JP2011107021A - Inspection method and device of hot-melt adhesion section - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection method of a hot-melt adhesion section, determining an adhesion quality of the hot-melt adhesion section so as not to be affected by various differences, such as that of a board thickness of a corrugated cardboard, that of a manufacture maker or a manufacture lot of hot melt, that of an ambient temperature, humidity or the like in a packaging chamber, and that of an environment like a season. <P>SOLUTION: The inspection method receives heat energy radiated from an adhesion section by hot melt 7 of a corrugated cardboard case 10 or the like by an infrared camera 2, and takes an image signal of the infrared camera 2 into an image processing device 3, to thereby determine adhesion quality of the adhesion section. A position of one spot among a plurality of hot-melt application positions of the adhesion section is defined as a reference position, and the adhesion quality of the adhesion section is determined by whether a value of a relative ratio between an image of a residual position and an image of the reference position, agrees with a value set beforehand in the image processing device 3. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  According to the present invention, thermal energy radiated from an adhesive portion by hot melt adhesive paste (hereinafter referred to as hot melt) such as a corrugated cardboard case is received by an infrared camera, and an image signal of the infrared camera is taken into an image processing apparatus to perform the adhesion. The present invention relates to an inspection method and apparatus for determining whether or not a part is adhered.

  Conventionally, an inspection apparatus that receives thermal energy radiated from a hot melt bonded portion such as a cardboard case by an infrared camera, takes an image signal of the infrared camera into an image processing device, and determines whether the bonded portion is bonded or not is Proposed. (Patent Document 1)

Japanese Patent Laying-Open No. 2004-20243 (FIG. 1)

According to Patent Document 1, thermal energy radiated from a measurement object having an adhesive part by hot melt is received by an infrared camera, and an image signal of the infrared camera is taken into an image processing unit, so that the adhesive state of the adhesive part is obtained. To determine.
However, in the technique of Patent Document 1, a thermal image from a plurality of locations of an adhesion portion of an object to be measured such as one cardboard case is binarized into a high temperature portion and a low temperature portion, and the area of the high temperature portion, etc. The size of the adhesive part is judged by the size, the change in thermal conductivity from the inner surface to the outer surface due to the difference in the thickness of the corrugated cardboard, the change in the thermal conductivity due to the difference in the manufacturer or manufacturing lot of the hot melt, There is a risk that the thermal image may change greatly even if the amount of hot melt is the same at the plurality of locations, affected by changes in the atmospheric temperature and humidity of the packaging chamber. Also, the cardboard caser packed in the cardboard case may change the speed depending on the transport amount of the package product flowing from the upstream, and the amount of hot melt sprayed from the hot melt spray nozzle increases at low speed. On the other hand, since the speed is reduced at high speed, it may be difficult to determine whether the amount of hot melt is normal even if the area is normal on the image. Further, for example, if the operation is performed in the summer under the conditions set in the winter, the images that can be detected are greatly different, and there is a fear that a defective product cannot be determined or that a normal product is determined to be defective.
That is, the thermal image is analyzed and processed from the absolute viewpoint of high temperature and low temperature rather than relative, so even if the amount of hot melt is the same at the plurality of locations, the image changes greatly and adhesion of the hot melt bonded portion There is a risk that the pass / fail judgment will be crazy.

  The present invention has an effect on differences in the thickness of corrugated board, differences in hot melt manufacturers or manufacturing lots, differences in packaging room temperature and humidity, environmental conditions such as seasons, etc. An object of the present invention is to provide a method and an apparatus for inspecting a hot melt bonded portion that can determine whether or not the hot melt bonded portion is bonded.

The present invention solves the above problems by the following means.
(1) A first means for inspecting a hot melt bonded portion is a method in which thermal energy radiated from a hot melt bonded portion such as a cardboard case is received by an infrared camera, and an image signal of the infrared camera is transmitted to an image processing apparatus. In the inspection method of taking in and determining the quality of the adhesion of the adhesion portion, one of the plurality of hot melt application positions of the adhesion portion is set as a reference position, and the image of the remaining position and the image of the reference position are Whether or not the adhesive portion is bonded is determined based on whether or not the relative ratio value is a value set in advance in the image processing apparatus.
(2) The method for inspecting a hot melt adhesive portion of the second means is the method for inspecting a hot melt adhesive portion of the first means, wherein two or more positions among the plurality of hot melt application positions of the adhesive portion. Is used as a reference position, and an image of one of the reference positions is compared with an image of the remaining position of the position group to which the reference position belongs by changing the reference position. Whether the relative ratio value of the image of the remaining position of the position group to which the reference position belongs and the image of the reference position is a value set in advance in the image processing device, respectively, It is characterized by determining simultaneously the quality of adhesion | attachment part about two or more adhesion parts.

(3) A method for inspecting a hot-melt bonded portion according to a third means is the method for inspecting a hot-melt bonded portion according to the first and second means, wherein the reference is included in a plurality of hot-melt application positions of the bonded portion. Whether the relative ratio between the image at the remaining position and the image at the reference position with respect to the reference position is sequentially changed and the value set in advance in the image processing apparatus. Is determined in the case of the sequentially switched reference position, and all or some of the determinations are comprehensively determined to determine whether the bonding portion is bonded or not.
(4) A fourth means for inspecting a hot melt bonded portion is the method for inspecting a hot melt bonded portion according to the first to third means, wherein a plurality of hot melt applications of the bonded portion are applied to the image processing apparatus. It is characterized in that it is set in advance so that the image at each position is multiplied by a correction coefficient.
(5) A method for inspecting a hot melt adhesive portion of a fifth means is the method for inspecting a hot melt adhesive portion of the first to fourth means, wherein a plurality of hot melt applications of the adhesive portion are applied to the image processing apparatus. It is characterized in that a minimum passing score of an image at each position is set in advance.

