JP2011082582A - Method of manufacturing connection structure, method of anisotropic conductive connection, and connection structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a connection structure capable of improving the connection reliability of a connected portion. <P>SOLUTION: In an arrangement step, a translucent substrate 2 in which a plurality of first electrodes 1 are provided on the surface, a concave portion 6 is formed between the first electrodes 1, and a polymer 7 is arranged at the concave portion 6; and an electronic component 4, having second electrodes 3, are arranged so that the first electrodes 1 and the second electrodes 3 face via anisotropic conductive adhesive 5, containing epoxy resin and polymerization initiator. In a connection step, heating pressing is performed from the surface 4a side that does not come in contact with the anisotropic conductive adhesive 5 of the electronic component 4, a light is emitted from the surface 2a side that does not come into contact with the anisotropic conductive adhesive 5 of the translucent substrate 2 after the heating pressing is started; and after a lapse of a predetermined time period, and the emitted light is radiated to the polymer 7; and accordingly, a connection body in which the first electrode 1 and the second electrode 3 are electrically connected is obtained. Furthermore, the refractive index of the polymer 7 is set smaller than those of the anisotropic conductive adhesive 5 and the translucent substrate 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a connection structure, an anisotropic conductive connection method, and a connection structure that can improve connection reliability.

  Conventionally, as a curing method in anisotropic conductive connection, for example, a thermal curing method and a UV (ultraviolet) curing method (ultraviolet curing method) have been performed independently.

  In the thermosetting method, for example, when a substrate having electrodes and an electronic component having electrodes are connected via an anisotropic conductive adhesive, heat of about 150 to 220 ° C. is applied at the time of heating and pressing. This is a method of proceeding the curing reaction of the conductive conductive adhesive. According to the thermosetting method, since the anisotropic conductive adhesive exhibits good reactivity (curing characteristics), no curing failure occurs. However, in the thermosetting method, the warpage of the substrate or the like becomes remarkable due to heat, which may cause problems in connection reliability.

  On the other hand, the UV curing method can suppress the warpage of the substrate and the like, but the reactivity of the anisotropic conductive adhesive is not sufficient compared with the thermosetting method, which causes a problem of poor curing. End up.

  Therefore, for example, as described in Patent Document 1, a method of using a thermosetting method and a UV curing method in combination has been proposed. However, since the UV light irradiated for UV curing does not pass through the metal wiring part on the substrate, there is a problem that it is difficult to reach the anisotropic conductive adhesive existing on the metal wiring part. As a result of the difficulty of UV light reaching the anisotropic conductive adhesive present on the metal wiring portion, curing failure occurs, and the connection reliability of the connection portion cannot be improved.

WO00 / 46315 publication

  Therefore, the present invention has been proposed in view of such conventional circumstances, and a method for manufacturing a connection structure, an anisotropic conductive connection method, and a connection that can improve the connection reliability of the connection portion. An object is to provide a structure.

  The connection structure manufacturing method according to the present invention includes a translucent substrate having a plurality of first electrodes on the surface, a recess formed between the first electrodes, and a polymer disposed in the recess; A disposing step of disposing an electronic component having the electrodes of the first electrode and the second electrode through an anisotropic conductive adhesive containing an epoxy resin and a polymerization initiator; Heat pressing from the side of the component that is not in contact with the anisotropic conductive adhesive, and the surface side of the transparent substrate that is not in contact with the anisotropic conductive adhesive after a predetermined time has elapsed after the start of heating and pressing. And a connecting step of obtaining a connection body in which the first electrode and the second electrode are electrically connected by irradiating the polymer with the irradiated light. The refractive index of the polymer Is made smaller than the refractive index of the anisotropic conductive adhesive and the translucent substrate.

