disposed between the respective conductive layers is inspected by a conventional substrate inspection method, a defect may not be reliably detected. Specifically, this type of flexible substrate is generally manufactured by laminating a flexible sheet-like insulating layer and a conductive layer composed of a conductor pattern. In this case, when the bonding is insufficient, the conductive layer and the insulating layer may be separated. However, in the conventional substrate inspection method, a substrate to be inspected is placed on a flat reference electrode or a mounting table, and the substrate is inspected in a flat state. For this reason, even if the conductive layer and the insulating layer are peeled off, when the flexible substrate is flat, the peeled portions are in close contact with each other. Is determined as a good product without deviating from the reference value. As described above, in the conventional substrate inspection method, the defect of the flexible substrate may not be surely found, and improvement of this point is desired.

  The present invention has been made in view of such a problem to be improved, and a main object of the present invention is to provide a substrate inspection method and a substrate inspection apparatus capable of reliably inspecting a defect of a flexible substrate.

  In order to achieve the above object, a substrate inspection method according to claim 1, wherein a pair of the conductive layers in a flexible substrate having a plurality of conductive layers constituted by conductive patterns and an insulating layer disposed between the conductive layers. An inspection signal is supplied between the layers to measure the capacitance between the two conductive layers, and the measured value of the capacitance is compared with a predetermined reference value to compare the conductive layer and the insulating layer. A substrate inspection method for inspecting the presence or absence of peeling, wherein the capacitance is measured while bending the flexible substrate.

  A substrate inspection method according to a second aspect is the substrate inspection method according to the first aspect, wherein the flexible substrate is curved so that the position of the curved portion is moved.

  According to a third aspect of the present invention, there is provided the substrate inspection method according to the second aspect, wherein the other end portion of the flexible substrate follows an arcuate locus in a state where the one end portion of the flat flexible substrate is fixed. The flexible substrate is bent so that the position of the bent portion moves from the other end side toward the one end side.

  According to a fourth aspect of the present invention, there is provided a substrate inspection apparatus comprising: a pair of conductive layers in a flexible substrate having a plurality of conductive layers formed of a conductor pattern and an insulating layer disposed between the conductive layers. A measurement unit that measures the capacitance between the two conductive layers in a state in which the inspection signal is supplied; and a measurement value of the capacitance measured by the measurement unit and a predetermined reference value; A substrate inspection apparatus for inspecting the presence or absence of separation between the conductive layer and the insulating layer, comprising a bending mechanism that bends the flexible substrate, and the measuring unit is configured to bend the flexible substrate by the bending mechanism. The capacitance is measured in a state where it is allowed to move.

  The substrate inspection apparatus according to claim 5 is the substrate inspection apparatus according to claim 4, wherein the bending mechanism bends the flexible substrate so that a position of the bending portion moves.

  The substrate inspection apparatus according to claim 6 is the substrate inspection apparatus according to claim 5, wherein the bending mechanism fixes the other end portion of the flexible substrate in a state where the one end portion of the flat flexible substrate is fixed. The flexible substrate is bent so that the position of the curved portion is moved from the other end side toward the one end side by moving along the arcuate locus.

  In the substrate inspection method according to claim 1 and the substrate inspection apparatus according to claim 4, the capacitance between the pair of conductive layers is measured while bending the flexible substrate, and the measured value is compared with the reference value. Then, the presence or absence of peeling between the conductive layer and the insulating layer is inspected. For this reason, in this substrate inspection method and substrate inspection apparatus, when peeling occurs between the conductive layer and the insulating layer, the flexible substrate is bent to separate the peeling portion, thereby creating a space. By measuring the measured value of the capacitance that decreases as a result, it can be reliably inspected that peeling has occurred. Therefore, according to the substrate inspection method and the substrate inspection apparatus, unlike the conventional substrate inspection method and the substrate inspection apparatus that inspects the flexible substrate in a flat state, the conductive substrate and the insulating layer are separated from each other. Defects can be reliably inspected.

  According to the substrate inspection method of claim 2 and the substrate inspection apparatus of claim 5, the peeled portion is formed by bending the flexible substrate so that the position of the curved portion moves. Even if it exists in any position, it can test | inspect reliably that peeling has arisen.

