JP2011103374A - Laser processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser processing apparatus that is less likely to cause a false operation in which a hole that has already been processed is reprocessed even when human-induced mistakes or the like occur. <P>SOLUTION: The laser processing apparatus includes: a laser irradiating means 3 for processing a substrate 1 with a laser beam; a means 4 for recognizing a position recognition mark 2 of the substrate 1 as an image; and a decision means 5 for determining the position recognition mark. A printed-wiring board is manufactured by using the laser processing apparatus. A processing confirmation mark 19 is provided in an end of the position recognition mark 2, thereby solving the false operation in which the processed hole is falsely reprocessed even if the hole is too small to determine whether the hole has already been processed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a laser processing apparatus for use in manufacturing a printed wiring board on which electronic components such as surface mount components, particularly bare chips, are mounted.

  Due to recent demands for higher functionality, smaller size, and lighter electronic devices such as information terminals and communication terminals, high integration and high speed technologies for semiconductors are rapidly progressing.

  For this reason, products capable of high-density wiring and high-density mounting are also demanded for printed wiring boards on which electronic components such as bare chips for achieving miniaturization and weight reduction are mounted.

  In order to enable high-density wiring and high-density mounting, printed wiring boards are required to reduce the wiring layer line width and line-to-line width, and also to make smaller via hole diameters for via holes used for connection between wiring layers. Yes. As a printed wiring board satisfying these requirements, a multilayer printed wiring board using a build-up method has been put into practical use and is widely used.

  An example of a method for manufacturing a build-up type printed wiring board is shown in FIGS.

  First, the inner layer substrate 20 is manufactured using a copper-clad laminate in which copper foil is bonded to both surfaces of a glass epoxy substrate, for example, on the base material. After drilling, a copper clad laminate is used in which the conductive paste 22 is filled and the copper foils on the front and back sides are conductively connected.

  An inner layer substrate 20 having a wiring pattern 23 formed on both sides of the copper-clad laminate by a photo process and etching is prepared {see FIG. 7A}.

  Next, the insulating base material 24 and the copper foil 25 are laminated on the front and back surfaces of the inner layer substrate 20 and heated and pressed with a vacuum hot press machine to produce a four-layer substrate 21 (see FIG. 7B).

  Next, an opening 26 is formed at a predetermined position of the front and back copper foils 25 by a photo process and etching so that the insulating base material 24 is exposed {see FIG. 7 (c)}.

  Next, the copper foil 25 provided with the opening 26 is used as a conformal mask to irradiate a laser to form a hole 27 for an interlayer connection via hole {see FIG. 7 (d)}. Since the insulating resin residue may adhere to the upper surface of the inner wiring pattern 23 that becomes the bottom surface of the hole 27 after laser drilling, the inside of the hole can be cleaned with chemicals such as potassium permanganate. desirable.

  Next, in order to establish an interlayer connection between the inner layer wiring pattern 23 and the outer layer copper foil 25, a copper plating layer is formed.

  First, the electroless copper plating layer 28 is formed on the entire front and back surfaces of the four-layer substrate 21 and the inner surface of the via hole 27 to impart conductivity {see FIG. 7 (e)}. Then, an electrolytic copper plating layer 29 is formed on the electroless copper plating layer 28 {see FIG. 7 (f)}.

  Next, an etching resist 30 is formed on the front and back surfaces of the four-layered substrate 21 connected between the layers by a photo process {see FIG. 8G}.

  Next, an unnecessary copper layer is removed with an etchant such as cupric chloride to form the via hole 31 and the outer wiring pattern 32, and then the etching resist 30 is peeled off with a solution such as sodium hydroxide {FIG. h) See}.

  Thereafter, if necessary, the solder resist 33 may be applied leaving the component mounting portion on the surface of the four-layer board 21 {see FIG. 8 (i)}.

  Finally, as a finishing process, a gold plating process or a water-soluble heat-resistant preflux process is performed for the purpose of rust-proofing copper exposed portions such as lands that serve as connection electrodes during component mounting.

  FIG. 8 (j) shows a gold plating process. First, an electroless nickel plating layer 34 is formed on the exposed copper portion, and an electroless gold plating layer 35 is formed thereon to obtain a four-layer printed wiring board. Can do.

  As prior art document information related to the invention of this application, for example, Patent Document 1 and Patent Document 2 are known.

