JP2010045071A5 - Substrate bonding apparatus, substrate bonding method, detection apparatus, transfer apparatus, and substrate holding member - Google Patents

Claims (47)

A detection unit for detecting the holding state of the substrate on the holding surface based on the internal pressure of the detection hole having one end opened to the holding surface of the substrate holding member having the holding surface for holding the substrate by electrostatic force;
An alignment unit for mutually aligning the substrates held by a pair of the substrate holding members each holding a substrate;
And a bonding unit for bonding the substrates aligned by the alignment unit.   The substrate bonding apparatus according to claim 1, wherein the detection unit detects the presence or absence of the substrate on the holding surface.   The substrate bonding apparatus according to claim 1, wherein the detection unit detects a shift from a predetermined position on the holding surface.   The substrate bonding apparatus according to any one of claims 1 to 3, wherein the detection unit detects whether the detection hole is sealed by the substrate.   The detection unit has a decompression unit that decompresses the inside of the detection hole, and the detection hole is sealed by the substrate based on the internal pressure of the detection hole that rises when the detection hole is not sealed by the substrate. The substrate bonding apparatus according to claim 4 which detects whether it has stopped.   The substrate bonding apparatus according to claim 4, wherein the detection unit has an air supply unit that supplies air to the inside of the detection hole.   7. The substrate bonding apparatus according to claim 6, wherein a force by which gas supplied into the detection hole pushes the substrate is smaller than a force by which the electrostatic force attracts the substrate.   The substrate bonding apparatus according to claim 6, wherein the air supply unit supplies an inert gas.   The said detection part detects whether the said detection hole is sealed by the board | substrate based on the internal pressure of the said detection hole which reduces when the said detection hole is not sealed by the board | substrate. 9. The substrate bonding apparatus according to any one of items 1 to 8.   The substrate bonding apparatus according to any one of claims 6 to 8, wherein the detection unit detects the gas leaked from the detection hole when the detection hole is not sealed by the substrate. A plurality of the detection holes are formed in the substrate holding member,
When the detection hole is not sealed by the substrate, the detection unit identifies the detection hole to which the gas has leaked among the plurality of detection holes in association with the composition of the gas leaked from the detection hole. The substrate bonding apparatus according to claim 10. A plurality of the detection holes are formed in the substrate holding member,
The substrate bonding apparatus according to claim 10, wherein the detection unit specifies a detection hole in which the gas leaks among the plurality of detection holes in association with a time when the gas leaked from the detection hole is detected. A detection unit which irradiates light to the substrate through the inside of a substrate holding member having a holding surface for holding the substrate by electrostatic force, and detects a holding state of the substrate on the holding surface based on reflected light from the substrate; ,
An alignment unit for mutually aligning the substrates held by a pair of the substrate holding members each holding a substrate;
And a bonding unit for bonding the substrates aligned by the alignment unit.   The substrate bonding apparatus according to claim 13, wherein the detection unit detects the presence or absence of the substrate on the holding surface.   The substrate bonding apparatus according to claim 13, wherein the detection unit detects a shift from a predetermined position on the holding surface.   The substrate bonding apparatus according to any one of claims 13 to 15, wherein the detection unit detects whether a detection hole of the substrate holding member is sealed by the substrate.   The detection unit irradiates the light to the substrate through a detection hole whose one end is opened in the holding surface of the substrate holding member, and the detection unit is based on the detection result of the light reflected by the substrate held on the holding surface. The substrate bonding apparatus according to claim 16, which detects that the detection hole is sealed by the substrate.   18. The control device according to claim 1, further comprising: a control unit configured to stop the operation of at least one of the alignment unit and the bonding unit when the detection unit detects that the substrate is not held by the substrate holding unit. The board | substrate bonding apparatus as described in any one. The substrate holding member has a plurality of detection holes each of which opens at one end in the vicinity of the edge of the substrate in a region of the holding surface that holds the substrate,
The substrate bonding apparatus according to any one of claims 1 to 18, wherein the detection unit individually detects the holding state of the substrate for each of the detection holes.   The detection unit detects that the substrate is held in one of the detection holes, and the other one of the detection holes does not detect that the substrate is held. 20. The substrate bonding apparatus according to claim 19, further comprising: a control unit for transporting the substrate holding member to an area different from the alignment unit and the bonding unit. The alignment unit includes a first stage that holds one of the substrate holding members, and a second stage that holds the other of the substrate holding members.
