JP2011142141A5 - Holder maintenance device and holder maintenance method - Google Patents

Holder maintenance device and holder maintenance method Download PDF

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Publication number
JP2011142141A5
JP2011142141A5 JP2010000818A JP2010000818A JP2011142141A5 JP 2011142141 A5 JP2011142141 A5 JP 2011142141A5 JP 2010000818 A JP2010000818 A JP 2010000818A JP 2010000818 A JP2010000818 A JP 2010000818A JP 2011142141 A5 JP2011142141 A5 JP 2011142141A5
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holder
maintenance
substrate holder
cleaning
dust
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JP2010000818A
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JP2011142141A (en
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Claims (28)

互いに重ね合された2つの半導体基板を互いに接合する基板重ね合わせ装置に用いられ、前記2つの半導体基板の少なくとも一方を保持して搬送する基板ホルダをメンテナンスするホルダメンテナンス装置であって、A holder maintenance device for use in a substrate stacking apparatus for bonding two semiconductor substrates stacked on each other to each other, and for maintaining a substrate holder for holding and transporting at least one of the two semiconductor substrates,
前記基板ホルダを収容するホルダラックと、A holder rack that accommodates the substrate holder;
前記ホルダラックから前記基板ホルダを搬出する搬送部と、A transport unit for unloading the substrate holder from the holder rack;
前記搬送部により搬送された前記基板ホルダをメンテナンスするメンテナンス部とA maintenance unit for maintaining the substrate holder transported by the transport unit;
を備えるホルダメンテナンス装置。Holder maintenance device provided with
前記メンテナンス部は、前記基板ホルダに付着した塵埃を検知する塵埃検知装置を有する請求項1に記載のホルダメンテナンス装置。The holder maintenance device according to claim 1, wherein the maintenance unit has a dust detection device that detects dust attached to the substrate holder. 前記塵埃検知装置は、前記基板ホルダを照明する光源と、前記基板ホルダからの反射光を撮像する撮像部と、前記撮像部で撮像された画像を処理する画像処理部とを有する請求項2に記載のホルダメンテナンス装置。3. The dust detection apparatus according to claim 2, further comprising: a light source for illuminating the substrate holder; an imaging unit for imaging reflected light from the substrate holder; and an image processing unit for processing an image captured by the imaging unit. Holder maintenance device as described. 前記撮像部は、前記基板ホルダからの散乱光を受ける位置に配置される請求項3に記載のホルダメンテナンス装置。The holder maintenance device according to claim 3, wherein the imaging unit is disposed at a position to receive scattered light from the substrate holder. 前記画像処理部は、前記撮像部で撮像された画像を処理することにより、前記塵埃の大きさ及び位置を検知する請求項3または4に記載のホルダメンテナンス装置。The holder maintenance device according to claim 3 or 4, wherein the image processing unit detects the size and position of the dust by processing an image captured by the imaging unit. 前記塵埃検知装置は、前記基板ホルダの一方の面の検知を完了した後、他方の面の検知を行う請求項2から5のいずれか1項に記載のホルダメンテナンス装置。The holder maintenance device according to any one of claims 2 to 5, wherein the dust detection device detects the other surface after completing detection of one surface of the substrate holder. 前記搬送部は、前記塵埃検知装置で検知が完了した前記基板ホルダを反転させ、前記塵埃検知装置に再度搬入する請求項6に記載のホルダメンテナンス装置。The holder maintenance device according to claim 6, wherein the transport unit reverses the substrate holder whose detection is completed by the dust detection device, and carries the substrate holder into the dust detection device again. 前記メンテナンス部は、前記基板ホルダを清掃する洗浄装置を有する請求項2から7のいずれか1項に記載のホルダメンテナンス装置。The holder maintenance device according to any one of claims 2 to 7, wherein the maintenance unit has a cleaning device that cleans the substrate holder. 前記洗浄装置は、前記基板ホルダに向けて流体を噴射する流体噴射部を有する請求項8に記載のホルダメンテナンス装置。The holder maintenance device according to claim 8, wherein the cleaning device includes a fluid ejecting unit that ejects a fluid toward the substrate holder. 前記洗浄装置は、前記流体噴射部から噴射される流体の圧力を調整する調圧部を有し、The cleaning apparatus has a pressure regulator that regulates the pressure of the fluid injected from the fluid injector.