  The anisotropic conductive connection method according to the present invention includes a translucent substrate having a plurality of first electrodes on the surface, a recess formed between the first electrodes, and a polymer disposed in the recess, and the second electrode An electronic component having a first electrode and a second electrode facing each other through an anisotropic conductive adhesive containing an epoxy resin and a cationic photopolymerization initiator; Heat pressing from the side of the component that is not in contact with the anisotropic conductive adhesive, and the surface side of the transparent substrate that is not in contact with the anisotropic conductive adhesive after a predetermined time has elapsed after the start of heating and pressing. And a step of electrically connecting the first electrode and the second electrode by irradiating the polymer with the irradiated light, and the refractive index of the polymer is made anisotropic. The refractive index of the conductive adhesive and the translucent substrate is made smaller.

  The connection structure according to the present invention includes a translucent substrate having a plurality of first electrodes on the surface and a recess formed between the first electrodes, and a polymer disposed in the recess, and a second electrode. The electronic component is disposed so that the first electrode and the second electrode face each other through an anisotropic conductive adhesive containing an epoxy resin and a polymerization initiator. While heating and pressing from the surface side not in contact with the adhesive, after a predetermined time has elapsed after the start of heating and pressing, light is irradiated from the surface side not in contact with the anisotropic conductive adhesive of the translucent substrate. The first electrode and the second electrode are electrically connected by irradiating the irradiated light to the polymer, and the refractive index of the polymer is the refractive index of the anisotropic conductive adhesive and the translucent substrate. Smaller than.

  According to the present invention, since the light irradiated to the polymer is scattered and irradiated between the electrodes, the curing reaction of the anisotropic conductive adhesive between the electrodes sufficiently proceeds, and the connection reliability of the connection portion is improved. Can be good.

It is sectional drawing which shows typically the arrangement | positioning process of the manufacturing method of the connection structure which concerns on this Embodiment. It is sectional drawing which shows typically the connection process of the manufacturing method of the connection structure which concerns on this Embodiment.

  Hereinafter, an example of a specific embodiment of the present invention (hereinafter referred to as “the present embodiment”) will be described.

<Method for manufacturing connection structure>
(Arrangement process)
FIG. 1 is a cross-sectional view schematically showing an arrangement process of the manufacturing method of the connection structure according to the present embodiment.

  In the arranging step, a translucent substrate 2 having a plurality of first electrodes 1 (hereinafter simply referred to as “electrode 1”) and a second electrode 3 (hereinafter simply referred to as “electrode 3”) on the surface. The electronic component 4 is disposed so that the electrode 1 and the electrode 3 face each other with the anisotropic conductive adhesive 5 interposed therebetween.

  In the arranging step, a polymer (hereinafter simply referred to as “polymer”) 7 having a refractive index smaller than that of the anisotropic conductive adhesive 5 and the translucent substrate 2 is arranged in the recess 6 formed between the electrodes 1. To do.

  The electrode 1 is composed of, for example, metal wiring. As the translucent substrate 2, a translucent substrate such as a glass substrate can be used. The electrode 3 is composed of bumps, for example. Examples of the electronic component 4 include chip components such as semiconductor chips, resistor chips, capacitor chips, substrates such as printed boards, flexible wiring boards based on polyimide and polyester, and indium oxide on glass such as liquid crystal panels. A transparent electrode wired with tin (ITO), chromium, aluminum, or the like can be used.

  The anisotropic conductive adhesive 5 can be configured, for example, in the form of a paste or a film formed by applying and drying an adhesive composition on a peelable substrate. The anisotropic conductive adhesive 5 is excellent in handleability by making the shape into a film, and can easily make the thickness after connection uniform.

  The anisotropic conductive adhesive 5 contains, for example, an epoxy resin, a polymerization initiator, and conductive particles 8. The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. Epoxy resins may be used alone or in combination of two or more. As the polymerization initiator, a cationic polymerization initiator capable of generating an acid with both heat and ultraviolet rays (UV) can be used, and examples thereof include onium salts such as aromatic sulfonium salts.

  Moreover, it is not limited to an epoxy resin, The acrylic resin containing various acrylates can also be used. Moreover, as a polymerization initiator, the radical initiator which generate | occur | produces a free radical with both a heat | fever and an ultraviolet-ray (UV) can be used, For example, organic oxide etc. are illustrated.