The substrate bonding apparatus according to any one of claims 1 to 20, wherein the detection unit is provided on at least one of the first stage and the second stage. Detecting the holding state of the substrate on the holding surface based on the internal pressure of the detection hole whose one end is opened to the holding surface of the substrate holding member having the holding surface holding the substrate by electrostatic force;
Aligning the substrates held by a pair of the substrate holding members, each holding a substrate, with each other;
And a bonding step of bonding the substrates aligned in the alignment step.   The substrate bonding method according to claim 22, wherein the detection step has a step of detecting whether the detection hole is sealed by the substrate. A light is irradiated to the substrate through a substrate holding member having a holding surface for holding the substrate by electrostatic force, and a detection step of detecting a holding state of the substrate on the holding surface based on reflected light from the substrate; ,
Aligning the substrates held by a pair of the substrate holding members, each holding a substrate, with each other;
And a bonding step of bonding the substrates aligned in the alignment step.   In the detection step, the light is irradiated to the substrate through a detection hole whose one end is opened on the holding surface of the substrate holding member, and the detection result of the light reflected by the substrate held on the holding surface is obtained. The substrate bonding method according to claim 24, detecting that the detection hole is sealed by the substrate. The substrate holding member has a plurality of detection holes each of which opens at one end in the vicinity of the edge of the substrate in a region of the holding surface that holds the substrate,
In the detection step, the holding state of the substrate is individually detected for each of the detection holes, and in the detection step, it is detected that the substrate is held in one of the detection holes, and the detection is performed. 25. The method according to claim 24, further comprising a transfer step of transferring the substrate holding member to an area other than the alignment portion and the bonding portion when it is not detected that the substrate is held in the other one of the holes. The board | substrate bonding method as described in 25.   The substrate bonding method according to claim 26, further comprising the step of reloading the substrate on the substrate holding member transferred to the other area after the transfer step.   28. The method according to any one of claims 24 to 27, further comprising the step of stopping at least one of the alignment step and the bonding step when it is detected in the detection step that the substrate is not held by the substrate holding portion. The board | substrate bonding method as described in one term.   A detection unit including a detection unit that detects the holding state of the substrate on the holding surface based on the internal pressure of the detection hole having one end opened to the holding surface of the substrate holding member having the holding surface that holds the substrate by electrostatic force apparatus.   The detection device according to claim 29, wherein the detection unit detects the presence or absence of the substrate on the holding surface.   The detection device according to claim 29, wherein the detection unit detects a deviation from a predetermined position on the holding surface.   The detection device according to any one of claims 29 to 31, wherein the detection unit detects whether the detection hole is sealed by the substrate.   The detection unit has a decompression unit that decompresses the inside of the detection hole, and the detection hole is sealed by the substrate based on the internal pressure of the detection hole that rises when the detection hole is not sealed by the substrate. The detection device according to claim 32, which detects whether or not it is stopped.   The detection device according to claim 32, wherein the detection unit has an air supply unit that supplies air to the inside of the detection hole.   A light is irradiated to the substrate through a substrate holding member having a holding surface for holding the substrate by electrostatic force, and a detection unit for detecting the holding state of the substrate on the holding surface based on the reflected light from the substrate Detection device provided.   The detection device according to claim 35, wherein the detection unit detects the presence or absence of the substrate on the holding surface.   The detection device according to claim 35, wherein the detection unit detects a deviation from a predetermined position on the holding surface.   The detection device according to any one of claims 35 to 37, wherein the detection unit detects whether the detection hole of the substrate holding member is sealed by the substrate.   The detection unit irradiates the light to the substrate through a detection hole whose one end is opened in the holding surface of the substrate holding member, and the detection unit is based on the detection result of the light reflected by the substrate held on the holding surface. The detection device according to claim 38, which detects that the detection hole is sealed by a substrate.   The holding state of the substrate to the holding surface is determined based on the positional relationship between the detection hole formed in the holding surface of the substrate holding member having the holding surface and the substrate held by the holding surface. A detection device provided with a detection unit that detects. 41. A sensing device according to any one of claims 29 to 40,
And a transfer unit configured to move the substrate holding member holding the substrate. The detection unit detects a holding state of the substrate to the holding surface based on an internal pressure of a detection hole having one end opened to the holding surface of the substrate holding member having the holding surface holding the substrate.
42. The carrier according to claim 41, further comprising: a holding area for holding the substrate holding member under negative pressure; and a detection hole extension which is open in an area different from the holding area and which communicates with the detection hole. Transport device. A holding surface for holding the substrate by electrostatic force;
And a detection hole formed to open at one end to the holding surface,
A substrate holding member in which a holding state of the substrate to the holding surface is detected by a detection unit based on an internal pressure of the detection hole. A holder body having a holding surface for holding the substrate by electrostatic force;
And a detection hole formed in the holder body such that one end is open in the holding surface,
A substrate holding member, wherein light from a detection unit is irradiated to the substrate through the detection hole, and a holding state of the substrate on the holding surface is detected by the detection unit based on reflected light from the substrate.   45. The substrate holding member according to claim 43, wherein the detection hole is formed in a region corresponding to a portion of the region of the holding surface held by the holding surface, in which the device is not formed.   46. The substrate holding member according to any one of claims 43 to 45, wherein a pressing tool for pushing the substrate is removed when the substrate is removed from the holding surface. A holding surface for holding the substrate by electrostatic force;
And a detection hole formed in the holding surface,
A substrate holding member in which a holding state of the substrate to the holding surface is detected by a detection unit based on a positional relationship between the detection hole and the substrate.