JP2011107588A - Camera module and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure of a camera module manufactured by a wafer process, which has an external light-shielding part for preventing flares from occurring in the camera module, wherein the external light-shielding part is manufactured easily in its manufacturing process without requiring manpower and labor hours during its manufacturing process, and also to provide a method of manufacturing the structure. <P>SOLUTION: In the camera module configured by piling up at least one lens on a solid-state imaging element via a spacer at least the inner wall of the spacer is covered with a shielding layer consisting of an electroless plating layer, or at least a peripheral portion of a lens element in the lens is covered with the shielding layer. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a camera module, and more particularly, to an external light shielding technique for a camera module mounted on a mobile phone.

  It is common practice to attach a camera to a mobile phone. The camera is built into a mobile phone as a camera module that uses a charge coupled (CCD) or complementary oxide semiconductor (C-M0S) solid-state image sensor for the camera body, and other lenses. ing.

  As shown in FIG. 5, there are two cameras that are mounted on the mobile phone 40. The first camera 41 is a high-definition camera having about 5 to 10 million pixels, and is not much different from a normal camera. The second camera 42 is a video dedicated camera having about 100,000 to 300,000 pixels, and is mainly a videophone camera. By operating the input button 43, the caller himself / herself or the other party's face can be shown on the display screen 44.

  As shown in FIG. 6, the conventional camera module is a camera module 50 including a solid-state image sensor 51 and about two to three lenses 52a and 52b, and is entirely supported by a camera frame 53 made of synthetic resin. ing. The camera frame 53 is colored black to block light from the surroundings. A color separation color filter and a condensing microlens are formed for each pixel on the light receiving element surface of the solid-state imaging element 51, but are too small to be shown in FIG. Further, the cover glass 54 protects the surface.

  As shown in FIG. 6, the solid-state image sensor 51 of the camera module 50 is electrically connected by an electrode of a conductive layer 56 of a printed circuit board 55, a wire bond ink, a pole grid array (hereinafter referred to as BGA) system, or the like. The image information converted into electrical signals is taken out.

  However, since the camera module 50 as shown in FIG. 6 uses a camera frame 53 made of synthetic resin, there is a problem that it is difficult to perform automatic mounting by the reflow method. Furthermore, it is inevitable that the printed circuit board 55 is bulky in the vertical direction due to the thickness of the printed circuit board 55 itself. This has hindered the reduction in thickness and weight of mobile phones.

  Therefore, a structure that can be manufactured by a wafer process has been proposed for the purpose of reducing the size and thickness of the camera module. The camera module 60 shown in FIG. 7 is an example. In FIG. 7, a silicon substrate 1 that is a solid-state image sensor has a color separation color filter 16 and a light condensing microlens 17 formed for each pixel on the light receiving element surface on the upper surface thereof. The electrical signal of the image information obtained by the solid-state imaging device is guided to the back surface of the silicon substrate 1 by the conductive material 2 that fills or covers the inner wall of the through-silicon via, and is patterned with the insulating layer 3 and the conductive layer. 4 enables connection to an external circuit at the connection terminal 5 by the BGA method.

Above the silicon substrate 1, a sealing glass plate 7 is bonded through a frame wall 6 to make the light receiving region airtight. Although the thickness of the frame mold 6 is exaggerated in the figure, it is as thin as about 50 μm. On the sealing glass plate 7, lens elements 9a and 9b made of transparent resin are formed on the front and back surfaces of the first lens base 9 via a first spacer 8 made of glass. Repeat. Further, a second lens body 15 formed by forming lens elements 11a and 11b made of a transparent resin is placed on the front and back surfaces of the second lens base 11 through a second spacer 12 made of glass. In the illustrated example, the first lens body 14 is a concave lens, and the second lens body 15 is a convex lens. A lens element made of a transparent resin is produced by a fine molding method or a photolithography method. Finally, the cover glass plate 13 is bonded through the third spacer 12. The cover glass plate 13 often serves also as an infrared cut glass.

  The camera module 60 shown in FIG. 7 shows only one product. However, in the actual manufacturing process, a processing process for a glass plate having a diameter of 20 to 30 cm is combined with a processing process for a silicon wafer having a diameter of 20 to 30 cm. Literally manufactured by a wafer process, and finally cut individually in a dicing process to form one camera module. In the camera module 60 of FIG. 7, if it is a second camera to be mounted on a mobile phone, the size of the silicon substrate 1 is only about 3 mm square, so 1,500 to 2,800 from a single wafer of 20 cm in diameter. About one can be taken.

