JP2011082512A - 砥粒無含有化学機械研磨組成物 - Google Patents

砥粒無含有化学機械研磨組成物 Download PDF

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Publication number
JP2011082512A
JP2011082512A JP2010213450A JP2010213450A JP2011082512A JP 2011082512 A JP2011082512 A JP 2011082512A JP 2010213450 A JP2010213450 A JP 2010213450A JP 2010213450 A JP2010213450 A JP 2010213450A JP 2011082512 A JP2011082512 A JP 2011082512A
Authority
JP
Japan
Prior art keywords
methacrylic acid
acid
acidic polymer
composition
transfer agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010213450A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011082512A5 (enExample
Inventor
Hongyu Wang
ホンユー・ワン
Scott A Ibbitson
スコット・エイ・イビットソン
Tirthankar Ghosh
ターサンカー・ゴーシュ
Mark R Winkle
マーク・アール・ウィンクル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2011082512A publication Critical patent/JP2011082512A/ja
Publication of JP2011082512A5 publication Critical patent/JP2011082512A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2010213450A 2009-09-25 2010-09-24 砥粒無含有化学機械研磨組成物 Pending JP2011082512A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/586,642 US20110073800A1 (en) 2009-09-25 2009-09-25 Abrasive-free chemical mechanical polishing compositions

Publications (2)

Publication Number Publication Date
JP2011082512A true JP2011082512A (ja) 2011-04-21
JP2011082512A5 JP2011082512A5 (enExample) 2013-08-22

Family

ID=43779265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010213450A Pending JP2011082512A (ja) 2009-09-25 2010-09-24 砥粒無含有化学機械研磨組成物

Country Status (5)

Country Link
US (1) US20110073800A1 (enExample)
JP (1) JP2011082512A (enExample)
KR (1) KR20110033786A (enExample)
CN (1) CN102031065B (enExample)
TW (1) TW201127924A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013137192A1 (ja) * 2012-03-16 2013-09-19 株式会社フジミインコーポレーテッド 研磨用組成物

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102155205B1 (ko) * 2012-08-31 2020-09-11 가부시키가이샤 후지미인코퍼레이티드 연마용 조성물 및 기판의 제조 방법
US20140308814A1 (en) * 2013-04-15 2014-10-16 Applied Materials, Inc Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions
CN104002252B (zh) * 2014-05-21 2016-06-01 华侨大学 超细磨料生物高分子柔性抛光膜及其制备方法
US10181408B2 (en) * 2017-01-31 2019-01-15 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten using polyglycols and polyglycol derivatives
CN113969173B (zh) * 2021-09-23 2022-05-13 易安爱富(武汉)科技有限公司 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001300285A (ja) * 2000-04-18 2001-10-30 Sanyo Chem Ind Ltd 研磨用砥粒分散剤及び研磨用スラリー
JP2006165541A (ja) * 2004-11-24 2006-06-22 Rohm & Haas Electronic Materials Cmp Holdings Inc 無砥粒ケミカルメカニカルポリッシング組成物及びそれに関連する方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4270480B2 (ja) * 1999-04-30 2009-06-03 綜研化学株式会社 アクリル系重合体の製造法
US6759463B2 (en) * 2000-09-21 2004-07-06 Rohm And Haas Company Emulsion polymerization methods involving lightly modified clay and compositions comprising same
US6433061B1 (en) * 2000-10-24 2002-08-13 Noveon Ip Holdings Corp. Rheology modifying copolymer composition
US7288616B2 (en) * 2002-01-18 2007-10-30 Lubrizol Advanced Materials, Inc. Multi-purpose polymers, methods and compositions

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001300285A (ja) * 2000-04-18 2001-10-30 Sanyo Chem Ind Ltd 研磨用砥粒分散剤及び研磨用スラリー
JP2006165541A (ja) * 2004-11-24 2006-06-22 Rohm & Haas Electronic Materials Cmp Holdings Inc 無砥粒ケミカルメカニカルポリッシング組成物及びそれに関連する方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013137192A1 (ja) * 2012-03-16 2013-09-19 株式会社フジミインコーポレーテッド 研磨用組成物
JPWO2013137192A1 (ja) * 2012-03-16 2015-08-03 株式会社フジミインコーポレーテッド 研磨用組成物
US9376594B2 (en) 2012-03-16 2016-06-28 Fujimi Incorporated Polishing composition

Also Published As

Publication number Publication date
TW201127924A (en) 2011-08-16
KR20110033786A (ko) 2011-03-31
CN102031065A (zh) 2011-04-27
CN102031065B (zh) 2013-09-11
US20110073800A1 (en) 2011-03-31

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