Japanese Patent Laid-Open No. 11-298146 JP 2000-233291 A (Laser Device)

  In the manufacturing process of the printed wiring board described in FIG. 7C and FIG. 7D, the hole 27 is drilled by the laser processing apparatus after the opening 26 is formed. The hole diameter is usually formed around 100 μm.

  For this reason, it is not possible to determine with the naked eye whether the substrate is after drilling or before drilling by just looking at the substrate.

  In addition, carbon dioxide lasers are often used for drilling, but YAG lasers and excimer lasers that are capable of drilling with smaller diameters are also being investigated. It has become difficult to determine with the naked eye whether it is the previous substrate.

  At the manufacturing site, since it is difficult to visually confirm the end of drilling, if there is a substrate after completion of drilling near the input side of the laser processing device, the substrate after completion of drilling is mistakenly lasered. There was also a case where an artificial defect that the machine was put into the processing apparatus and processed again was generated.

  In addition, when an abnormality or the like of equipment occurs during the hole machining, the laser machining apparatus is usually temporarily stopped to remove the cause of the abnormality, and then the hole machining is resumed. In this case, there is a possibility that the hole that has been drilled is processed in duplicate.

  Specifically, when 15 sheets of products are made on a single substrate, the equipment was stopped during processing of the 12th sheet. Therefore, after inspection and adjustment, when processing is resumed, processing starts from the 13th sheet. Although it should be done, since it processed from the 11th sheet accidentally, the case where the same hole is processed twice corresponds.

  That is, since the substrate {see FIG. 7 (c)} in which the opening portion 26 is formed is almost entirely covered with the copper foil 25 except for the opening portion 26, how many sheets the hole processing has been completed. It is difficult to discriminate with the naked eye. Therefore, it is considered that the above-described problems occur due to artifacts.

  When such a defect occurs, the hole bottom of the hole processed in duplicate receives more impact by laser processing, and as a result, a pin hole 36 is generated in the copper foil which is the wiring pattern 23 on the hole bottom. {See Fig. 9 (a)}.

  Even if the copper plating is performed in the presence of the pinhole 36, the bottom of the hole is completely covered with the copper plating layer, and the pinhole is rarely lost. As shown in FIG. There are many cases where 36 remains.

  Further, since electrical continuity is provided even in the state where the pinhole 36 is generated, it is not determined as a disconnection failure in the electrical inspection process of the printed wiring board, and further, in the appearance inspection process of the printed wiring board. However, since it is difficult to detect pinholes at the bottom of small-diameter holes with current equipment, there is a possibility that they will be used as electronic equipment after being shipped as a good circuit board. It was.

  When the electronic component 37 is mounted on the printed wiring board in which the pinhole 36 is generated, gas is generated from the conductive paste or base material directly under the pinhole 36 through the pinhole 36 to join the mounting electronic component and the printed wiring board. In some cases, voids 39 are generated in the solder 38 that is to be removed.

  Compared with the state of mounting the electronic component 37 on a normal printed wiring board {FIG. 10 (a)}, when the void 39 is generated in a relatively large form as shown in FIG. 10 (b). In addition, a short circuit (short) 40 occurs between adjacent solder joints, and the presence of voids 39 in the solder 38 reduces the bonding strength between the electronic component for mounting and the printed wiring board, and decreases the connection reliability. There was also a possibility that the problem of bringing about.

  The present invention solves the above-described problems, and provides a laser processing apparatus that does not cause a problem of processing a hole that has already been processed even if a human error or equipment abnormality occurs. It aims at manufacturing a printed wiring board using it.

  In order to solve the above problems, the present invention comprises a laser irradiation means for processing a workpiece with laser light, a means for recognizing a position recognition mark of the workpiece, and a means for determining the position recognition mark. The laser irradiation means includes an operation of forming a processing hole in a workpiece with reference to the position recognition mark and an operation of forming a processing confirmation mark at an end of the position recognition mark, and determines the position recognition mark. The means for performing is to provide a laser processing apparatus characterized by confirming that the processing confirmation mark does not exist, and to manufacture a printed wiring board.

