JP2011100916A - 電子部品の放熱用実装構造 - Google Patents

電子部品の放熱用実装構造 Download PDF

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Publication number
JP2011100916A
JP2011100916A JP2009255946A JP2009255946A JP2011100916A JP 2011100916 A JP2011100916 A JP 2011100916A JP 2009255946 A JP2009255946 A JP 2009255946A JP 2009255946 A JP2009255946 A JP 2009255946A JP 2011100916 A JP2011100916 A JP 2011100916A
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JP
Japan
Prior art keywords
electronic component
heat
heat dissipation
component
conductive pattern
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009255946A
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English (en)
Japanese (ja)
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JP2011100916A5 (enExample
Inventor
Tsunao Honpo
本保　　綱男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2009255946A priority Critical patent/JP2011100916A/ja
Publication of JP2011100916A publication Critical patent/JP2011100916A/ja
Publication of JP2011100916A5 publication Critical patent/JP2011100916A5/ja
Pending legal-status Critical Current

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JP2009255946A 2009-11-09 2009-11-09 電子部品の放熱用実装構造 Pending JP2011100916A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009255946A JP2011100916A (ja) 2009-11-09 2009-11-09 電子部品の放熱用実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009255946A JP2011100916A (ja) 2009-11-09 2009-11-09 電子部品の放熱用実装構造

Publications (2)

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JP2011100916A true JP2011100916A (ja) 2011-05-19
JP2011100916A5 JP2011100916A5 (enExample) 2012-12-20

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ID=44191863

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009255946A Pending JP2011100916A (ja) 2009-11-09 2009-11-09 電子部品の放熱用実装構造

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JP (1) JP2011100916A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014229372A (ja) * 2013-05-20 2014-12-08 スタンレー電気株式会社 Ｌｅｄランプ

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04176195A (ja) * 1990-11-07 1992-06-23 Ibiden Co Ltd サーモカプラ
JP2001068877A (ja) * 1999-08-30 2001-03-16 Sharp Corp 電子回路装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04176195A (ja) * 1990-11-07 1992-06-23 Ibiden Co Ltd サーモカプラ
JP2001068877A (ja) * 1999-08-30 2001-03-16 Sharp Corp 電子回路装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014229372A (ja) * 2013-05-20 2014-12-08 スタンレー電気株式会社 Ｌｅｄランプ

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