JP2011085625A - Camera module and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure of a camera module having an external light shielding part manufacturable easily in a process without requiring man-power or labor in a manufacturing process, which works for a flare prevention countermeasure of the camera module manufactured in a wafer process, and to provide a method for manufacturing the camera module. <P>SOLUTION: In the camera module, a side wall of the camera module formed by laminating at least one lens body on a solid imaging element through a glass spacer is coated by a shielding layer, and a shielding film is formed by some of an electroless plating method, a vacuum film forming method and an application method. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a camera module, and more particularly, to an external light shielding technique for a camera module mounted on a mobile phone.

  It is common practice to attach a camera to a mobile phone. The camera is built into a mobile phone as a camera module that uses a charge coupled (CCD) or complementary oxide semiconductor (C-M0S) solid-state image sensor for the camera body, and other lenses. ing.

  As shown in FIG. 4, there are two cameras that are mounted on the mobile phone 40. The first camera 41 is a high-definition camera having about 5 to 10 million pixels, and is not much different from a normal camera. The second camera 42 is a video dedicated camera having about 100,000 to 300,000 pixels, and is mainly a videophone camera. By operating the input button 43, the caller himself / herself or the other party's face can be shown on the display screen 44.

  As shown in FIG. 5, the conventional camera module is a camera module 50 including a solid-state imaging device 51 and about two to three lenses 52a and 52b, and is entirely supported by a camera frame 53 made of synthetic resin. ing. The camera frame 53 is colored black to block light from the surroundings. On the light receiving element surface of the solid-state image sensor 51, color separation color filters and condensing microlenses are formed for each pixel, but are too small to be shown in FIG. Further, the cover glass 54 protects the surface.

  As shown in FIG. 5, the solid-state imaging device 51 of the camera module 50 is electrically connected by an electrode of a conductive layer 56 of a printed circuit board 55, a wire bond ink, a pole grid array (hereinafter referred to as BGA) system, or the like. The image information converted into electrical signals is taken out.

  However, since the camera module 50 as shown in FIG. 5 uses a camera frame 53 made of synthetic resin, there is a problem that it is difficult to perform automatic mounting by the reflow method. Furthermore, it is inevitable that the printed circuit board 55 is bulky in the vertical direction due to the thickness of the printed circuit board 55 itself. This has hindered the reduction in thickness and weight of mobile phones.

  Therefore, a structure that can be manufactured by a wafer process has been proposed for the purpose of reducing the size and thickness of the camera module. The camera module 60 shown in FIG. 6 is an example. In FIG. 6, a silicon substrate 1 that is a solid-state image sensor has a color separation color filter 16 and a light condensing microlens 17 formed in each pixel on the light receiving element surface on the upper surface thereof. An electrical signal of image information obtained by the solid-state imaging device is guided to the back surface of the silicon substrate 1 by a conductive material 2 that fills or coats the through silicon via (hereinafter referred to as TSV) and is patterned. The insulating layer 3 and the conductive layer 4 enable connection to an external circuit at the connection terminal 5 by the BGA method.

Above the silicon substrate 1, a sealing glass plate 7 is bonded through a frame wall 6 to make the light receiving region airtight. Although the thickness of the frame mold 6 is exaggerated in the figure, it is as thin as about 50 μm. On the sealing glass plate 7, a first lens body 14 formed by forming a lens made of a transparent resin on the front and back surfaces of the first lens base 9 is overlaid through a first spacer 8 made of glass. Further, a second lens body 15 formed by forming a lens made of a transparent resin is overlapped on the front and back surfaces of the second lens base 11 through a second spacer 12 made of glass. In the illustrated example, the first lens body 14 is a concave lens, and the second lens body is a convex lens. A lens made of a transparent resin is produced by a fine molding method or a photolithography method. Finally, the cover glass plate 13 is bonded through the third spacer 12. The cover glass plate 13 often serves also as an infrared cut glass.