前記調圧部は、前記基板ホルダへの前記塵埃の固着度に応じて圧力を調整する請求項9に記載のホルダメンテナンス装置。10. The holder maintenance device according to claim 9, wherein the pressure adjustment unit adjusts the pressure in accordance with the degree of adhesion of the dust to the substrate holder.
前記洗浄装置は、前記基板ホルダに気体を噴射する気体噴射部を有し、The cleaning apparatus has a gas injection unit for injecting a gas to the substrate holder,
前記流体噴射部は、前記基板ホルダに液体を噴射することにより前記基板ホルダを洗浄し、前記気体噴射部は、前記流体噴射部による洗浄後に前記気体を噴射することにより前記液体を除去する請求項9または10に記載のホルダメンテナンス装置。The fluid ejecting unit cleans the substrate holder by ejecting a liquid to the substrate holder, and the gas ejecting unit removes the liquid by ejecting the gas after cleaning by the fluid ejecting unit. The holder maintenance device according to 9 or 10.
前記メンテナンス部は、前記基板ホルダを清掃する洗浄装置を有し、The maintenance unit has a cleaning device for cleaning the substrate holder.
前記洗浄装置は、前記画像処理部により検知された前記位置を洗浄する請求項5に記載のホルダメンテナンス装置。The holder maintenance device according to claim 5, wherein the cleaning device cleans the position detected by the image processing unit.
前記メンテナンス部は、前記洗浄装置による洗浄に液体が用いられた場合に、前記洗浄装置による洗浄後に前記基板ホルダを乾燥させる乾燥装置を有する請求項8から12のいずれか1項に記載のホルダメンテナンス装置。The holder maintenance according to any one of claims 8 to 12, wherein the maintenance unit has a drying device for drying the substrate holder after cleaning by the cleaning device when a liquid is used for cleaning by the cleaning device. apparatus. 前記乾燥装置は、前記基板ホルダを加熱するベーク装置、遠心乾燥装置、およびスピン乾燥装置のいずれかである請求項13に記載のホルダメンテナンス装置。The holder maintenance device according to claim 13, wherein the drying device is any one of a baking device which heats the substrate holder, a centrifugal drying device, and a spin drying device. 前記搬送部は、前記洗浄後に前記基板ホルダを前記塵埃検知装置に搬入し、塵埃が検知されなかった場合は、前記基板ホルダを前記塵埃検知装置から前記乾燥装置に搬送し、塵埃が検知された場合は、前記基板ホルダを前記塵埃検知装置から前記洗浄装置に搬送する請求項13または14に記載のホルダメンテナンス装置。The transport unit carries the substrate holder into the dust detection device after the cleaning, and transports the substrate holder from the dust detection device to the drying device when dust is not detected, and dust is detected. In the case, the holder maintenance device according to claim 13 or 14, wherein the substrate holder is transported from the dust detection device to the cleaning device. 前記搬送部は、前記メンテナンス部でのメンテナンスが完了した前記基板ホルダを前記ホルダラックに搬送する請求項1から15のいずれか1項に記載のホルダメンテナンス装置。The holder maintenance device according to any one of claims 1 to 15, wherein the transport unit transports the substrate holder, for which the maintenance in the maintenance unit is completed, to the holder rack. 互いに重ね合された2つの半導体基板を互いに接合する基板重ね合わせ装置に用いられ、前記2つの半導体基板の少なくとも一方を保持して搬送する基板ホルダをメンテナンスするホルダメンテナンス方法であって、A holder maintenance method for use in a substrate stacking apparatus for bonding two semiconductor substrates stacked on each other to hold and transport at least one of the two semiconductor substrates.
前記基板ホルダを収容するホルダラックから前記基板ホルダを搬出する搬送段階と、A transfer step of unloading the substrate holder from a holder rack that accommodates the substrate holder;
前記搬送段階で搬送された前記基板ホルダをメンテナンスするメンテナンス段階とA maintenance step of maintaining the substrate holder transferred at the transfer step;
を含むホルダメンテナンス方法。Holder maintenance method including.
