JP2011091029A - スイッチ構造及び方法 - Google Patents

スイッチ構造及び方法 Download PDF

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Publication number
JP2011091029A
JP2011091029A JP2010201497A JP2010201497A JP2011091029A JP 2011091029 A JP2011091029 A JP 2011091029A JP 2010201497 A JP2010201497 A JP 2010201497A JP 2010201497 A JP2010201497 A JP 2010201497A JP 2011091029 A JP2011091029 A JP 2011091029A
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JP
Japan
Prior art keywords
conductive element
contact
switch structure
metallic material
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010201497A
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English (en)
Japanese (ja)
Other versions
JP2011091029A5 (cg-RX-API-DMAC10.html
Inventor
Christopher Fred Keimel
クリストファー・フレッド・ケイメル
Marco Francesco Aimi
マルコ・フランチェスコ・アイミ
Shubhra Bansal
シュブラ・バンサル
Reed Roeder Corderman
リード・ローダー・コーダーマン
Kuna Venkat Satya Rama Kishore
クナ・ヴェンカット・サチャ・ラマ・キショア
Eddula Sudhakar Reddy
エデュラ・スッダカール・レディ
Atanu Saha
アタヌ・サハ
Kanakasabapathi Subramanian
カナカサバパシ・スブラマニアン
Parag Thakre
パラグ・サクレ
Alex David Corwin
アレックス・デイヴィッド・コーウィン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of JP2011091029A publication Critical patent/JP2011091029A/ja
Publication of JP2011091029A5 publication Critical patent/JP2011091029A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H59/00—Electrostatic relays; Electro-adhesion relays
    • H01H59/0009—Electrostatic relays; Electro-adhesion relays making use of micromechanics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0052—Special contact materials used for MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/0036—Switches making use of microelectromechanical systems [MEMS]
    • H01H2001/0084—Switches making use of microelectromechanical systems [MEMS] with perpendicular movement of the movable contact relative to the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2237/00—Mechanism between key and laykey
    • H01H2237/004—Cantilever
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49105—Switch making

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Contacts (AREA)
JP2010201497A 2009-09-23 2010-09-09 スイッチ構造及び方法 Pending JP2011091029A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/565,127 US8354899B2 (en) 2009-09-23 2009-09-23 Switch structure and method

Publications (2)

Publication Number Publication Date
JP2011091029A true JP2011091029A (ja) 2011-05-06
JP2011091029A5 JP2011091029A5 (cg-RX-API-DMAC10.html) 2013-10-10

Family

ID=43303797

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010201497A Pending JP2011091029A (ja) 2009-09-23 2010-09-09 スイッチ構造及び方法

Country Status (5)

Country Link
US (1) US8354899B2 (cg-RX-API-DMAC10.html)
EP (1) EP2315221B1 (cg-RX-API-DMAC10.html)
JP (1) JP2011091029A (cg-RX-API-DMAC10.html)
KR (1) KR101734547B1 (cg-RX-API-DMAC10.html)
CN (1) CN102034648B (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018512703A (ja) * 2015-03-02 2018-05-17 ゼネラル・エレクトリック・カンパニイ 熱変形低減用の電気機械システム基板アタッチメント
KR101885996B1 (ko) * 2017-04-18 2018-08-07 국민대학교산학협력단 3-d 프린터로 제작되는 mems 칸틸레버 스위치의 제조방법
JP2018527206A (ja) * 2015-09-03 2018-09-20 ゼネラル・エレクトリック・カンパニイ 電気めっきｍｅｍｓ構造の高融点シード金属

Families Citing this family (10)

* Cited by examiner, † Cited by third party
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US8779886B2 (en) * 2009-11-30 2014-07-15 General Electric Company Switch structures
US9926193B2 (en) * 2014-06-27 2018-03-27 Intel Corporation Magnetic nanomechanical devices for stiction compensation
FR3027448B1 (fr) * 2014-10-21 2016-10-28 Airmems Commutateur microelectromecanique robuste
US9362608B1 (en) 2014-12-03 2016-06-07 General Electric Company Multichannel relay assembly with in line MEMS switches
FR3034567B1 (fr) 2015-03-31 2017-04-28 St Microelectronics Rousset Dispositif metallique a piece(s) mobile(s) ameliore loge dans une cavite de la partie d'interconnexion (" beol ") d'un circuit integre
US9466452B1 (en) 2015-03-31 2016-10-11 Stmicroelectronics, Inc. Integrated cantilever switch
GB2564434B (en) 2017-07-10 2020-08-26 Ge Aviat Systems Ltd Power distribution switch for a power distribution system
US20230068451A1 (en) * 2021-08-30 2023-03-02 Texas Instruments Incorporated Methods and apparatus to thermally actuate microelectromechanical structures devices
DE102022200337A1 (de) * 2022-01-13 2023-07-13 Robert Bosch Gesellschaft mit beschränkter Haftung MEMS-Relais
US20260015222A1 (en) * 2024-07-12 2026-01-15 Menlo Microsystems, Inc. Two stage plating for reduced Ni and NiO layer formation

Citations (6)

