JP2011100916A5 - - Google Patents

Download PDF

Info

Publication number
JP2011100916A5
JP2011100916A5 JP2009255946A JP2009255946A JP2011100916A5 JP 2011100916 A5 JP2011100916 A5 JP 2011100916A5 JP 2009255946 A JP2009255946 A JP 2009255946A JP 2009255946 A JP2009255946 A JP 2009255946A JP 2011100916 A5 JP2011100916 A5 JP 2011100916A5
Authority
JP
Japan
Prior art keywords
electronic component
component
mounting structure
heat dissipation
passive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009255946A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011100916A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009255946A priority Critical patent/JP2011100916A/ja
Priority claimed from JP2009255946A external-priority patent/JP2011100916A/ja
Publication of JP2011100916A publication Critical patent/JP2011100916A/ja
Publication of JP2011100916A5 publication Critical patent/JP2011100916A5/ja
Pending legal-status Critical Current

Links

JP2009255946A 2009-11-09 2009-11-09 電子部品の放熱用実装構造 Pending JP2011100916A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009255946A JP2011100916A (ja) 2009-11-09 2009-11-09 電子部品の放熱用実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009255946A JP2011100916A (ja) 2009-11-09 2009-11-09 電子部品の放熱用実装構造

Publications (2)

Publication Number Publication Date
JP2011100916A JP2011100916A (ja) 2011-05-19
JP2011100916A5 true JP2011100916A5 (enExample) 2012-12-20

Family

ID=44191863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009255946A Pending JP2011100916A (ja) 2009-11-09 2009-11-09 電子部品の放熱用実装構造

Country Status (1)

Country Link
JP (1) JP2011100916A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5628378B1 (ja) * 2013-05-20 2014-11-19 スタンレー電気株式会社 Ｌｅｄランプ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2916628B2 (ja) * 1990-11-07 1999-07-05 イビデン株式会社 サーモカプラ
JP2001068877A (ja) * 1999-08-30 2001-03-16 Sharp Corp 電子回路装置

Similar Documents

Publication Publication Date Title
EP2884530A3 (en) Heat sink and heat dissipation system
EP2410563A3 (en) Stacked interconnect heat sink
JP2017135368A5 (enExample)
CN203720516U (zh) 摄像机的加热及散热装置
JP2012060132A5 (enExample)
JP2013527434A5 (enExample)
JP2009532912A5 (enExample)
JP2015206815A5 (enExample)
JP2010097601A5 (enExample)
JP2016127227A5 (enExample)
TWM391129U (en) Power supply having heat dissipation function and its combination with an electronic device
CN203840687U (zh) 散热器、电路板散热结构以及电子设备
JP2015037174A5 (enExample)
JP2013058663A5 (enExample)
CN204031699U (zh) 电子产品用石墨导热片
JP2011100916A5 (enExample)
CN204442828U (zh) 一种高效散热的pcb电路板
JP2014120582A5 (enExample)
CN203884067U (zh) 一种具有新型绝缘结构的多层印刷线路板
KR20130004547U (ko) Ｌｅｄ 방열모듈
CN203025636U (zh) 显卡散热装置
CN202852761U (zh) 镇流器用散热结构
JP2011014837A5 (enExample)
CN205864859U (zh) 一种具有散热结构的pcb电路板
CN203775521U (zh) 移植式电路基板散热结构