JP2011141263A - Probe card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card capable of adjusting horizontality easily. <P>SOLUTION: The probe card includes: a printed circuit board; a horizontal adjustment part penetrating the printed circuit board, and including a horizontal adjusting bolt and a connection part formed on the end of the horizontal adjusting bolt; a probe substrate connected electrically to the printed circuit board; and a connection member stored in a groove part formed on the probe substrate, and connected to the connection part. In the probe card, when a force is applied to the probe substrate, the force is dispersed by the connection member made of a resin, to thereby facilitate adjustment of horizontality. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a probe card, and more particularly to a probe card in which the levelness can be easily adjusted.

  2. Description of the Related Art Generally, in a semiconductor device, a fabrication process for forming a circuit pattern and a contact pad for inspection on a wafer and a wafer on which the circuit pattern and the contact pad are formed are assembled with respective semiconductor chips. Manufactured by an assembly process.

  Between the fabrication process and the assembly process, an inspection process is performed in which an electrical signal is applied to the contact pads formed on the wafer to inspect the electrical characteristics of the wafer.

  The inspection process is a process performed to inspect the wafer for defects and remove the wafer in which the defects have occurred during the assembly process.

  In the inspection process, an inspection device called a tester for applying an electrical signal to the wafer and an inspection device called a probe card for performing an interface function between the wafer and the tester are mainly used.

  The probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes that make contact with contact pads formed on the wafer.

  Recently, as the demand for highly integrated chips increases, circuit patterns formed on a wafer by a fabrication process and contact pads connected to the circuit patterns are formed with high integration. That is, the interval between adjacent contact pads is very narrow, and the size of the contact pads themselves is finely formed. As a result, since the probe of the probe card used in the inspection process must be in contact with the contact pad, the distance between adjacent probes must be very narrow, corresponding to the contact pad. The size of itself must be finely formed.

  In order to inspect such a fine pitch contact pad, the probe of the probe card is also formed at a fine pitch. Accordingly, a so-called probe transformer called a space transformer is used between the printed circuit board and the probe, which compensates for the difference between the distance between the terminals on the printed circuit board and the distance between the probes.

  It is important that a plurality of probes are mounted on the lower part of the probe substrate, and that the ends of the probes are all at the same height so that the probe and the contact pads of the wafer can all come into contact with each other. For this purpose, it is important to maintain the level of the probe substrate.

  The present invention is intended to solve the above-described problems, and the present invention provides a probe card in which the levelness can be easily adjusted.

  As a means for solving the above-described problems, an embodiment of the present invention includes a printed circuit board, a horizontal adjustment bolt, and a connecting portion formed at an end of the horizontal adjustment bolt, penetrating the printed circuit board. Provided is a probe card including a leveling unit, a probe board electrically connected to the printed circuit board, and a connecting member received in a groove formed on the probe board and fastened to the connecting part.

  Here, the cross section in the thickness direction of the groove part may include a step formed so as to have a smaller area toward the bottom.

  The cross section in the thickness direction of the groove portion may include a step formed to have a larger area as it goes downward.

  A cross section in the thickness direction of the groove may be rectangular.

  A cross section in the thickness direction of the groove portion may be a semicircular shape or a semielliptical shape.

  The connection part may further include a serrated fastening part fastened to the connection member.

  The connecting member may be an adhesive resin.

  The connecting member may be an epoxy resin.

  A side jig penetrating the printed circuit board and holding a side face of the probe board may be further included.

  The horizontal adjustment part may further include a nut part corresponding to the horizontal adjustment bolt.

  According to the present invention, when force is applied to the probe substrate, the force is dispersed by the connecting member made of resin, so that it is possible to provide a probe card in which the levelness can be easily adjusted.

  In addition, since the assembly of the bolts for adjusting the horizontality can be accurately performed at the position where the groove portion is formed, it is possible to ensure the tolerance of assembly due to a mistake in assembly by the operator.

  Furthermore, since the defect rate of the probe substrate in the subsequent process can be reduced, the material cost and the unit production cost can be reduced, and the disposal cost in the finished product can also be reduced.

It is sectional drawing which shows schematically the probe card by one Embodiment of this invention. It is sectional drawing which expands and shows roughly the A area | region of FIG. FIG. 6 is an enlarged schematic cross-sectional view of a horizontal adjustment unit of a probe card according to another embodiment of the present invention. FIG. 10 is an enlarged schematic cross-sectional view of a horizontal adjustment unit of a probe card according to still another embodiment of the present invention. FIG. 10 is an enlarged schematic cross-sectional view of a horizontal adjustment unit of a probe card according to still another embodiment of the present invention.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiment of the present invention can be modified in various other forms, and the scope of the present invention is not limited to the embodiment described below. In addition, embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shape and size of elements in the drawings may be exaggerated for a clearer description, and the elements indicated by the same reference numerals in the drawings are the same elements.