  In the substrate inspection method according to claim 3, and the substrate inspection apparatus according to claim 6, the other end of the flexible substrate is moved along an arcuate locus while the one end of the flat flexible substrate is fixed. The flexible substrate is curved so that the position of the curved portion moves from the other end side toward the one end side. For this reason, according to the substrate inspection method and the substrate inspection apparatus, the curved portion can be moved from the other end side to the one end side in a short time because the bending operation is simple. Can be improved. Moreover, according to this board | substrate inspection method and board | substrate inspection apparatus, as a result of being able to move the curved part reliably from the other end part side to the one end part side, test | inspection precision can fully be improved.

1 is a block diagram showing a configuration of a substrate inspection apparatus 1. FIG. 2 is a cross-sectional view illustrating a configuration of a flexible substrate 100. FIG. 3 is a block diagram showing a configuration of a bending mechanism 15. FIG. It is explanatory drawing explaining operation | movement of the bending mechanism. It is sectional drawing of the state which curved the flexible substrate. It is a change figure showing change of measured value Cm of capacitance C.

  Hereinafter, embodiments of a substrate inspection apparatus will be described with reference to the accompanying drawings.

  First, the configuration of the substrate inspection apparatus 1 will be described with reference to the drawings. The substrate inspection apparatus 1 shown in FIG. 1 is configured to be able to inspect the quality of the flexible substrate 100 according to the substrate inspection method. Here, as shown in FIG. 2, the flexible substrate 100 includes a plurality of (in this example, four) conductive layers 101 a to 101 d (hereinafter, also referred to as “conductive layer 101” when not distinguished from each other) configured by a conductor pattern. And a plurality of (three in this example) insulating layers 102 disposed between the conductive layers 101, and are configured to be flexible and bendable as a whole. ing. In this case, as an example, the flexible substrate 100 is formed by alternately laminating the conductive layers 101 and the insulating layers 102 with the adhesive layer 103 interposed therebetween, and bonding the layers 101 and 102 with the adhesive layer 103. .

  On the other hand, as shown in FIG. 1, the substrate inspection apparatus 1 includes a signal output unit 11, a measurement unit 12, a display unit 13, a storage unit 14, a bending mechanism 15, and a control unit 16.

  The signal output unit 11 outputs a current I (an AC constant current as an example) as an inspection signal under the control of the control unit 16, and the current I is passed through a pair of probes 11a and 11a (see FIG. 2). It supplies between the two conductive layers 101 in the flexible substrate 100. The measurement unit 12 performs measurement processing according to the control of the control unit 16. In this case, in the measurement process, the measurement unit 12 in the state where the current I output from the signal output unit 11 is supplied between the two conductive layers 101 in the flexible substrate 100. A voltage V generated between them is input through a pair of probes 12a and 12a (see the figure), and the voltage value of the voltage V is measured, and the measured voltage value of the voltage V and the current I being supplied are measured. Based on the value and the phase difference between the current I and the voltage V, the capacitance C between the two conductive layers 101 is measured (calculated) (hereinafter, the value of the measured capacitance C is measured. Also referred to as “value Cm”).

  The display unit 13 controls the control unit 16 to control an image indicating the measured value Cm of the capacitance C measured by the measuring unit 12 (for example, an image showing a change in the measured value Cm (see FIG. 6)) or a control. The result of pass / fail judgment executed by the unit 16 is displayed. The storage unit 14 stores the measurement value Cm of the capacitance C measured by the measurement unit 12 according to the control of the control unit 16. In addition, the storage unit 14 stores a reference value Cs of the capacitance C between the conductive layers 101 used when the control unit 16 determines the quality.

  The bending mechanism 15 is configured to be capable of executing a bending process (bending process) for bending (bending deformation) the flexible substrate 100 under the control of the control unit 16. Specifically, as shown in FIG. 3, the bending mechanism 15 includes a first suction unit 21, a second suction unit 22, and a drive unit 23.

  The first suction unit 21 is connected to an unillustrated intake mechanism via an intake pipe, and is sucked by the intake mechanism to adsorb one end portion 100a of the flexible substrate 100 as shown in FIG. Hold. The first suction portion 21 is attached to a frame 15 a that constitutes the bending mechanism 15. For this reason, the one end part 100 a of the flexible substrate 100 sucked by the first suction part 21 is fixed to the frame 15 a via the first suction part 21.