(6) A sixth means for inspecting a hot melt bonded portion is an infrared camera that receives thermal energy radiated from a hot melt bonded portion such as a cardboard case, and an image signal of the infrared camera. An inspection apparatus for a hot-melt bonded portion provided with an image processing device for determining whether or not the bonded portion is bonded by melt, wherein the image processing device is arranged at one position among a plurality of hot-melt application positions of the bonded portion. The reference position, and whether or not the relative ratio between the image at the remaining position and the image at the reference position is a value set in advance in the image processing apparatus, determines whether the bonding portion is bonded. The present invention is characterized in that it is an image processing apparatus for judging pass / fail.
(7) A seventh means for inspecting a hot melt bonded portion is the same as the sixth means for inspecting a hot melt bonded portion, wherein the image processing device is connected to a plurality of hot melt application positions of the bonded portion. Two or more positions are set as reference positions, and an image of one of the reference positions is compared with an image of the remaining positions of the position group to which the reference position belongs, by changing the reference position, The value of the relative ratio between the image at the remaining position of the position group to which the reference position belongs and the image at the reference position with respect to the reference position is a value preset in the image processing apparatus. The image processing apparatus is characterized in that whether or not the bonding portion is bonded is determined by two or more bonding portions at the same time.

(8) An inspection device for a hot melt adhesive portion of an eighth means is the inspection device for a hot melt adhesive portion of the sixth and seventh means, wherein the image processing device is connected to a plurality of hot melt coatings of the adhesive portion. Among the positions, the reference position is sequentially switched, and a value of a relative ratio between the image at the remaining position and the image at the reference position with respect to the reference position is set in advance in the image processing apparatus. An image processing apparatus that determines whether or not the value is a value in the case of the sequentially switched reference position, and comprehensively determines all or some of the determinations to determine whether the bonding portion is bonded or not. It is characterized by that.
(9) The ninth means for inspecting the hot melt bonded portion is the sixth to eighth means for inspecting a hot melt bonded portion, wherein the image processing apparatus is connected to a plurality of hot melt applied portions of the bonded portion. The image processing apparatus is set in advance so as to multiply the image at each position by a correction coefficient.
(10) The tenth means for inspecting a hot melt bonded portion is the same as the sixth to ninth means for inspecting a hot melt bonded portion, wherein the image processing device is a plurality of hot melt applied portions of the bonded portion. The image processing apparatus is characterized in that the minimum acceptable score of the image at each position is set in advance.

  According to the first and sixth aspects of the present invention, thermal energy radiated from a hot melt bonded portion such as a cardboard case is received by an infrared camera, and an image signal of the infrared camera is taken into an image processing apparatus to In the inspection method and apparatus for determining whether the bonding is good or bad, one of the plurality of hot melt application positions of the bonding portion is set as a reference position, and an image at the remaining position and the image at the reference position are relative to each other. By applying an inspection method and apparatus for determining whether or not the adhesive portion is bonded based on whether the value of the ratio is a value set in advance in the image processing apparatus, application of hot melt Even if the area of the part looks large or small, it will be judged relative evaluation, so the difference in cardboard thickness, hot melt manufacturer or manufacturing lot Ambient temperature and the difference of humidity of the packaging room, even if there is a difference of environmental seasons like, as less sensitive to these differences, has the effect that it is checking the bonding state of the hot-melt adhesive part.

  The present invention according to claims 2 and 7 is the hot melt bonded portion inspection method and apparatus according to claims 1 and 6, wherein two or more hot melt application positions of the bonded portion are positioned. Is used as a reference position, and an image of one of the reference positions is compared with an image of the remaining position of the position group to which the reference position belongs by changing the reference position. Whether the relative ratio value of the image of the remaining position of the position group to which the reference position belongs and the image of the reference position is a value set in advance in the image processing device, respectively, Inspection for determining the adhesion of the adhesive part on the side surface of the corrugated cardboard case, and corrugated cardboard by using the inspection method and apparatus for simultaneously determining the adherability of the adhesive part for two or more adhesive parts Over scan of a test of a plurality of locations adhesive portion is different such testing determines the quality of the adhesion of the adhesive portion of the top surface can be performed simultaneously, also has the effect that it is possible to improve the inspection accuracy.

  The present invention according to claim 3 and claim 8 is the hot melt bonded portion inspection method and apparatus according to claim 1, 2 and 6 and 7, wherein the reference position among a plurality of hot melt application positions of the bonded portion. Are sequentially switched, and whether or not the value of the relative ratio between the image at the remaining position and the image at the reference position with respect to the reference position is a value set in advance in the image processing apparatus. In the inspection method and apparatus, the determination is made in the case of the sequentially switched reference positions, and all the cases or a part of the determinations are comprehensively determined to determine whether or not the bonding portion is bonded. Thus, it is possible to improve the inspection accuracy of the hot melt bonded portion as compared with the case where the determination is based on only one reference position.

  According to a fourth and ninth aspect of the present invention, there is provided a method and an apparatus for inspecting a hot melt bonded portion according to claims 1 to 3 and 6 to 8, wherein the image processing apparatus includes a plurality of hot melt bonded portions. With the inspection method and apparatus set in advance so that the image at each position of the application position is multiplied by the correction coefficient, when the thermal image is captured by the infrared camera, the center of the infrared camera and the measured surface of the cardboard case Even if the center is off and there is a bias in the amount of infrared rays received from multiple hot-melt application positions of the bonding part, it is possible to reasonably determine whether or not the bonding part is bonded, and improve the inspection accuracy. It has the effect that it can be made.

