JP2681979B2 - Manufacturing method of color separation filter - Google Patents

Description

TECHNICAL FIELD The present invention relates to a color separation filter for a solid-state imaging device represented by a CCD (charge coupled device) used in the heart of a color television camera such as a VTR.

Specifically, in a type in which a color separation filter layer is provided directly on the light-receiving part of a solid-state image sensor, a light-shielding layer that blocks unnecessary light from the outside and prevents optical flare and fogging is formed on the side surface of the filter. The present invention relates to a method for manufacturing a color separation filter for a solid-state image sensor.

<Prior Art> FIG. 4 is an explanatory diagram of a solid-state imaging device using a conventional color separation filter (a side surface does not have a light shielding layer).

According to this, the light receiving portion (2) of the CCD (1) is attached via the adhesive layer (3). The CCD (1) is configured to be able to transmit an electric signal relating to an image to the outside of the solid-state image pickup package (6) via the conducting wire (4) and the lead frame (5). Light rays that have passed through a lens shape (not shown) of the camera are incident on this solid-state image pickup device, but as shown in the figure, the flare prevention plate (8) is provided on the lower surface of the sealing glass plate (7). Are provided in the peripheral portion and are designed to block unnecessary light rays that are obliquely incident from the outside.

When a light ray is incident from an oblique direction, the light ray is incident from the side surface of the transparent substrate (9) of the color separation filter (2) and causes flare and fog phenomena. To prevent this, the flare prevention plate (8) is used. It was necessary.

The flare prevention plate (8) as described above needs to be aligned and mounted before the sealing glass plate (7) is mounted. With the miniaturization of the solid-state image pickup device, the work is becoming extremely difficult.

<Problems to be Solved by the Invention> In view of the above-mentioned conventional techniques, the present invention does not attach a flare prevention plate to a solid-state image sensor, but physically deposits a flare prevention light-shielding film on the side surface of the color separation filter itself. It is intended to be attached by the method, by the physical vapor deposition method,
Thus, it is possible to prevent the filter layer of the liver and kidney from being damaged, and also to prevent the cutting process from being disturbed.

<Means for Solving the Problems> That is, the present invention forms a plurality of color separation filters by forming at least a color separation filter layer in a desired pattern with a predetermined number of colors on one surface of a glass transparent substrate,
On this color separation filter surface side, a protective coating resin layer and a synthetic resin pressure-sensitive adhesive tape are laminated and coated in this order, and each color separation filter is individually cut on the synthetic resin pressure-sensitive adhesive tape, and then the intervals between the color separation filters are expanded. After that, a light-shielding layer is formed on the surface of the synthetic resin adhesive tape and the side surface of the color separation filter by any one of the vacuum deposition method, the sputtering method, and the ion plating method, and then the synthetic resin adhesive tape is peeled off. It is a method for producing a characteristic color separation filter.

When the light-shielding layer is a metal, an electroless plating method can be considered as a forming method, but in view of the complexity of the steps of cleaning, degreasing, sensitization, activation and plating, and the fact that the material that can be plated is limited, Compared with the vacuum vapor deposition method, the sputtering method, and the ion plating method, which will be described below, there are major negative points.

An example of the color filter for color separation obtained by the manufacturing method of the present invention will be described in detail with reference to FIG.
It has a thickness of about 1.0 mm, and the material is quartz glass.
Ordinary glass represented by low expansion glass, borosilicate glass or soda lime glass is used.

In this way, the filter layer (11) for color separation is provided on one surface of the glass transparent substrate (10). The filter layer (11) is, as is known in JP-B-52-17375 and JP-B-52-17376, a thin film obtained by photo-curing a light-sensitive material of a water-soluble resin such as gelatin, glue, and casein with a dye. There is a dyed organic filter layer.
Of course, an inorganic interference filter layer formed by alternately stacking high-refractive index thin films and low-refractive index thin films of about 10 to 20 layers as exemplified by O ₂ —SiO ₂ can also be adopted.

The filter layer (11) has a thickness of about 10 μm or less, and in FIG. 1, the thickness thereof is greatly exaggerated as compared with the transparent substrate (10). Moreover, although it is not clear from FIG. 1, a desired number of colors, for example, two colors of cyan and yellow or three colors of red, green and blue correspond to a desired pattern, that is, the shape of the light receiving portion of the solid-state image sensor. It is provided by. Often transparent substrates (10)
Not only the filter layer (11) for color separation on one side of
An overcoat layer for protecting the surface of the filter layer (11) is added, or a light-shielding layer is provided in the gap between or around the filter layers of each color, and is transparent to the filter layer (11). There are few examples of color separation filters that consist only of the substrate (10).

However, it goes without saying that such additional elements for the filter layer (11) are conventionally known, and the present invention is applicable to all of these conventionally known color separation filters.