However, the camera module 60 of FIG. 7 also has a problem to be solved. The reason is that the spacers 8, 10 and 12 and the lens bases 9 and 11 stacked on the silicon substrate 1 are made of glass or plastic, so that the wafer process has sufficient strength to circulate. Means that the thickness is required to be about 0.4 mm. Therefore, the height of the lens part of the camera module 60 is considerably high, and because glass and plastic are translucent,
There is a drawback that external light is incident from the side surface of the laminate.

  When a light beam is incident on the camera module from an oblique direction, the light beam induces flare and fogging. This is a phenomenon in which white blurring or an unnecessary light image is generated on a so-called shooting screen. As a countermeasure against flare to prevent this, as shown in FIG. 8, it can be proposed to attach a metal shielding barrel 18 that blocks light from the side surface to the camera module 60.

  However, as mentioned above, the size of the silicon substrate 1 of the camera module is about 3 mm square, and it is a mechanical means to manually attach a cylindrical shield to such a small object. However, it is not only troublesome in terms of process but also extremely difficult in terms of work. Even if 2.000 wafers can be made per wafer in the wafer process, flare prevention measures become a bottleneck in the process, preventing mass production as a camera module and reducing costs.

JP 2008-124919 A

  The present invention is a flare prevention measure for a camera module manufactured by the wafer process described above, and includes an external light shielding unit that can be easily manufactured in a manufacturing process without requiring manual labor or labor. A structure of a camera module and a manufacturing method thereof are provided.

  In order to achieve the above object, the invention according to claim 1 is a camera module in which at least one lens body is laminated on a solid-state image sensor via a spacer. The camera module is characterized by being covered with a light shielding layer of a plating layer.

The invention described in claim 2 is the camera module according to claim 1, wherein the light shielding layer is made of black colored resin instead of the light shielding layer of the electroless plating layer.

  The invention according to claim 3 is the camera module according to claim 1 or 2, wherein at least one of the lower surface or the upper surface of the light shielding layer has low light reflectivity.

  According to a fourth aspect of the present invention, in a camera module in which at least one lens body is laminated on a solid-state imaging device via a spacer, at least a peripheral portion of the lens element of the lens body is covered with a light shielding layer. The camera module is characterized by that.

  The invention described in claim 5 is characterized in that the light-shielding layer covering the periphery of the lens element is a light-shielding layer obtained by photo-curing and heat-fixing a coating film of a black colored photosensitive resin composition. The camera module according to 4 is used.

The invention according to claim 6
The camera module manufacturing method includes the following steps (a) to (e).
(a) a step of preparing a solid-state imaging device having multiple faces on a wafer in a wafer process;
(b) creating a spacer having a large number of openings corresponding to the light receiving surface of the solid-state imaging device by etching a glass wafer;
(c) a step of covering at least the inner wall of the opening of the spacer with a light shielding layer;
(d) a step of creating a lens module having a plurality of surfaces by laminating at least one lens structure on the top surface of the solid-state imaging element having the plurality of surfaces through the spacer;
(e) After that, the process of cutting along the cutting lines between the multi-faceted camera modules and separating them into individual camera modules.

  The invention described in claim 7 is the method for manufacturing a camera module according to claim 6, wherein the light shielding film is a light shielding film formed by an electroless plating method.

  The invention according to claim 8 is the method for manufacturing a camera module according to claim 6, wherein the light shielding film is a light shielding film formed by application of a black colored resin.

The invention described in claim 9
The camera module manufacturing method includes the following steps (a) to (e).
(a) a step of preparing a solid-state imaging device having multiple faces on a wafer in a wafer process;
(b) creating a spacer having a large number of openings corresponding to the light receiving surface of the solid-state imaging device by etching a glass wafer;
(c) a step of forming a lens structure in which a large number of lens elements are formed on a lens substrate, and at least the periphery of the lens element is covered with a light shielding layer;
(d) A step of creating a multifaceted lens module by laminating at least one lens structure produced in step (c) on the top surface of the multifaceted solid-state imaging device via the spacer. ,
(e) After that, the process of cutting along the cutting lines between the multi-faceted camera modules and separating them into individual camera modules.

  The invention described in claim 10 is characterized in that the light-shielding layer covering the periphery of the lens element is a light-shielding layer obtained by photocuring a black colored photosensitive resin coating and heat-fixing. This is a manufacturing method of the camera module described.