  The present invention according to claims 5 and 10 is the hot melt bonded portion inspection method and apparatus according to any one of claims 1 to 4 and claim 6 to 9, wherein the image processing apparatus includes a plurality of hot melt bonded portions. By setting the pass score minimum value of the image at each position of the application position in advance, it can be determined that the image is rejected when the image does not have any hot melt applied. Thus, it is possible to further rationalize the bonding quality of the bonding portion based on a relative ratio with the image at the reference position, and to improve the inspection accuracy.

It is a top view of the corrugated cardboard caser which has the inspection apparatus of the hot-melt-bonding part concerning this invention. It is an AA view of FIG. It is a figure explaining the adhesion state of a hot-melt adhesion part. It is a figure explaining the case where it has a hot-melt-bonding part on the top | upper surface and side surface of a cardboard case, and is a perspective view. It is a figure explaining the case where the center of an infrared camera and the center of a cardboard case have shifted | deviated.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments. In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art or those that are substantially the same.

(Mode for carrying out the invention)
A first embodiment of the present invention will be described with reference to FIG. 1, FIG. 2, and FIG.
FIG. 1 is a plan view of a corrugated cardboard caser having an inspection apparatus for hot melt bonded portions according to the present invention.
FIG. 2 is an AA view of FIG.
FIG. 3 is a view for explaining the bonding state of the hot-melt bonding portion.

  In the figure, the cardboard caser 5 has a conveying device 12 for conveying the cardboard case 10 in the direction of arrow F while wrapping around a package product (not shown), and the flap 10a of the cardboard case 10 is opened as shown. As shown in the drawing, the flap 10a is ejected to the flap 10f and the flap 10g that have already been folded, and the flap 10a is moved along with the conveyance of the corrugated cardboard case 10 by the conveying device 12. It comprises a guide 9 which is folded in a twisted shape and bonded to the flap 10f and the flap 10g, and a hot melt bonded portion inspection device 1 for checking the bonding state of the bonded portion by the hot melt 7.

The inspection apparatus 1 for the hot melt bonded portion is a thermal energy radiated from an application position 7a (herein, a plurality of application positions are collectively referred to as 7a) of the hot melt 7 sprayed by the spray nozzle 8. Detecting the presence of the corrugated cardboard case 10 and the image processing apparatus 3 that receives the thermal image signal of the infrared camera 2 that receives light (herein also referred to as infrared rays) And a signal line 6 connecting the infrared camera 2 and the image processing device 3, and a signal line 6 a connecting the detector 4 and the image processing device 3. ing.
The infrared camera 2 is arranged so that the center C0 of the infrared camera 2 and the center C1 of the surface to be measured of the corrugated cardboard case 10 are at the same position when capturing a thermal image. Is set so that the entire surface of the corrugated cardboard case 10 that is the object to be measured can be covered.

Next, the operation of the hot melt bonded portion inspection apparatus 1 according to the first embodiment will be described.
Since the hot melt 7 injected to the flap 10f and the flap 10g is heated, the corrugated cardboard case 10 as the object to be measured is thermally conducted to the surface of the flap 10a that is folded and bonded to the flap 10f and the flap 10g. The portion of the application position 7a is hotter than the surroundings, and the thermal energy radiated from the portion is received by the infrared camera 2 from the application position 7a of the cardboard case 10 by scanning at a predetermined period, and a thermal image signal Is output to the image processing apparatus 3.

The image processing device 3 analyzes the magnitude of the thermal energy from the application position 7a based on the thermal image signal from the infrared camera 2 synchronized with the detection signal of the cardboard case 10 by the detector 4. Whether or not the bonded portion is bonded is determined based on whether the size of the bond, the amount of difference from the reference point of the bonding arrangement, and the like are preset values. In addition, the magnitude | size of adhesion | attachment may be made into the length of adhesion | attachment, and is good also as an area of adhesion | attachment.
The value set in advance in the image processing apparatus 3 is a high temperature obtained by binarizing the high temperature portion and the low temperature portion using the allowable range of the temperature distribution of the bonded portion, the maximum temperature and the minimum temperature, the average temperature, or a threshold value. The area of the part, the hot melt application position, and the like are taken up, and are determined based on the hot melt adhesive strength of the corrugated cardboard case 10 obtained by calculation, experiment, or experience.

  Here, the bonding state of the hot-melt bonded portion and the bonding quality determination (hereinafter also referred to as “passing determination”) will be described with reference to FIG. 3. FIG. 3A illustrates each of the plurality of application positions 7 a. In the four positions from position 7a1 to position 7a4 (hereinafter simply referred to as 7a1, 7a2, 7a3, 7a4), the size and arrangement of adhesion are in accordance with predetermined reference values. That is, the size of adhesion (here, only the size in the longitudinal direction is considered for convenience of explanation) is Y at all four locations, and the arrangement of the adhesion is the leading position of 7a1 and 7a3 as shown in the figure. Indicates that S1 is inward from y1 and y2, and L is inward from x1, and the rear end positions of 7a2 and 7a4 are S inward from y1 and y2 and L inward from x2. Yes.

  In the present embodiment, when the infrared camera 2 captures a thermal image, the center C0 of the infrared camera 2 and the center C1 of the surface to be measured of the cardboard case 10 are arranged at the same position. The thermal energy radiated from the 7a1, 7a2, 7a3, and 7a4 is received by the infrared camera 2 in the same state at four locations.

