JPH02153304A - Production of color resolving filter - Google Patents
Production of color resolving filterInfo
- Publication number
- JPH02153304A JPH02153304A JP63308329A JP30832988A JPH02153304A JP H02153304 A JPH02153304 A JP H02153304A JP 63308329 A JP63308329 A JP 63308329A JP 30832988 A JP30832988 A JP 30832988A JP H02153304 A JPH02153304 A JP H02153304A
- Authority
- JP
- Japan
- Prior art keywords
- color
- films
- grooves
- light
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 238000007747 plating Methods 0.000 claims abstract description 6
- 238000000926 separation method Methods 0.000 claims description 12
- 238000004070 electrodeposition Methods 0.000 claims description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 20
- 229910052759 nickel Inorganic materials 0.000 abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 239000010949 copper Substances 0.000 abstract description 7
- 238000009499 grossing Methods 0.000 abstract description 6
- 238000009713 electroplating Methods 0.000 abstract description 5
- 238000001020 plasma etching Methods 0.000 abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000365 copper sulfate Inorganic materials 0.000 abstract description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 abstract description 2
- 238000005260 corrosion Methods 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 229910052814 silicon oxide Inorganic materials 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract 1
- 238000000206 photolithography Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000003595 spectral effect Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000220259 Raphanus Species 0.000 description 1
- 235000006140 Raphanus sativus var sativus Nutrition 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001962 electrophoresis Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は色フィルターの製造方法に関するものであり、
特に単板式カラー固体撮像素子用色分解フィルターの製
造方法に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a color filter,
In particular, the present invention relates to a method of manufacturing a color separation filter for a single-plate color solid-state image sensor.
単板式カラー固体撮像素子においては、第２図（ａ）■
）に示すように固体撮像素子の画素のそれぞれに対応し
て、色フイルタ−１，２，３をモザイク状に規則的に配
置することによって入射光に含まれる色情報を得ている
。その際隣接する異なる分光透過率を持った色フィルタ
ーからの透過光又は散乱光の洩れや、各色フイルタ−パ
タン間の位置合わせ誤差等による色フィルター同士の重
なり部分や色フィルター間に生ずる隙間からの透過光の
侵入による混色を防止するために、各色フィルターの境
界部分には通常第２図（ａ） （ｂ）に示すような遮光
膜パタン４が形成されている。In the case of a single-chip color solid-state image sensor, Fig. 2 (a) ■
), color information contained in incident light is obtained by regularly arranging color filters 1, 2, and 3 in a mosaic pattern corresponding to each pixel of a solid-state image sensor. At that time, leakage of transmitted light or scattered light from adjacent color filters with different spectral transmittances, overlapping parts of color filters due to alignment errors between color filter patterns, and gaps between color filters may occur. In order to prevent color mixing due to penetration of transmitted light, a light-shielding film pattern 4 as shown in FIGS. 2(a) and 2(b) is usually formed at the boundary between each color filter.
一方、固体撮像素子が高解像度化するに従い画素面積が
縮小するため、色フィルターバクンのアスペクト比が増
大し色フィルター表面への斜め入射光による混色が発生
し易くなる。この場合色フイルタ−パタン自体が微細化
しているため遮光膜パタン４の幅を拡げることによって
斜め入射光による混色を減少させた場合には、固体撮像
素子の感光部への入射光の光量が大幅に減少するため撮
像素子としての感度が低下してしまう。このため、隣接
する色フイルタ−パタン等による混色を減少せる方法と
して、色フイルタ−パタンの境界部分でなく、色フイル
タ−パタンの間隙に遮光膜を充填配置する構成が考えら
れている。しかし色フイルタ−パタンの間隙にのみ選択
的に遮光膜を充填することは困難であるため、このよう
な構成による色分解フィルターを実現することはできな
かった。本発明の目的は単板式カラー固体撮像素子用色
分解フィルターの製造方法に関する上記の問題を解決し
、色フイルタ−パタンの間隙にのみ選択的に遮光膜を形
成する方法を提供することにある。On the other hand, as the resolution of solid-state image sensors increases, the pixel area decreases, so the aspect ratio of the color filter backbone increases and color mixing due to obliquely incident light on the surface of the color filter becomes more likely to occur. In this case, since the color filter pattern itself is miniaturized, if the width of the light-shielding film pattern 4 is increased to reduce color mixing due to obliquely incident light, the amount of light incident on the photosensitive area of the solid-state image sensor will be significantly increased. As a result, the sensitivity of the image sensor decreases. Therefore, as a method for reducing color mixing caused by adjacent color filter patterns, a structure has been considered in which a light-shielding film is filled and placed in the gaps between color filter patterns instead of in the boundaries between the color filter patterns. However, it has been difficult to selectively fill only the gaps between the color filter patterns with a light-shielding film, so it has not been possible to realize a color separation filter with such a configuration. SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems regarding the method of manufacturing a color separation filter for a single-plate color solid-state image sensor, and to provide a method for selectively forming a light-shielding film only in the gaps between color filter patterns.
