JP2011146415A - 半導体装置、及び半導体装置の製造方法 - Google Patents
半導体装置、及び半導体装置の製造方法 Download PDFInfo
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 238000005476 soldering Methods 0.000 description 1
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- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/732—Location after the connecting process
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Abstract
【解決手段】半導体装置は、配線基板と、この配線基板に貼り付けられたリッドを備える。このリッドには、注入口部が設けられている。このリッドの内側には、この注入口部から樹脂が注入されている。このリッドと配線基板とは、注入された樹脂により固定されている。
【選択図】図2
Description
図2に示すように、本発明における半導体装置は、配線基板10と、半導体チップ20と、リッド(LID:蓋材)30を備える。
アンダーフィル(UF)樹脂21を注入し、アンダーフィル(UF)樹脂21の硬化(キュア)を行う。
半導体チップ20の裏面に放熱ペーストを塗布した後、配線基板10上に線状に接着剤(リッド接着樹脂)23を塗布し、接着剤23を塗布した部分にリッドの縁を接着させ、リッド30を貼り付け、放熱ペースト22及び接着剤23の硬化(キュア)を行う。
次に、形成されたFCBGAタイプの半導体パッケージの裏面(配線基板10の半導体チップ20搭載面とは反対側の面)の電極(図示略)にはんだボール11を搭載し、半導体パッケージを加熱(リフロー)してはんだボール11を溶融させて、電極(図示略)と接合する。その後、洗浄乾燥を行う。
アンダーフィル(UF)樹脂21を注入し、アンダーフィル(UF)樹脂21の硬化(キュア)を行う。この工程は、図4に示すステップS101と同じである。
アンダーフィル(UF)樹脂21の硬化後、半導体チップ20の裏面に放熱ペースト22を塗布し、半導体チップ20にリッド30をかぶせて、配線基板10上にリッド30を配置する。その後、放熱ペースト22の硬化(キュア)を行う。ここで、FCBGA用のリッド30に、予め樹脂注入用の注入口部31が設けられているものとする。
配線基板10上にリッド30を配置した後、リッド30に設けられた注入口部31にニードルディスペンサ(図示略)を挿入し、このニードルディスペンサで、注入口部31から、リッド30の内側のギャップ部分にギャップ充填樹脂40を注入し、ギャップ充填樹脂40の硬化(キュア)を行う。なお、ギャップ充填樹脂40の材料は、接着剤23と同じリッド接着樹脂と同じでも良い。また、ギャップ充填樹脂40の材料は、アンダーフィル(UF)樹脂21と同じにすることも可能である。
ギャップ充填樹脂40の硬化後、形成されたFCBGAタイプの半導体パッケージの裏面(配線基板10の半導体チップ20搭載面とは反対側の面)の電極(図示略)にはんだボール11を搭載し、半導体パッケージを加熱(リフロー)してはんだボール11を溶融させて、電極(図示略)と接合する。その後、洗浄乾燥を行う。この工程は、図4に示すステップS103と同じである。
11… はんだボール(バンプ)
20… 半導体チップ
21… アンダーフィル(UF)樹脂
22… 放熱ペースト
23… 接着剤(リッド接着樹脂)
30… リッド(LID:蓋材)
31… 注入口部
40… ギャップ充填樹脂(Gap樹脂)
Claims (10)
- 半導体チップが搭載された配線基板と、
前記配線基板上で前記半導体チップを覆い、樹脂を注入するための注入口部を有するリッドと、
前記リッドの内側で、前記配線基板と前記リッドとを接着しているギャップ充填樹脂と
を具備する
半導体装置。 - 請求項1に記載の半導体装置であって、
前記注入口部は、前記リッドの絞り部分(側壁)に設けられている
半導体装置。 - 請求項1又は2に記載の半導体装置であって、
前記注入口部は、前記リッドの天板の部分(頂部壁)に設けられている
半導体装置。 - 請求項1乃至3のいずれか一項に記載の半導体装置であって、
前記ギャップ充填樹脂は、前記リッドの内側で、前記配線基板と前記リッドの絞り部分(側壁)と前記アンダーフィル樹脂とに接した状態で充填され、前記配線基板と前記リッドとを接着している
半導体装置。 - 請求項1乃至3のいずれか一項に記載の半導体装置であって、
前記ギャップ充填樹脂は、前記リッドの内側で、前記配線基板及び前記リッドの絞り部分(側壁)に接した状態で充填されており、前記半導体チップ及びアンダーフィル(UF)樹脂に接していない状態で、前記配線基板と前記リッドとを接着している
半導体装置。 - 樹脂を注入するための注入口部を有し、半導体チップが搭載された配線基板上で前記半導体チップを覆うリッドを配置する工程と、
前記注入口部にディスペンサを挿入し、前記ディスペンサで前記注入口部から前記リッドの内側にギャップ充填樹脂を注入する工程と、
前記ギャップ充填樹脂を熱硬化する工程と
を含む