A metal, an inorganic material or an organic material is formed on the side surface of the color separation filter shown in FIG. 1 by any one of the vacuum deposition method, the sputtering method and the ion plating method. The material of the metal is selected from nickel, aluminum, chromium, titanium, copper, iron, silver, gold and the like. Further, examples of these metal compounds include nitrides, oxides, and carbides. Inorganic substances are elements such as carbon and silicon,
Pigments such as phthalocyanine blue are candidates for organic substances.

The manufacturing method of the color separation filter for a solid-state image sensor according to the present invention will be described below in detail with reference to FIGS.

As shown in FIG. 2 (a), the color separation filter for solid-state imaging device is called “multi-sided attachment”, and at the filter manufacturing stage, a color separation filter layer (on the upper surface of one large transparent substrate (10 a). There is a step of forming a large number of 11) and then cutting each piece. Immediately before this cutting, as shown in FIG. 2 (a), the color-separated filter layer (11) was prepared by multi-sided attachment, and a protective coating resin layer (13) was applied to the upper surface to cover the filter layer (11). , Further attach the synthetic resin adhesive tape (19). An extensible film layer (15) such as a vinyl chloride resin film having an adhesive layer (14) is attached to the lower surface. FIG. 2B shows a state in which a cutting groove (16) is formed between the color separation film layers (11) by a dicing device or the like. As is already clear, the protective coating layer (13) and the synthetic resin adhesive tape (19) prevent the filter layer (11) from being contaminated by the cutting coolant and the glass scraps generated during cutting. is there.
Then, as shown in FIG. 2 (c), a force is applied to the stretchable film membrane (15) so as to spread it to both sides as shown by the arrow in the figure, so that the width of the cutting groove (16) is increased. Enlarge the groove (16) '. In this state, the color separation filter (18) cut into individual pieces has a wide space between the side surfaces thereof, so that cleaning of this portion can be easily performed.

After thoroughly washing with water and drying, a metal inorganic substance or an organic substance is formed on the side surface by a vacuum deposition method, a sputtering method, or an ion plating method. In this method, the vacuum vapor deposition method may be either the EB vapor deposition method or the resistance heating method, and it may be used properly depending on the material. In addition, as the sputtering method, a cathode sputtering method, a bipolar sputtering method, or the like can be selected, and as the ion plating method, many methods such as a Mattox method, a high frequency excitation method, an ion cluster beam method, or an arc discharge method can be applied. is there.

Approximately several hundred Å of the above-mentioned metal, inorganic or organic substance on the side of the color separation filter by any one of these methods
A few μ is formed, but at this time, the synthetic resin adhesive tape (1
9) These substances also adhere to the surface. After that, the individual color separation filters (18) are peeled off from the stretchable film membrane (15) having an adhesive layer, and then the protective film (13) and the synthetic resin adhesive tape (19) are peeled off to obtain a second film. As shown in Figure (e), individual color separation filters (18)
By using one of the above-mentioned various methods on the side surface thereof, a light-shielding layer (12) made of a metal, an inorganic material, or an organic material is obtained.

In some cases, performing ion bombardment before the vacuum deposition method or ion plating method or performing reverse sputtering before the sputtering method to clean the substrate is effective in increasing the adhesion of the light shielding layer. It is a means.

<Function> In the present invention, a light-shielding layer can be provided only on the side surface of the color separation filter by a physical vapor deposition method, and two layers of a protective coating resin layer and a synthetic resin adhesive tape are provided to protect the color separation filter layer. Since the structure is adopted, the inconvenience that the deposited metal or metal compound penetrates to the filter layer is avoided.

 Hereinafter, embodiments of the present invention will be described.

<Example 1> On a transparent substrate made of Pyrex glass (manufactured by Corning, USA) having a thickness of 1.0 mm and a diameter of 10 cm, 24 polygonal filter layers each having a side length of about 10 mm were attached by a known method to 24 pieces. , A coating material that becomes an easily peelable coating film on the surface filter side "Siritecto II: product name manufactured by Controline Inc. in the United States"
Is applied and dried to form a protective coating layer film. Next, a vinyl chloride-based synthetic resin adhesive tape (VD-8: Nitto Denko Co., Ltd. product name) was further attached. Subsequently, the stretchable tape SPV-224 (trade name of Nitto Denko Corporation) having an adhesive layer provided on one side of a stretchable polyvinyl chloride film and the lower surface of the transparent substrate are attached to each other, and the result is shown in FIG. ) State. Then, a cutting machine using a 600-mesh resin blade was used to form a cutting groove from the surface, and the end portion of the stretchable tape was pulled to obtain the state shown in FIG. 2 (c). Next, aluminum was vapor-deposited by a vacuum vapor deposition method under the conditions shown in Table 1 so that the side surface had a film thickness of 3000 Å.

