Claims (5)
一種晶圓之研磨方法，其使用包含保持晶圓之夾盤、及具有研磨保持於該夾盤之晶圓之磨輪之研磨機構的研磨裝置，該晶圓之研磨方法係以刮痕檢測機構檢測晶圓之研磨面有無刮痕，且當未檢測出刮痕時，便將晶圓搬送至下一個步驟，而當檢測出刮痕時，則繼續進行研磨或進行刮痕去除研磨。
A method of polishing a wafer using a polishing apparatus including a chuck for holding a wafer and a polishing mechanism having a grinding wheel for polishing a wafer held by the chuck, the method of polishing the wafer is detected by a scratch detection mechanism The polished surface of the wafer is scratched, and when no scratch is detected, the wafer is transferred to the next step, and when the scratch is detected, the polishing or scratch removal grinding is continued.
一種晶圓之研磨方法，其使用包含保持晶圓之夾盤、具有研磨保持於該夾盤之晶圓之磨輪之研磨機構、及檢測於晶圓之研磨面產生之刮痕之刮痕檢測機構的研磨裝置，該晶圓之研磨方法係於以磨輪研磨晶圓之晶圓研磨步驟結束後，執行以刮痕檢測機構檢測晶圓之研磨面有無刮痕之刮痕檢測步驟，且當刮痕存在時，便執行去除刮痕之刮痕去除研磨步驟，之後，再度執行刮痕檢測步驟，而當在前述刮痕檢測步驟，未從晶圓之研磨面檢測出刮痕時，則將晶圓搬送至下一個步驟。
A method of polishing a wafer using a chuck including a chuck for holding a wafer, a grinding mechanism having a grinding wheel for polishing a wafer held on the chuck, and a scratch detecting mechanism for detecting a scratch generated by a polished surface of the wafer The polishing apparatus for polishing the wafer is performed after the wafer polishing step of polishing the wafer by the grinding wheel, and the scratch detecting step of detecting the scratched surface of the polished surface of the wafer by the scratch detecting mechanism is performed, and when the scratch is detected When present, the scratch removing polishing step of removing the scratch is performed, and then the scratch detecting step is performed again, and when the scratch is not detected from the polished surface of the wafer in the scratch detecting step, the wafer is Move to the next step.
一種研磨裝置，其包含有保持晶圓之夾盤、及具有用以研磨保持於該夾盤之晶圓之磨輪之研磨機構，該研磨裝置更包含檢測於晶圓之研磨面產生之刮痕的刮痕檢測機構，其中前述刮痕檢測機構具有：拍攝機構，其拍攝晶圓之研磨面，以取得影像資訊；二值化處理機構，其將該拍攝機構拍攝之影像進行二值化處理；及
刮痕判定機構，其藉來自該二值化處理機構之資訊判定刮痕。
A polishing apparatus comprising a chuck for holding a wafer and a polishing mechanism having a grinding wheel for polishing a wafer held on the chuck, the polishing device further comprising a scratch detected by the polished surface of the wafer a scratch detecting mechanism, wherein the scratch detecting mechanism has: a photographing mechanism that captures a polished surface of the wafer to obtain image information; and a binarization processing mechanism that binarizes the image captured by the photographing mechanism;
The scratch determining means determines the scratch by the information from the binarization processing means.
如申請專利範圍第3項之研磨裝置，其中前述刮痕檢測機構與前述夾盤相鄰配設，且檢測保持於該夾盤之研磨中之晶圓研磨面之刮痕。
A polishing apparatus according to claim 3, wherein the scratch detecting means is disposed adjacent to the chuck, and detects a scratch of the polished surface of the wafer held in the grinding of the chuck.
一種研磨裝置，其包含有保持晶圓之夾盤、及具有用以研磨保持於該夾盤之晶圓之磨輪之研磨機構，該研磨裝置更包含檢測於晶圓之研磨面產生之刮痕的刮痕檢測機構，其中前述刮痕檢測機構與前述夾盤相鄰配設，且檢測保持於該夾盤之研磨中之晶圓研磨面之刮痕。
A polishing apparatus comprising a chuck for holding a wafer and a polishing mechanism having a grinding wheel for polishing a wafer held on the chuck, the polishing device further comprising a scratch detected by the polished surface of the wafer The scratch detecting mechanism, wherein the scratch detecting mechanism is disposed adjacent to the chuck, and detects a scratch of the wafer polishing surface held by the chuck.