  As the conductive particles 8, known conductive particles can be used. For example, on the surface of particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver and gold, particles of metal oxide, carbon, graphite, glass, ceramic, plastic, etc. The thing which coated the metal, the thing which coat | covered the insulating thin film further on the surface of these particle | grains, etc. are mentioned.

  A polymer 7 which will be described in detail later is disposed in the recess 6 formed between the electrodes 1. The radius of curvature of the polymer 7 is defined by the radius of curvature of the recess 6. As shown in FIG. 1, the recess 6 preferably has a radius of curvature of 0.5 to 3 times the distance D between the electrodes 1 (inter-wiring distance D). By setting the radius of curvature of the recess 6 to 0.5 to 3 times the distance D between the electrodes 1, the radius of curvature of the polymer 7 with respect to the distance D between the electrodes 1, as will be described in detail later, It becomes possible to easily make it 0.5 to 3 times. The recess 6 refracts light incident from the side of the surface 2 a that is not in contact with the anisotropic conductive adhesive 5 of the translucent substrate 2.

  The polymer 7 disposed in the recess 6 functions as a lens structure and scatters light. The refractive index of the polymer 7 is made smaller than the refractive indexes of the anisotropic conductive adhesive 5 and the translucent substrate 2. By making the refractive index of the polymer 7 smaller than the refractive indexes of the anisotropic conductive adhesive 5 and the translucent substrate 2, light incident from the surface 2 a side of the translucent substrate 2 is scattered by the polymer 7. Light can be irradiated between the electrode 1 and the electrode 3. Thereby, since the curing reaction of the anisotropic conductive adhesive 5 existing between the electrode 1 and the electrode 3 proceeds sufficiently, the connection reliability of the connection portion between the electrode 1 and the electrode 3 can be improved. it can.

  As the polymer 7, a polymer that can achieve both high transparency and a low refractive index is preferable. For example, an amorphous fluoropolymer having a transmittance of 95% and a refractive index of 1.34 can be used. The radius of curvature of the polymer 7 is preferably 0.5 to 3 times, and particularly preferably 0.5 times the distance D between the electrodes 1. By making the radius of curvature of the polymer 7 0.5 to 3 times the distance D between the electrodes 1, the polymer 7 was incident from the surface 2 a side of the translucent substrate 2 by the polymer 7 in the connection step described in detail later. Light can be scattered effectively. Thereby, since more light is irradiated between the electrode 1 and the electrode 3, the hardening reaction of the anisotropic conductive adhesive 5 between electrodes fully progresses, and the connection reliability of a connection part is improved. It can be made even better.

(Connection process)
FIG. 2 is a cross-sectional view schematically showing a connection step in the method for manufacturing the connection structure according to the present embodiment.

  In the connecting step, as shown in FIG. 2, the electronic component 4 is heated and pressed (heated and pressurized) from the surface 4a side that is not in contact with the anisotropic conductive adhesive 5, and a predetermined time has elapsed after the start of the heating and pressing. Later, light is irradiated from the surface 2 a side of the translucent substrate 2 that is not in contact with the anisotropic conductive adhesive 5. The irradiated light is irradiated to the polymer 7, and the light irradiated to the polymer 7 is scattered and irradiated between the electrode 1 and the electrode 3. As a result, the curing reaction of the anisotropic conductive adhesive 5 between the electrodes sufficiently proceeds to obtain a connection body in which the electrode 1 and the electrode 3 are electrically connected.

  In the connecting step, it is possible to press the translucent substrate 2 and the electronic component 4 at a low temperature by performing heat pressing and light irradiation. Therefore, for example, when an LCD (Liquid Crystal Display) panel is used as the translucent substrate 2, color unevenness of the LCD panel can be reduced. For example, when a flexible printed circuit board (FPC: Flexible printed circuits) is used as the electronic component 4, the pitch shift of the flexible printed circuit board due to thermal expansion can be improved. Since the translucent substrate 2 and the electronic component 4 can be pressure-bonded at a low temperature, for example, the thermal shock applied to the heating and pressing device 9 that performs heating and pressing can be reduced.