前記メンテナンス段階は、前記基板ホルダに付着した塵埃を検知する塵埃検知段階を含む請求項17に記載のホルダメンテナンス方法。The holder maintenance method according to claim 17, wherein the maintenance step includes a dust detection step of detecting dust attached to the substrate holder. 前記塵埃検知段階では、前記塵埃の大きさ及び位置を検知する請求項18に記載のホルダメンテナンス方法。The holder maintenance method according to claim 18, wherein the dust detection step detects the size and position of the dust. 前記塵埃検知段階では、前記基板ホルダの一方の面の検知を完了した後、他方の面の検知を行う請求項18または19に記載のホルダメンテナンス方法。20. The holder maintenance method according to claim 18, wherein in the dust detection step, after detection of one surface of the substrate holder is completed, detection of the other surface is performed. 前記メンテナンス段階は、前記基板ホルダを清掃する洗浄段階を含む請求項18から20のいずれか1項に記載のホルダメンテナンス方法。21. The holder maintenance method according to any one of claims 18 to 20, wherein the maintenance step includes a cleaning step of cleaning the substrate holder. 前記洗浄段階は、前記基板ホルダに向けて流体を噴射する流体噴射段階を含む請求項21に記載のホルダメンテナンス方法。The holder maintenance method according to claim 21, wherein the cleaning step includes a fluid injection step of injecting a fluid toward the substrate holder. 前記洗浄段階は、前記流体噴射段階で噴射される流体の圧力を調整する調圧段階を含み、前記調圧段階は、前記基板ホルダへの前記塵埃の固着度に応じて圧力を調整する請求項22に記載のホルダメンテナンス方法。The cleaning step includes a pressure adjustment step of adjusting the pressure of fluid injected in the fluid injection step, and the pressure adjustment step adjusts the pressure in accordance with the degree of adhesion of the dust to the substrate holder. 22. The holder maintenance method described in 22. 前記洗浄段階は、前記基板ホルダに気体を噴射する気体噴射段階を有し、The cleaning step comprises a gas injection step of injecting a gas onto the substrate holder,
前記流体噴射段階は、前記基板ホルダに液体を噴射することにより前記基板ホルダを洗浄し、前記気体噴射段階は、前記流体噴射段階による洗浄後に前記気体を噴射することにより前記液体を除去する請求項22または23に記載のホルダメンテナンス方法。The fluid injection step cleans the substrate holder by injecting a liquid onto the substrate holder, and the gas injection step removes the liquid by injecting the gas after cleaning by the fluid injection step. The holder maintenance method as described in 22 or 23.
前記メンテナンス段階は、前記基板ホルダを清掃する洗浄段階を含み、The maintenance step includes a cleaning step of cleaning the substrate holder.
前記洗浄段階は、前記塵埃検知段階で検知された前記位置を洗浄する請求項19に記載のホルダメンテナンス方法。The holder maintenance method according to claim 19, wherein the cleaning step cleans the position detected in the dust detection step.
前記メンテナンス段階は、前記洗浄段階における洗浄に液体が用いられた場合に、前記洗浄段階による洗浄後に前記基板ホルダを乾燥させる乾燥段階を含む請求項21から25のいずれか1項に記載のホルダメンテナンス方法。26. The holder maintenance according to any one of claims 21 to 25, wherein the maintenance step includes a drying step of drying the substrate holder after cleaning by the cleaning step when a liquid is used for cleaning in the cleaning step. Method. 前記洗浄段階の後に前記塵埃検知段階を再度実施し、塵埃が検知されなければ前記乾燥段階を実施し、塵埃が検知された場合は、前記洗浄段階を再度実施する請求項26に記載のホルダメンテナンス方法。The holder maintenance according to claim 26, wherein the dust detection step is performed again after the cleaning step, the drying step is performed if dust is not detected, and the cleaning step is performed again if dust is detected. Method. 前記メンテナンス段階でのメンテナンスが完了した前記基板ホルダを前記ホルダラックに搬送する段階を含む請求項17から27のいずれか1項に記載のホルダメンテナンス方法。28. The holder maintenance method according to any one of claims 17 to 27, including the step of transporting the substrate holder, for which the maintenance in the maintenance stage is completed, to the holder rack.
JP2010000818A 2010-01-05 2010-01-05 Holder maintenance device Pending JP2011142141A (en)

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JP2013026553A (en) * 2011-07-25 2013-02-04 Nikon Corp Substrate holder maintenance device, substrate bonding device, substrate holder maintenance method, and bonded semiconductor device manufacturing method
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