  The camera module 60 shown in FIG. 6 shows only one product, but in the actual manufacturing process, a processing process for a glass plate having a diameter of 20 to 30 cm is combined with a processing process for a silicon wafer having a diameter of 20 to 30 cm. Literally manufactured by a wafer process, and finally cut individually in a dicing process to form one camera module. In the camera module 60 of FIG. 6, if it is the second camera mounted on a mobile phone, the size of the silicon substrate 1 is only about 3 mm square, so 1,500 to 2,800 pieces from a single wafer of 20 cm in diameter. Can be taken.

  However, the camera module 60 of FIG. 6 also has a problem to be solved. The spacers 8, 10, 12 and the lens bases 9, 11 stacked on the silicon substrate 1 are all made of glass and have a thickness sufficient to circulate the wafer process. Is about 0.4 mm. For this reason, the height of the lens portion of the camera module 60 is considerably high, and there is a drawback that external light is incident from the side surface of the laminate.

  When a light beam is incident on the camera module at an angle, the light beam causes flare and fogging. This is a phenomenon in which white blurring or an unnecessary light image is generated on a so-called shooting screen. As a flare countermeasure for preventing this, as shown in FIG. 7, it can be proposed to attach a metal shielding barrel 18 that blocks light from the side surface to the camera module 60.

  However, as mentioned above, the size of the silicon substrate 1 of the camera module is about 3 mm square, and it is a mechanical means to manually attach a cylindrical shield to such a small object. However, it is not only troublesome in terms of process but also extremely difficult in terms of work. Even if 2.000 wafers can be made per wafer in the wafer process, flare prevention measures become a bottleneck in the process, preventing mass production as a camera module and reducing costs.

JP 2008-124919 A JP 2002-214436 A

  The present invention is a flare prevention measure for a camera module manufactured by the wafer process described above, and includes an external light shielding unit that can be easily manufactured in a manufacturing process without requiring manual labor or labor. A structure of a camera module and a manufacturing method thereof are provided.

The invention described in claim 1 for achieving the above object
The camera module is characterized in that a side wall of a camera module in which at least one lens body is laminated on a solid-state image pickup element via a glass spacer is covered with an electroless plating light-shielding layer.

The invention according to claim 2
2. The camera module according to claim 1, wherein the light shielding layer is formed by sputtering instead of the light shielding layer of the electroless plating layer.

The invention according to claim 3
The camera module according to claim 1, wherein a light shielding layer of a coating film is used instead of the light shielding layer of the electroless plating layer.

The invention according to claim 4
The camera module according to any one of claims 1 to 3, wherein at least one of a lower surface or an upper surface of the light shielding layer has low light reflectivity.

The invention according to claim 5
The camera module according to any one of claims 1 to 4, wherein a sealing glass plate is bonded onto a solid-state image sensor via a frame mold.

The invention according to claim 6
The camera module according to any one of claims 1 to 5, wherein a cover glass is bonded onto the lens body.

The invention according to claim 7 provides
For a camera module produced in a wafer process by many-sided attachment to a wafer, (a) a step of sticking an easily peelable protective film on its upper surface, and sticking an extensible film having an adhesive layer on its lower surface,
(b) cutting each camera module along a cutting line between the camera modules;
(c) after cutting, expanding the gap between the camera modules by stretching the stretchable film;
(d) forming a light-shielding film on the side wall surface of the camera module with an expanded gap;
(e) peeling the extensible film having the easily peelable protective film on the upper surface of the camera module and the adhesive layer on the lower surface, and a method for producing a camera module.

The invention according to claim 8 provides
For a camera module that has been produced in large numbers by wafer-side mounting in a wafer process, (a) a step of attaching an easily peelable protective film on the upper surface,
(b) a step of half-cutting each camera module to the middle of the silicon substrate of the solid-state imaging device along a cutting line between the camera modules;
(c) a step of forming a light-shielding film on the side wall surface of the camera module that has been cut and exposed after half cutting;
(e) A method for manufacturing a camera module, comprising: cutting all of the camera module, and peeling off an easily peelable protective film on the upper surface of the camera module.