  In the connecting step, heat pressing is performed, and light is irradiated from the surface 2a side of the translucent substrate 2 after a predetermined time has elapsed after the start of the heating pressing. Thereby, the resin of the anisotropic conductive adhesive 5 is sufficiently flowed before the curing reaction of the anisotropic conductive adhesive 5 starts, and the resin existing between the electrode 1 and the electrode 3 is quickly removed. can do. Moreover, the progress of the curing reaction can be promoted by performing light irradiation when the resin of the anisotropic conductive adhesive 5 is flowing by heating. Furthermore, when the resin of the anisotropic conductive adhesive 5 flows by heating, light irradiation is performed so that the portion where the light is difficult to reach, that is, the anisotropic conductive adhesive between the electrode 1 and the electrode 3. The curing reaction of 5 can sufficiently proceed.

  In the connecting step, it is preferable to simultaneously stop heating and light irradiation. By simultaneously stopping the heating and pressing and light irradiation, for example, the electrode 1 absorbs light to prevent the electrode 1 from generating heat, and the resin of the anisotropic conductive adhesive 5 is loosened and becomes conductive. The pressing of the active particles 8 can be prevented from becoming weak. Thereby, it can prevent that the connection reliability of a connection part deteriorates.

  For example, the heating and pressing can be performed by using the heating and pressing device 9 that can irradiate light from the surface 2a side of the translucent substrate 2.

  The heat pressing time is preferably 5 to 30 seconds, for example. By setting the heating and pressing time to 5 to 30 seconds, the fluidity of the anisotropic conductive adhesive 5 is prevented from becoming insufficient, and the workability is prevented from being lowered. it can.

  In the connecting step, it is preferable to irradiate light from the surface 2a side of the translucent substrate 2 after 1 to 3 seconds have elapsed since the start of the heating and pressing. When light irradiation is started before 1 second has elapsed from the start of heating and pressing, the curing reaction of the anisotropic conductive adhesive 5 starts before the conduction between the electrode 1 and the electrode 3 is ensured. This will cause poor conduction. Moreover, when light irradiation is started after the elapse of 3 seconds from the start of heating and pressing, the time required for light irradiation is shortened, resulting in poor curing of the anisotropic conductive adhesive 5.

  In the connection step, the light irradiation time is preferably 3 to 30 seconds. If the light irradiation time is shorter than 3 seconds, the anisotropic conductive adhesive 5 may be poorly cured. In addition, when the light irradiation time is longer than 30 seconds, for example, the tact time becomes long, so that workability is deteriorated.

The light used for the curing reaction of the anisotropic conductive adhesive 5 can be, for example, ultraviolet light and can be generated by the light source 10. The light source 10 can be composed of, for example, a mercury lamp, a metal halide lamp, an electrodeless lamp, or the like. The dose of light ^is preferably set to 100~3000W / cm 2 (10~300J / cm 2). By setting the light irradiation amount to 100 to 3000 W / cm ² , the curing reaction of the anisotropic conductive adhesive 5 can be sufficiently advanced. Moreover, the curing reaction of the anisotropic conductive adhesive 5 proceeds rapidly, so that the resin flow of the anisotropic conductive adhesive 5 and the exclusion of the resin from between the electrodes can be prevented.

  As described above, in the method for manufacturing a connection structure, light incident from the other surface side of the translucent substrate is scattered by a polymer having a refractive index smaller than that of the epoxy resin, and the light is difficult to reach between the electrodes. Is also irradiated with light. Thereby, since the curing reaction of the anisotropic conductive adhesive 5 between the electrode 1 and the electrode 3 proceeds sufficiently, it is possible to prevent the anisotropic conductive adhesive 5 from being poorly cured. Therefore, the connection reliability of the connection portion can be improved.