The present invention is a camera module that eliminates the need for a shielding lens barrel for preventing flare, and is a countermeasure for preventing flare in a camera module manufactured by a wafer process. A similar wafer process can be employed in the manufacturing process.
Therefore, it is possible to provide a camera module structure and a method for manufacturing the same that can be easily manufactured in a process without requiring manual labor or labor. The manufacturing process is suitable for mass production and contributes to cost reduction.

It is a figure of the cross-sectional view of the camera module provided with the light shielding film which becomes this invention. It is process drawing of the cross-sectional view explaining typically an example of the process of forming a light shielding layer in this spacer connection body and this connection body. (a)-(e) is a part of figure of the cross-sectional view which illustrates typically an example of the camera module manufacturing process which becomes this invention. (f)-(g) is a part of figure of the cross-sectional view which illustrates typically an example of the camera module manufacturing process which becomes this invention. It is a schematic diagram explaining a camera module being mounted on a mobile phone. It is a figure of the cross-sectional view explaining the structure of the conventional camera module. It is sectional drawing of the conventional camera module manufactured by a wafer process. It is sectional drawing of the conventional camera module provided with the shielding lens-barrel. In another configuration example of the camera module according to the present invention, a light shielding layer is formed on a part of a spacer and a lens body. It is process drawing which illustrates typically the method of coat | covering the week edge part of a lens element with a light shielding layer.

A camera module according to an embodiment of the present invention will be described below with reference to FIG.
The camera module 60 according to the present invention shown in FIG. 1 is provided with a light shielding layer 61 by electroless plating for preventing flare on the inner walls of the spacers 8, 10, 12. The material is a single plating layer of a metal selected from nickel, chromium, cobalt, iron, copper, gold, etc., as well as an alloy selected from a combination of nickel-iron, cobalt-iron, copper-iron, etc. An electroplating layer is mentioned. In addition, a metal such as copper is electrolessly plated, and then the surface thereof is chemically or oxidized to form a metal compound to form a metal light-shielding layer having a low light reflectance on the surface.

  The light shielding layer 61 formed by electroless plating preferably has a high light shielding performance of 2.0 or more by a Macbeth densitometer. In this sense, it is convenient to use a metal as the light shielding layer 61. In FIG. 1, the thickness of the light shielding layer 61 is exaggerated. For a metal plating layer that is normally used, a thickness of 0.1 to 1.0 μm is sufficient to achieve a concentration of 2.0 or more.

  Further, the light shielding layer 61 on the inner wall of the camera module 60 of the present invention can be formed by applying a black paint by a spray coating method or a dipping method. The light shielding film 61 made of a paint is convenient because its front and back surfaces are often low in light reflection. The thickness of the light shielding layer 61 by such a coating method is about 2.0 to 50 μm.

  In the embodiment shown in FIG. 1, the light shielding layer 61 is formed not only on the inner walls of the spacers 8, 10, 12 but also on the upper and lower surfaces thereof. The reason for this is that, from the manufacturing method to be described later, this form is natural and easy to make, and the other is that the upper and lower surfaces of the spacer have a light shielding layer to block incident light from an oblique direction. It is effective and is preferable for preventing flare.

  A method for manufacturing a camera module according to the present invention will be described below in detail with reference to FIGS.

  The material glass plate 21 shown in FIG. 2 (a) serves as a matrix of the spacer, and the material thereof is, for example, borosilicate glass, alumina silicate glass, soda lime glass, or the like. Its size is the same diameter as the silicon wafer for producing the solid-state imaging device, for example, 20 to 30 cm. Its thickness is about 0.4 mm to 2.0 mm. If the thickness is less than 0.4 mm, the material is not robust and cannot be applied to the wafer process processing and manufacturing apparatus, so this thickness is the lower limit. The upper limit is determined in consideration of the relationship with the thickness of the lens element to be applied in a later process and the lens design for ensuring the required optical path length. However, in order to make the camera module of the present invention as thin as possible, the thickness of the material glass plate 21 should be as thin as possible.

  A hydrofluoric acid resistant resist film 22a, 22b is formed in a pattern on both surfaces of the glass plate 21. When the resist films 22a and 22b are viewed from above, a lattice pattern is formed. The shape and size of this lattice pattern are actually the same size as the size and bitch of a solid-state imaging device formed in a separate process on a silicon wafer.