  FIG. 1 is a cross-sectional view schematically showing a probe card according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view schematically showing an enlarged area A of FIG.

  Referring to FIG. 1, the probe card includes a printed circuit board 110, a horizontal adjustment unit 120, a probe board 130, and a connecting member 140 (see FIG. 2).

  A probe circuit pattern (not shown) for an inspection process is formed on the upper surface of the printed circuit board 110 in the drawing, and a hole into which the interposer 111 can be mounted is formed on the lower surface of the drawing.

  The printed circuit board 110 may be connected to a tester (not shown) for an inspection process.

  Since the probe card inspects a highly integrated wafer, the interval between adjacent probe circuit patterns formed on the upper surface of the printed circuit board 110 in the drawing may be very narrow.

  The interposer 111 is located in a separation space between the printed circuit board 110 and the probe board 130, one end is connected to the probe circuit pattern of the printed circuit board 110, and the other end is in contact with the probe board 130.

  The interposer 111 serves to transmit an electrical signal that has passed through the printed circuit board 110 to the probe board 130 for an inspection process.

  The interposer 111 is an interface means for electrically connecting the printed circuit board 110 and the probe board 130, and may have various shapes.

  The probe substrate 130 may be a multi-layer substrate formed of an insulating material such as ceramic, glass, or silicon. An interposer is coupled to the upper surface of the probe substrate in the drawing and connected to the printed circuit board, and a plurality of probes 131 that are in direct contact with the inspection object (wafer chip) are mounted on the lower surface of the probe substrate in the drawing. .

  The probe board 130 transmits the electrical signal received from the printed circuit board 110 to the probe 131.

  The probe 131 directly contacts the inspection object (wafer chip) to transmit an electrical signal to the inspection object, and transmits the electrical signal received from the inspection object to the probe card again.

  Recently, as the probe substrate becomes larger due to higher integration of the wafer and the number of probes attached to the probe substrate increases, the force applied to the probe substrate increases and the inside of the substrate may be bent. Accordingly, the probe card adjusts the level using the level adjusting device.

  It is important that the ends of the probes 131 are all located at the same height so that the probes 131 can all come into contact with the contact pads of the inspection object. For this purpose, it is important for the probe substrate 130 to maintain levelness.

  In the present embodiment, the level of the probe substrate 130 is adjusted and held by the level adjustment unit 120. The horizontal adjustment unit 120 is connected to the reinforcing plate 160, passes through the printed circuit board 110, and is connected to the probe board 130.

  The horizontal adjustment unit 120 includes a horizontal adjustment bolt 121 and a connecting part 122 formed at the end of the horizontal adjustment bolt 121.

  A groove 131a is formed on the probe substrate 130, and a connecting member 140 that is fastened to the connecting portion 122 is accommodated in the groove 131a. Here, the connecting member 140 may be an adhesive resin and is preferably an epoxy resin, but the connecting member 140 of the present invention is not limited thereto.

  In order to perform the inspection process, the probe board 130 is assembled to the printed circuit board 110.

  In order to assemble the probe board 130 to the printed circuit board, the probe board 130 can be mounted on the side jig 150. The side jig 150 is connected to the reinforcing plate 160 and is formed through the printed circuit board 110 to hold the side face of the probe board 130. The height of the side jig 150 can be adjusted by a side adjustment bolt 151.

  When assembling, the probe board 130 is applied with a force in the Z-axis direction by the horizontal adjustment unit 120 in order to adjust the level.

  The horizontal adjustment unit 120 may include a nut part 123 corresponding to the horizontal adjustment bolt 121.

  In order to adjust the level of the probe board 130, the level adjustment bolt 121 is pulled, and a force is applied to the probe board. At this time, the force applied by the connecting member 140 accommodated in the groove 131a is dispersed in the connecting portion 122 of the horizontal adjustment portion 120.

  As shown in FIG. 2, the cross section in the thickness direction of the groove 131 a is rectangular and has an increased contact area with the connecting member 140 compared to the conventional one, and the force applied by the connecting member 140 is dispersed. There is an effect that. At this time, the connecting part 122 is further provided with a serrated fastening part that is fastened to the connecting member 140, and the contact area between the connecting member 140 and the connecting part 122 can be increased to disperse the force. Thereby, unnecessary force is prevented from being applied to the probe substrate 130, and damage to the probe substrate can be prevented.

  FIG. 3 is a cross-sectional view schematically showing an enlarged horizontal adjustment portion of a probe card according to another embodiment of the present invention. The description will focus on components that are different from the above-described embodiment, and detailed descriptions of the same components will be omitted.

  The present embodiment is an example in which the structure is the same as that of the above-described example, but the structure of the groove 131b is changed.