  Next, in FIG. 3B, among the four locations 7a1 to 7a4, 7a1 and 7a2 have the same bonding size and bonding arrangement as in FIG. 3A, and 7a3 has the bonding size. When Ys = 0.7Y, the position of bonding is S from y1 to the inside, Ls = 0.7L from x1 to the inside, 7a4 is the size of bonding, Yb = 1.3Y, and bonding The arrangement of shows the state where the rear end position is S from y1 to the inside and L from x2 to the inside.

  Also, FIG. 3C shows that 7a1 has the same adhesion size and arrangement as in FIG. 3A, 7a2 has 0 adhesion, that is, no hot melt, and 7a3 has adhesion. The size of Y is Y, and the position of adhesion is Sb = 1.3S from y1 to the inside, Lb = 1.3L from x1 to the inside, and 7a4 is Yb = 1.3Y. Thus, the arrangement of the adhesion shows a state in which the rear end position is Sb = 1.3S from y1 to the inside and Lb = 1.3L from x2 to the inside.

  Further, FIG. 3D shows that the bonding size of 7a1 is Yss = 0.5Y, the bonding arrangement is Lbb = 2L, and the bonding size and bonding arrangement of all three places from 7a2 to 7a4 are shown. Shows the same state as in FIG.

The image processing apparatus 3 compares the image signal of 7a1 with the image signals of the remaining three locations 7a2, 7a3, and 7a4 when the 7a1 of one of the four application positions is used as a reference, and the comparison value Is within the set range, the adhesion state of the hot melt adhesion portion is determined to be acceptable.
Here, the comparison of the image signals is the size and arrangement of the adhesion. Regarding the size, the size of 7a2, 7a3, 7a4 is 0.7Y to 1.3Y with respect to the size Y of 7a1 at the reference position. If it is within the range, the size is acceptable. Regarding the arrangement of the adhesive, 7a2, 7a3 and 7a4 are in the range of 0.7S to 1.3S and 0.7L to 1 with respect to S and L of the reference position 7a1, respectively. .. If the range is 3L, the arrangement of the adhesive is set to pass, and if both the size and arrangement of the adhesive are acceptable, the bonding state of the hot melt bonded portion is determined to be acceptable. Yes.

Therefore, in the case of the setting as described above, FIG. 3A is of course passed, but the bonding state of the hot melt bonded portion of FIG. 3B is passed, and FIG. 3C does not have the image of 7a2. Therefore, the adhesion state of the hot melt bonded portion is determined to be unacceptable.
Further, in FIG. 3D, the size of the adhesion is 7a1 which is the reference position, Y = 0.5Y, and three places 7a2 to 7a4 are Y. Therefore, the size of 7a2 to 7a4 and the reference position 7a1 Is a reference position 7a1 from y2 to S, x1 to Lbb = 2L, and 7a2, 7a3, and 7a4 are respectively Y2 from S and x2 to L Since y1 is S and x1 to L, and y1 is S and x2 to L, the ratio between the arrangement of 7a2, 7a3 and 7a4 and the arrangement of the reference position 7a1 is 1.0 for S. However, L is 0.5, and the pass / fail judgment from 7a2 to 7a4 is rejected from both the size of adhesion and the arrangement of adhesion.
In the case of FIG. 3D, 7a2 to 7a4 are normally normal in both the size and the arrangement of the adhesive, and 7a1 is abnormal in both the size and the arrangement of the adhesive as described above. The pass / fail judgment is rejected because of the setting. Since 7a1 is originally an unacceptable content, the pass / fail judgment based on the value of the relative ratio between the reference position 7a1 and the remaining positions is correct.

  In the above description, the pass / fail judgment setting of the bonding state of the bonding portion is set as an example, the bonding size is within the range of 0.7Y to 1.3Y with respect to the reference position size described above, and the bonding arrangement is the above The case where the reference position in the description is within the range of 0.7S to 1.3S and the range of 0.7L to 1.3L has been shown, but the present invention is not limited to this. .

In the above description, a case where 7a1 is determined as the reference position has been described, but any of 7a2, 7a3, and 7a4 can be used as the reference position instead. In this case, in FIG. 3D, any one of 7a2 to 7a4 is set as a reference position, so that 7a1 is determined to be unacceptable, and FIG. 3D is also rejected.
The reference position may be determined in advance or may be determined arbitrarily.

  As described above, the inspection of the adhesion state of the hot melt bonded portion is determined by relative comparison between the image signal and the image signal at the remaining positions with any one of the four application positions as a reference position. Therefore, even if the area of the hot melt application part appears large or small, it can be reasonably judged whether the adhesive state is acceptable, and further, the difference in the thickness of the corrugated cardboard, the manufacturer of the hot melt or the production lot Even if there is a difference in the atmosphere of the packaging room, a difference in the atmospheric temperature and humidity, and a difference in the environment such as the season, the pass / fail judgment of the adhesion state can be made reasonably so as not to be influenced by the difference.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIG.
FIG. 4 is a perspective view illustrating a case where a hot-melt adhesive portion is provided on the top and side surfaces of the cardboard case.
In FIG. 4, the same structure as that of the first embodiment is denoted by the same symbol, and redundant description is omitted.

In the figure, an inspection device 21 for a hot melt bonded portion according to the second embodiment is an infrared camera 2, an image processing device 23, a detector (not shown) (the same as the detector 4 of FIG. .), A signal line 26 connecting the infrared camera 2 and the image processing device 23, and a signal line 26a connecting the detector (not shown) and the image processing device 23.
The infrared camera 2 is arranged so that the center of the infrared camera 2 and the center in the transport direction of the cardboard case 10p are at the same position when capturing a thermal image, and the infrared light reception is measured. In order to receive the thermal energy radiated from the hot melt bonded portions of both the side surface 10b and the top surface 10c of the corrugated cardboard case 10p, as shown in the drawing, from the diagonally upper side with respect to the side surface 10b and the top surface 10c, The infrared light receiving angle β is set so as to cover both the side surface 10b and the top surface 10c.