  Specifically, a plurality of end portions of the position recognition mark are lasered immediately after the position recognition mark provided on the substrate surface for laser beam alignment is recognized by the CCD camera when drilling with a laser processing apparatus. A program for turning is added to the laser processing data. As a result, processing confirmation marks are formed on the position recognition marks provided at least at the four corners of the processed sheet. By setting such position recognition marks so that the CCD camera cannot recognize them, overlapping processing is performed. Can be prevented.

  By manufacturing a printed wiring board using the laser processing apparatus of the present invention, it is not possible to determine whether or not a hole has been drilled in a laser drilling process for a via hole for interlayer connection on a high-density board or a bare chip mounting board. It is possible to solve the problem of overlapping machining with respect to a processed hole that has occurred when drilling such a small-diameter hole.

  As a result, it is possible to solve the above-described conventional problems and form a highly reliable conductive hole for interlayer connection, and stably mount components on the printed wiring board.

Schematic which shows the structure of the laser processing apparatus in embodiment of this invention The figure which shows the operation | movement flow of the laser processing apparatus in the embodiment Plan view of substrate used in laser processing apparatus in same embodiment Process sectional drawing which shows the manufacturing process of the printed wiring board using the laser processing apparatus in the embodiment Detailed view of substrate position recognition mark in the same embodiment The figure which shows 1 process of the manufacturing process of the printed wiring board in the embodiment Process sectional drawing which shows the manufacturing method of the conventional printed wiring board Process sectional drawing which shows the manufacturing method of the conventional printed wiring board Sectional drawing which shows the subject in the manufacturing method of the conventional printed wiring board Sectional view showing problems in mounting components on a conventional printed wiring board

(Embodiment)
Embodiments of the present invention will be described below with reference to the drawings.

  First, FIG. 1 is a schematic view showing the configuration of the laser processing apparatus of the present invention. In FIG. 1, a laser processing apparatus forms a fine hole in a workpiece such as a substrate 1 by irradiation with a laser beam. The configuration of the laser processing apparatus of the present invention will be described below.

  Laser irradiation means 3 for processing the substrate 1 as a workpiece with laser light, image recognition means 4 for recognizing the position recognition mark 2 provided on the substrate 1, and determination means for determining the state of the position recognition mark 2 And 5.

  The laser irradiation means 3 includes a laser oscillator 6, a reflecting mirror 7, a galvanometer 8, a lens 9, and an XY table 10 for placing a workpiece.

  That is, the laser beam is emitted from the laser oscillator 6, converted in direction by the reflecting mirror 7, and then guided from the next reflecting mirror 7 in the direction of the galvanometer 8 including the XY biaxial galvanometer mirror. Then, after the irradiation direction is changed by the operation of the galvanometer 8 to be incident and focused on the fθ lens 9, the laser beam is irradiated onto the substrate 1 positioned on the XY table 10.

  A feature of the laser processing apparatus of the present invention is that the laser irradiation means 3 will be described later with reference to FIGS. 4 and 5 at the end of the position recognition mark 2 in addition to the operation of forming a processing hole in the substrate 1 with the position recognition mark 2 as a reference. Only when the determination means 5 recognizes the state of the position recognition mark 2 before forming the processing hole in the substrate 1 and the processing confirmation mark 19 does not exist. A processed hole is formed in the substrate 1.

  After the formation of the processing hole is completed, the processing confirmation mark 19 is formed by removing a part of the end portion of the position recognition mark 2 by laser processing to form a defective portion.

  In other words, when the determination unit 5 recognizes the state of the position recognition mark 2 and the processing confirmation mark already exists before forming the processing hole in the substrate 1, the processing hole to the workpiece by the laser irradiation unit 3 is formed. Means for stopping the forming operation is included.

  Note that the determination means 5 for the position recognition mark 2 may include stop display means (not shown) such as a patrol light or a buzzer for indicating the stop of the operation when the operation of forming the machining hole in the workpiece is stopped. desirable.

  In addition, the substrate 1 as a workpiece in the present embodiment is composed of a plurality of processing regions, and each processing region includes a position recognition mark 2, and the position recognition mark 2 of the substrate 1 is image-recognized. The means and the means for determining the position recognition mark 2 are means for each processing region.

  Specifically, when the substrate 1 is irradiated with the laser beam, the position recognition mark 2 in the first processing region is confirmed by the image recognition means 4 and the judgment means 5 confirms that the processing confirmation mark does not exist. Then, irradiation is performed while scanning a predetermined region of the processing region on the substrate 1 in the XY directions.