本発明では上記問題を解決するために色フイルタ−パタ
ンの間隙にのみ選択的に遮光膜を形成する方法について
鋭意検討した結果、基板上に透明導電膜を形成する工程
と、非導電性の色フィルターを所望パクン状に形成する
工程と、前記色フィルターが形成されていない部分の前
記透明導電膜にめっき法または電着法により遮光膜を析
出させる工程を経ることにより色フィルターパクンの間
隙にのみ選択的に遮光膜を形成することができることを
見い出した。In order to solve the above-mentioned problems, the present invention has developed a method for selectively forming a light-shielding film only in the gaps between color filter patterns. By going through the steps of forming the filter into a desired shape and depositing a light-shielding film on the transparent conductive film in the areas where the color filter is not formed, by plating or electrodeposition, only the gaps between the color filter holes are formed. We have discovered that it is possible to selectively form a light-shielding film.
本発明では、互いに異なる分光透過率を持つ２ないし３
種の色フィルターパクンを基板上に規則的に配置し、更
に色フイルタ−パタンの境界部分に遮光部分を設けるこ
とによって形成される色分解フィルターの製造法におい
て、まず低膨張ガラス等よりなる透明基板表面に透明導
電膜を全面もしくは必要領域に形成する６次いで該透明
導電膜りに必要に応じて２ないし３種の色フイルタ−パ
タンを所望パタン状に形成した後、前記色フイルタ−パ
タンがその表面に形成されていない前記透明導電膜が露
出している領域に無電解めっき法及び／または電解めっ
き法により選択的に遮光性被膜を成長させる。前記２な
いし３種の色フイルタ−パタンの境界部分が互いに接触
あるいは重畳している場合、あるいは境界部分の幅が所
定の値より狭い場合には、フォトリソグラフィー法及び
反応性イオンエツチング法により前記境界部分のみを１
〜ｌＯμｍ程度の所定間隔に溝状に除去し、溝の底部に
前記透明導電膜を露出させた後に無電解めっき法及び電
解めっき法により選択的に遮光性被膜を成長させること
も可能である。本発明によれば各色フイルタ−パタンの
間隙部分に設けた１μｍ程度の微細な溝の内部にのみ選
択的に遮光性被膜を形成し、溝の内部を遮光性物質で満
たすことができるため色フィルターの開口率を低下させ
ることなく効果的に混色を防ぐことができる。第２図（
ａ）は表面に本発明による遮光膜を形成した色分解フィ
ルターを設けた透明基板１２を固体撮像素子１３に貼り
合わせて形成した単板式カラー固体撮像素子の貼り合わ
せ部分の断面を示す説明図である。In the present invention, two to three spectral transmittances having different spectral transmittances are used.
In the manufacturing method of a color separation filter, which is formed by regularly arranging seed color filter patterns on a substrate and further providing a light-shielding part at the border of the color filter pattern, first a transparent substrate made of low expansion glass or the like is used. A transparent conductive film is formed on the entire surface or in necessary areas. 6. Next, two or three types of color filter patterns are formed on the transparent conductive film in a desired pattern as necessary, and then the color filter pattern is A light-shielding film is selectively grown on the exposed region of the transparent conductive film that is not formed on the surface by electroless plating and/or electrolytic plating. If the boundary portions of the two or three color filter patterns contact or overlap each other, or if the width of the boundary portion is narrower than a predetermined value, the boundary portions may be etched by photolithography and reactive ion etching. only part 1
It is also possible to remove the transparent conductive film in the form of grooves at predetermined intervals of about 10 μm, expose the transparent conductive film at the bottom of the grooves, and then selectively grow a light-shielding film by electroless plating or electrolytic plating. According to the present invention, a light-shielding film is selectively formed only inside the fine grooves of about 1 μm provided in the gaps between the filter patterns of each color, and the inside of the grooves can be filled with a light-shielding substance. Color mixing can be effectively prevented without reducing the aperture ratio. Figure 2 (
a) is an explanatory view showing a cross section of a bonded portion of a single-panel color solid-state image sensor formed by bonding a transparent substrate 12 provided with a color separation filter with a light-shielding film according to the present invention on its surface to a solid-state image sensor 13; be.