The invention described in claim 9
9. The camera module manufacturing method according to claim 7, wherein the light shielding film is formed by any one of an electroless plating method, a vacuum film forming method, and a coating method.

The invention according to claim 10 provides
The camera module manufacturing method according to any one of claims 7 to 9, wherein an adhesive tape is further laminated on the easily peelable protective film adhered to the upper surface of the camera module. It is a method.

The present invention is a camera module that eliminates the need for a shielding lens barrel for preventing flare, and is a countermeasure for preventing flare in a camera module manufactured by a wafer process. A similar wafer process can be employed in the manufacturing process.
Therefore, it is possible to provide a camera module structure and a method for manufacturing the same that can be easily manufactured in a process without requiring manual labor or labor. The manufacturing process is suitable for mass production and contributes to cost reduction.

It is a figure of the cross-sectional view of the camera module provided with the light shielding film which becomes this invention. It is process drawing of the cross sectional view which illustrates typically an example of the camera module manufacturing process which becomes this invention. It is process drawing of the cross sectional view explaining typically another example of the camera module manufacturing process which becomes this invention. It is a schematic diagram explaining a camera module being mounted on a mobile phone. It is a figure of the cross-sectional view explaining the structure of the conventional camera module. It is a figure of the sectional view of the camera module concerning the present invention. It is a figure of the cross-sectional view of the camera module provided with the shielding barrel of the conventional structure.

Hereinafter, the present invention will be described with reference to FIGS.
The camera module 60 according to the present invention shown in FIG. 1 has a light shielding film 61 for preventing flare formed on the side wall thereof by electroless plating. The material of the plating film is selected from a combination of nickel-iron, cobalt-iron, copper-iron, etc., as well as a single plating layer made of a metal selected from nickel, chromium, cobalt, iron, copper, gold, etc. An electroless plating layer of an alloy. In addition, a metal such as copper is electrolessly plated, and then the surface thereof is chemically or oxidized to form a metal compound to form a metal light-shielding layer having a low light reflectance on the surface.

  The electroless plating layer 61 should have a high light shielding performance of an optical density of 2.0 or more with a Macbeth densitometer. In this sense, it is convenient to use a metal as the light shielding layer. In FIG. 1, the thickness of the electroless plating layer 61 is exaggerated. In the normally used metal plating layer 61, a thickness of 0.1 to 1.0 μm is sufficient to achieve an optical density of 2.0 or more.

  Further, the light shielding film 61 covering the side surface of the camera module 60 according to the present invention may be a light shielding film 61 formed by a sputtering film forming method. The light shielding film 61 formed by the sputtering method is not only formed of a single metal such as metallic chromium, but also a reactive gas such as oxygen gas or nitrogen gas is introduced into the sputtering film forming chamber to The light-reflecting light-shielding film 61 may be formed on the front and back surfaces. It is sufficient if the thickness of the light-shielding film formed by the sputtering method is 0.1 to 1.0 μm.

  Further, the light shielding film 61 can be formed by applying a black paint by a spray coating method or a dipping method. In many cases, the light-shielding film 61 made of a paint itself has a low light reflectivity. The thickness of the light shielding film 61 by such a coating method is about 5.0 to 100 μm.

  A method for manufacturing a camera module according to the present invention will be described below in detail with reference to FIGS. 2A to 2E of the drawings showing one embodiment in the order of steps.

The means for selectively applying the light shielding film 61 only to the side wall of the camera module becomes clear.
As shown in FIG. 2A, the camera module 60 is referred to as “multiple attachment”, and in the manufacturing stage, a large number of large silicon wafers 21 are manufactured, and thereafter, there is a process of cutting one by one. Immediately before this cutting, as shown in FIG. 2A, an easily peelable protective film 22 is attached to the upper surface of the camera module 60 produced by multi-face attachment to cover the upper surface of the camera module 60.
In other words, if the strength of the easily peelable protective film 22 is insufficient, the adhesive tape 23 may be laminated and reinforced. For example, an extensible film film 25 such as polyethylene or a vinyl chloride resin film having an adhesive layer 24 is attached to the lower surface.