  When the irradiation of the processing region is completed, the processing confirmation mark 19 is formed by removing a part of the end portion of the position recognition mark by laser processing to form a defective portion.

  Then, after the XY table 10 is moved in the X or Y direction or the X and Y directions to reach the next processing region, the substrate 1 is laser processed again. Similarly, laser processing is performed for each processing region.

The operation flow of the laser processing apparatus of the present invention is as shown in FIG.
1. The position recognition mark 2 is confirmed by the image recognition means 4.
2. The determination means 5 confirms the presence or absence of the processing confirmation mark 19.
3a. When the processing confirmation mark 19 does not exist, a processing hole is formed by laser processing.
4a. A processing confirmation mark 19 is formed at the end of the position recognition mark by laser processing.
3b. When the processing confirmation mark 19 exists, the laser processing operation is stopped,
4b. Activate the stop display means.

  Next, the production of a printed wiring board using the laser processing apparatus of the present invention will be described below.

  First, FIG. 3 shows conformal in laser processing of position recognition marks 2 and interlayer connection holes in at least four corners of a multilayer substrate 1 in which an insulating base material and copper foil are laminated on the front and back of the inner layer substrate and formed by vacuum hot pressing. A plan view showing a mask opening 13 formed therein. The manufacturing method is as follows.

  First, an inner substrate 15 having wiring patterns 14 formed on both sides is prepared {see FIG. 4A}.

  Next, an insulating base material 16 such as a B-stage prepreg and the like and a copper foil 17 are laminated on the outermost layer of the inner layer substrate 15 and heated and pressed with a vacuum hot press machine to form a multilayer copper clad having a four-layer structure. A laminated substrate is produced {see FIG. 4B}. In addition, in order to realize high wiring accommodation, it is possible to use a multilayer substrate in which layers are connected by a conduction hole filled with a conductive paste. This will be described using the inner layer substrate.

  Next, an opening 13 is formed at a predetermined position of the copper foil 17 on the front and back sides of the copper-clad laminated substrate so that the insulating base 16 is exposed by a photo process and etching, and a position recognition mark 2 is also formed simultaneously {FIG. See 4 (c)}. The opening shape and size of the position recognition mark 2 are not particularly limited as long as they can be recognized by a CCD camera as the image recognition means 4 of the laser processing apparatus (for example, Φ1.0 mm). The opening 13 is preferably formed immediately above the wiring pattern 14 of the inner layer substrate 15. As a result, the interlayer connection between the surface layer and the inner layer substrate can be achieved by the presence of the wiring pattern 14 of the inner layer substrate 15 at the bottom of the hole for interlayer connection described later.

  Next, the position recognition marks 2 at the four corners of the multilayer substrate 1 are image-recognized and detected by a CCD camera (not shown) of the laser processing apparatus, and the expansion / contraction and distortion of the substrate are determined from the distance between the plurality of position recognition marks. The occurrence state is detected and corrected by multiplying by a dimensional correction coefficient (scale factor) according to the contraction and distortion of the substrate as necessary.

  The step of recognizing the position recognition mark 2 detects only the position recognition mark 2 in the image recognition area, and confirms that there is no existing processing confirmation mark (details shown in FIG. 5). It is a process to do.

  Confirming the presence / absence of the processing confirmation mark includes determining whether or not the next step can be performed, and the step of recognizing and determining the position recognition mark 2 is a characteristic of the present invention. One of the configurations.

  Next, after confirming that the aforementioned processing confirmation mark does not exist, a processing confirmation mark 19 is formed at the end of the position recognition mark 2 as shown in FIG. The laser beam is moved directly above the opening 13 provided at the position and irradiated with the laser to form a hole 18 for interlayer connection. This step is performed for each front and back surface, and holes 18 are formed on both the front and back surfaces.

  Thereafter, a multilayer printed wiring board is obtained through the same steps as those shown in FIG.

  As shown in the production of the printed wiring board using the laser processing apparatus of the present invention, when the interlayer connection hole 18 is formed, the processing confirmation mark 19 is necessarily formed at the end of the position recognition mark 2. Will be formed.

  The position recognition mark of the printed wiring board of the present invention is that the processing confirmation mark 19 is formed at the end of the position recognition mark.