  Hereinafter, specific examples of the present invention will be described. Note that the scope of the present invention is not limited to any of the following examples.

Example 1
It is blended so as to be 40 parts by mass of a phenoxy resin, 29 parts by mass of a liquid epoxy resin, and 10 parts by mass of a cationic photopolymerization initiator in a solid weight ratio. Toluene was added to prepare a resin composition having a solid content of 50%. Further, the resin composition was applied onto a release-treated polyethylene terephthalate, and the solvent was dried to obtain an anisotropic conductive film having an adhesive layer thickness of 20 μm.
・ Phenoxy resin (trade name PKHC, (Union Carbide))
-Photocationic polymerizable compound bisphenol type liquid epoxy resin (Bisphenol A type epoxy resin, trade name: Epicoat 828, manufactured by Yuka Shell Epoxy Co., Ltd.)
・ Silane coupling agent (trade name: A-187, manufactured by Momentive Performance Materials)
・ Photocationic polymerization initiator (trade name: Sun-Aid SI-80, manufactured by Sanshin Chemical Industry Co., Ltd.)
-Conductive particles having an average particle size of 4 μm (AUL704, manufactured by Sekisui Chemical Co., Ltd.)

  Using the obtained anisotropic conductive film, an IC substrate (thickness 0.5 mm) having electrodes with an interelectrode distance of 10 μm was connected to a glass substrate (thickness 0.5 mm) on which metal wiring as an electrode was formed. did.

  In Example 1, an amorphous fluoropolymer (product name: Teflon (registered trademark) AF) having a refractive index of 1.3 and a transmittance of 95% is used as a lens structure between the concave portion of the glass substrate and the anisotropic conductive film. Arranged. The radius of curvature of the amorphous fluoropolymer was twice the distance between the electrodes on the glass substrate.

The connection conditions were simultaneous heating and pressing at 110 ° C. and 60 MPa for 5 seconds and ultraviolet irradiation from the glass substrate side using a heating and pressing bonder manufactured by Sony Chemical & Information Device. Specifically, ultraviolet irradiation was started after 2 seconds had elapsed from the start of only the heat pressing, and the heating pressing and the ultraviolet irradiation were simultaneously terminated after 10 seconds from the start of the heating pressing. Thereafter, the pressure was released to obtain a connection body. In addition, the ultraviolet irradiation amount irradiated to an anisotropic conductive film from a light source was 10 J / cm ² (Construction A).

(Example 2)
In Example 2, a connection body of an IC substrate and a glass substrate was produced in the same manner as in Example 1 except that the curvature radius of the amorphous fluoropolymer was the same as the distance between the electrodes on the glass substrate.

(Example 3)
In Example 3, a connection body of an IC substrate and a glass substrate was produced in the same manner as in Example 1 except that the radius of curvature of the amorphous fluoropolymer was 0.5 times the distance between the electrodes on the glass substrate. .

Example 4
In Example 4, a connection body of an IC substrate and a glass substrate was produced in the same manner as in Example 1 except that the radius of curvature of the amorphous fluoropolymer was set to 3 times the distance between the electrodes on the glass substrate.

(Comparative Example 1)
In Comparative Example 1, a connection body of an IC substrate and a glass substrate was produced in the same manner as in Example 1 except that no amorphous fluoropolymer was used.

(Comparative Example 2)
In the comparative example 2, the connection body of an IC substrate and a glass substrate was produced by the same construction method (construction method B) as Example 1 except having started heat press and ultraviolet irradiation simultaneously.

(Comparative Example 3)
In Comparative Example 3, the connection between the IC substrate and the glass substrate was performed by the same construction method (Construction C) as in Example 1 except that ultraviolet irradiation was not performed and the connection condition for heating and pressing was 180 ° C., 60 MPa, and 5 seconds. The body was made.