  The second adsorption unit 22 is connected to an intake mechanism (not shown) via an intake pipe in the same manner as the first adsorption unit 21, and sucks the other end 100 b of the flexible substrate 100 by performing intake by the intake mechanism. And hold. The drive part 23 performs the movement process which moves the 2nd adsorption | suction part 22 along the arc-shaped locus | trajectory L shown with a broken line in FIG. 4 as an example. In this case, the drive unit 23 moves the second suction unit 22 in this manner, so that the other end portion 100b of the flexible substrate 100 sucked by the second suction unit 22 is moved along the locus L. Further, as the other end portion 100b moves, the position of the curved portion (hereinafter also referred to as “curved portion W”) moves from the other end portion 100b side toward the one end portion 100a side, as shown in FIG. In this way, the flexible substrate 100 is bent.

  The control unit 16 controls the signal output unit 11, the measurement unit 12, the display unit 13, the storage unit 14, and the bending mechanism 15 to execute various processes. In this case, the control unit 16 causes the measurement unit 12 to execute the measurement process in a state where the bending mechanism 15 is executing the bending process, that is, in a state where the flexible substrate 100 is bent. Further, the control unit 16 compares the measured value Cm of the capacitance C measured by the measuring unit 12 with the reference value Cs, and executes a determination process for determining whether the flexible substrate 100 is acceptable. In this determination process, when the measured value Cm is equal to or greater than the reference value Cs, the control unit 16 determines that the flexible substrate 100 is good, assuming that no peeling has occurred. When the measured value Cm is less than the reference value Cs, it is determined that peeling has occurred, and the flexible substrate 100 is determined to be defective.

  Next, a method for inspecting the quality of the flexible substrate 100 using the substrate inspection apparatus 1 (substrate inspection method) and the operation of the substrate inspection apparatus 1 at that time will be described with reference to the drawings.

  First, the flexible substrate 100 to be inspected is set in the bending mechanism 15. Specifically, as shown by a solid line in FIG. 4, one end 100 a is positioned on the first suction portion 21 in the bending mechanism 15 and the other end 100 b is positioned on the second suction portion 22. The flexible substrate 100 is placed on the substrate. Next, the intake mechanism (not shown) is operated. At this time, the first suction portion 21 sucks the one end portion 100 a of the flexible substrate 100 and the second suction portion 22 sucks the other end portion 100 b of the flexible substrate 100 by the intake air of the intake mechanism.

  Subsequently, as shown in FIG. 2, one end portion 100a side (the flexible substrate 100 is fixed) of two conductive layers 101 (for example, the conductive layers 101a and 101b shown in the drawing) of the respective conductive layers 101 in the flexible substrate 100. The pair of probes 11a and 11a connected to the signal output unit 11 are brought into contact with each other, and the pair of probes 12a and 12a connected to the measuring unit 12 are brought into contact with each other.

  Next, an operation unit (not shown) is operated to instruct the start of inspection. Subsequently, the control unit 16 starts control of each unit in accordance with an operation signal from the operation unit. Specifically, the control unit 16 instructs the signal output unit 11 to start outputting the current I as the inspection signal. Next, the control unit 16 instructs the bending mechanism 15 to start a bending process (bending process) and instructs the measuring unit 12 to start a measurement process of the capacitance C.

  Subsequently, in accordance with an instruction to start the bending process by the control unit 16, the drive unit 23 of the bending mechanism 15 starts a movement process for moving the second suction unit 22. In this movement process, the drive unit 23 moves the second adsorption unit 22 at a constant speed along the locus L as shown in FIG. By the movement of the second suction part 22, the other end part 100 b of the flexible substrate 100 sucked by the second suction part 22 is moved along the locus L. As the other end portion 100b moves, the flexible substrate 100 is bent so that the bending portion W moves from the other end portion 100b side to the one end portion 100a side, as shown in FIG.

  On the other hand, during the execution of the bending process by the bending mechanism 15, the measurement unit 12 starts the measurement process according to an instruction from the control unit 16. In this measurement process, the measurement unit 12 includes the current value of the current I output from the signal output unit 11, the voltage value of the voltage V generated between the conductive layers 101a and 101b by the supply of the current I, the current I and the voltage. The capacitance C between the conductive layers 101a and 101b is measured based on the V phase difference. In addition, the control unit 16 stores the measurement value Cm measured by the measurement unit 12 in the storage unit 14. In this case, the measurement unit 12 sequentially measures the capacitance C at regular time intervals, and the control unit 16 sequentially stores the measurement value Cm in the storage unit 14.