  Referring to FIG. 3, the groove 131 b has a semi-elliptical cross section in the thickness direction, and has an increased contact area with the connecting member 140 compared to the conventional one, and the force applied by the connecting member 140 is dispersed. There is an effect that. Here, the cross section in the thickness direction of the groove 131b may be semicircular. At this time, as in the previous embodiment, the connecting portion 122 is further provided with a serrated fastening portion that is fastened to the connecting member 140, and the contact area between the connecting member 140 and the connecting portion 122 is also increased. Can be dispersed. Thereby, unnecessary force is prevented from being applied to the probe substrate 130, and damage to the probe substrate can be prevented.

  FIG. 4 is a cross-sectional view schematically showing an enlarged horizontal adjustment portion of a probe card according to still another embodiment of the present invention. The description will focus on components that are different from the above-described embodiment, and detailed descriptions of the same components will be omitted.

  The present embodiment is an example in which the structure is the same as the above-described example, but the structure of the groove 131c is changed.

  Referring to FIG. 4, the cross section in the thickness direction of the groove 131 c includes a step formed so as to have a narrower area as it goes down, and the contact area with the connecting member 140 is smaller than that of the conventional one. There is an effect that the force applied by the connecting member 140 is dispersed. At this time, as in the previous embodiment, the connecting part 122 is further provided with a sawtooth fastening part fastened to the connecting member 140, thereby increasing the contact area between the connecting member 140 and the connecting part 122. , Can distribute the force. Thereby, unnecessary force is prevented from being applied to the probe substrate 130, and damage to the probe substrate can be prevented.

  FIG. 5 is a cross-sectional view schematically showing an enlarged horizontal adjustment portion of a probe card according to still another embodiment of the present invention. The description will focus on components that are different from the above-described embodiment, and detailed descriptions of the same components will be omitted.

  The present embodiment is an example in which the structure is the same as that of the above-described example, but the structure of the groove 131d is changed.

  Referring to FIG. 5, the cross section in the thickness direction of the groove 131 d includes a step formed to have a larger area as it goes down, and the contact area with the connecting member 140 is larger than that of the conventional one. There is an effect that the force applied by the connecting member 140 is dispersed. In addition, the groove part 131d of this embodiment can increase the contact area with the probe board | substrate 130 from the groove parts 131a-131c of a previous Example. At this time, as in the previous embodiment, the connecting portion 122 is further provided with a serrated fastening portion that is fastened to the connecting member 140, and the contact area between the connecting member 140 and the connecting portion 122 is also increased. Can be dispersed. Thereby, unnecessary force is prevented from being applied to the probe substrate 130, and damage to the probe substrate can be prevented.

  According to the present invention, when force is applied to the probe substrate, the force is dispersed by the connecting member made of resin, so that it is possible to provide a probe card in which the levelness can be easily adjusted.

  In addition, since the assembly of the bolts for adjusting the horizontality can be accurately performed at the position where the groove portion is formed, it is possible to ensure the tolerance of assembly due to a mistake in assembly by the operator.

  Furthermore, since the defect rate of the probe substrate in the subsequent process can be reduced, the material cost and the unit production cost can be reduced, and the disposal cost in the finished product can also be reduced.

  The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Accordingly, it is obvious to those skilled in the art that various forms of substitution, modification, and change are possible without departing from the technical idea of the present invention described in the claims. Yes, this also belongs to the technical idea described in the appended claims.

DESCRIPTION OF SYMBOLS 110 Printed circuit board 120 Level adjustment part 121 Level adjustment bolt 122 Connection part 123 Nut part 130 Probe board 131 Groove part 140 Connection member 150 Side jig

Claims (10)

A printed circuit board;
A horizontal adjustment portion that penetrates the printed circuit board and includes a horizontal adjustment bolt and a connecting portion formed at an end of the horizontal adjustment bolt;
A probe board electrically connected to the printed circuit board;
A connecting member housed in a groove formed on the probe substrate and fastened to the connecting portion;
A probe card comprising:   2. The probe card according to claim 1, wherein a cross section in the thickness direction of the groove portion includes a step formed to have a smaller area toward the bottom.   2. The probe card according to claim 1, wherein the cross section in the thickness direction of the groove portion includes a step formed to have a larger area toward the bottom.   The probe card according to claim 1, wherein a cross section in the thickness direction of the groove is rectangular.   2. The probe card according to claim 1, wherein a cross section in the thickness direction of the groove portion is a semicircular shape or a semielliptical shape.   The probe card according to claim 1, wherein the connection part further includes a sawtooth fastening part fastened to the connection member.   The probe card according to claim 1, wherein the connecting member is an adhesive resin.   The probe card according to claim 1, wherein the connecting member is an epoxy resin.   The probe card according to claim 1, further comprising a side jig penetrating the printed circuit board and holding a side face of the probe board.   The probe card according to claim 1, wherein the horizontal adjustment part further includes a nut part corresponding to the horizontal adjustment bolt.

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