半導体装置の製造方法。 - 請求項6に記載の半導体装置の製造方法であって、
前記配線基板上に、陥没部分、突起部分、及び段差部分のうち少なくとも1つを設け、前記リッドを配置してから前記ギャップ充填樹脂を注入するまでの間、前記リッドを一時的に固定する工程
を更に含む
半導体装置の製造方法。 - 請求項6に記載の半導体装置の製造方法であって、
前記リッドの内側にギャップ充填樹脂を注入する際、前記ディスペンサで前記リッドを固定する工程
を更に含む
半導体装置の製造方法。 - 請求項6乃至8のいずれか一項に記載の半導体装置の製造方法であって、
前記リッドの内側で、前記ギャップ充填樹脂が前記半導体チップ及びアンダーフィル(UF)樹脂に接することを回避し、前記配線基板と前記リッドの絞り部分(側壁)との間に前記ギャップ充填樹脂を充填する工程
を更に含む
半導体装置の製造方法。 - 請求項6乃至9のいずれか一項に記載の半導体装置の製造方法であって、
前記配線基板上に前記リッドを配置した後、前記リッドに前記注入口部を設ける工程
を更に含む
半導体装置の製造方法。
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JP2010003701A JP5263895B2 (ja) | 2010-01-12 | 2010-01-12 | 半導体装置、及び半導体装置の製造方法 |
US13/004,444 US8519529B2 (en) | 2010-01-12 | 2011-01-11 | Semiconductor package with lid bonded on wiring board and method of manufacturing the same |
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WO2013002399A1 (ja) | 2011-06-30 | 2013-01-03 | パナソニックヘルスケア株式会社 | 薬剤包装装置 |
JP2014063921A (ja) * | 2012-09-21 | 2014-04-10 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法並びに電子装置及びその製造方法 |
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JP5442990B2 (ja) * | 2008-12-24 | 2014-03-19 | 京セラ株式会社 | 回路装置の製造方法及び電子機器の製造方法 |
CN102364677A (zh) * | 2011-10-09 | 2012-02-29 | 常熟市华海电子有限公司 | 一种倒装芯片封装结构 |
US9287191B2 (en) | 2011-10-12 | 2016-03-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device package and method |
JP2014082233A (ja) * | 2012-10-12 | 2014-05-08 | Sumitomo Electric Ind Ltd | 半導体装置及びその製造方法 |
US9831190B2 (en) | 2014-01-09 | 2017-11-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor device package with warpage control structure |
DE102016224083A1 (de) * | 2016-12-02 | 2018-06-07 | Robert Bosch Gmbh | Elektrische Baugruppe |
US10224262B2 (en) * | 2017-05-12 | 2019-03-05 | Globalfoundries Inc. | Flexible heat spreader lid |
US11282763B2 (en) * | 2019-06-24 | 2022-03-22 | Amkor Technology Singapore Holding Pte. Ltd. | Semiconductor device having a lid with through-holes |
CN114256188A (zh) * | 2020-09-22 | 2022-03-29 | 华为技术有限公司 | 封装基板、封装结构、电子设备及制造方法 |
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JP2014063921A (ja) * | 2012-09-21 | 2014-04-10 | Fujitsu Semiconductor Ltd | 半導体装置及びその製造方法並びに電子装置及びその製造方法 |
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US20110169155A1 (en) | 2011-07-14 |
JP5263895B2 (ja) | 2013-08-14 |
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