JP2011109040A5 - - Google Patents

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Publication number
JP2011109040A5
JP2011109040A5 JP2009265502A JP2009265502A JP2011109040A5 JP 2011109040 A5 JP2011109040 A5 JP 2011109040A5 JP 2009265502 A JP2009265502 A JP 2009265502A JP 2009265502 A JP2009265502 A JP 2009265502A JP 2011109040 A5 JP2011109040 A5 JP 2011109040A5
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JP
Japan
Prior art keywords
semiconductor substrate
substrate holder
detection device
temperature detection
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009265502A
Other languages
English (en)
Japanese (ja)
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JP2011109040A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009265502A priority Critical patent/JP2011109040A/ja
Priority claimed from JP2009265502A external-priority patent/JP2011109040A/ja
Publication of JP2011109040A publication Critical patent/JP2011109040A/ja
Publication of JP2011109040A5 publication Critical patent/JP2011109040A5/ja
Pending legal-status Critical Current

Links

JP2009265502A 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置 Pending JP2011109040A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009265502A JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009265502A JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

Publications (2)

Publication Number Publication Date
JP2011109040A JP2011109040A (ja) 2011-06-02
JP2011109040A5 true JP2011109040A5 (cg-RX-API-DMAC10.html) 2013-02-14

Family

ID=44232171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009265502A Pending JP2011109040A (ja) 2009-11-20 2009-11-20 半導体基板ホルダ及び温度検出装置

Country Status (1)

Country Link
JP (1) JP2011109040A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5824886B2 (ja) * 2011-06-07 2015-12-02 株式会社ニコン 基板貼り合わせ方法および温度検出装置
CN104364888B (zh) 2012-05-28 2017-02-22 株式会社日立国际电气 基板处理装置、温度计测系统、处理装置的温度计测方法、输送装置以及记录介质
JP5959111B2 (ja) * 2013-03-21 2016-08-02 Ｓｅｍｉｔｅｃ株式会社 熱流センサ
JP7052770B2 (ja) * 2019-04-15 2022-04-12 株式会社Sumco 評価体、評価システム、評価体の製造方法、および評価方法
DE102020007791A1 (de) 2020-12-18 2022-06-23 Att Advanced Temperature Test Systems Gmbh Modulares Wafer-Chuck-System

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249911B2 (ja) * 1996-01-08 2002-01-28 東京エレクトロン株式会社 温度測定装置、処理装置及び処理方法
JP2000091390A (ja) * 1998-09-14 2000-03-31 Tokyo Electron Ltd ウエハ一括試験装置
JP2004251789A (ja) * 2003-02-20 2004-09-09 Komatsu Ltd 温度測定装置及び被処理基板

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