  As the resist films 22a and 22b, a commercially available hydrofluoric acid-resistant photosensitive resin can be used. If a photosensitive resin is used, resist films 22a and 22b having a desired pattern can be formed on both surfaces of the glass plate 21 by a series of photolithography processes including coating, pattern exposure, development, and heat fixing. In addition to this organic photosensitive resin, the lower side is supplemented with a patterned thin film of metal nickel, silver, chrome, etc. to make a double layer of a metal layer and a photosensitive resin. It is also practical to do.

  Next, the glass plate 21 is wet-etched with a hydrofluoric acid-based etchant. The hydrofluoric acid-based etching solution is preferably hydrofluoric acid + ammonium fluoride or a mixed system of hydrofluoric acid and sulfuric acid, hydrochloric acid, phosphoric acid, or ammonium salt, rather than hydrofluoric acid alone. Compared to hydrofluoric acid alone, the etching rate is increased and the smoothness of the etched surface is improved. In any case, it is used in an aqueous solution. FIG. 2B shows a state after the etching is finished. The portions where the resist films 22a and 22b are not provided are dissolved, and the openings 23 are formed.

  Next, as shown in FIG. 2C, the resist films 22a and 22b are peeled off by contacting with an alkaline aqueous solution such as caustic soda, caustic potash or sodium carbonate. What is completed is a lattice-patterned spacer continuous body 24 having a plurality of openings by etching, and a portion where the original thickness of the material glass plate 21 is maintained becomes a spacer.

  Next, the light shielding layer 25 is formed on the entire surface of the spacer continuous body 24. As a means for forming the light shielding layer 25, there are an electroless plating method and a black colored resin coating method.

  The light shielding layer 25 preferably has a high light shielding performance of 2.0 or more with a Macbeth densitometer, and it is convenient to use a metal film as the light shielding layer 25 in this sense. In FIG. 2 (d), the thickness of the light shielding layer 25 by electroless plating is exaggerated. For a metal plating layer that is normally used, a thickness of 0.1 to 1.0 μm is sufficient to achieve a concentration of 2.0 or more.

  The electroless plating can be described basically using a conventionally known metal electroless plating method and alloy electroless plating method. A series of steps of electroless plating method, that is, cleaning, degreasing, sensitization, activation, and plating operation are performed.

  However, since the camera module according to the present invention is incorporated into a mobile phone or the like by post-processing, it is desirable that the metal light shielding layer by electroless plating on the inner surface is attached to the inner surface with a strong adhesive force. Therefore, it is desirable to select a plating method having high adhesive strength to the glass surface as the electroless plating method. As an example, in the case of nickel electroless plating, after degreasing treatment, sensitization treatment, activation treatment, treatment with an aqueous solution of an alkali metal salt of hypophosphorous acid such as sodium hypophosphite or potassium hypophosphite. It is possible to perform this operation of electroless plating after it has been performed.

  By performing electroless plating, a light shielding film 25 by electroless plating of metal or alloy is formed on the entire surface of the spacer continuous body 24 as shown in FIG.

  The light shielding layer 25 can also be formed by applying a black paint by spray coating or dipping. The light shielding layer 25 made of a paint often has a low light reflection property on its front and back surfaces. As the black paint, a black colored photosensitive resin composition obtained by adding a black pigment or dye to the photosensitive resin composition liquid may be used. The thickness of the light shielding layer 25 by such a coating method is about 2.0 to 20 μm.

  Subsequently, a process of completing a camera module by combining a solid-state imaging device and a lens body will be described with reference to FIGS.

  As described above, this step can be continuously performed by a wafer process. That is, as shown in FIG. 3A, a large number of solid-state imaging elements 31 are formed on a silicon wafer 30 having a diameter of 20 to 30 cm. In general, a color filter for color separation, a microlens for condensing light to the light receiving unit, and the like are formed on the light receiving surface of each solid-state imaging device 31, and a BGA as an external connection terminal is provided on the back surface of the wafer. However, these are too small for illustration. A frame wall 32 is formed on the surface of each solid-state imaging device 31 so as to surround the periphery. Although the thickness of the frame wall 32 is exaggerated in the figure, it is as thin as about 50 μm.

  Next, as shown in FIG. 3B, a sealing glass plate 33 is attached to the frame wall 32. The sealing glass plate 33 is a glass plate having the same diameter as that of the silicon wafer 30. The frame wall 32 is a material having an adhesive property with the sealing glass plate 33.

  Next, as shown in FIG. 3C, the first spacer continuous body 34 prepared in advance is aligned and attached to the upper surface of the sealing glass plate 33. As described with reference to FIG. 2, the first spacer continuous body 34 is provided with a light shielding layer on the entire surface. However, in the scale of FIG. 3, the light shielding layer is too thin and is simply indicated by a thick line in FIG.