In the figure, a corrugated cardboard case 10p has a side face 10b folded in the direction of arrow B, and is bonded to a flap (not shown) that has already been folded by hot melt 7 at hot melt application positions 7b1, 7b2, 7b3, 7b4. The surface 10c is folded in the direction of the arrow C, and is bonded to the already-folded flap (not shown) by the hot melt 7 at the hot melt application positions 7b5, 7b6, 7b7, 7b8.
Here, the flap folding structure and the like are similar to those of the first embodiment, and the description thereof is omitted.
Moreover, since the magnitude | size of adhesion | attachment and arrangement | positioning of adhesion | attachment in each hot-melt application position are similar to the description in above-mentioned FIG. 3, detailed description is abbreviate | omitted.

  The image processing device 23 uses 7b1 as a reference position among a plurality of hot melt application positions, and the value of the relative ratio between the images at the remaining positions 7b2, 7b3, 7b4 and the image at the reference position 7b1 Whether or not the bonding of the side surface 10b is determined to be good or not is determined based on whether or not the value is set in advance in the device 23. At the same time, the image of the remaining positions 7b6, 7b7, and 7b8 and the reference are set with 7b5 as the reference position. It is set so as to determine whether or not the adhesive portion of the top surface 10c is bonded based on whether the value of the relative ratio with the image at the position 7b5 is a value preset in the image processing device 23. Yes.

Next, the operation of the hot melt bonded portion inspection apparatus 21 according to the second embodiment will be described.
Here, for convenience of explanation, it is assumed that the image takes up only the size of adhesion.
Also, in the figure, the size of bonding at 7b2, 7b3, 7b4 is the same as the size of bonding at the reference position 7b1, the size of bonding at 7b6, 7b7 is the same as the size of bonding at the reference position 7b5, The size of adhesion is 1.3 times the size of adhesion at the reference position 7b5.

  The image processing apparatus 23 compares the values of the relative ratios of the adhesion magnitudes of 7b2, 7b3, and 7b4 and the adhesion magnitude of the reference position 7b1, respectively, and the adhesion magnitudes and reference values of 7b6, 7b7, and 7b8, respectively. Comparing the value of the relative ratio with the magnitude of adhesion at the position 7b5, if the value of the ratio is within the range of 0.7 to 1.3, the adhesion state of the hot melt bonded portion is determined to be acceptable. The adhesive state of the hot melt adhesive portion is determined to be acceptable for both the side surface 10b and the top surface 10c of the cardboard case 10p.

  As described above, two or more positions (here, two places, 7b1 and 7b5 are selected) out of a plurality (eight places here) of hot melt application positions, and one of the positions is selected. The image of the reference position 7b1 and the remaining images 7b2, 7b3, 7b4 are compared. At the same time, the reference position is changed from 7b1 to 7b5, and the image of the reference position 7b5 is compared with the remaining images of 7b6, 7b7, 7b8. The relative ratio between the remaining position image and the reference position image with respect to each of the reference positions 7b1 and 7b5 is a value preset in the image processing device 23, respectively. By determining whether or not the adhesion of the bonding portion is good, it is possible to determine whether or not the hot melt bonding portions on both the side surface 10b and the top surface 10c of the cardboard case 10p are good. Constant and can be inspected at the same time.

  In the above description, the reference position of the side surface 10b is selected as 7b1, but the present invention is not limited to this, and 7b2, 7b3 or 7b4 may be selected, and the reference position of the top surface 10c is selected as 7b5. However, the present invention is not limited to this, and it is needless to say that 7b6, 7b7, or 7b8 may be selected.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. 1, FIG. 2, and FIG.
Here, in FIG. 1, symbols related to the third embodiment are indicated by (). The same structure as that of the first embodiment is denoted by the same symbol, and detailed description thereof is omitted.
In the figure, a hot melt bonded portion inspection apparatus 41 according to the third embodiment includes an infrared camera 2, an image processing apparatus 43, a detector 4, a signal line 46 connecting the infrared camera 2 and the image processing apparatus 43, The signal line 46 a connects the detector 4 and the image processing device 43.

  The image processing apparatus 43 determines the relative ratio between the image at the remaining position and the image at the reference position 7a1 with 7a1 as the reference position, and then instantaneously sets the image at the remaining position and the reference as 7a2 as the reference position. Judgment is made at a relative ratio with respect to the image at the position 7a2, and then a determination is made at a relative ratio between the image at the remaining position and the image at the reference position 7a3 with 7a3 as the reference position. 7a4 is set as a reference position, and the remaining position image and the reference position 7a4 image are determined at a relative ratio, and if all pass, the hot melt bonded portion is determined to pass. Has been.

Next, the operation of the hot melt bonded inspection apparatus 41 according to the third embodiment will be described.
7a1, 7a2, 7a3, and 7a4 are set at one position 7a1 as a reference position, and the relative ratio between the images 7a2, 7a3, and 7a4 and the image at the reference position 7a1 is set in the image processing device 43 in advance. After determining whether or not the value is the same, the reference position is sequentially changed from 7a1 to 7a2, then 7a3, and further to 7a4. The relative ratio, the relative ratio between the images at 7a1, 7a2, and 7a4 and the image at the reference position 7a3, and the relative ratio between the images at 7a1, 7a2, and 7a3 and the image at the reference position 7a4 are respectively the image processing. It is determined whether or not the value is set in advance in the device 43, and if all of these determinations are acceptable, it is determined that the bonding state of the bonded portion is acceptable.