  The position recognition mark is image-recognized, the presence / absence of the processing confirmation mark 19 is confirmed, and whether or not the next process can be executed is determined. If the presence of the processing confirmation mark 19 is confirmed, By not processing the connection hole, the conventional problem can be solved.

  That is, the laser processing to the insulating base 16 exposed in the opening 13 formed immediately above the wiring pattern 14 of the inner layer substrate 15 forms a hole 18 and the laser beam is also irradiated onto the wiring pattern 14 of the inner layer substrate 15. However, when a printed wiring board is manufactured using the laser processing apparatus of the present invention, laser beam irradiation is not performed repeatedly, and pinholes are generated in the wiring pattern 14 of the inner layer substrate 15. Nor.

  It is effective to increase the number of position recognition marks in order to further improve the drilling position accuracy.

  In the example of FIG. 3, a single multilayer substrate 1 is composed of a plurality of individual multilayer substrates 1a, and more specifically, a case where the individual multilayer substrate 1a is multi-planar made of 15 sheets is shown. By providing the position recognition marks 2a at the four corners of each individual multi-layer substrate 1a, it becomes possible to make holes at more accurate positions.

  The arrows shown in FIG. 3 indicate the order of laser drilling, and laser drilling is performed for each individual multilayer substrate 1a from the upper right end to the upper left end, from the middle right end to the middle left end, and from the lower right end to the lower left end. It shows that it will be broken.

  Even in such a multi-chamfer configuration, the process of recognizing and determining the position recognition mark as described above is performed for each individual multilayer substrate, and whether or not the next process can be performed is determined based on the presence or absence of the processing confirmation mark. By doing so, it is possible to prevent duplicated hole processing.

  In the case shown in FIG. 3, when performing laser drilling of the individual multilayer substrate 1a of the first sheet (upper right corner of the drawing), the position recognition marks 2a to 2d as the position recognition marks are sequentially placed on a CCD camera (not shown). ), Positioning is performed, and a laser beam is moved to a predetermined position after being subjected to a dimensional correction coefficient (scale factor) corresponding to the contraction and distortion of the substrate to make a hole.

  In this step, immediately after the position recognition mark 2a is detected by the CCD camera and positioned, the copper foil at the end of the position recognition mark is irradiated with the laser a plurality of times, as shown in FIG. After the processing confirmation mark 19 is given to the mark, a laser is irradiated to the opening 13 provided in the conformal mask, which is a position where the hole should be originally drilled, to make a hole for interlayer connection.

  That is, by adding data to be processed a plurality of times to the copper-plated portion at the end of the position recognition mark 2a to the drilling data of the laser processing apparatus, the position recognition mark 2a of the individual multilayer substrate 1a that has been drilled once. The processing confirmation mark 19 is present at the end.

  Specifically, in the image recognition area (dotted line) of the CCD camera, when only the shape of the position recognition mark 2a is recognized as shown in FIG. 6A, an operation of irradiating the opening 13 with a laser is performed. If the processing confirmation mark 19 as shown in FIG. 6B is present so as to cause a recognition error, the individual multi-layer substrate or the multi-layer substrate that has been drilled is not processed in duplicate.

  Note that setting so as to cause a recognition error includes a case where the center point of the position recognition mark 2a cannot be correctly recognized, and the setting is relatively easy.

  The processing confirmation mark can be formed in a dot shape on the copper foil 17 at a location different from the end of the position recognition mark 2a. The laser processing energy can be reduced and formed easily, and the image recognition area of the CCD camera can be made the same as that of the position recognition mark 2a. This is also a desirable form in terms of operating efficiency.

  In particular, it is desirable not to make a hole in the insulating base material by irradiating a laser to a position where the exposed portion of the position recognition mark 2a is not exposed to the exposed insulating base material and irradiating a laser with a laser. . Thereby, image recognition can be stably performed by the CCD camera.

  Thus, according to the manufacture of the printed wiring board using the laser processing apparatus in the present embodiment, the following effects can be obtained.

  (1) At the site where printed wiring boards are manufactured, the space around the laser processing equipment is narrow, or there are many production processes, and the substrate that has been drilled and the substrate before drilling are messy around the laser processing equipment. In the past, there has been a possibility that a substrate that has already been drilled is mistakenly drilled again and damages the bottom of the hole.