  FIG. 2B shows a state in which a cutting groove 26 is formed between the camera modules 60 by a dicing apparatus or the like. As is clear from the above, the easily peelable catching film 22 prevents the upper surface of the camera module from being contaminated by the cutting coolant or glass waste generated during cutting.

  Subsequently, as shown in FIG. 2 (c), a force is applied to expand the extensible film film 25 outwardly as shown by the arrows in the figure, so that the width of the aforementioned cut groove 26 is increased to increase the gap 27. And In this state, the camera modules cut into individual pieces have a wider space between the side surfaces, and this portion can be easily cleaned.

  Next, a method known as an electroless plating method in the state of FIG. 2C, that is, a series of steps of cleaning, degreasing, sensitization, activation, and plating operation is performed.

  The electroless plating can be described basically using a conventionally known metal electroless plating method and alloy electroless plating method. However, since the camera module according to the present invention is incorporated into a mobile phone or the like by post-processing, it is desirable that the metal light shielding layer by electroless plating on the side surface is adhered to the side surface with a strong adhesive force. Therefore, it is desirable to select a plating method having high adhesive strength to the glass surface as the electroless plating method.

For example, in the case of nickel electroless plating, after degreasing, sensitization, and activation, treatment with an aqueous solution of an alkali metal salt of hypophosphorous acid such as sodium hypophosphite or potassium hypophosphite It is possible to perform this operation of electroless plating after it has been performed.
By applying electroless plating, as shown in FIG. 2 (d), the light shielding film 28 by electroless plating of metal or alloy forms the side wall of the camera module 60, the protective film 22, the adhesive tape 23, and the stretchable film film 25. Formed on the entire surface.

  However, after that, the individual camera modules 60 are peeled off from the stretchable film 25, and then the easily peelable protective film 22 and the adhesive tape 23 are also peeled off, as shown in FIG. Thus, a camera module 60 that is separated and independent and having a light shielding film 28 formed by electroless plating only on the side wall thereof is obtained.

  In other words, the state of FIG. 2C is expanded between the camera modules 60 by the gaps 27. Therefore, the light shielding film 28 can be applied to the side wall also by the sputtering film forming method. Further, a black paint film can be applied to the side wall of the camera module 60 by the spray method or the dipping method to form the light shielding film 28.

  It is clear that the state shown in FIG. 2D can also be obtained by a sputtering film forming method or a coating method. Thereafter, the easily peelable protective film 22, the adhesive tape 23, and the stretchable film film 25 adhering to the upper and lower surfaces of the camera module 60 may be removed by exactly the same process.

  Next, another embodiment of the camera module manufacturing method according to the present invention will be described with reference to FIGS.

In this embodiment, the electroless plating is performed without widening the gap between the camera modules, but stopping the silicon wafer 21 of the camera module 60 in a half cut.
As shown in FIG. 3A, the camera module 60 is referred to as “multiple attachment”, and a large number of camera modules 60 are produced on a single silicon wafer 21, and thereafter, there is a step of cutting one by one. Immediately before this cutting, as shown in FIG. 3A, an easily peelable protective film 22 is applied to the upper surface of the camera module 60 produced by multi-face attachment to cover the upper surface of the camera module 60.
In other words, when the strength of the easily peelable protective film 22 is insufficient, the adhesive tape 23 may be laminated and reinforced as in the previous embodiment. In order to increase the strength, for example, a backing film film 29 such as polyester having a pressure-sensitive adhesive layer 24 or a vinyl chloride resin film is attached to the lower surface. This backing film film 29 is for supporting the individual camera modules 60 so that they do not fall apart even if the silicon wafer 21 is half-cut in the next process.