また本発明は、色フィルターが非導電性物質で形成され
ていれば有機フィルター、無機フィルターを問わず応用
することができ、遮光性被膜についてもニンケル、銅、
クロム等のような無電解めっき法又は電解めっき法によ
り析出可能な金属はもちろん、そのほかに電気泳動を利
用した電着法によって析出可能な黒色顔料によって形成
させることも可能である。Further, the present invention can be applied to both organic and inorganic filters as long as the color filter is made of a non-conductive substance, and the light-shielding coating can also be applied to nickel, copper, copper, etc.
In addition to metals such as chromium that can be deposited by electroless plating or electrolytic plating, it is also possible to use black pigments that can be deposited by electrodeposition using electrophoresis.
さらに本発明では主にカラー固体ＩＲ像素子用色分解フ
ィルターの製造を例にとってその方法を説明しているが
、その他のカラー損像素子用色分解フィルターまたはカ
ラー液晶デイスプレィ用色分解フィルター等を製造する
際にも本発明による方法が応用できることはいうまでも
ない。Further, in the present invention, the method is mainly explained by taking as an example the production of color separation filters for color solid-state IR image elements, but it is also possible to produce color separation filters for other color image loss elements, color separation filters for color liquid crystal displays, etc. It goes without saying that the method according to the present invention can also be applied when doing so.
以下本発明の実施例について第１図を用いて具体的に説
明する。Embodiments of the present invention will be specifically described below with reference to FIG.
〔実施例１〕
厚さ０．５輪転直径３ｉｎｃｈのＡＭガラス（旭硝子製
）からなる透明基板５上にスパッタリング法によりＩＴ
Ｏの透明導電膜７（膜厚０．１ｍ ｕ ）を形成した（
第１図（ａ）参照）、このＩＴＯ膜付透明基板を３００
°Ｃ２時間大気中で焼成した後ＩＴＯ膜７上に所望パタ
ン状にしラド１．グリーン２．ブルー３の各色フィルタ
ーパクンを形成し、次いでスパッタリング法により酸化
シリコンよりなる平滑化層８を積層した（第１図（ｂ）
参照）０次にフォトリソグラフィー法にてパタン状耐食
膜を平滑化層８の上に形成し、反応性イオンエツチング
法を用いて、各色フィルター境界部分に溝９を形成する
（第１図（ｃ）参照）０次いで無電解ニッケルめっきに
より溝９次部に露出するＩＴＯ膜７膜面表面み選択的に
ニッケル膜１０を析出させた後、硫酸銅浴中でＩＴＯ膜
７を陰極として電解めっきを行い溝９次部に露出するＩ
ＴＯ膜７膜面表面出したニッケル膜１３上に金属銅層１
１を析出させた（第１図（ｄ）参照）。[Example 1] IT was deposited by sputtering on a transparent substrate 5 made of AM glass (manufactured by Asahi Glass) with a thickness of 0.5 and a rotary diameter of 3 inches.
A transparent conductive film 7 (film thickness 0.1 m u ) of O was formed (
(see Figure 1(a)), this transparent substrate with ITO film was
After firing in the atmosphere for 2 hours at °C, a desired pattern is formed on the ITO film 7 using a radish 1. Green 2. A filter patch for each color of blue 3 was formed, and then a smoothing layer 8 made of silicon oxide was laminated by sputtering (Fig. 1(b)).
0) Next, a patterned corrosion resistant film is formed on the smoothing layer 8 by photolithography, and grooves 9 are formed at the boundaries of each color filter using reactive ion etching (see Figure 1 (c). )) Next, a nickel film 10 was selectively deposited on the surface of the ITO film 7 exposed in the groove 9th part by electroless nickel plating, and then electrolytic plating was performed in a copper sulfate bath using the ITO film 7 as a cathode. I exposed in the 9th part of the running groove
A metallic copper layer 1 is placed on the nickel film 13 exposed to the surface of the TO film 7.
1 was precipitated (see FIG. 1(d)).
