WO2023112315A1 - Probe card substrate connection base - Google Patents
Probe card substrate connection base Download PDFInfo
- Publication number
- WO2023112315A1 WO2023112315A1 PCT/JP2021/046781 JP2021046781W WO2023112315A1 WO 2023112315 A1 WO2023112315 A1 WO 2023112315A1 JP 2021046781 W JP2021046781 W JP 2021046781W WO 2023112315 A1 WO2023112315 A1 WO 2023112315A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- pedestal
- probe card
- card board
- opening
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Definitions
- This application relates to a probe card board connection pedestal.
- the probe card board is composed of a plurality of plate-like members stacked on top of each other. That is, a circuit board with electrical wiring, a reinforcing plate for preventing deformation of the circuit board, and a probe board on which probes are mounted are superimposed and integrated by a connecting device.
- the connecting device is composed of the base body, the support, and the tightening member.
- the pedestal body is fixed to the surface of either the lowermost layer or the uppermost flat plate-like member by resin or solder, and the pedestal body is provided with a support, which is used to hold the middle layer of the flat plate-like member and the uppermost or uppermost layer. It is constructed such that a fastening member such as a screw penetrates through the lower layer plate-like member and fastens the top layer or the bottom layer plate-like member on the opposite side of the pedestal main body.
- Patent Document 1 proposes improving the material of fixing members such as bolts.
- the present application discloses a technique for solving the above-described problems, and provides a pedestal body for a probe card board that does not protrude large even when a large amount of adhesive is applied. With the goal.
- the probe card board connection pedestal disclosed in the present application has an adhesive surface set on a predetermined surface of a pedestal body to be bonded to a substrate, and an opening in the adhesive surface provided inside the pedestal body. , an adhesive storage chamber in which an adhesive is stored, and an escape hole provided in the adhesive storage chamber and opening in a direction opposite to the adhesive surface, through which the adhesive can be discharged. It is something to do.
- the probe card board connection pedestal of the present application it is possible to increase the thickness of the adhesive layer and reduce the protrusion of the adhesive.
- FIG. 1 is a configuration diagram of a probe card board and a connection device according to Embodiment 1;
- FIG. FIG. 5 is an explanatory diagram showing the bonding operation of the pedestal body according to the first embodiment; It is explanatory drawing which shows the adhesion
- 4 is a configuration diagram showing the arrangement of connection pedestals according to Embodiment 1.
- FIG. FIG. 2 is a partially broken perspective view showing the structure of the pedestal body of Embodiment 1;
- FIG. 11 is a partially broken perspective view showing the structure of a base body according to Embodiment 2;
- FIG. 11 is a partially broken perspective view showing the structure of a base body according to Embodiment 3;
- FIG. 11 is a cross-sectional view showing the structure of a pedestal body and support columns according to Embodiment 4;
- FIG. 1 is a cross-sectional view showing a schematic configuration of a probe card substrate and a connection pedestal used therein according to Embodiment 1.
- FIG. This cross-sectional view shows the structure of the probe card board and the connection base for the probe card board in an enlarged manner.
- the probe card substrate 1 includes a probe substrate 3 provided with a plurality of probes 2, a wiring substrate 4, and a reinforcing plate 5. are fastened by a connection device 6 to form an integral structure.
- a plurality of electrodes 41 of electric circuit wiring are provided on the surface of the wiring board 4 of the probe card shown in FIG.
- a plurality of probes 2 are provided on the surface of the probe board 3 , and the probes 2 are connected to a plurality of electrodes 31 on the back surface of the probe board 3 through wiring inside the probe board 3 .
- the electrodes 31 of the probe board 3 and the electrodes 41 of the wiring board 4 are connected by relay pins 7 .
- connection device 6 is composed of a base body 9 and a support 10.
- the base body 9 is adhered to the surface of the probe board 3 with an adhesive 8, and the screw portion 91 of the base body 9 is attached.
- the post 10 is configured to be screwed to.
- the head 11 of the post 10 extends to the reinforcing plate 5, and is configured to be tightened so as to narrow the distance between the probe board 3 and the reinforcing plate 5 by rotating the head 11. there is
- a predetermined surface of the pedestal body 9 is set as the bonding surface 92 and bonded to the probe substrate 3 .
- An adhesive containing chamber 93 for containing the adhesive 8 is provided inside the pedestal main body 9 , and an opening 94 opens to the bonding surface 92 .
- the adhesive containing chamber 93 is provided with a release hole 95 that opens on the side opposite to the opening 94 provided on the adhesive surface 92 side.