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JPH05271879A (ja) * 1992-01-31 1993-10-19 Toshiba Corp 高強度ばね部材
JPH08506690A (ja) * 1993-02-18 1996-07-16 シーメンス アクチエンゲゼルシャフト ハイブリッド駆動装置を備えたマイクロメカニカルなリレー
JP2005113189A (ja) * 2003-10-07 2005-04-28 Yoshihiko Yokoyama ナノ組織化合金
JP2005536014A (ja) * 2002-08-08 2005-11-24 エックスコム ワイアレス インコーポレイテッド マルチモルフ・アクチュエータと静電ラッチメカニズムとを有するマイクロ・ファブリケーションされたリレー
JP2006179384A (ja) * 2004-12-24 2006-07-06 Sharp Corp マイクロ接点開閉器および無線通信機器
JP2007516097A (ja) * 2003-10-31 2007-06-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 高周波マイクロマシン技術及びそのような技術の製造方法

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US5258591A (en) * 1991-10-18 1993-11-02 Westinghouse Electric Corp. Low inductance cantilever switch
US6153839A (en) * 1998-10-22 2000-11-28 Northeastern University Micromechanical switching devices
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US7126220B2 (en) * 2002-03-18 2006-10-24 Nanonexus, Inc. Miniaturized contact spring
US20030016417A1 (en) * 2001-07-17 2003-01-23 Cruise Lee Wireless pointing and remote-controlling device for briefing
CN100550429C (zh) 2001-11-09 2009-10-14 图恩斯通系统公司 具有触头和支座凸块的mems器件及其相关方法
US6624003B1 (en) * 2002-02-06 2003-09-23 Teravicta Technologies, Inc. Integrated MEMS device and package
US6686820B1 (en) * 2002-07-11 2004-02-03 Intel Corporation Microelectromechanical (MEMS) switching apparatus
US6699379B1 (en) * 2002-11-25 2004-03-02 Industrial Technology Research Institute Method for reducing stress in nickel-based alloy plating
US20040154925A1 (en) * 2003-02-11 2004-08-12 Podlaha Elizabeth J. Composite metal and composite metal alloy microstructures
JP2005146405A (ja) * 2003-11-14 2005-06-09 Toru Yamazaki 電析積層合金薄板とその製造方法
DE602005003008T2 (de) * 2005-03-21 2008-08-14 Delfmems RF MEMS Schalter mit einer flexiblen und freien Schaltmembran
US7663456B2 (en) * 2005-12-15 2010-02-16 General Electric Company Micro-electromechanical system (MEMS) switch arrays
US7872432B2 (en) * 2006-03-20 2011-01-18 Innovative Micro Technology MEMS thermal device with slideably engaged tether and method of manufacture
US7812703B2 (en) * 2006-03-23 2010-10-12 Innovative Micro Technology MEMS device using NiMn alloy and method of manufacture
US7688167B2 (en) * 2006-10-12 2010-03-30 Innovative Micro Technology Contact electrode for microdevices and etch method of manufacture
WO2009067222A1 (en) * 2007-11-19 2009-05-28 Xcom Wireless, Inc. Microfabricated cantilever slider with asymmetric spring constant
US7609136B2 (en) * 2007-12-20 2009-10-27 General Electric Company MEMS microswitch having a conductive mechanical stop

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05271879A (ja) * 1992-01-31 1993-10-19 Toshiba Corp 高強度ばね部材
JPH08506690A (ja) * 1993-02-18 1996-07-16 シーメンス アクチエンゲゼルシャフト ハイブリッド駆動装置を備えたマイクロメカニカルなリレー
JP2005536014A (ja) * 2002-08-08 2005-11-24 エックスコム ワイアレス インコーポレイテッド マルチモルフ・アクチュエータと静電ラッチメカニズムとを有するマイクロ・ファブリケーションされたリレー
JP2005113189A (ja) * 2003-10-07 2005-04-28 Yoshihiko Yokoyama ナノ組織化合金
JP2007516097A (ja) * 2003-10-31 2007-06-21 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 高周波マイクロマシン技術及びそのような技術の製造方法
JP2006179384A (ja) * 2004-12-24 2006-07-06 Sharp Corp マイクロ接点開閉器および無線通信機器

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018512703A (ja) * 2015-03-02 2018-05-17 ゼネラル・エレクトリック・カンパニイ 熱変形低減用の電気機械システム基板アタッチメント
JP2018527206A (ja) * 2015-09-03 2018-09-20 ゼネラル・エレクトリック・カンパニイ 電気めっきｍｅｍｓ構造の高融点シード金属
KR101885996B1 (ko) * 2017-04-18 2018-08-07 국민대학교산학협력단 3-d 프린터로 제작되는 mems 칸틸레버 스위치의 제조방법

Also Published As

Publication number Publication date
EP2315221A1 (en) 2011-04-27
KR101734547B1 (ko) 2017-05-11
EP2315221B1 (en) 2012-11-14
US8354899B2 (en) 2013-01-15
KR20110033055A (ko) 2011-03-30
CN102034648B (zh) 2014-06-25
CN102034648A (zh) 2011-04-27
US20110067983A1 (en) 2011-03-24

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