  Although the explanation has been made before and after the bonding, an adhesive is applied to the lower surface of the first spacer continuous body 34 to a thickness of about 5 to 10 μm by roll coating. According to the roll coating method, it can be selectively applied to the lower surface of the first spacer continuous body 34. Even if a part of the adhesive reaches the inner wall of the opening 35, there is no particular problem in practice as long as it is a small amount and does not block incident light. The same applies to the second and third spacer connecting bodies thereafter.

  Next, as shown in FIG. 3D, the first lens structure 36 is laminated on the upper surface of the first spacer continuous body 34. For the lamination, an adhesive is applied in advance on the upper surface of the first spacer continuous body 34 by a roll coating method. The thickness is about 5 to 10 μm, which is the same as described in FIG. The first lens structure 36 is a concave lens.

Next, as shown in FIG. 3 (e), the second spacer structure 37 and the second lens structure 38 are laminated and bonded onto the first lens structure 36. The second spacer continuous body 37 mediates the lamination adhesion as in the first spacer continuous body 34 described above. Subsequently, as shown in FIG. 4 (f), the third spacer connecting body 39 and the cover glass plate 13 are laminated and bonded onto the second lens structure 38. The state shown in FIG. 4F is a state in which lens bodies and transparent glass plates are stacked on a multi-layer floor on a silicon wafer 30, and a camera module is manufactured with multiple faces.

  Finally, in order to separate each camera module individually, it is cut from the top to the bottom by a dicing apparatus. Incidentally, the cutting line to be cut corresponds to the center line of the lattice pattern of the spacer continuous bodies 34, 37, 39, and the camera module 60 shown in FIG. 4G is obtained by cutting. An enlarged version of this is nothing but the camera module 60 shown in FIG.

  There can still be several variations on the present invention. For example, in the example of FIG. 9, a camera module in which not only the light shielding layer 61 is applied to the spacers 8, 10, and 12 but also the light shielding film 62 is formed on necessary portions of the first lens body 14 and the second lens body 15. It is. In the example of FIG. 9, the light shielding layer 62 is formed up to the periphery of the lens elements of the lens bodies 14 and 15 so as to increase the effect of preventing flare. A lens body having the light-shielding film 62 having such specifications can be manufactured by the process shown in FIGS.

  That is, as shown in FIG. 10A, a lens body 90 in which a large number of lens elements 92a and 92b made of transparent resin are formed on both surfaces of a glass lens base 91 is prepared. Next, a black colored photosensitive resin composition is applied to the surface of the lens body 90 to form a photosensitive black layer 93. The black colored photosensitive resin composition used here is a photosensitive resin in which a pigment is dispersed or a dye is added. For example, a dye or a pigment coloring material, a relatively low molecular weight solvent-soluble resin, photopolymerizable It consists of a monomer or oligomer, a photopolymerization initiator and a solvent.

  Next, as shown in FIG. 9 (c), parallel light 95 is irradiated through an exposure mask 94. The exposure mask 94 is provided with a light-shielding film 96 in a desired pattern so that light 95 is not exposed to an area where the photosensitive black layer 93 is to be removed. As described above, the black colored photosensitive resin composition is a negative photosensitive resin, and only the portion that is exposed to light is photocured.

  Next, as shown in FIG. 10 (d), only the photocured region is left by development using a solvent or an alkaline aqueous solution, and then a heat fixing process is performed to form the light shielding layer 97. The shape of the heat-shielded light-shielding layer 97 is no longer affected by the exposure or development process. Therefore, from the state shown in FIG. 10D, a light shielding film can be formed on the back surface of the lens base 91 by applying the same process as described above. Thus, a lens structure 38 in which a large number of lens bodies 15 used in the camera module shown in FIG.

  Specific examples of the present invention will be described below. The composition ratios in the examples are mass ratios unless otherwise specified.

(1) Fabrication of spacer continuous body For an alumina borosilicate glass wafer having a thickness of 0.5 mm and a diameter of 20 cm (Zn0 21%, Al ₂ O ₃ 5%, B ₂ O ₃ 40%, SiO ₂ 14%) Then, a 200 nm thick metal chromium layer was formed on both surfaces by sputtering, and an acrylic-epoxy photosensitive resin was applied to a thickness of 2 μm, and pattern exposure was performed with both surfaces aligned, and development and heat fixing were performed. The shape of the resist film is a lattice pattern, and the shape and pitch are matched with the shape and pitch of a solid-state image sensor formed on a silicon wafer. With this resist film, the lower metal chromium layer was etched to form a double-layer corrosion-resistant film made of metal chromium and a resist film. The shape of the corrosion-resistant film is a lattice-like pattern in which etching openings are to be formed when viewed from above.