In the above description, if all of the determinations in the case of the four reference positions (here, four) are acceptable, the bonding state of the bonding portion is determined to be acceptable. If a part (two or three) of the determinations in the case of the reference position of the place is not all (here, four) but passes (two or three), the bonding state of the bonded portion is determined to be acceptable. It can also be set in advance.
As described above, according to the inspection method by the hot melt bonded portion inspection apparatus 41 that determines by sequentially switching the reference position, the inspection accuracy of the bonding state of the hot melt bonded portion is improved as compared with the case where the reference position is determined by one place. To do.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to FIG. This will be described in part with reference to FIG.
FIG. 5 is a diagram for explaining a case where the center of the infrared camera is shifted from the center of the cardboard case.
In FIG. 5, the same structures as those in the first and second embodiments are denoted by the same symbols, and redundant description is omitted.

In the figure, the hot melt bonded portion inspection apparatus 31 according to the fourth embodiment includes an infrared camera 2, an image processing apparatus 33, a detector 4, a signal line 36 connecting the infrared camera 2 and the image processing apparatus 33, The signal line 36 a connects the detector 4 and the image processing device 33.
When the infrared camera 2 captures a thermal image, the center C0 of the infrared camera 2 and the center C1 of the surface to be measured of the cardboard case 10 are at the same center position with respect to the height direction of the cardboard case 10. However, the cardboard case 10 is displaced as shown in the drawing direction. In this case, the angle γ of the infrared light reception is set so that the infrared light reception can cover the entire surface having the bonding portion of the corrugated cardboard case 10 as the object to be measured.

  In the above description, for convenience of explanation, when capturing a thermal image, the center C0 of the infrared camera 2 is the same as the center C1 of the surface to be measured of the cardboard case 10 and the height direction of the cardboard case 10. Although the case where the cardboard case 10 is shifted as shown in the drawing has been described with respect to the conveyance direction of the cardboard case 10, the cardboard case 10 is shifted with respect to the height direction. The same applies to the case where the same is true, and a duplicate description is omitted.

  The image processing device 33 uses one position as a reference position among a plurality of application positions (using FIG. 3; four positions in FIG. 3) of the bonding portion, and images of the remaining positions and the reference positions. Whether or not the bonding portion is bonded is determined based on whether or not the value of the ratio relative to the image is a value set in advance in the image processing apparatus 33. An operation for multiplying the image by a correction coefficient is set.

Next, the operation of the hot melt bonded inspection apparatus 31 according to the fourth embodiment will be described.
In the case of the present embodiment, when the infrared camera 2 captures a thermal image, the center C0 of the infrared camera 2 and the center C1 of the surface to be measured of the cardboard case 10 are in the height direction of the cardboard case 10. The images of 7a1 and 7a3 are the same as the images of 7a2 and 7a4, even if the size of the adhesion is the same. The intensity of infrared light reception is different, and the images of 7a2 and 7a4 have a smaller amount of infrared light reception than the images of 7a1 and 7a3. Here, it is assumed that the amount of infrared light received by 7a1 and 7a3 is 1.0, and the amount of infrared light received by 7a2 and 7a4 is 0.9 times the amount of infrared light received by 7a1 and 7a3.

  Here, the image processing device 33 multiplies the images of 7a2 and 7a4 by a correction factor of 0.9 to set the calculation so that the magnitude of adhesion as the images of 7a1 to 7a4 can be compared at the same level. If the reference position is 7a3, the relative proportions of the adhesion magnitudes of 7a1, 7a2 and 7a4 and the adhesion magnitude of the reference position 7a3 are corrected appropriately, and the pass / fail status of the hot melt adhesion portion is confirmed. Judgment is made.

  As described above, the image processing device 33 is configured such that, in a state where the correction coefficient is multiplied by 7a1 to 7a4, the value of the relative ratio between the images of 7a1, 7a2, and 7a4 and the image of the reference position 7a3 It is set so as to determine whether or not the bonding portion is bonded depending on whether the value is within the range of 0.7 to 1.3 set in advance in the device 33, and the infrared camera 2 is Even when the center C0 of the infrared camera 2 and the center C1 of the surface to be measured of the cardboard case 10 are shifted from the conveyance direction of the cardboard case 10 when capturing the thermal image, The quality of adhesion can be determined.

(Fifth embodiment)
Next, a fifth embodiment will be described with reference to FIG.
Here, in FIG. 4, the symbols related to the fifth embodiment are indicated by []. The same structure as that of the first to fourth embodiments is denoted by the same symbol, and detailed description thereof is omitted.
In the figure, a hot melt bonded portion inspection apparatus 51 according to the fifth embodiment is the same as the infrared camera 2, the image processing apparatus 53, and a detector (not shown) (detector 4 in FIG. 1. .), A signal line 56 connecting the infrared camera 2 and the image processing device 53, and a signal line 56 a connecting the detector (not shown) and the image processing device 53.

  As in the case of the fourth embodiment, when the infrared camera 2 captures a thermal image, the center of the infrared camera 2 and the center perpendicular to the conveying direction of the cardboard case 10p are shifted. As shown in the figure, the infrared rays can be received from the hot melt bonded portions of both the side surface 10b and the top surface 10c of the corrugated cardboard case 10p which is the object to be measured. In addition, the angle δ for receiving infrared rays is set so that both the side surface 10b and the top surface 10c can be covered from obliquely above the side surface 10b and the top surface 10c.