  FIG. 3B shows a state in which a cutting groove 30 is formed between the camera modules 60 by a dicing apparatus or the like. However, the silicon wafer 21 is in a semi-cut state and is not fully cut. Desirably, the width of the cutting groove 30 of this embodiment should be wider than the width of the cutting groove 26 formed in the embodiment of FIG.

  Following the state of FIG. 3B, a characteristic of this process is to perform a series of steps known as electroless plating, that is, cleaning, degreasing, sensitization, activation, and plating operation. . By performing electroless plating, a metal or alloy electroless plating layer 31 is formed on the side surface of the camera module 60, the protective film 22, and the entire surface of the adhesive tape 23, as shown in FIG.

  However, after that, the entire silicon wafer 21 is cut and moved in order, and the individual camera modules 60 are peeled off from the backing film film 29. Thereafter, the easily peelable protective film 22 and the adhesive tape 23 are also peeled off. In this case, as shown in FIG. 3 (d), a camera module 60 that is individually separated and independent and having a light-shielding electroless plating layer 31 formed on its side surface is obtained. In this process example, the electroless plating layer 31 does not reach the bottom of the camera module 60. Since the bottom of the camera module 60 has BGA electrode terminals that are electrically connected to an external circuit, it is desirable to reliably prevent the electroless plating layer 31 from entering the bottom.

  Specific examples of the present invention will be described below.

[Example 1]
A silicon wafer having a thickness of 0.25 mm and a diameter of 30 cm and a camera module shown in FIG. “Product name” is applied and dried to form an easily peelable protective film. Next, the stretchable film film 5PV-224 (trade name, manufactured by Nitto Denko Corporation) having an adhesive layer provided on one side of the stretchable polyvinyl chloride film and the lower surface of the silicon wafer were bonded together, and FIG. ) State. Subsequently, a cutting groove was formed from the surface by a cutting machine using a 450 mesh resin blade. Subsequently, the edge part of the said extensible film membrane was pulled, and it was set as the state of FIG.2 (b).

  Subsequently, the side of the glass rudules that had been degreased and washed with water was soaked for 4 minutes in an aqueous solution (25 ° C.) in which 5 g of stannic chloride and 5 ml of 35% by weight hydrochloric acid were dissolved in 1 liter of water. The treatment was performed, and after washing with running water for 10 seconds, an activation treatment was performed by immersing in an aqueous solution in which 0.1 g of palladium chloride (PdCl 2) and 0.2 ml of hydrochloric acid were dissolved in 1 liter of water at room temperature for 4 minutes. After washing with water, a product name “Schuma S-680” manufactured by Nippon Kanzen Co., Ltd. was used as the electroless nickel plating solution, and the electroless plating was performed by dipping at a liquid temperature of 50 ° C. for 10 minutes.

After washing with water, dry with hot air at 80 ° C for 30 seconds, and peel off the stretchable film film and the easily peelable protective film on the back surface of the camera module. Thus, a solid-state imaging camera module with the above was obtained. This electroless plating layer of nickel had an optical density value of 5.0 ± 0.5 with a Macbeth densitometer, and had satisfactory adhesive strength.

[Example 2]
In the same manner as in the first embodiment, a camera module multifaceted on a silicon wafer is formed as shown in FIG. 2 (c), and pretreatment of electroless plating, that is, degreasing, sensitization and activation. The treatment was exactly the same as in Example 1. Thereafter, by using an electroless plating solution of various metals shown below, a solid-state imaging device camera module that forms an electroless plating layer made of each metal or alloy on the side surface to form a light-shielding layer for preventing flare is obtained. Obtained. All of the light shielding layers had an optical density measured by a Macbeth densitometer of 3.0 or more.

A. Electroless copper plating solution Copper sulfate 35g / l
Sodium tartrate 175g / l
Sodium hydroxide 50g / l
37% by weight formalide 100 ml added Plating conditions: PH = 11.5, liquid temperature 24 ° C., immersion time 15 minutes.