Next, glass etching was performed by a dipping method at room temperature using a mixed etching solution of 10% hydrofluoric acid and 10% NH ₄ OH. Etching recesses were formed from both sides of the glass wafer and communicated to form openings. The resist film and the chromium layer were dissolved and removed to obtain a spacer continuous body 24 shown in FIG.

Next, the spacer assembly which has been degreased and washed with water is immersed in an aqueous solution (25 ° C.) in which 5 g of stannic chloride and 5 ml of 35 wt% hydrochloric acid are dissolved in 1 liter of water for 4 minutes, and is sensitized. After rinsing with running water for 10 seconds, an activation treatment was performed by immersing in an aqueous solution in which 0.1 g of palladium chloride (PdCl ₂ ) and 0.2 ml of hydrochloric acid were dissolved in 1 liter of water at room temperature for 4 minutes. After washing with water, a product name “Schuma S-680” manufactured by Nippon Kanzen Co., Ltd. was used as the electroless nickel plating solution, and the electroless plating was performed by dipping at a liquid temperature of 50 ° C. for 10 minutes. After washing with water, hot air drying was performed at 80 ° C. for 30 seconds to obtain a spacer continuous body 24 in which an electroless plating layer was applied to the entire surface. This electroless plating layer of nickel had a value of 5.0 ± 0.5 with a Macbeth densitometer, and its adhesive strength was satisfactory.

(2) Assembling of Camera Module A description will be given based on FIGS. 3 (a) to 3 (e) and FIGS. 4 (f) to 4 (g). A silicon wafer having a thickness of 0.25 mm and a diameter of 20 cm prepared with a large number of solid-state imaging elements 31 shown in FIG. A sealing glass plate 33 having a thickness of 0.4 mm and a diameter of 20 cm was bonded to the upper surface by using the frame wall 32 provided on the upper surface of the solid-state imaging device 31 instead of the spacer / adhesive layer. (See Fig. 3 (b))
Next, an acrylic-epoxy adhesive is applied to the lower surface of the first spacer continuous body 34 with the light shielding layer prepared in FIG. The adhesive is applied only to the lower surface of the first spacer continuous body 34. In this state, the first spacer continuous body 34 was joined to the solid-state imaging device 31 in alignment. (See Fig. 3 (c))
Next, about 5 μm of adhesive is applied to the upper surface of the thick portion of the first spacer continuous body 34 by a roll coating method. A concave lens-shaped first lens structure 36 is laminated on the first spacer continuous body 34 and bonded together. Also at this time, it goes without saying that each lens of the lens structure 36 and the light receiving surface of the solid-state imaging device 31 are aligned. (See Fig. 3 (d))
Subsequently, the second spacer continuous body 37 and the second lens body 38 are laminated and bonded in the same manner as described below (see FIG. 3 (e)), and further, the third spacer continuous body 39, the cover glass The plate 13 was joined (see FIG. 4 (f)).

  Finally, a dicing apparatus using a 450 mesh resin blade was used to cut a groove from the surface with the central portion of the spacer continuous body as a cutting line. Separated into individual camera modules, a finished product in the state of FIG.

In exactly the same manner as in Example 1, for an alumina borosilicate glass wafer having a thickness of 0.5 mm and a diameter of 20 cm (Zn0 21%, Al ₂ O ₃ 5%, B ₂ O ₃ 40%, SiO ₂ 14%) Then, the spacer continuous body of FIG. 2C of the drawing was obtained by chemical etching using a hydrofluoric acid-based etching solution. On the other hand, as the pretreatment of electroless plating, that is, degreasing, sensitization and activation treatment, the same treatment as in Example 1 was performed. After that, by using electroless plating solutions of various metals as shown below, an electroless plating layer made of each metal or alloy is formed on the entire surface of the spacer continuous body to provide a spacer continuous body with a light shielding layer. Got. All of the light shielding layers had a density measured by a Macbeth densitometer of 3.0 or more.