  Next, as shown in FIG. 4, the control unit 16 is configured such that the other end portion 100 b of the flexible substrate 100 is at a position P <b> 1 (a position where the other end portion 100 b is located in a state where the flexible substrate 100 is flat (initial state)). When moving from the position to the position P2, the measurement unit 12 is instructed to end the measurement process and the bending mechanism 15 is instructed to end the bending process. Subsequently, the measurement unit 12 ends the measurement process according to the instruction of the control unit 16, and the driving unit 23 of the bending mechanism 15 moves the second suction unit 22 according to the instruction of the control unit 16, thereby positioning the other end 100b. Return to P1.

  Next, the control unit 16 executes a determination process. In this determination process, the control unit 16 reads the measurement value Cm stored in the storage unit 14 from the start to the end of the measurement process (during the measurement process) and also reads the reference value Cs. Next, the control unit 16 compares the measured value Cm with the reference value Cs.

  Here, for example, when there is no peeled portion between the conductive layer 101a and the insulating layer 102 or between the conductive layer 101b and the insulating layer 102 in the flexible substrate 100, the electrostatic capacitance between the conductive layers 101a and 101b. The value of the capacitance C is maintained at a value equal to or higher than the reference value Cs without greatly deviating from the reference value Cs. In addition, for example, even if there is a peeled portion between the conductive layer 101b and the insulating layer 102 of the flexible substrate 100, since the peeled portion adheres when the flexible substrate 100 is in a flat state (flat plate state), The value of the capacitance C between the conductive layers 101a and 101b is maintained substantially the same as the reference value Cs without greatly deviating from the reference value Cs.

  On the other hand, when the flexible substrate 100 having a peeled portion between the conductive layer 101b and the insulating layer 102 is curved, the conductive layer 101b and the insulating layer 102 are separated from each other as shown in FIG. A occurs, and the value of the capacitance C decreases due to the generation of the space A and becomes smaller than the reference value Cs. For this reason, when the value of the capacitance C is measured while bending the flexible substrate 100 in which the peeling portion exists so that the bending portion W moves, the bending portion W becomes the peeling portion as shown in FIG. At the time of movement, the value of the capacitance C will fall below the reference value Cs. For this reason, in the determination process, the control unit 16 determines whether the measured value Cm during the measurement process is equal to or greater than the reference value Cs, or between the conductive layer 101a and the insulating layer 102, or between the conductive layer 101b and the insulating layer. When any measurement value Cm during the measurement process is less than the reference value Cs, it is determined that no peeling has occurred between the conductive layer 101a and the insulating layer 102, or the conductive layer 101b. That the flexible substrate 100 is defective.

  In this case, when it is determined in the determination process based on the measured value of the capacitance C between the conductive layers 101a and 101b that separation has not occurred, then two combinations of two conductive layers 101 (for example, conductive layers) 101b, 101c) is selected and the inspection is performed in the same procedure as described above. Hereinafter, all combinations for selecting two of the conductive layers 101 are inspected. In this case, when it determines with peeling not having generate | occur | produced about all the combinations, the control part 16 determines that the flexible substrate 100 is favorable. Thus, the quality inspection for the flexible substrate 100 is completed.

  Thus, in this board | substrate inspection method and the board | substrate inspection apparatus 1, the measurement process which measures the electrostatic capacitance C between a pair of conductive layers 101 is performed while curving the flexible substrate 100, and the measured value Cm and reference value are performed. The presence or absence of peeling between the conductive layer 101 and the insulating layer 102 is inspected by comparing Cs. For this reason, in this board | substrate inspection method and the board | substrate inspection apparatus 1, when peeling has arisen between the conductive layer 101 and the insulating layer 102, the flexible substrate 100 is curved and a peeling part is spaced apart, thereby space A is made. By measuring the measured value Cm of the capacitance C that decreases due to the occurrence, it can be reliably inspected that peeling has occurred. Therefore, according to this substrate inspection method and substrate inspection apparatus 1, unlike the conventional substrate inspection method and substrate inspection apparatus that inspects the flexible substrate 100 in a flat state, the conductive layer 101 and the insulating layer 102 are separated. The defective flexible substrate 100 can be inspected reliably.