(Comparative Example 4)
In Comparative Example 4, a connection body of an IC substrate and a glass substrate was produced by the same construction method (Construction D) as in Example 1 except that the connection condition of ultraviolet irradiation was 20 J / cm ² and heating and pressing were not performed. did.

(Comparative Example 5)
Comparative Example 5 was the same as in Example 1 except that ultraviolet irradiation was started after 0.5 seconds had elapsed from the start of heating and pressing, and ultraviolet heating was terminated at the same time 10 seconds after the start of heating and pressing. The connection body of an IC substrate and a glass substrate was produced by this construction method (construction method E).
(Comparative Example 6)

  In Comparative Example 6, the heating method is started after 2 seconds from the start of ultraviolet irradiation, and the heating method and ultraviolet irradiation are simultaneously terminated after 10 seconds from the start of ultraviolet irradiation. A connection body of the IC substrate and the glass substrate was produced by (Method F).

The results of Examples 1 to 4 and Comparative Examples 1 to 6 are summarized in Table 1 below.

(About reactivity evaluation)
The reactivity was calculated from the attenuation amount (%) of the absorption wavelength of the epoxy ring before and after mounting using an infrared spectrophotometer (product number FT / IR-4100, manufactured by JASCO Corporation).

  In Table 1, the reactivity “◯” indicates that 70% or more of the anisotropic conductive film is reacted. The reactivity “Δ” indicates that more than 30% and less than 70% of the anisotropic conductive film are reacted. The reactivity “x” indicates that 30 or less of the anisotropic conductive film is reacted.

(About panel warpage evaluation)
Panel warpage is scanned from the lower side of the glass substrate using a stylus type surface roughness meter (trade name: SE-3H, manufactured by Kosaka Laboratory Co., Ltd.), and the warpage amount of the glass substrate surface after IC chip pressure bonding ( μm).

  In Table 1, the panel warpage “「 ”indicates that the panel warpage is 5 μm or less. A panel warpage of “◯” indicates that the panel warpage exceeds 5 μm and is 12 μm or less. The panel warpage “Δ” indicates that the panel warpage is more than 12 μm and less than 20 μm. The panel warpage “x” indicates that the panel warpage is 20 μm or more.

(About connection reliability evaluation)
In Table 1, “connection reliability (initial)” is connection reliability immediately after the connection body is manufactured. The “connection reliability (85 ° C., 85% RH500Hr)” is the connection reliability after being left for 500 hours in an environment of 85 ° C. and humidity of 85%.

  The connection reliability evaluation of “」 ”indicates that the resistance value including the connection part between the electrodes in the connection body is 10Ω or less. The initial connection reliability evaluation of “◯” indicates that the resistance value including the connection portion between the electrodes in the connection body exceeds 10Ω and is 50Ω or less. The initial connection reliability evaluation of “Δ” indicates that the resistance value including the connection part between the electrodes in the connection body is more than 50Ω and less than 100Ω. The initial connection reliability evaluation of “×” indicates that the resistance value including the connected portion after connection is 100Ω or more.

  The resistance value was measured by measuring the connection resistance (Ω) using a digital multimeter (trade name: Digital Multimeter 7561, manufactured by Yokogawa Electric Corporation).

  In Examples 1 to 4, since the amorphous fluoropolymer was arranged between the concave portion of the glass substrate and the anisotropic conductive film to connect the IC substrate and the glass substrate, the reactivity evaluation, the panel warpage evaluation, and The connection reliability evaluation was good.

  In Example 2, since the radius of curvature of the amorphous fluoropolymer was the same as the distance between the electrodes on the glass substrate, the initial connection reliability evaluation was particularly good.

  In Example 3, since the radius of curvature of the amorphous fluoropolymer was half of the distance between the electrodes on the glass substrate, the initial connection reliability evaluation and the connection reliability after being left for 500 hours in an environment of 85 ° C. and 85% humidity were performed. The property evaluation was particularly good.