A. Electroless copper plating solution
Copper sulfate 35g / l
Sodium tartrate 175g / l
Sodium hydroxide 50g / l
37% by weight formaldehyde added 100 ml PH = 11.5, liquid temperature 24 ° C., immersion time 15 minutes

B. Electroless cobalt plating solution
Cobalt sulfate 0.07 mol / l
Sodium hypophosphite 0.2 mol / l
Sodium citrate 0.2 mol / l
Ammonium sulfate 0.6 mol / l
PH = 9.5, liquid temperature 90 ° C., immersion time 20 minutes

C. Electroless nickel-iron alloy plating solution
Nickel chloride 0.056 mol / l
Ferrous ammonium sulfate 0.020 mol / l
Sodium potassium tartrate 0.2 mol / l
Sodium hypophosphite 0.094 mol / l
Ammonia water 3.6 mol / l
Liquid temperature 75 ° C, immersion time 20 minutes

  The obtained spacer continuous body can be used as a camera module spacer in the same manner as in Example 1 to obtain a camera module having a flare-preventing light-shielding layer on the inner wall.

  In exactly the same manner as in Example 1, an alumina borosilicate glass wafer having a thickness of 0.5 mm and a diameter of 20 cm was subjected to chemical etching using a hydrofluoric acid-based etchant, and the spacer shown in FIG. A continuous body was obtained.

Next, a coating film is formed on the entire surface by spray coating. Spray coating is a method in which paint is sent from a compressor and sprayed with a jet of compressed air, and the air pressure during operation is 1 to 5 kg / cm ² . The spacer continuous body in the state of FIG. 2 (c) was placed on a rotary base, and a spray gun was installed at an angle of 20 ° to 70 ° at a position 10 to 100 cm away from this, and the paint was sprayed. Slowly turn the rotary table and paint on the side of the camera module so that the coating thickness is about 20 μm. Thereafter, the spacer continuous body was turned over, and the same coating operation was performed and applied.

Thereafter, drying and curing are performed at a temperature of 80 ° C. for about 20 minutes. By performing spray coating in this way, a light shielding film 61 is formed on the entire surface as shown in FIG. The paint described above is a black paint trade name “Riopol Black” (acrylic urethane resin paint) manufactured by Toyo Ink Mfg. Co., Ltd. This coated light-shielding film had a value of 4.0 ± 0.5 by a Macbeth densitometer and had satisfactory adhesive strength.
The obtained spacer continuous body can be used as a camera module spacer in the same manner as in Example 1 to obtain a camera module having a flare-preventing light-shielding layer on the inner wall.

  In this example, in addition to the provision of the light shielding layer on the spacer continuous body, the light shielding layer is applied to the periphery of the lens element of the lens body.

(1) Preparation of black colored photosensitive composition for light shielding layer Acrylic resin (20 parts by weight of methacrylic acid, 15 parts by weight of hydroxyethyl methacrylate, 10 parts by weight of methyl methacrylate, 55 parts by weight of butyl methacrylate are dissolved in 300 parts by weight of ethyl cellosolve. Acrylic resin obtained by adding 0.75 parts by weight of azobisnitrile under a nitrogen atmosphere and reacting at 70 ° C. for 5 hours was diluted with ethyl cellosolve so that the resin concentration became 20% by weight.
80 g of this diluted resin, 20 g of carbon black, and 0.2 g of a dispersant (fluorine surfactant) were added and dispersed for 3 hours while cooling with a bead mill disperser. To 100.2 g of this colored resin liquid, 3.9 g of trimethylolpropane triacrylate as a photopolymerizable monomer and 0.8 g of piperonyl-s-triazine as a photopolymerization initiator are added, and the solid content is 7 with ethyl cellosolve as a solvent. It diluted so that it might become weight%, and it stirred well and prepared the black coloring photosensitive composition for light shielding layer formation.

2. Preparation of light-shielding layer The black colored photosensitive composition for forming the light-shielding layer was spin-coated on a lens structure on which a large number of lenses were formed, pre-baked at 70 ° C. for 20 minutes, and a thickness of 3 on the surface of the lens structure. A photosensitive black coating film 93 having a thickness of 0 μm was formed (see FIG. 10B).

Next, exposure is performed with parallel light 95 from a high-pressure mercury lamp (exposure 150 mJ / cm ² ) using an exposure mask 94 in which a light-shielding film 93 that blocks light corresponding to the opening of the lens element is formed. After development with an aqueous sodium carbonate solution, it was thoroughly washed with water. After the washing and drying operation, post-baking was performed at 150 ° C. for 1 hour to obtain a lens structure in which the light shielding layer 97 was covered up to the lens periphery (see FIG. 10C).