  The image processing device 53 compares the relative ratio values of the image sizes of 7b2, 7b3, and 7b4 with the image size of the reference position 7b1, and if the comparison value is within a predetermined range. The bonded state of the hot melt bonded portion of the side surface 10b is determined to be acceptable, and the relative ratio values of the image size of 7b6, 7b7, 7b8 and the image size of the reference position 7b5 are compared, and the comparison value is obtained. Is set in advance so that the bonding state of the hot melt bonded portion of the top surface 10c is determined to be acceptable, but the operation of multiplying the images of 7b1 to 7b8 by the correction coefficient is performed. Is set.

Next, the operation of the hot melt bonded inspection apparatus 51 according to the fifth embodiment will be described.
Here, for convenience of explanation, it is assumed that the image takes up only the size of adhesion.
Further, in the figure, the magnitudes of adhesion from 7b1 to 7b8 are the same as those in the second embodiment.

When capturing the thermal image, the center of the infrared camera 2 is shifted from the center perpendicular to the conveyance direction of the cardboard case 10p, so that each application position of the side surface 10b and the top surface 10c of the cardboard case 10p. However, the received thermal energy is different even with the same adhesion size.
Therefore, when looking at 7b1 to 7b4 on the side surface 10b, the thermal energy of 7b1 to 7b4 received by the infrared camera 2 has a difference in the light receiving angle even though the adhesion magnitude of 7b1 to 7b4 is actually the same. Therefore, it is not possible to assume that the magnitudes of adhesion as images 7b1 to 7b4 are all the same.

Here, as in the case of the fourth embodiment, the image processing device 53 multiplies the images 7b1 to 7b4 on the side surface 10b by the correction coefficient, and maintains the same adhesion size as the images 7b1 to 7b4. The calculation is set so that the levels can be compared, and the bonding ratio of the hot melt bonded portion is determined to be acceptable by making the relative ratio between the bonding size of 7b2, 7b3 and 7b4 and the bonding size of the reference position 7b1 appropriate. Judgment is made.
The same calculation is set for the top surface 10c, and a detailed description thereof is omitted.

  As in the fourth embodiment and the fifth embodiment, the calculation by multiplying the correction coefficient is not limited to the correction of the difference in the light receiving angle at which the thermal energy is received by the infrared camera 2, but also the cardboard caser. 5 of the surrounding environment, for example, can be applied to the case of correcting the difference in environment such as when the 7b1 and 7b2 are easily cooled by wind, and the like in the first to third embodiments. It can be applied to all.

(Sixth embodiment)
Next, a sixth embodiment will be described with reference to FIG. 1, FIG. 2, and FIG.
Here, in FIG. 1, symbols related to the sixth embodiment are indicated by []. The same structure as that of the first embodiment is denoted by the same symbol, and detailed description thereof is omitted.
In the figure, the hot melt bonded portion inspection device 61 according to the sixth embodiment includes an infrared camera 2, an image processing device 63, a detector 4, a signal line 66 connecting the infrared camera 2 and the image processing device 63, The signal line 66 a connects the detector 4 and the image processing device 63.

  One of the image processing devices 63 determines the relative ratio between the image at the remaining position and the image at the reference position 7a1 with 7a1 as the reference position. The adhesion state is set so as to be determined as acceptable, and the other is set as the minimum acceptable score of the image at the reference position 7a1.

Next, the operation of the sixth hot melt bonded portion inspection apparatus 61 will be described.
Here, description will be made with reference to FIG. 3, and 7a1 is set as a reference position.
In FIG. 3 (a), the adhesion size of 7a2, 7a3 and 7a4 (in this section, for convenience of explanation, only the adhesion size is taken for convenience of explanation) and the adhesion size of the reference position 7a1. The relative ratio values are both 1.0. In FIG. 3B, the relative ratio values of the adhesion sizes 7a2, 7a3, and 7a4 and the adhesion size of the reference position 7a1 are 1. 0, 0.7 and 1.3.

In FIG. 3C, the values of the relative ratios of the adhesion size of 7a2, 7a3, 7a4 and the adhesion size of the reference position 7a1 are 1.0, 0, and 1.3, respectively.
In FIG. 3D, the values of the relative ratios of the adhesion size of 7a2, 7a3, 7a4 and the adhesion size of the reference position 7a1 are 2.0, 2.0, and 2.0, respectively.

  The image processing device 63 is hot if the size of the adhesive is one in which the size of 7a2, 7a3, 7a4 is in the range of 0.7Y to 1.3Y with respect to the size of the reference position 7a1. The adhesion state of the melt adhesion part is set to pass, and in the case of FIG. 3 (a) and FIG. 3 (b), the adhesion state of the hot melt adhesion part is determined to be acceptable, FIG. 3 (c), In the case of FIG. 3D, the bonding state of the hot melt bonded portion is determined to be unacceptable, but the other is the bonding of the hot melt bonded portion when the bonding size at the reference position 7a1 is 0.6 or less. Since the state is set so as to be determined as rejected, in the case of FIG. 3D, the bonding state of the hot melt bonded portion is determined as rejected also from this point.

In the above description, the case where 7a1 is set as the reference position has been described, but 7a2, 7a3, or 7a4 may be used as the reference position instead of 7a1.
Further, in the above description, the case where the minimum acceptable score is set for the image at the reference position 7a1 has been described. However, the minimum acceptable score may be set for all or part of the images 7a1 to 7a4.

  As described above, the method and apparatus for inspecting a hot melt bonded portion includes a position of one of a plurality of hot melt application positions of the hot melt bonded portion as a reference position, and an image of the remaining position and the reference position. Since the quality of the adhesion is judged based on the relative ratio value to the image of the image, all hot melt application positions have the same ratio and the amount of hot melt adhesion has decreased, or the position has the same ratio. However, the probability that an abnormality will occur at the same ratio among a plurality of hot melt injection nozzles of an actual corrugated cardboard caser is extremely low.