  However, according to the present invention, even if a substrate that has been punched by mistake is set and activated in the laser processing apparatus, a processing confirmation mark is present at the end of the position recognition mark, so the CCD camera The center point of the position recognition mark cannot be recognized correctly, a recognition error is displayed on the operation screen of the laser processing apparatus, or a stop display means such as a patrol light or a buzzer indicating the stop of the operation is activated, and the laser processing apparatus Stops laser processing. Therefore, it does not occur that the holes that have been processed are overlapped.

  (2) In order to prevent duplicate processed products from being shipped as non-defective products in the electrical inspection process when the substrate set in the laser processing apparatus is temporarily stopped due to equipment abnormality during processing. Such a substrate in the middle of processing was disposed of.

  For example, if the multi-chamfering configuration is made up of 15 sheets of individual multi-layer substrates on one substrate, the equipment stops at the 12th sheet even if the 11th sheet is normally drilled, Since one of the substrates was discarded, all of the 15 individual multi-layer substrates were treated as defective products.

  However, according to the present invention, when removing the abnormality of the laser processing apparatus and restarting the processing, the processing confirmation mark exists at the end of the position recognition mark even if the processing is erroneously started with the sheet before the 12th. As a result, a recognition error occurs in the CCD camera and the equipment is stopped, so that there is no overlap processing.

  Even if processing is started from the 14th sheet, there are only 2 sheets of defects, the 12th sheet being processed and the 13th sheet not processed. Of course, if the processing is resumed from the 13th sheet, the defect is only one sheet in the 12th sheet being processed. In addition, since the sheet | seat in the middle of a process or an unprocessed sheet | seat does not have the via hole for conduction | electrical_connection, it is removed as a disconnection defect in the electrical inspection of a post process, Therefore It is not shipped as a product.

  From the above, even if the equipment is stopped during processing, duplicate processing due to human error does not occur, and defective products that are discarded are also targeted, and waste can be minimized.

  As described above, the laser processing apparatus of the present invention is capable of forming a hole that has been drilled even if a human error or equipment abnormality occurs in the process of manufacturing a printed wiring board such as a high-density board or a bare chip mounting board. Since it is not processed repeatedly, a printed wiring board provided with a highly reliable conduction hole for interlayer connection can be provided. Furthermore, since the defects to be discarded can be minimized, the industrial applicability of the present invention can be said to be great.

DESCRIPTION OF SYMBOLS 1 Board | substrate 1a Individual multilayer board | substrate 2, 2a-2d Position recognition mark 3 Laser irradiation means 4 Image recognition means 5 Judgment means 6 Laser oscillator 7 Reflector 8 Galvanometer 9 Lens 10 XY table 13 Opening part 14 Wiring pattern 15 Inner layer board 16 Insulation base Material 17 Copper foil 18 Hole 19 Processing confirmation mark

Claims (6)

Laser irradiation means for processing a workpiece by laser light;
Means for recognizing the position recognition mark of the workpiece;
Means for determining the position recognition mark,
The laser irradiation means includes an operation of forming a machining hole in a workpiece with the position recognition mark as a reference, and an operation of forming a processing confirmation mark at an end of the position recognition mark,
The laser processing apparatus according to claim 1, wherein the means for determining the position recognition mark is means for confirming that the processing confirmation mark does not exist. The means for determining the position recognition mark, if the processing confirmation mark already exists,
The laser processing apparatus according to claim 1, further comprising means for stopping an operation of forming a machining hole in the workpiece by the laser irradiation means. The operation of forming a processing confirmation mark at the end of the position recognition mark is as follows:
The laser processing apparatus according to claim 1, wherein the laser processing apparatus is an operation of removing a part of an end portion of the position recognition mark by laser processing to form a defect portion. The workpiece is composed of a plurality of processing areas, and each processing area is provided with a position recognition mark,
2. The laser processing apparatus according to claim 1, wherein the means for recognizing the position recognition mark of the workpiece and the means for determining the position recognition mark are means for each processing region. Laser irradiation means for processing a workpiece with laser light is as follows:
The laser processing apparatus according to claim 1, comprising a laser oscillator, a reflecting mirror, a galvanometer mirror, an XY table for mounting a lens and a workpiece. The means for determining the position recognition mark is:
3. The laser processing apparatus according to claim 2, further comprising stop display means for indicating a stop of an operation for forming a processing hole in the workpiece.

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