- the escape hole 95 is an opening for discharging the adhesive 8 when the base body 9 is pressed against the probe board 3 when the adhesive 8 stored in the adhesive storage chamber 93 is large.
- the adhesive 8 is applied to the adhesive storage chamber 93 of the pedestal body 9, the pedestal body 9 is pressed against the probe board 3, and heat is applied. .
- the pedestal body 9 can be fixed to the probe substrate 3 by curing the adhesive 8 on the adhesive surface 92 and in the adhesive storage chamber 93 .
- the fillet 99 is expanded by the pedestal body 90 at the time of adhesion, and the area of the fillet 99 is formed large.
- a barrier 96 is provided facing the escape hole 95 . This barrier 96 prevents the adhesive 8 coming out of the escape hole 95 from crawling up the column 10 .
- the inner wall surface of the adhesive storage chamber 93 is formed to have an inwardly bulging shape, that is, a shape in which the narrowed portion 97 is provided in the opening 94, so that the cured adhesive 8 is gripped by the adhesive storage chamber 93. It can be a structure that
- the inner wall surface of the adhesive storage chamber 93 is inclined toward the relief hole 95 (it is composed of a smooth slope up to the opening of the relief hole 95).
- FIG. 4 is a configuration diagram showing the arrangement of a plurality of pedestal bodies 9 provided on the surface of the probe board 3. As shown in FIG. As shown in FIG. 4, the pedestal body 9 is arranged at the intersection of a straight line A drawn radially from the center of the probe board 3 and a concentric circle B so that the tensile forces applied to the respective pedestal bodies 9 are substantially equal. It is configured.
- FIG. 5 is a partially broken perspective view of the pedestal body 9.
- the pedestal body 9 includes a threaded portion 91 for fixing the support 10, an adhesive surface 92, an adhesive storage chamber 93, an opening 94, an escape hole 95, a barrier 96, a constricted portion 97, and an inclined surface. It can be fabricated as a monolithic structure of metal with 98.
- FIG. 6 is a partially broken perspective view of the pedestal body 9 of the second embodiment.
- the pedestal body 9 of the second embodiment has the barrier 96 removed from the pedestal body 9 of the first embodiment.
- the amount of agent 8 can be adjusted.
- FIG. 7 is a partially broken perspective view of the pedestal body 9 of the third embodiment.
- the pedestal body 9 of the third embodiment is intended to be more compact than the pedestal body 9 of the second embodiment, and the threaded portion 91 is embedded in the adhesive accommodating chamber 93. is. In this case, since the capacity of the adhesive storage chamber 93 is reduced, the effect that the amount of the adhesive 8 used can be reduced can be obtained.
- FIG. 8 is a cross-sectional view of the pedestal body 9 of Embodiment 4.
- the threaded portion 91 is changed from a female thread to a male thread.
- the posts 10 are internally threaded.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
There is a need to increase the connection strength of a base body (9) of a connection device (6) for connecting a plurality of plate-like members stacked on one another. A probe card substrate connection base (100) is characterized by comprising: an adhesive surface (91) set on a predetermined surface of the base body (9) that is adhered to a substrate (3); an adhesive containing chamber (93) that is provided inside the base body (9), has an opening (94) in the adhesive surface (91), and contains an adhesive (8); and a relief hole (95) that is provided in the adhesive containing chamber (93), opens in an opposite direction to the adhesive surface (91), and allows the adhesive (8) to be discharged therethrough.
Description
本願は、プローブカード基板用接続台座に関するものである。
This application relates to a probe card board connection pedestal.
プローブカード基板は、板状の部材が複数重ね合わせて構成されている。すなわち、電気配線が施された回路基板、回路基板の変形を防ぐための補強板およびプローブが搭載されたプローブ基板が重ね合わされ、接続装置によって一体に構成されている。
The probe card board is composed of a plurality of plate-like members stacked on top of each other. That is, a circuit board with electrical wiring, a reinforcing plate for preventing deformation of the circuit board, and a probe board on which probes are mounted are superimposed and integrated by a connecting device.
ここで、接続装置は、台座本体と支柱と締め付け部材とによって構成されている。台座本体が、最下層あるいは最上層の平板状の部材のいずれかの表面に樹脂または半田によって固定され、台座本体に支柱が立てられ、支柱によって中間の層の平板状の部材および最上層あるいは最下層の平板状の部材を貫いて、ねじなどの締め付け部材によって台座本体の反対側の最上層あるいは最下層の平板状の部材を締め付けるように構成されている。
Here, the connecting device is composed of the base body, the support, and the tightening member. The pedestal body is fixed to the surface of either the lowermost layer or the uppermost flat plate-like member by resin or solder, and the pedestal body is provided with a support, which is used to hold the middle layer of the flat plate-like member and the uppermost or uppermost layer. It is constructed such that a fastening member such as a screw penetrates through the lower layer plate-like member and fastens the top layer or the bottom layer plate-like member on the opposite side of the pedestal main body.