  Even if a plurality of hot melt spray nozzles may have an abnormality at the same ratio, the amount of hot melt adhesion may be reduced at the same ratio or the position may be shifted at the same ratio. Possible possibilities include a phenomenon in which hot melt is not applied at all due to failure of the hot melt device, forgetting to turn on the power, etc., and in this regard, the image processing device 63 passes the size of the image at the reference position. By setting the point minimum value as a condition, it can be determined that the hot melt is not applied at all and it can be determined to be rejected, and it can be reasonably determined whether or not the adhesive state is acceptable.

1, 21, 31, 41, 51, 61 Inspection apparatus 2 for hot melt bonded portion Infrared camera 3, 23, 33, 43, 53, 63 Image processing apparatus 4 Detector 5 Cardboard caser 7 Hot melt 7a (of hot melt ) Application position (generic name)
7a1-7a4, 7a5-7a8 (hot melt) application position (each position)
8 (hot melt) spray nozzle 10, 10p cardboard case

Claims (10)

  In the inspection method of receiving thermal energy radiated from a hot melt bonded portion such as a cardboard case by an infrared camera and taking an image signal of the infrared camera into an image processing apparatus to determine whether the bonded portion is bonded or not. Among the plurality of hot melt application positions of the bonding portion, one position is set as a reference position, and a value of a relative ratio between an image at the remaining position and the image at the reference position is set in the image processing apparatus in advance. A method for inspecting a hot melt bonded portion, wherein whether or not the bonded portion is bonded is determined based on whether or not the value is a predetermined value.   2. The inspection method for a hot melt bonded portion according to claim 1, wherein two or more positions among the plurality of hot melt application positions of the bonded portion are set as reference positions, and an image of one of the reference positions and the image Comparison with the image of the remaining position of the position group to which the reference position belongs is performed by changing the reference position, and for each reference position, the image of the remaining position of the position group to which the reference position belongs and the reference position Whether or not the bonded portion is bonded is determined simultaneously for two or more bonded portions based on whether or not the relative ratio value with the image is a value set in advance in the image processing apparatus. A method for inspecting a hot melt bonded portion.   3. The method for inspecting a hot melt adhesive portion according to claim 1 or 2, wherein the reference position is sequentially switched among a plurality of hot melt application positions of the adhesive portion, and an image of the remaining position with respect to the reference position is selected. In the case of the sequentially switched reference position, it is determined whether or not the value of the relative ratio with the image at the reference position is a value set in advance in the image processing apparatus. A method for inspecting a hot-melt bonded portion, wherein a comprehensive determination is made in the case of or a part of the case to determine whether the bonded portion is bonded or not.   4. The method for inspecting a hot melt bonded portion according to claim 1, wherein the image processing apparatus is configured to multiply a correction coefficient to an image at each of a plurality of hot melt application positions of the bonded portion. 5. A method for inspecting a hot melt bonded portion, characterized in that it is set in advance.   5. The inspection method for a hot melt bonded portion according to claim 1, wherein the image processing apparatus is provided with a minimum passing score of an image at each of a plurality of hot melt application positions of the bonded portion. A method for inspecting a hot melt bonded portion, which is set in advance.   An infrared camera that receives thermal energy radiated from a hot melt bonded portion such as a cardboard case, and an image processing device that takes in an image signal of the infrared camera and determines whether the hot melt bonded portion is good or bad In the inspection apparatus for a hot melt bonded portion, the image processing device is configured such that one of the plurality of hot melt application positions of the bonded portion is a reference position, and an image of the remaining position and the image of the reference position are Hot melt bonding characterized in that the image processing apparatus determines whether the bonding portion is good or not based on whether a relative ratio value is a value set in advance in the image processing apparatus. Inspection equipment.   7. The inspection apparatus for a hot melt adhesive portion according to claim 6, wherein the image processing device has two or more positions as reference positions among a plurality of hot melt application positions of the adhesive portion, and one of the positions. The image of the reference position and the image of the remaining position of the position group to which the reference position belongs are compared by changing the reference position, and the remaining position of the position group to which the reference position belongs for each reference position. Depending on whether or not the relative ratio value between the image and the image at the reference position is a value set in advance in the image processing apparatus, whether or not the bonding portion is bonded is determined at two or more locations. An inspection apparatus for a hot melt bonded portion, characterized in that the image processing device is configured to simultaneously determine the bonded portion.   8. The inspection apparatus for a hot melt adhesive portion according to claim 6 or 7, wherein the image processing device sequentially switches the reference position among a plurality of hot melt application positions of the adhesive portion with respect to the reference position. In the case of the sequentially switched reference positions, it is determined whether or not the value of the relative ratio between the image at the remaining position and the image at the reference position is a value preset in the image processing apparatus. An inspection apparatus for a hot-melt bonded portion, characterized in that an image processing apparatus that comprehensively determines all or some of the determinations to determine whether or not the bonded portion is bonded is used.   9. The hot melt bonded portion inspection apparatus according to claim 6, wherein the image processing device multiplies an image at each of a plurality of hot melt application positions of the bonded portion by a correction coefficient. An inspection apparatus for a hot melt bonded portion, characterized in that the image processing apparatus is set in advance.   The inspection apparatus for a hot melt bonded part according to any one of claims 6 to 9, wherein the image processing apparatus is configured to obtain a minimum passing score of an image at each of a plurality of hot melt application positions of the bonded part. An inspection apparatus for a hot melt bonded portion, characterized in that the image processing apparatus is set in advance.

Images