B. Electroless cobalt plating solution Cobalt sulfate 0.07 mol / l
Sodium hypophosphite 0.2 mol / l
Sodium citrate 0.2 mol / l
Ammonium sulfate 0.6 mol / l
Plating conditions: PH = 9.5, liquid temperature 90 ° C., immersion time 20 minutes.

C. Electroless nickel-iron alloy plating solution Nickel chloride 0.056 mol / l
Ferrous ammonium sulfate 0.020 mol / l
Sodium potassium tartrate 0.2 mol / l
Sodium hypophosphite 0.094 mol / l
Ammonia water 3.6 mol / l
Plating conditions: liquid temperature 75 ° C., immersion time 20 minutes.

[Example 3]
In exactly the same manner as in Example 1, a camera module formed with multiple faces on a silicon wafer was formed into the state shown in FIG. 2C and introduced into a continuous sputter deposition apparatus. A semi-transparent, light-reflective chromium oxynitride film was formed to a thickness of 0.01 μm by a reactive sputtering method in which the sputtering target was metallic chromium and oxygen gas and nitrogen gas were first introduced into the sputtering chamber. Next, a light-shielding film of 0.12 μm was formed from metallic chromium, and finally a translucent light-reflective chromium oxynitride film was formed to 0.01 μm by a reactive sputtering method in which oxygen gas and nitrogen gas were introduced. . The obtained light shielding film had low light reflectivity on both the front and back surfaces. By removing the extensible film film and the easily peelable protective film on the back surface of the camera module, a low-reflective light-shielding film of chromium oxynitride / chromium / chromium oxynitride is applied only to the side wall. A solid-state imaging camera module was obtained. This chromium-based light-shielding film had an optical density value of 3.0 ± 0.5 with a Macbeth densitometer, and had satisfactory adhesive strength.

[Example 4]
Exactly the same as in Example 1, a camera module formed with multiple faces on a silicon wafer was formed in the state shown in FIG. 2 (c), washed thoroughly with water, dried, and then spray coated on the side. A coating film is formed. Spray coating is a method in which paint is sent from a compressor and sprayed with a jet of compressed air, and the air pressure during operation is 1 to 5 kg / cm ² . The camera module in the state of FIG. 2C was placed on a rotary table, and a spray gun was installed at an angle of 20 ° to 70 ° at a position 10 to 100 cm away from the camera module to spray the paint. Slowly turn the rotary table and paint on the side of the camera module so that the coating thickness is about 20 μm.

   Thereafter, drying or curing is performed at a temperature of 80 ° C. for about 20 minutes. By performing spray coating in this way, a light shielding film is formed on the entire protective surface and side surfaces of the camera module as shown in FIG. Thereafter, the individual camera modules are peeled off from the extensible film J rem having the adhesive layer, and then the adhesive tape on the upper surface is peeled off, as shown in FIG. A product having a light shielding film formed on the side wall by spray coating is obtained. The paint described above is a black paint trade name “Riopol Black” (acrylic urethane resin paint) manufactured by Toyo Ink Mfg. Co., Ltd. This coated light-shielding film had a value of 4.0 ± 0.5 by a Macbeth densitometer and had satisfactory adhesive strength.

[Example 5]
A silicon wafer having a thickness of 0.25 mm and a diameter of 30 cm and a camera module shown in FIG. “Product name” is applied and dried to form an easily peelable protective film. Further, a vinyl chloride-based synthetic resin adhesive tape “VD-8: trade name manufactured by Nitto Denko Corporation” was attached. Next, the backing film membrane VD-8 (trade name, manufactured by Nitto Denko Corporation) with an adhesive layer provided on one side of the polyvinyl chloride film and the lower surface of the silicon wafer were bonded together, and the state shown in FIG. did. Subsequently, a cutting machine using a 450 mesh resin blade was used to form a cutting groove for half-cutting from the surface to the middle of the silicon wafer to obtain the state shown in FIG. The width of this cutting groove is 0.8 mm.