  Moreover, according to this board | substrate inspection method and the board | substrate inspection apparatus 1, by curving the flexible substrate 100 so that the position of the bending part W may move, the part which has peeled exists in which position of the flexible substrate 100 However, it can be reliably inspected that peeling has occurred.

  Moreover, in this board | substrate inspection method and the board | substrate inspection apparatus 1, in the state which fixed the one end part 100a of the flexible substrate 100 of the flat state, the other end part 100b of the flexible substrate 100 is moved along an arc-shaped locus | trajectory, and the curved part W The flexible substrate 100 is curved so that the position of the second side moves from the other end portion 100b side toward the one end portion 100a side. Therefore, according to the substrate inspection method and the substrate inspection apparatus 1, the bending portion W can be moved from the other end portion 100b side to the one end portion 100a side in a short time because the bending operation is simple. Efficiency can be sufficiently improved. Moreover, as a result of being able to move the bending part W from the other end part 100b side to the one end part 100a side reliably, test | inspection precision can fully be improved.

  The above-described method and configuration can be changed as appropriate. For example, the flexible substrate 100 is moved while moving the curved portion W by bringing one or both ends 100a, 100b of the flexible substrate 100 close to each other along a direction parallel to the surface of the flat flexible substrate 100. It is also possible to adopt a method and a configuration for bending the wire. Further, both ends 100a and 100b are held in a state where the flexible substrate 100 is loosened, and a rod-shaped member pressed against one surface of the flexible substrate 100 in that state is moved between the both ends 100a and 100b along the entire surface. Accordingly, it is possible to adopt a method and a configuration in which the flexible substrate 100 is bent while the bending portion W is moved.

  Furthermore, a method and a configuration in which the flexible substrate 100 is bent by spraying gas onto the flexible substrate 100 in a state where one end (one end portion 100a or the other end portion 100b) of the flexible substrate 100 is fixed are adopted. You can also. Further, instead of the method and configuration of holding the end portions 100a and 100b by suction by the first suction portion 21 and the second suction portion 22, a method and configuration of holding and holding the end portions 100a and 100b by a clamp mechanism. Can also be adopted.

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 12 Measuring part 15 Bending mechanism 16 Control part 21 1st adsorption | suction part 22 2nd adsorption | suction part 23 Drive mechanism 100 Flexible substrate 100a One end part 100b Other end part 101a-101d Conductive layer 102 Insulating layer C Electrostatic capacity Cm measurement Value Cs Reference value W Curved part

Claims (6)

An inspection signal is supplied between a pair of conductive layers in a flexible substrate having a plurality of conductive layers composed of conductive patterns and an insulating layer disposed between the conductive layers, and between the conductive layers. Measuring the capacitance of the substrate, comparing the measured value of the capacitance with a predetermined reference value, and inspecting the presence or absence of peeling between the conductive layer and the insulating layer,
A substrate inspection method for measuring the capacitance while curving the flexible substrate.   The substrate inspection method according to claim 1, wherein the flexible substrate is bent so that the position of the curved portion moves.   With the one end of the flexible substrate in a flat state fixed, the other end of the flexible substrate is moved along an arcuate trajectory so that the position of the curved portion is changed from the other end to the one end. The substrate inspection method according to claim 2, wherein the flexible substrate is curved so as to move toward the substrate. In a state in which an inspection signal is supplied between a pair of conductive layers in a flexible substrate having a plurality of conductive layers composed of conductive patterns and an insulating layer disposed between the conductive layers. A measuring unit for measuring the capacitance between the layers, and comparing the measured value of the capacitance measured by the measuring unit with a predetermined reference value, and the conductive layer and the insulating layer; A substrate inspection apparatus for inspecting the presence or absence of peeling,
A bending mechanism for bending the flexible substrate;
The measurement unit is a substrate inspection apparatus that measures the capacitance in a state where the flexible substrate is bent by the bending mechanism.   The substrate inspection apparatus according to claim 4, wherein the bending mechanism bends the flexible substrate so that a position of the curved portion moves.   The bending mechanism moves the other end portion of the flexible substrate along an arcuate locus while fixing one end portion of the flexible substrate in a flat state, so that the position of the curved portion is moved from the other end portion side. The board inspection apparatus according to claim 5, wherein the flexible board is bent so as to move toward the one end side.

Images