  In Comparative Example 1, since the IC substrate and the glass substrate were connected without disposing the amorphous fluoropolymer between the concave portion of the glass substrate and the anisotropic conductive film, the reactivity evaluation and the connection reliability evaluation were not good. There wasn't.

  In Comparative Example 2, since the heat pressing and the ultraviolet irradiation were started at the same time, the connection reliability evaluation was not good.

  In Comparative Example 3, since only the heating and pressing were performed, the panel warpage evaluation and the connection reliability evaluation of the connection body were not good.

  In Comparative Example 4, since only ultraviolet irradiation was performed, the reactivity evaluation and the connection reliability evaluation were not good.

  In Comparative Example 5, since only the heat pressing was started and ultraviolet irradiation was started after 0.5 seconds had elapsed, the reactivity evaluation and the connection reliability evaluation after being left for 500 hours in an environment of 85 ° C. and humidity 85% Was not good.

  In Comparative Example 6, since only the ultraviolet irradiation was started and the heat pressing was started after the elapse of 2 seconds, the reactivity evaluation and the connection reliability evaluation were not good.

DESCRIPTION OF SYMBOLS 1 1st electrode, 2 translucent board | substrate, 2a surface, 3 2nd electrode, 4 electronic component, 4a surface, 5 anisotropic conductive adhesive, 6 recessed part, 7 polymer, 8 conductive particle, 9 heat press Device, 10 light source

Claims (4)

A translucent substrate having a plurality of first electrodes on the surface and having recesses formed between the first electrodes and having a polymer disposed in the recesses, and an electronic component having a second electrode are bonded to an epoxy. An arrangement step of arranging the first electrode and the second electrode so as to face each other through an anisotropic conductive adhesive containing a resin and a polymerization initiator;
The electronic component is heated and pressed from the side of the electronic component that is not in contact with the anisotropic conductive adhesive, and after the predetermined time has elapsed after the start of the heating and pressing, the anisotropic conductive adhesive of the translucent substrate and Is connected to obtain a connection body in which the first electrode and the second electrode are electrically connected to each other by irradiating the polymer with the irradiated light. A process,
The manufacturing method of the connection structure which makes the refractive index of the said polymer smaller than the refractive index of the said anisotropic conductive adhesive and the said translucent board | substrate.   The method for manufacturing a connection structure according to claim 1, wherein a radius of curvature of the polymer is 0.5 times a distance between electrodes of the translucent substrate. A translucent substrate having a plurality of first electrodes on the surface, a recess formed between the first electrodes, and a polymer disposed in the recess, and an electronic component having a second electrode, epoxy resin, An arrangement step of arranging the first electrode and the second electrode to face each other through an anisotropic conductive adhesive containing a polymerization initiator;
The electronic component is heated and pressed from the side of the electronic component that is not in contact with the anisotropic conductive adhesive, and after the predetermined time has elapsed after the start of the heating and pressing, the anisotropic conductive adhesive of the translucent substrate and Has a connection step of electrically connecting the first electrode and the second electrode by irradiating light from a surface side not in contact with the polymer and irradiating the irradiated light to the polymer. ,
An anisotropic conductive connection method, wherein a refractive index of the polymer is smaller than refractive indexes of the anisotropic conductive adhesive and the translucent substrate. A translucent substrate having a plurality of first electrodes on the surface and having recesses formed between the first electrodes and having a polymer disposed in the recesses, and an electronic component having a second electrode are bonded to an epoxy. Arranged so that the first electrode and the second electrode face each other through an anisotropic conductive adhesive containing a resin and a polymerization initiator,
The electronic component is heated and pressed from the side of the electronic component that is not in contact with the anisotropic conductive adhesive, and after the predetermined time has elapsed after the start of the heating and pressing, the anisotropic conductive adhesive of the translucent substrate and Irradiates light from the non-contact surface side, and the first electrode and the second electrode are electrically connected by irradiating the polymer with the irradiated light,
The connection structure in which the refractive index of the polymer is smaller than the refractive indexes of the anisotropic conductive adhesive and the translucent substrate.

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