After that, the stretchable tape on the back surface of the color separation filter, the protective film coating layer on the front surface, and the adhesive tape were peeled off to obtain a color separation filter for a solid-state image sensor in which an aluminum layer was applied only on the side surface. . This aluminum layer had a value of 3.5 ± 0.5 on a Macbeth densitometer and had satisfactory adhesive strength.

<Example 2> In exactly the same manner as in Example 1, a multi-faceted filter layer was formed on a Pyrex glass having a thickness of 0.5 mm and a diameter of 10 cm, and the state of FIG. Nickel was vapor-deposited under the conditions shown in Table 2 by the ion plating method so that the side surface would have a film thickness of 2500Å. Then, the stretchable tape adhering to the back surface of the color separation filter and the protective coating layer and the adhesive tape on the surface were peeled off to obtain a color separation filter for a solid-state image sensor having a nickel layer only on the side surface. . This nickel layer had a value of 3.0 ± 0.5 on a Macbeth densitometer, and the adhesive strength was also satisfactory.

<Example 3> In exactly the same manner as in Example 1, a multi-layered filter layer was formed on a transparent substrate, and the state of FIG. Chromium was sputtered so that the side surface had a thickness of 2500 Å. After that, the stretchable tape and the protective film on the surface attached to the back surface of the color separation filter were peeled off to obtain a color separation filter for a solid-state image sensor having a chrome layer only on the side surface. This chrome layer is 3.0 ± 0.5 with a Macbeth densitometer
And the adhesive strength was satisfactory.

<Effects of the Invention> As described above, when the color separation filter of the present invention has a filter layer for color separation formed on one glass transparent substrate by multi-face attachment, the color separation filter is additionally added during the cutting process. By setting the vapor deposition process by any one of the vacuum vapor deposition method, the sputtering method, and the ion plating method, the light shielding layer can be applied only to the desired area on the side surface of the filter, which is easy to manufacture. Is an industrially highly utilized one.

Further, according to the present invention, in the physical vapor deposition method, what protects the color separation filter layer is composed of a synthetic resin adhesive tape and a protective coating resin layer. It does not penetrate into the filter layer. In addition, since the adhesive layer of the adhesive tape contacts the color separation filter via the coating resin layer, the viscous material of the adhesive layer also prevents the color separation filter from being contaminated.

In addition, if the synthetic resin adhesive tape is adhered as in the present invention and the cutting process is performed, it is possible to prevent an accident that the resin component of the protective coating resin layer extends like threads and adheres to the side surface of the glass transparent substrate. Although the reason why it can be prevented is not clear, the fact that the thread-shaped resin component does not adhere to the side surface is very convenient when the light-shielding film is formed on the side surface in the subsequent step. In the state where the resin component adheres to the side surface, the vapor-deposited light-shielding film may be exfoliated later, but in the present invention, such defects are drastically reduced.

FIG. 3 shows the color separation filter for a solid-state image pickup device according to the present invention incorporated in a CCD type solid-state image pickup device. As is apparent from the figure, since the side surface is provided with the light-shielding film (12), it is not necessary to provide a flare prevention plate on the solid-state imaging device, and the solid-state imaging device can be manufactured extremely easily in terms of work.

As described above, the method for manufacturing the color separation filter of the present invention is extremely excellent in practical use in combination with the convenience of manufacturing and the convenience of incorporating the solid-state imaging device.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing an embodiment of a color separation filter for a solid-state image sensor according to the present invention. FIGS. 2A to 2E are cross-sectional views showing an example of the method of manufacturing the color separation filter according to the present invention in the order of steps. FIG. 3 is an explanatory view showing a state in which the color separation filter according to the present invention is incorporated in a solid-state image pickup device. FIG. 4 is an explanatory diagram showing an example of a conventional solid-state imaging device. (10) …… Transparent substrate (11) …… Filter layer (12) …… Light shielding layer

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP 62-52503 (JP, A) JP 62-56901 (JP, A) JP 60-205502 (JP, A)

Claims (1)

(57) [Claims] 1. A plurality of color separation filters are formed by forming at least one color separation filter layer in a desired pattern with a predetermined number of colors on one surface of a glass transparent substrate, and on the color separation filter surface side, After laminating and covering the protective coating resin layer and the synthetic resin adhesive tape in this order, and individually cutting each color separation filter from the synthetic resin adhesive tape,
Expand the space between the color separation filters, and then form a light-shielding layer on the surface of the synthetic resin adhesive tape and the side surface of the color separation filter by any means of vacuum deposition, sputtering, and ion plating. A method for producing a color separation filter, which comprises peeling a synthetic resin adhesive tape.