Subsequently, the same operation as described above was performed on the back surface of the glass structure to obtain a lens structure having a light shielding layer covering the back surface of the lens. When the optical density (OD) of the light shielding layer was measured with a Macbeth densitometer, it was 3.0 or more, and the light shielding layer had a low surface reflection and a high density.
The obtained lens structure can be used as a camera module lens body in the same manner as in Example 1. By using the lens structure together with a spacer continuous body having a light-shielding film, a flare-preventing light-shielding layer is formed on the inner wall. Obtained camera module.

  As described above, when the camera module of the present invention is formed on a single silicon wafer with multiple faces, flare prevention is performed in a desired area on the inner surface of the camera module in a series of wafer processes. A light shielding layer can be applied, and the simplicity of the manufacturing method is very advantageous in industry.

1. Silicon substrate 2, through hole (conductive material or inner wall covering)
3, insulating layer 4, conductive layer,
5. Connection terminal (BGA)
6. Frame wall (about 50μm)
7, sealing glass plate 8, first spacer 9, first lens base 10, spacer 11, second lens base 12, second spacer 13, cover glass 14, first lens body 15, second lens body 16, color Filter 17, micro lens 18, shielding barrel 21, glass plates 22a and 22b, resist film 24, spacer connecting body 25, light shielding layer 30, silicon wafer 34, first spacer connecting body 35, opening 36, first lens structure Body 37, second spacer connecting body 38, second lens structure 39, third spacer connecting body 40, mobile phone 41, first camera 42, second camera 43, input button 44, display surfaces 50, 60, camera module 51, solid-state imaging devices 52a and 52b, lens 53, camera frame 55, printed circuit boards 56, 56a and 56b, conductive layers 61 and 97, light shielding layers 62 and 96, light shielding 90, the lens 91, the lens body 92, lens element 93, photosensitive black layer 94, the exposure mask 95, the light

Claims (10)

  A camera module in which at least one lens body is laminated on a solid-state imaging element via a spacer, wherein at least an inner wall of the spacer is covered with a light-shielding layer of an electroless plating layer.   The camera module according to claim 1, wherein a black colored resin light shielding layer is used instead of the light shielding layer of the electroless plating layer.   The camera module according to claim 1, wherein at least one of the lower surface and the upper surface of the light shielding layer has low light reflectivity.   A camera module in which at least one lens body is laminated on a solid-state imaging device via a spacer, wherein at least a peripheral part of a lens element of the lens body is covered with a light shielding layer.   5. The camera module according to claim 4, wherein the light-shielding layer covering the periphery of the lens element is a light-shielding layer obtained by photo-curing and heat-fixing a coating film of a black colored photosensitive resin composition. A method for manufacturing a camera module, comprising the following steps (a) to (e):
(a) a step of preparing a solid-state imaging device having multiple faces on a wafer in a wafer process;
(b) creating a spacer having a large number of openings corresponding to the light receiving surface of the solid-state imaging device by etching a glass wafer;
(c) a step of covering at least the inner wall of the opening of the spacer with a light shielding layer;
(d) a step of creating a lens module having a plurality of surfaces by laminating at least one lens structure on the top surface of the solid-state imaging element having the plurality of surfaces through the spacer;
(e) After that, the process of cutting along the cutting lines between the multi-faceted camera modules and separating them into individual camera modules.   The method for manufacturing a camera module according to claim 6, wherein the light shielding film is a light shielding film formed by an electroless plating method.   The method for manufacturing a camera module according to claim 6, wherein the light shielding film is a light shielding film formed by applying a black colored resin. A method for manufacturing a camera module, comprising the following steps (a) to (e):
(a) a step of preparing a solid-state imaging device having multiple faces on a wafer in a wafer process;
(b) creating a spacer having a large number of openings corresponding to the light receiving surface of the solid-state imaging device by etching a glass wafer;
(c) a step of forming a lens structure in which a large number of lens elements are formed on a lens substrate, and at least the periphery of the lens element is covered with a light shielding layer;
(d) A step of creating a multifaceted lens module by laminating at least one lens structure produced in step (c) on the top surface of the multifaceted solid-state imaging device via the spacer. ,
(e) After that, the process of cutting along the cutting lines between the multi-faceted camera modules and separating them into individual camera modules.   10. The method of manufacturing a camera module according to claim 9, wherein the light shielding layer covering the periphery of the lens element is a light shielding layer obtained by photocuring a black colored photosensitive resin coating and heat-fixing.

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