以上の工程を経ることにより各色フイルタ−パタンの境
界部分に設けた溝の内部をニッケル及び銅よりなる遮光
性物質で満たすことができた。By going through the above steps, it was possible to fill the inside of the grooves provided at the boundaries between the filter patterns of each color with a light-shielding substance made of nickel and copper.
〔実施例２〕
厚さ０．５ａｍ、直径３ｉｎｃｈのＡＮガラス（旭硝子
製）からなる透明基板５上にスパッタリング法によりＩ
ＴＯ膜７（膜厚０．１ｍμ）を形成した（第１図（ａ）
参照）。[Example 2] I was deposited by sputtering on a transparent substrate 5 made of AN glass (manufactured by Asahi Glass Co., Ltd.) with a thickness of 0.5 am and a diameter of 3 inches.
A TO film 7 (film thickness 0.1 mμ) was formed (Fig. 1(a)
reference).
このＩＴＯ膜付透明基板を３００°Ｃ２時間大気中で焼
成した後ＩＴＯ膜７上に所望パタン状にレッド１．グリ
ーン２．ブルー３の各色フイルタ−パタンを形成し、次
いで透明樹脂よりなる平滑化層８を積層した（第１図（
ｂ）参照）０次にフォトリソグラフィー法及び反応性イ
オンエツチング法を用いて、各色フィルター境界部分に
溝９を形成する（第１図（ｃ）参照）０次いで電着法を
用いて溝９次部に露出す、るＩＴＯ膜７膜面表面み選択
的にカーボンブラックの電着層１２を析出させた後、１
５０Ｃ’ ３０分のベーキングを行った。（第１図（ｅ
）参照）
以上の工程を経ることにより各色フィルターパクンの境
界部分に設けた溝の内部をカーボンブラックよりなる遮
光性物質で満たすことができた。After baking this transparent substrate with an ITO film in the air at 300°C for 2 hours, a desired pattern of red 1. Green 2. A filter pattern for each color of blue 3 was formed, and then a smoothing layer 8 made of transparent resin was laminated (see Fig. 1).
(See Figure 1(c)) Next, form grooves 9 at the border of each color filter using photolithography and reactive ion etching (see Figure 1(c)) Next, form grooves 9 using electrodeposition. After selectively depositing an electrodeposition layer 12 of carbon black on the surface of the ITO film 7 exposed in the
Baking was carried out at 50C' for 30 minutes. (Figure 1(e)
)) By going through the above steps, it was possible to fill the inside of the grooves provided at the boundaries between the filter strips of each color with a light-shielding substance made of carbon black.
本発明によれば色分解フィルターにおいて各色フイルタ
−パタン間に設けた微小な溝の内部を選択的に遮光性物
質で満たすことができる。従って各色フイルタ−パタン
の寸法が微細化した場合でも各色フイルタ−パタンへの
入射光が隣接する色フィルターバクンに斜め方向より進
入しないため混色を生ずることがない。According to the present invention, in a color separation filter, the inside of the minute groove provided between each color filter pattern can be selectively filled with a light-shielding substance. Therefore, even if the dimensions of each color filter pattern are miniaturized, the light incident on each color filter pattern will not enter the adjacent color filter pattern from an oblique direction, so that color mixing will not occur.
また従来法による遮光膜の形成が遮光層の成膜、フォト
リソグラフィー、及びエツチングの各工程を経て行われ
るのと比較し、本発明では各色フイルタ−パタン間に生
じた間隙の内部にめっき法により選択的に遮光膜を形成
することができるため遮光膜の形成工程を簡略化できる
。さらに、隣接する色フィルターパクンの境界部分をエ
ツチング除去した後に遮光膜の形成を行う場合において
もフォトリソグラフィー、エツチング、及びめっきの各
工程のみで遮光膜が形成されるため本発明による方法は
、従来法と比較してパタン制度が格段に向上するものと
なる。In addition, compared to the conventional method of forming a light-shielding film through the steps of forming the light-shielding layer, photolithography, and etching, the present invention uses a plating method to form the inside of the gap between each color filter pattern. Since the light shielding film can be selectively formed, the process of forming the light shielding film can be simplified. Furthermore, even when forming a light-shielding film after etching and removing the boundary portions of adjacent color filters, the method according to the present invention is different from conventional methods because the light-shielding film is formed only by the steps of photolithography, etching, and plating. The pattern system will be significantly improved compared to the law.