プローブカードは、様々な温度状態における半導体デバイスの検査に使用されるため、温度変化に対する耐久性が求められている。プローブカード基板用の接続装置の耐久性を向上させるために、特許文献１では、ボルトなどの固定部材の材質を改良することが提案されている。
Probe cards are required to be durable against temperature changes because they are used to inspect semiconductor devices under various temperature conditions. In order to improve the durability of the connecting device for the probe card board, Patent Document 1 proposes improving the material of fixing members such as bolts.
接続装置の耐久性を向上させるために、特許文献１に提案されているように、固定部材を改良しても、固定部材を固定する台座本体の取り付けが問題である。台座本体は、板状の部材（基板）の表面に樹脂または半田などの接着剤によって取り付けられているので、限られた接着面積で如何にして固着力を高めるかということが問題である。
Even if the fixing member is improved as proposed in Patent Document 1 in order to improve the durability of the connection device, the mounting of the pedestal main body that fixes the fixing member remains a problem. Since the pedestal body is attached to the surface of a plate-like member (substrate) with an adhesive such as resin or solder, the problem is how to increase the fixing force with a limited adhesive area.
この問題は、接着剤の量を多くすることによって幾分かは軽減できる。しかし、接着剤が多い場合には、フィレット（はみだし部）が大きくなり、台座本体の固定に必要な領域よりも広い面積をフィレットが占めることになり、プローブ基板または配線基板として本来必要とされる面積に影響を与える（配線を設ける領域に樹脂層が入り込む）という問題があった。
This problem can be somewhat alleviated by increasing the amount of adhesive. However, if there is a large amount of adhesive, the fillet (protruding portion) becomes large, and the fillet occupies a wider area than the area required for fixing the pedestal body. There is a problem that the area is affected (the resin layer enters the area where the wiring is provided).
本願は、上記のような問題を解決するための技術を開示するものであり、接着剤が多く付けられている場合であっても、はみだし部が大きくならないプローブカード基板用台座本体を提供することを目的とする。
The present application discloses a technique for solving the above-described problems, and provides a pedestal body for a probe card board that does not protrude large even when a large amount of adhesive is applied. With the goal.
本願に開示されるプローブカード基板用接続台座は、基板に接着される台座本体の予め定められた面に設定された接着面、前記台座本体の内部に設けられ前記接着面に開口部を有し、接着剤が収容される接着剤収容室、および前記接着剤収容室に設けられ前記接着面とは反対の方向に開口して、前記接着剤を吐出し得る逃がし穴を備えたことを特徴とするものである。
The probe card board connection pedestal disclosed in the present application has an adhesive surface set on a predetermined surface of a pedestal body to be bonded to a substrate, and an opening in the adhesive surface provided inside the pedestal body. , an adhesive storage chamber in which an adhesive is stored, and an escape hole provided in the adhesive storage chamber and opening in a direction opposite to the adhesive surface, through which the adhesive can be discharged. It is something to do.
本願のプローブカード基板用接続台座によれば、接着剤の層を厚くすると共に接着剤のはみ出しを小さくすることができる。
According to the probe card board connection pedestal of the present application, it is possible to increase the thickness of the adhesive layer and reduce the protrusion of the adhesive.
実施の形態１
以下、図面に基づいて実施の形態１を説明する。なお、図中同一符号は、各々同一または相当部分を示す。
図１は、実施の形態１によるプローブカード基板およびそこに使用される接続台座の概略的な構成を示す断面図である。この断面図は、プローブカード基板の構成と、プローブカード基板用接続台座を拡大して表している。Embodiment 1
Embodiment 1 will be described below with reference to the drawings. The same reference numerals in the drawings indicate the same or corresponding parts.
FIG. 1 is a cross-sectional view showing a schematic configuration of a probe card substrate and a connection pedestal used therein according toEmbodiment 1. FIG. This cross-sectional view shows the structure of the probe card board and the connection base for the probe card board in an enlarged manner.
以下、図面に基づいて実施の形態１を説明する。なお、図中同一符号は、各々同一または相当部分を示す。
図１は、実施の形態１によるプローブカード基板およびそこに使用される接続台座の概略的な構成を示す断面図である。この断面図は、プローブカード基板の構成と、プローブカード基板用接続台座を拡大して表している。
FIG. 1 is a cross-sectional view showing a schematic configuration of a probe card substrate and a connection pedestal used therein according to
図１に示すように、プローブカード用基板１は、複数のプローブ２が設けられたプローブ基板３と、配線基板４と、補強板５とを備え、プローブ基板３、配線基板４および補強板５が接続装置６によって締結されて一体構造とされている。
As shown in FIG. 1, the probe card substrate 1 includes a probe substrate 3 provided with a plurality of probes 2, a wiring substrate 4, and a reinforcing plate 5. are fastened by a connection device 6 to form an integral structure.
図１に示すプローブカードの配線基板４の表面には電気回路配線の複数の電極４１が設けられている。また、プローブ基板３の表面には複数のプローブ２が設けられ、プローブ２からプローブ基板３の裏面の複数の電極３１までそれぞれプローブ基板３の内部の配線を通って接続されている。そしてプローブ基板３の電極３１と配線基板４の電極４１とは中継ピン７によって接続されている。
A plurality of electrodes 41 of electric circuit wiring are provided on the surface of the wiring board 4 of the probe card shown in FIG. A plurality of probes 2 are provided on the surface of the probe board 3 , and the probes 2 are connected to a plurality of electrodes 31 on the back surface of the probe board 3 through wiring inside the probe board 3 . The electrodes 31 of the probe board 3 and the electrodes 41 of the wiring board 4 are connected by relay pins 7 .
接続装置６は、拡大した断面図に示すように、台座本体９と支柱１０とによって構成され、台座本体９は、プローブ基板３の表面に接着剤８によって接着され、台座本体９のねじ部９１に支柱１０がねじ止めされるように構成されている。支柱１０の頭部１１は、補強板５にまで伸びていて、頭部１１を回転させることによって、プローブ基板３と補強板５との間隔を狭くするように締め付けることができるように構成されている。
As shown in the enlarged cross-sectional view, the connection device 6 is composed of a base body 9 and a support 10. The base body 9 is adhered to the surface of the probe board 3 with an adhesive 8, and the screw portion 91 of the base body 9 is attached. The post 10 is configured to be screwed to. The head 11 of the post 10 extends to the reinforcing plate 5, and is configured to be tightened so as to narrow the distance between the probe board 3 and the reinforcing plate 5 by rotating the head 11. there is
台座本体９の予め定められた面が接着面９２として設定され、プローブ基板３に接着される。台座本体９の内部には接着剤８を収容する接着剤収容室９３が設けられ、接着面９２に開口部９４が開口している。接着剤収容室９３には、接着面９２側に設けられた開口部９４とは反対の側に開口している逃がし穴９５が設けられている。
A predetermined surface of the pedestal body 9 is set as the bonding surface 92 and bonded to the probe substrate 3 . An adhesive containing chamber 93 for containing the adhesive 8 is provided inside the pedestal main body 9 , and an opening 94 opens to the bonding surface 92 . The adhesive containing chamber 93 is provided with a release hole 95 that opens on the side opposite to the opening 94 provided on the adhesive surface 92 side.
この逃がし穴９５は、接着剤収容室９３に収容されている接着剤８が多量の場合に、台座本体９をプローブ基板３に押し付けた際に、接着剤８を吐出させるための開口である。
The escape hole 95 is an opening for discharging the adhesive 8 when the base body 9 is pressed against the probe board 3 when the adhesive 8 stored in the adhesive storage chamber 93 is large.
台座本体９をプローブ基板３に接着するには、図２に示すように、台座本体９の接着剤収容室９３に接着剤８を塗布し、台座本体９をプローブ基板３に押し付け、熱を加える。そして、接着面９２の上および接着剤収容室９３の中の接着剤８を硬化させることによって台座本体９をプローブ基板３に固定することができる。
In order to bond the pedestal body 9 to the probe board 3, as shown in FIG. 2, the adhesive 8 is applied to the adhesive storage chamber 93 of the pedestal body 9, the pedestal body 9 is pressed against the probe board 3, and heat is applied. . The pedestal body 9 can be fixed to the probe substrate 3 by curing the adhesive 8 on the adhesive surface 92 and in the adhesive storage chamber 93 .
ここで、接着剤収容室９３に塗布された接着剤８が多い場合には、台座本体９をプローブ基板３に押し付けた際に接着剤収容室９３内の余分な接着剤８が逃がし穴９５から押し出されることになる。この実施の形態１の場合には、逃がし穴９５から余分な接着剤８が押し出されることによって、接着面９２の横方向にはみ出す接着剤８の量がわずかになる。すなわち、フィレット９９の領域を小さくすることができる。
Here, if the amount of adhesive 8 applied to the adhesive storage chamber 93 is large, excess adhesive 8 in the adhesive storage chamber 93 will escape from the escape hole 95 when the pedestal body 9 is pressed against the probe board 3 . will be pushed out. In the case of the first embodiment, the excess adhesive 8 is pushed out from the relief hole 95, so that the amount of the adhesive 8 protruding in the lateral direction of the adhesive surface 92 is reduced. That is, the area of fillet 99 can be reduced.
これに対して、接着剤収容室９３および逃がし穴９５を備えていない台座本体９０の場合には、図３の比較例に示すように、台座本体９０の接着面に塗布された接着剤８は、接着の際に台座本体９０によって押し広げられ、フィレット９９の領域が大きく形成されることになる。
On the other hand, in the case of the pedestal body 90 that does not have the adhesive storage chamber 93 and the escape hole 95, as shown in the comparative example of FIG. , the fillet 99 is expanded by the pedestal body 90 at the time of adhesion, and the area of the fillet 99 is formed large.
なお、図２における逃がし穴９５を、接着剤８の注入孔として使用することもできる。この時も注入した接着剤８が溢れたとしても、溢れ出た接着剤８の拡がりを、台座本体９の逃がし穴９５に近い領域に留めることができる。
また、逃がし穴９５に対峙して障壁９６が設けられている。この障壁９６によって、逃がし穴９５から出た接着剤８が支柱１０に這い上ることを防ぐようにしている。 2 can also be used as an injection hole for theadhesive 8. As shown in FIG. At this time also, even if the injected adhesive 8 overflows, the spread of the overflowed adhesive 8 can be confined to a region near the relief hole 95 of the base body 9 .
Abarrier 96 is provided facing the escape hole 95 . This barrier 96 prevents the adhesive 8 coming out of the escape hole 95 from crawling up the column 10 .
また、逃がし穴９５に対峙して障壁９６が設けられている。この障壁９６によって、逃がし穴９５から出た接着剤８が支柱１０に這い上ることを防ぐようにしている。 2 can also be used as an injection hole for the
A
さらに、接着剤収容室９３の内壁面は、内側に膨らみを持った形状、すなわち開口部９４に絞り込み部９７を設けた形状とすることによって、硬化した接着剤８を接着剤収容室９３によって把持する構造とすることができる。
Furthermore, the inner wall surface of the adhesive storage chamber 93 is formed to have an inwardly bulging shape, that is, a shape in which the narrowed portion 97 is provided in the opening 94, so that the cured adhesive 8 is gripped by the adhesive storage chamber 93. It can be a structure that
また、接着剤収容室９３の内壁面は、逃がし穴９５に向けて傾斜している（逃がし穴９５の開口まで滑らかな斜面によって構成されている）。この傾斜面９８を接着剤８が上昇した場合、空気溜まりの発生を防ぐことができるため、減圧した環境で作業をする必要がないという効果を得ることができる。
In addition, the inner wall surface of the adhesive storage chamber 93 is inclined toward the relief hole 95 (it is composed of a smooth slope up to the opening of the relief hole 95). When the adhesive 8 rises on this inclined surface 98, it is possible to prevent the occurrence of air pockets, so that it is possible to obtain the effect that it is not necessary to work in a depressurized environment.
図４は、プローブ基板３の表面に設けられる複数の台座本体９の配置を示す構成図である。
図４に示すように、台座本体９は、プローブ基板３の中心から放射状にひかれた直線Ａと同心円Ｂとの交点に配置され、それぞれの台座本体９に加わる引っ張り力がほぼ同等になるように構成されている。 FIG. 4 is a configuration diagram showing the arrangement of a plurality ofpedestal bodies 9 provided on the surface of the probe board 3. As shown in FIG.
As shown in FIG. 4, thepedestal body 9 is arranged at the intersection of a straight line A drawn radially from the center of the probe board 3 and a concentric circle B so that the tensile forces applied to the respective pedestal bodies 9 are substantially equal. It is configured.
図４に示すように、台座本体９は、プローブ基板３の中心から放射状にひかれた直線Ａと同心円Ｂとの交点に配置され、それぞれの台座本体９に加わる引っ張り力がほぼ同等になるように構成されている。 FIG. 4 is a configuration diagram showing the arrangement of a plurality of
As shown in FIG. 4, the
図５は、台座本体９の一部を破断した斜視図である。
図５に示すように、台座本体９として、支柱１０を固定するためのねじ部９１、接着面９２、接着剤収容室９３、開口部９４、逃がし穴９５、障壁９６、絞り込み部９７、傾斜面９８を備えた金属の一体構造物として製作することができる。 FIG. 5 is a partially broken perspective view of thepedestal body 9. As shown in FIG.
As shown in FIG. 5, thepedestal body 9 includes a threaded portion 91 for fixing the support 10, an adhesive surface 92, an adhesive storage chamber 93, an opening 94, an escape hole 95, a barrier 96, a constricted portion 97, and an inclined surface. It can be fabricated as a monolithic structure of metal with 98.
図５に示すように、台座本体９として、支柱１０を固定するためのねじ部９１、接着面９２、接着剤収容室９３、開口部９４、逃がし穴９５、障壁９６、絞り込み部９７、傾斜面９８を備えた金属の一体構造物として製作することができる。 FIG. 5 is a partially broken perspective view of the
As shown in FIG. 5, the
実施の形態２
図６は、実施の形態２の台座本体９の一部を破断した斜視図である。この実施の形態２の台座本体９は、実施の形態１の台座本体９に比べて、障壁９６を取り除いたもので、接着剤８を適量に調整できる場合には、逃がし穴９５から溢れ出る接着剤８の量を調整できる。Embodiment 2
FIG. 6 is a partially broken perspective view of thepedestal body 9 of the second embodiment. The pedestal body 9 of the second embodiment has the barrier 96 removed from the pedestal body 9 of the first embodiment. The amount of agent 8 can be adjusted.
図６は、実施の形態２の台座本体９の一部を破断した斜視図である。この実施の形態２の台座本体９は、実施の形態１の台座本体９に比べて、障壁９６を取り除いたもので、接着剤８を適量に調整できる場合には、逃がし穴９５から溢れ出る接着剤８の量を調整できる。
FIG. 6 is a partially broken perspective view of the
実施の形態３
図７は、実施の形態３の台座本体９の一部を破断した斜視図である。この実施の形態３の台座本体９は、実施の形態２の台座本体９に比べて、より小型化にすることを狙ったもので、ねじ部９１を接着剤収容室９３の中に埋設したものである。この場合には、接着剤収容室９３の容量が小さくなることから、接着剤８の使用量を少なくできるという効果を得ることができる。Embodiment 3
FIG. 7 is a partially broken perspective view of thepedestal body 9 of the third embodiment. The pedestal body 9 of the third embodiment is intended to be more compact than the pedestal body 9 of the second embodiment, and the threaded portion 91 is embedded in the adhesive accommodating chamber 93. is. In this case, since the capacity of the adhesive storage chamber 93 is reduced, the effect that the amount of the adhesive 8 used can be reduced can be obtained.
図７は、実施の形態３の台座本体９の一部を破断した斜視図である。この実施の形態３の台座本体９は、実施の形態２の台座本体９に比べて、より小型化にすることを狙ったもので、ねじ部９１を接着剤収容室９３の中に埋設したものである。この場合には、接着剤収容室９３の容量が小さくなることから、接着剤８の使用量を少なくできるという効果を得ることができる。
FIG. 7 is a partially broken perspective view of the
実施の形態４
図８は、実施の形態４の台座本体９の断面図である。この実施の形態４の台座本体９は、実施の形態１の台座本体９に比べて、ねじ部９１が雌ねじであったのを、雄ねじにしたものである。同時に、支柱１０のねじを、雌ねじにしている。
この実施の形態４のように、台座本体９のねじ部９１を雄ねじにすることによって、接着剤８がねじ部９１に付着した場合の対処作業が容易になるという効果を得ることができる。Embodiment 4
FIG. 8 is a cross-sectional view of thepedestal body 9 of Embodiment 4. As shown in FIG. In the pedestal body 9 of the fourth embodiment, unlike the pedestal body 9 of the first embodiment, the threaded portion 91 is changed from a female thread to a male thread. At the same time, the posts 10 are internally threaded.
By making the threadedportion 91 of the pedestal main body 9 male-threaded as in the fourth embodiment, it is possible to obtain the effect of facilitating the handling work when the adhesive 8 adheres to the threaded portion 91 .
図８は、実施の形態４の台座本体９の断面図である。この実施の形態４の台座本体９は、実施の形態１の台座本体９に比べて、ねじ部９１が雌ねじであったのを、雄ねじにしたものである。同時に、支柱１０のねじを、雌ねじにしている。
この実施の形態４のように、台座本体９のねじ部９１を雄ねじにすることによって、接着剤８がねじ部９１に付着した場合の対処作業が容易になるという効果を得ることができる。
FIG. 8 is a cross-sectional view of the
By making the threaded
本願は、例示的な実施の形態が記載されているが、実施の形態に記載された様々な特徴、態様、及び機能は特定の実施の形態の適用に限られるのではなく、単独で、または様々な組み合わせで実施の形態に適用可能である。
従って、例示されていない無数の変形例が、本願明細書に開示される技術の範囲内において想定される。例えば、少なくとも１つの構成要素を変形する場合、追加する場合または省略する場合が含まれるものとする。 Although the present application has described exemplary embodiments, the various features, aspects, and functions described in the embodiments are not limited to application of particular embodiments, alone or Various combinations are applicable to the embodiments.
Accordingly, numerous variations not illustrated are envisioned within the scope of the technology disclosed herein. For example, the modification, addition, or omission of at least one component shall be included.
従って、例示されていない無数の変形例が、本願明細書に開示される技術の範囲内において想定される。例えば、少なくとも１つの構成要素を変形する場合、追加する場合または省略する場合が含まれるものとする。 Although the present application has described exemplary embodiments, the various features, aspects, and functions described in the embodiments are not limited to application of particular embodiments, alone or Various combinations are applicable to the embodiments.
Accordingly, numerous variations not illustrated are envisioned within the scope of the technology disclosed herein. For example, the modification, addition, or omission of at least one component shall be included.
１ プローブカード用基板、２ プローブ、３ プローブ基板、４ 配線基板、５ 補強板、６ 接続装置、７ 中継ピン、８ 接着剤、９ 台座本体、１０ 支柱、１１ 頭部、３１ 電極、４１ 電極、９０ 台座本体、９１ ねじ部、９２ 接着面、９３ 接着剤収容室、９４ 開口部、９５ 逃がし穴、９６ 障壁、９７ 絞り込み部、９８ 傾斜面、９９ フィレット
1 Probe card board, 2 Probe, 3 Probe board, 4 Wiring board, 5 Reinforcement plate, 6 Connection device, 7 Relay pin, 8 Adhesive, 9 Base body, 10 Support, 11 Head, 31 Electrode, 41 Electrode, 90 Pedestal main body, 91 Screw part, 92 Adhesive surface, 93 Adhesive storage chamber, 94 Opening, 95 Escape hole, 96 Barrier, 97 Squeezing part, 98 Inclined surface, 99 Fillet
Claims (7)
- 基板に接着される台座本体の予め定められた面に設定された接着面、前記台座本体の内部に設けられ前記接着面に開口部を有し、接着剤が収容される接着剤収容室、および前記接着剤収容室に設けられ前記接着面とは反対の方向に開口して、前記接着剤を吐出し得る逃がし穴を備えたことを特徴とするプローブカード基板用接続台座。 an adhesive surface set on a predetermined surface of a pedestal body to be adhered to a substrate; an adhesive storage chamber provided inside the pedestal body and having an opening in the adhesive surface for accommodating an adhesive; A connecting pedestal for a probe card board, comprising a relief hole which is provided in the adhesive storage chamber and opens in a direction opposite to the adhesive surface to allow the adhesive to be discharged.
- 前記逃がし穴の開口の外側に間隙を有して前記逃がし穴に対向する障壁を備えたことを特徴とする請求項１に記載のプローブカード基板用接続台座。 The probe card board connection pedestal according to claim 1, further comprising a barrier facing the escape hole with a gap outside the opening of the escape hole.
- 前記接着剤収容室の前記開口部の壁面が内側に拡大している形状であることを特徴とする請求項１または２に記載のプローブカード基板用接続台座。 The connection base for probe card board according to claim 1 or 2, characterized in that the wall surface of the opening of the adhesive containing chamber is shaped so as to expand inward.
- 前記接着剤収容室の内壁面が前記逃がし穴の開口に向かって傾斜していることを特徴とする請求項１から３のいずれか１項に記載のプローブカード基板用接続台座。 The connection pedestal for probe card board according to any one of claims 1 to 3, characterized in that the inner wall surface of the adhesive containing chamber is inclined toward the opening of the relief hole.
- 前記台座本体の前記接着面とは反対の面に支柱に結合されるねじ部が設けられていることを特徴とする請求項１から４のいずれか１項に記載のプローブカード基板用接続台座。 The connecting pedestal for a probe card board according to any one of claims 1 to 4, characterized in that a threaded portion coupled to the support is provided on the surface of the pedestal main body opposite to the adhesive surface.
- 前記ねじ部が雌ねじであることを特徴とする請求項５に記載のプローブカード基板用接続台座。 The connection pedestal for probe card board according to claim 5, characterized in that the screw portion is a female screw.
- 前記ねじ部が雄ねじであることを特徴とする請求項５に記載のプローブカード基板用接続台座。 The connection pedestal for probe card board according to claim 5, characterized in that the screw portion is a male screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/046781 WO2023112315A1 (en) | 2021-12-17 | 2021-12-17 | Probe card substrate connection base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/046781 WO2023112315A1 (en) | 2021-12-17 | 2021-12-17 | Probe card substrate connection base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2023112315A1 true WO2023112315A1 (en) | 2023-06-22 |
Family
ID=86773949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2021/046781 WO2023112315A1 (en) | 2021-12-17 | 2021-12-17 | Probe card substrate connection base |
Country Status (1)
| Country | Link |
|---|---|
| WO (1) | WO2023112315A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030159U (en) * | 1973-07-14 | 1975-04-04 | ||
| US20100237887A1 (en) * | 2009-02-19 | 2010-09-23 | Touchdown Technologies, Inc. | Microelectronic contactor assembly, structures thereof, and methods of constructing same |
| JP2011141263A (en) * | 2010-01-08 | 2011-07-21 | Samsung Electro-Mechanics Co Ltd | Probe card |
| JP2011154017A (en) * | 2010-01-26 | 2011-08-11 | Samsung Electro-Mechanics Co Ltd | Level adjustment member and probe card with the same |
| JP2013167461A (en) * | 2012-02-14 | 2013-08-29 | Micronics Japan Co Ltd | Electrical connection device and its assembling method |
| WO2015015224A1 (en) * | 2013-08-02 | 2015-02-05 | Colin Leslie Hearl Wood | Fixings |
-
2021
- 2021-12-17 WO PCT/JP2021/046781 patent/WO2023112315A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5030159U (en) * | 1973-07-14 | 1975-04-04 | ||
| US20100237887A1 (en) * | 2009-02-19 | 2010-09-23 | Touchdown Technologies, Inc. | Microelectronic contactor assembly, structures thereof, and methods of constructing same |
| JP2011141263A (en) * | 2010-01-08 | 2011-07-21 | Samsung Electro-Mechanics Co Ltd | Probe card |
| JP2011154017A (en) * | 2010-01-26 | 2011-08-11 | Samsung Electro-Mechanics Co Ltd | Level adjustment member and probe card with the same |
| JP2013167461A (en) * | 2012-02-14 | 2013-08-29 | Micronics Japan Co Ltd | Electrical connection device and its assembling method |
| WO2015015224A1 (en) * | 2013-08-02 | 2015-02-05 | Colin Leslie Hearl Wood | Fixings |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100845725B1 (en) | Semiconductor device and fabrication method thereof | |
| US20080197470A1 (en) | Stacked electronic component and manufacturing method thereof | |
| JP6179503B2 (en) | Assembled battery | |
| US20090096083A1 (en) | Connecting structure for connecting at least one semiconductor component to a power semiconductor module | |
| CN101359638B (en) | Electronic device, method of producing the same, and semiconductor device | |
| WO2023112315A1 (en) | Probe card substrate connection base | |
| JP2001237572A (en) | Printed board reinforcing structure | |
| JP6946837B2 (en) | Battery pack | |
| US20080272488A1 (en) | Semiconductor Device | |
| JP5028968B2 (en) | Semiconductor device, stacked semiconductor device, and interposer substrate | |
| KR100962085B1 (en) | Double Flange Insert Structure for Mechanical Fastening of Sandwich Panels | |
| US6979782B1 (en) | Apparatus and method for mechanical coupling of land grid array applications | |
| US8524530B2 (en) | Flexible semiconductor package and method for fabricating the same | |
| JP6515047B2 (en) | Semiconductor device and method of manufacturing the same | |
| US20020063324A1 (en) | Semiconductor device, method of fabricating same, semiconductor device package construction, and method of mounting the semiconductor device | |
| CN1469697A (en) | Method of fixing IC package onto circuit board | |
| US6021671A (en) | Acceleration sensor including an acceleration detection element bonded to a circuit substrate with a conductive bonding material | |
| JP2019046825A (en) | Semiconductor device | |
| US6932621B2 (en) | Connector interface pad for structurally integrated wiring | |
| JP7433358B2 (en) | Fastening structure, spacer, board unit and electronic device | |
| JP2009260389A (en) | Semiconductor device | |
| JP2019161129A (en) | Circuit module | |
| JP2005149849A (en) | Fuel cell stack | |
| CN102394181A (en) | Matrix type super capacitor | |
| JP2023155728A (en) | Circuit module and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 21968228 Country of ref document: EP Kind code of ref document: A1 |