  Next, in the state of FIG. 3B, the electroless plating process of nickel was performed in the same manner as in Example 1 to obtain the state of FIG. After the electroless plating process, each camera module is completely cut off, and the easy-peelable protective film, adhesive tape, and backing film film are peeled off from the camera module to form an electroless plated layer on the side surface to prevent flare. A solid-state imaging device camera module was obtained. All of the light shielding layers had a density measured by a Macbeth densitometer of 3.0 or more.

  As described above, when the camera module of the present invention is formed on a single silicon wafer by multi-sided attachment, an additional electroless plating process is set in the cutting process. The flare-preventing light-shielding layer can be applied only to the desired area of the side surface of the above, and the simplicity of the manufacturing method can be said to greatly benefit the industry.

  As described above, the camera module of the present invention is suitable for mass production and contributes to cost reduction in combination with ease of manufacture and convenience when incorporated in a mobile phone or the like. It is extremely excellent.

1. Silicon substrate 2, through hole (conductive material or inner wall covering)
3, insulating layer 4, conductive layer,
5. Connection terminal (BGA)
6. Frame wall (about 50μm)
7, sealing glass plate 8, first spacer 9, first lens base 11, second lens base 12, second spacer 13, cover glass 14, first lens body 15, second lens body 16, color filter 17, Micro lens 18, shielding barrel 21, silicon wafer 22, easily peelable protective film 23, adhesive tape 24, adhesive layer 25, extensible films 26 and 30, cutting grooves 28, 31, 61, light shielding film 29, backing film film 40, mobile phone 41, first camera 42, second camera 43, input button 44, display surface 50, 60, camera module 51, solid-state imaging device 52a, 52b, lens 53, camera frame 55, printed circuit board 56, 56a, 56b, conductive layer

Claims (10)

  A camera module characterized in that a side wall of a camera module in which at least one lens body is laminated on a solid-state image pickup device via a glass spacer is covered with an electroless plating light-shielding layer.   The camera module according to claim 1, wherein a light shielding layer formed by sputtering is used instead of the light shielding layer of the electroless plating layer.   The camera module according to claim 1, wherein a light shielding layer of a coating film is used instead of the light shielding layer of the electroless plating layer.   The camera module according to any one of claims 1 to 3, wherein at least one of the lower surface and the upper surface of the light shielding layer has low light reflectivity.   The camera module according to any one of claims 1 to 4, wherein a sealing glass plate is bonded onto a solid-state imaging device via a frame mold.   The camera module according to claim 1, wherein a cover glass is bonded onto the lens body. For camera modules that have been manufactured in large numbers by wafer surface processing,
(a) adhering an easily peelable protective film to the upper surface and adhering a stretchable film having an adhesive layer on the lower surface thereof,
(b) cutting each camera module along a cutting line between the camera modules;
(c) after cutting, expanding the gap between the camera modules by stretching the stretchable film;
(d) forming a light-shielding film on the side wall surface of the camera module with an expanded gap;
(e) peeling the extensible film having the easily peelable protective film on the upper surface of the camera module and the adhesive layer on the lower surface, and a method for producing a camera module. For a camera module that has been produced in large numbers by wafer-side mounting in a wafer process, (a) a step of attaching an easily peelable protective film on the upper surface,
(b) a step of half-cutting each camera module to the middle of the silicon substrate of the solid-state imaging device along a cutting line between the camera modules;
(c) a step of forming a light-shielding film on the side wall surface of the camera module that has been cut and exposed after half cutting;
(e) A method of manufacturing a camera module, comprising: cutting all of the camera module, and peeling off an easily peelable protective film on the upper surface of the camera module.   9. The method of manufacturing a camera module according to claim 7, wherein the light shielding film is formed by any one of an electroless plating method, a vacuum film forming method, and a coating method.   The camera module manufacturing method according to any one of claims 7 to 9, wherein an adhesive tape is further laminated on the easily peelable protective film adhered to the upper surface of the camera module. Method.

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