以上のように、本発明は実用上極めて優れている。As described above, the present invention is extremely superior in practical terms.
第１図（ａ）〜（ｄ）は本発明の色分解フィルター製造
方法の実施例を工程順に示す説明図である。
１、レッドフィルター
２、グリーンフィルター
３、ブルーフイルター
４、遮光膜
５、透明基板
６、中間層
７、透明導電膜
８、平滑化層
９、溝
１０、ニッケル膜
１１、銅層
１２、電着塗料層FIGS. 1(a) to 1(d) are explanatory drawings showing an example of the method for producing a color separation filter of the present invention in the order of steps. 1, red filter 2, green filter 3, blue filter 4, light shielding film 5, transparent substrate 6, intermediate layer 7, transparent conductive film 8, smoothing layer 9, groove 10, nickel film 11, copper layer 12, electrodeposition paint layer
Claims (2)
の色フィルターを所望パタン状に形成する工程と、前記
色フィルターが形成されていない間隙の前記透明導電膜
上にめっき法または電着法により遮光膜を形成すること
を特徴とする色分解フィルターの製造方法。(1) A step of forming a transparent conductive film on a substrate, a step of forming a non-conductive color filter in a desired pattern, and a plating method or A method for producing a color separation filter, characterized by forming a light-shielding film by an electrodeposition method.
る工程のあと、色フィルターの境界部分を所定の間隔に
溝状に除去する工程を付加することを特徴とする請求項
（１）記載の色分解フィルターの製造方法。(2) The method according to claim (1), characterized in that, after the step of forming the non-conductive color filter in a desired pattern, a step of removing the boundary portions of the color filter in the form of grooves at predetermined intervals is added. A method for manufacturing color separation filters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30832988A JP2600867B2 (en) | 1988-12-06 | 1988-12-06 | Manufacturing method of color separation filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP30832988A JP2600867B2 (en) | 1988-12-06 | 1988-12-06 | Manufacturing method of color separation filter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02153304A true JPH02153304A (en) | 1990-06-13 |
| JP2600867B2 JP2600867B2 (en) | 1997-04-16 |
Family
ID=17979747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP30832988A Expired - Fee Related JP2600867B2 (en) | 1988-12-06 | 1988-12-06 | Manufacturing method of color separation filter |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2600867B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08122515A (en) * | 1994-10-26 | 1996-05-17 | Dainippon Toryo Co Ltd | Production of color filter |
| KR100309211B1 (en) * | 1997-04-23 | 2002-11-18 | 엘지.필립스 엘시디 주식회사 | Lcd with wide viewing angle and fabricating method thereof |
| US7297451B2 (en) * | 2004-07-21 | 2007-11-20 | Samsung Corning Co., Ltd. | Black matrix, method for the preparation thereof, flat display device and electromagnetic interference filter employing the same |
| JP2008116895A (en) * | 2006-10-12 | 2008-05-22 | Bridgestone Corp | Method for manufacturing panel substrate with color filter, panel substrate with color filter, and information display panel |
| JP2009117570A (en) * | 2007-11-06 | 2009-05-28 | Sanyo Electric Co Ltd | Photoelectric conversion device |
| JP2011085625A (en) * | 2009-10-13 | 2011-04-28 | Toppan Printing Co Ltd | Camera module and method for manufacturing the same |
-
1988
- 1988-12-06 JP JP30832988A patent/JP2600867B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08122515A (en) * | 1994-10-26 | 1996-05-17 | Dainippon Toryo Co Ltd | Production of color filter |
| KR100309211B1 (en) * | 1997-04-23 | 2002-11-18 | 엘지.필립스 엘시디 주식회사 | Lcd with wide viewing angle and fabricating method thereof |
| US7297451B2 (en) * | 2004-07-21 | 2007-11-20 | Samsung Corning Co., Ltd. | Black matrix, method for the preparation thereof, flat display device and electromagnetic interference filter employing the same |
| JP2008116895A (en) * | 2006-10-12 | 2008-05-22 | Bridgestone Corp | Method for manufacturing panel substrate with color filter, panel substrate with color filter, and information display panel |
| JP2009117570A (en) * | 2007-11-06 | 2009-05-28 | Sanyo Electric Co Ltd | Photoelectric conversion device |
| JP2011085625A (en) * | 2009-10-13 | 2011-04-28 | Toppan Printing Co Ltd | Camera module and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2600867B2 (en) | 1997-04-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |