JP2011077213A - Led lamp - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve an LED lamp having a wide viewing angle visible from a forward direction and also from side and backward directions and having high luminous intensity. <P>SOLUTION: In the LED lamp 10, an LED chip 28 for radiating light having a wavelength for exciting a phosphor is surrounded by a substantially ring-shaped frame 22, a dome-shaped translucent hollow enclosure 32 for covering the LED chip 28 is disposed on the frame 22, and a phosphor layer 34 for converting emission of the LED chip 28 to visible light having a prescribed wavelength for radiation is formed in the entire region of an inner surface of the hollow enclosure 32. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an LED lamp (light emitting diode lamp), and more particularly to an LED lamp having a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction, and having a high luminous intensity.

2. Description of the Related Art In recent years, LED (Light Emitting Diode) lamps with low power consumption and long life are attracting attention as illumination light sources that replace incandescent bulbs and fluorescent lamps.
A conventional general LED lamp has a structure in which an LED chip is covered with a shell-type translucent envelope made of resin or the like. In this structure, a convex lens is provided at the tip of the translucent envelope. As a result, the amount of light emitted in the forward direction is large and the light is emitted brightly, but light is hardly emitted in the lateral direction and the backward direction, and the viewing angle is narrow.

For this reason, for example, in Patent Document 1, spherical or polygonal beads, protrusions, or recesses are provided on the surface of the translucent envelope that covers the LED chip, and light from the LED chip is transmitted to the beads, protrusions, or There has been proposed an LED lamp in which light can be visually recognized not only from the front direction but also from the side direction and the rear direction by diffusing in multiple directions with the concave portions.
Japanese Patent Laid-Open No. 2000-4050

  However, the LED lamp proposed in Patent Document 1 diffuses the light emitted from the LED chip, which is a light source, and radiates it in multiple directions, which causes a problem of a decrease in luminous intensity due to the diffusion of light. It was.

  The present invention has been made in view of the above-mentioned conventional problems, and its purpose is a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction, and a high luminous intensity LED lamp. Is to realize.

In order to achieve the above object, an LED lamp according to claim 1 of the present invention comprises:
An LED lamp comprising an LED chip and a translucent hollow envelope covering the LED chip, wherein the light emitted from the LED chip is converted into visible light having a predetermined wavelength over the entire inner surface of the hollow envelope. It is characterized by forming a phosphor layer to emit.

The LED lamp according to claim 2 of the present invention is the LED lamp according to claim 1,
The LED chip is surrounded by a frame, and a dome-shaped hollow envelope that covers the LED chip is disposed on the frame.

The LED lamp according to claim 3 of the present invention is the LED lamp according to claim 1,
The LED chip is surrounded by a frame, and a substantially spherical hollow envelope that covers the LED chip and bulges outward from the outer end of the frame is disposed on the frame. It is characterized by that.

The LED lamp according to claim 4 of the present invention is the LED lamp according to claim 1,
The LED chip is covered with a bullet-type hollow envelope, and a light-transmitting filler is enclosed in the hollow envelope.

In the LED lamp of the present invention, a phosphor layer is formed on the entire inner surface of the light-transmitting hollow envelope that covers the LED chip to convert the light emitted from the LED chip into visible light having a predetermined wavelength and emit it. In addition, visible light wavelength-converted by the phosphor layer is emitted in various directions, so that visible light is emitted in various directions from the entire surface of the hollow envelope. In addition, an LED lamp with a wide viewing angle that can be viewed from the rear direction can be realized.
Moreover, in the LED lamp of the present invention, since the phosphor layer, which is a visible light source, is formed on the inner surface of the hollow envelope, the light source exists near the surface of the hollow envelope from which visible light is emitted. Thus, an LED lamp with high luminous intensity is realized.

Hereinafter, embodiments of an LED lamp according to the present invention will be described with reference to the drawings.
As shown in FIGS. 1 and 2, the first LED lamp 10 according to the present invention includes an LED element 12, a frame member 14, and a heat radiating member 16, and these are integrated. In FIG. 1, reference numeral 18 denotes a high heat conductive insulating adhesive, and the LED element 12 and the heat radiating member 16 are connected via the high heat conductive insulating adhesive 18. The high thermal conductive insulating adhesive 18 has a thickness of 20 to 30 μm.

As shown in FIGS. 3 and 4, the LED element 12 includes a substantially ring-shaped frame 22 made of resin or the like and having a hole 20, and a first lead frame 24 and a second lead frame 26. is doing. The lead frames 24 and 26 have a thickness of about 0.3 mm.
The first lead frame 24 includes a substantially disc-shaped front end portion 24a that covers substantially the entire bottom surface 22a of the frame body 22, and a rear end portion that passes through the frame body 22 and is taken out in the horizontal direction. 24b.
A part of the tip 24a of the first lead frame 24 is exposed in the hole 20, and the LED chip 28 is die-bonded to the tip 24a of the first lead frame 24 exposed in the hole 16. Thus, the first lead frame 24 and one electrode (not shown) on the bottom surface of the LED chip 28 are electrically connected. As a result, the LED chip 28 is surrounded by the substantially ring-shaped frame 22.
The second lead frame 26 includes a front end portion 26a that penetrates the frame body 22 and is exposed in the hole 20, and a rear end portion 26b that is taken out in the horizontal direction toward the outside of the frame body 22. And is formed by electrically connecting the tip end portion 26a of the second lead frame 26 and the other electrode (not shown) on the upper surface of the LED chip 28 via a bonding wire 30.

The distal end portion 24a of the first lead frame 24 and the distal end portion 26a of the second lead frame 26 are insulated from each other by being arranged to face each other with a predetermined gap in the vertical direction.
Thus, in the first LED lamp 10, the front end portion 24a of the first lead frame 24 and the front end portion 26a of the second lead frame 26 are not arranged on the same plane, and are predetermined in the vertical direction. Since the front end portion 24 of the first lead frame 24 covers the substantially entire bottom surface 22a of the frame body 22, the gap between the first lead frame 24 and the second lead frame 26 is provided. Insulating properties can be secured.

  When a voltage is applied, the LED chip 28 emits light of a predetermined wavelength such as ultraviolet light or blue visible light that excites a phosphor described later, and is made of, for example, a gallium nitride based semiconductor crystal.

In FIGS. 1 and 3, reference numeral 32 denotes a light-transmitting hollow envelope formed as a dome shape having a spherical surface. By arranging the hollow envelope 32 on the frame body 22 of the LED element 12, The LED chip 28 is covered.
The hollow envelope 32 can be made of, for example, translucent glass, translucent resin such as acrylic, polycarbonate, or epoxy. When the hollow envelope 32 is made of glass, which is an inorganic material, the inorganic material hardly absorbs high-energy short-wavelength light such as ultraviolet rays emitted from the LED chip 28, and short-wavelength light Even if it absorbs, since the molecular bonding force is strong, it hardly deteriorates, so it has excellent durability.

A phosphor layer 34 is formed on the entire inner surface of the hollow envelope 32. The phosphor layer 34 emits light such as ultraviolet light or blue visible light emitted from the LED chip 28 by converting it into visible light having a predetermined wavelength.
As the phosphor constituting the phosphor layer 34, for example, one having the following composition can be used.
As a phosphor for red light emission that converts ultraviolet light into red visible light, M ₂ O ₂ S: Eu (M is any one of La, Gd, and Y), 0.5 MgF ₂ .3.5MgO.GeO ₂ : Mn , 2MgO · 2LiO ₂ · Sb ₂ O ₃ : Mn, Y (P, V) O ₄ : Eu, YVO ₄ : Eu, (Sr, Mg) ₃ (PO ₄ ): Sn, Y ₂ O ₃ : Eu, CaSiO ₃ : Pb, Mn, etc.
Further, as a phosphor for green emission for converting ultraviolet light to green visible _{light, BaMg 2 Al 16 O 27:} Eu, Mn, Zn 2 SiO 4: Mn, (Ce, Tb, Mn) MgAl 11 O 19, LaPO 4 _{: Ce, Tb, (Ce,} Tb) MgAl 11 O 19, Y 2 SiO 5: Ce, Tb, ZnS: Cu, Al, ZnS: Cu, Au, Al, (Zn, Cd) S: Cu, Al, SrAl ₂ O ₄ : Eu, SrAl ₂ O ₄ : Eu, Dy, Sr ₄ Al ₁₄ O ₂₅ : Eu, Dy, Y ₃ Al ₅ O ₁₂ : Tb, Y ₃ (Al, Ga) ₅ O ₁₂ : Tb, Y ₃ Al ₅ O ₁₂ : Ce, Y ₃ (Al, Ga) ₅ O ₁₂ : Ce, and the like.
Further, as a phosphor for blue light emission that converts ultraviolet light into blue visible light, (SrCaBa) ₅ (PO ₄ ) ₃ Cl: Eu, BaMg ₂ Al ₁₆ O ₂₇ : Eu, (Sr, Mg) ₂ P ₂ O _{7 : Eu, Sr 2 P 2 O} 7: Eu, Sr 2 P 2 O 7: Sn, Sr 5 (PO 4) 3 Cl: Eu, BaMg 2 Al 16 O 27: Eu, CaWO 4, CaWO 4: Pb, ZnS : Ag, Cl, ZnS: Ag, Al, (Sr, Ca, Mg) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu and the like.
Further, when white light is obtained using an LED chip that emits blue visible light as a light source, Y ₃ is used as the green light emitting phosphor 16 that converts blue visible light emitted from the LED chip into green visible light. (Al, Ga) ₅ O ₁₂ : Ce, SrGa ₂ S ₄ : Eu, Ca ₃ Sc ₂ Si ₃ O ₁₂ : Ce, α-SiAlON: Eu, β-SiAlON: Eu, and the like.
Further, when an LED chip that emits blue visible light is used as a light source, (Sr, Ca) S is used as a red light emitting phosphor 16 that converts blue visible light emitted from the LED chip into red visible light. : Eu, (Ca, Sr) ₂ Si ₅ N ₈ : Eu, CaSiN ₂ : Eu, CaAlSiN ₃ : Eu, and the like.
By appropriately selecting and mixing the phosphors for red light emission, green light emission, and blue light emission, various colors can be developed.
The phosphor constituting the phosphor layer 34 includes organic and inorganic fluorescent dyes and organic and inorganic fluorescent pigments.

In order to form the phosphor layer 34 on the inner surface of the hollow envelope 32, for example, a phosphor dispersion liquid in which a phosphor is dispersed in a light-transmitting inorganic binder is applied to the inner surface of the hollow envelope 32. Then, firing may be performed.
Examples of the inorganic binder include inorganic substances such as an alkali silane bond, an ethyl silicate bond, an alkoxy lane bond, an alkoxy lane bond in which an organic functional group is partially introduced, and an alkoxy lane bond obtained by reacting an organic polymer. A binder or a hybrid inorganic binder can be preferably used.

5 to 8 show the heat radiating member 16. FIG. 5 is a front view, FIG. 6 is a plan view, FIG. 7 is a side view, and FIG.
The heat radiating member 16 is made of a conductive material such as aluminum having good thermal conductivity, and has a main body portion 36 and a pair of notches 38 (FIG. 6).

9 to 11 show the frame member 14. FIG. 9 is a plan view, FIG. 10 is a side view, and FIG. 11 is a cross-sectional view taken along the line CC in FIG.
The frame member 14 is made of an insulating material such as a resin, and provides insulation between the heat dissipation member 16 made of a conductive material and the first lead frame 24 and the second lead frame 26 of the LED element 12. It is used to secure.

The frame member 14 is formed at a substantially ring-shaped main body portion 40 that abuts and surrounds a side peripheral surface 22b (see FIG. 3) of the frame body 22 of the LED element 12, and a lower end of the main body portion 40. A pair of drooping portions 42 that are in contact with and cover the side peripheral surface 36a (see FIG. 6) of the main body portion 36 at the position where the cutout portion 38 of the heat radiation member 16 is formed, and formed from the upper end of the main body portion 40 to the lower end of the drooping portion 42 A pair of notches 44 is provided.
The hanging portion 42 is formed with a step portion 46 on which the LED element 12 is placed. When the LED element 12 is placed on the step portion 46, the tip of the first lead frame 24 of the LED element 12 is placed. It is designed such that a gap of 20 to 30 μm is formed between the portion 24a and the heat radiating member 16.
Further, the width of the notch 44 is substantially the same as the width of the first lead frame 24 and the second lead frame 26 of the LED element 12.

The LED element 12, the frame member 14, and the heat radiating member 16 are integrated in the manner shown in FIG. That is, the frame member 14 is fitted to the heat radiating member 16 having a high heat conductive insulating adhesive 18 applied to the surface thereof in a thickness of 20 to 30 μm, so that the notch 38 forming position of the heat radiating member 16 on the main body side. The peripheral surface 36 a is covered with the hanging part 42 of the frame member 14.
Next, the LED element 12 is placed on the step portion 46 of the hanging portion 42 of the frame member 14, and the side peripheral surface 22 b of the frame body 22 of the LED element 12 is surrounded by the main body portion 40 of the frame member 14. Thus, the LED element 12 and the frame member 14 are fitted.
As a result, the first lead frame tip 24a covering the substantially entire surface 22a of the bottom surface of the frame of the LED element 12 and the heat radiating member 16 are connected via the high thermal conductive insulating adhesive 18, and the first LED lamp 10 is completed.

  As described above, the width of the cutout portion 44 of the frame member 14 is substantially the same as the widths of the first lead frame 24 and the second lead frame 26 of the LED element 12. By inserting the second lead frame 26 into the notch 44, the LED element 12 and the frame member 14 can be easily positioned when fitted, and the first lead of the LED element 12 can be obtained. The frame 24 and the second lead frame 26 are not rattled in the notch 44, and the LED element 12 and the frame member 14 can be firmly fixed.

The high thermal conductive insulating adhesive 18 corresponds to, for example, a high thermal conductive resin obtained by mixing a metal powder having good thermal conductivity in a resin such as a silicon resin, an epoxy resin, or a polyimide resin.
In addition, when the thickness of the high thermal conductive insulating adhesive 18 is large, the thermal conductivity is hindered. Therefore, the thickness is suitably 100 μm or less, and more preferably 20 to 30 μm as described above. Is good.

  When a voltage is applied to the LED chip 28 via the first lead frame 24 and the second lead frame 26, the first LED lamp 10 has ultraviolet rays that excite the phosphor layer 34 from the LED chip 28. Light such as blue visible light is emitted. When the phosphor layer 34 receives the light emitted from the LED chip 28, the phosphor layer 34 converts the light from the LED chip 28 into visible light of a predetermined wavelength and emits it in various directions. The light passes through the hollow envelope 32 and is emitted to the outside.

Thus, in the first LED lamp 10 of the present invention, the light emitted from the LED chip 28 is converted into visible light having a predetermined wavelength over the entire inner surface of the translucent hollow envelope 32 covering the LED chip 28. Since the visible light that has been wavelength-converted by the phosphor layer 34 is emitted in various directions, the visible light is emitted from the entire surface of the hollow envelope 32 in various directions. Thus, an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, since the first LED lamp 10 has the phosphor layer 34, which is a visible light source, formed on the inner surface of the hollow envelope 32, the light source near the surface of the hollow envelope 32 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
Part of the visible light emitted from the phosphor layer 34 is directed toward the inside of the hollow envelope 32, but most of the visible light is finally transmitted through the phosphor layer 34 and emitted to the outside. .

In the first LED lamp 10, the leading end 24 a of the first lead frame 24 on which the LED chip 28 is disposed is connected to the heat radiating member 16 through the high thermal conductive insulating adhesive 18. Therefore, the heat generated by the LED chip 28 is conducted to the heat radiating member 16 through the first lead frame 24 and the high thermal conductive insulating adhesive 18 and can be efficiently radiated to the outside of the first LED lamp 10. .
In addition, in the LED element 12, the tip 24a of the first lead frame 24 on which the LED chip 28 is disposed is formed to cover the substantially entire surface of the frame bottom surface 22a, so that a large heat radiation area is ensured. The heat dissipation effect is high. The first lead frame 24 can be made of a copper alloy, which is a conductive material having good thermal conductivity.

  If the main body bottom surface 36b is brought into contact with another heat radiating member by mounting the main body bottom surface 36b of the heat radiating member 16 on another heat radiating member (not shown), the heat generated by the LED chip 28 is Heat can be efficiently radiated to another heat radiating member via the heat radiating member 16.

As described above, the frame member 14 made of an insulating material ensures insulation between the heat radiating member 16 made of a conductive material and the first lead frame 24 and the second lead frame 26 of the LED element 12. It is used for this purpose.
That is, when the LED element 12 is placed on the stepped portion 46 of the hanging part 42 of the frame member 14, a gap of 20 to 30 μm is formed between the first lead frame tip 24 a of the LED element 12 and the heat dissipation member 16. Therefore, physical contact between the first lead frame tip 24a of the LED element 12 and the heat radiating member 16 is prevented, and insulation is ensured.

  Thus, the insulation between the heat dissipation member 16 made of a conductive material and the first lead frame 24 and the second lead frame 26 of the LED element 12 can be ensured by, for example, the first LED lamp 10. In some cases, a plurality of first LED lamps 10 are arranged on the same conductive member, such as when many are arranged on another conductive heat radiating member (not shown). It is.

FIG. 13 is a schematic sectional view showing a second LED lamp 48 according to the present invention. The second LED lamp 48 is characterized in that a hollow envelope 50 is formed in a substantially spherical shape. The other configurations are substantially the same as those of the first LED lamp 10.
The substantially spherical hollow envelope 50 of the second LED lamp 48 has its side peripheral surface bulging outward from the outer end of the frame 22 surrounding the LED chip 28.

Thus, even in the second LED lamp 48, as in the first LED lamp 10, the LED chip 28 emits light over the entire inner surface of the light-transmitting hollow envelope 50 that covers the LED chip 28. A phosphor layer 34 is formed that radiates by converting into visible light having a wavelength. Since visible light that has been wavelength-converted by the phosphor layer 34 is emitted in various directions, the entire surface of the hollow envelope 50 is exposed. Since visible light is emitted in various directions, an LED lamp with a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, since the second LED lamp 48 has the phosphor layer 34, which is a visible light source, formed on the inner surface of the hollow envelope 50, the light source near the surface of the hollow envelope 50 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.
In the second LED lamp 48, the side surface of the substantially spherical hollow envelope 50 bulges outward from the outer end of the frame 22 surrounding the LED chip 28. It is possible to suppress the visible light radiated from the rearward direction 34 from being blocked by the frame body 22, and the visibility from the rear direction is improved.

FIG. 14 is a schematic cross-sectional view showing a third LED lamp 52 according to the present invention. The third LED lamp is formed on the front end portion 54a of the first lead frame 54 for mounting an LED chip from the bottom surface thereof. A concave portion having a substantially funnel shape in which the hole diameter gradually increases toward the upper side is provided, and a reflector 56 is formed by forming the inner surface of the concave portion as a reflecting surface, and the LED chip 28 is connected and fixed on the bottom surface of the reflector 56 by die bonding. Thus, the first lead frame 54 and one electrode (not shown) on the bottom surface of the LED chip 28 are electrically connected.
Further, the leading end portion 58a of the second lead frame 58 and the other electrode (not shown) on the upper surface of the LED chip 28 are electrically connected through a bonding wire 30.

The LED chip 28, the upper end of the tip portion 54a and the terminal portion 54b of the first lead frame 54, and the upper end of the tip portion 58a and the terminal portion 58b of the second lead frame 58 are formed into a bullet shape having a spherical surface at the tip. It is covered with a translucent hollow envelope 60.
In addition, a phosphor layer 34 is formed on the entire inner surface of the hollow envelope 60 to convert light such as ultraviolet light and blue visible light emitted from the LED chip 28 into visible light having a predetermined wavelength and emit it. .
Further, inside the hollow envelope 60, a transparent material 64 made of an inorganic material such as water glass or sol-gel glass, or an organic material such as epoxy resin or acrylic resin is enclosed. .
The lower end of the terminal portion 54b of the first lead frame 54 and the lower end of the terminal portion 58b of the second lead frame 58 are led out of the hollow envelope 60 through the filler 64.

Next, a method for manufacturing the third LED lamp 52 will be described with reference to FIGS.
First, the LED chip 28 is die-bonded via Ag paste or the like on the bottom surface of the reflector 56 formed at the distal end portion 54a of the first lead frame 54, and then the distal end of the second lead frame 58 via the bonding wire 30. The part 58a and the LED chip 28 are connected (FIG. 15).

Next, as shown in FIG. 16, the hollow envelope 60 is inserted into the recess 66a of the fixing jig 66 from the tip side and fixed. As a result, the opening of the hollow envelope 60 is arranged on the upper side. Prior to fixing to the fixing jig 66, the phosphor layer 34 is formed in advance on the entire inner surface of the hollow envelope 60. As described above, in order to form the phosphor layer 34 on the inner surface of the hollow envelope 60, for example, a phosphor dispersion liquid in which a phosphor is dispersed in an inorganic binder is applied to the inner surface of the hollow envelope 60. And then firing.
Next, a predetermined amount of uncured filler 64 is injected into the hollow envelope 60 from the opening of the hollow envelope 60 (FIG. 17).
Next, as shown in FIG. 18, the upper end of the leading end portion 54a and the terminal portion 54b of the first lead frame 54 to which the LED chip 28 is connected and arranged, and the leading end portion 58a and the terminal portion 58b of the second lead frame 58 are connected. Is accommodated in the hollow envelope 60.
Thereafter, the third LED lamp 52 is completed by curing the filler 64 by heating at a predetermined temperature.

  When a voltage is applied to the LED chip 28 via the first lead frame 54 and the second lead frame 58, the third LED lamp 52 is configured to emit ultraviolet light that excites the phosphor layer 34 from the LED chip 28. Light such as blue visible light is emitted. When the phosphor layer 34 receives the light emitted from the LED chip 28, the phosphor layer 34 converts the light from the LED chip 28 into visible light having a predetermined wavelength, and this visible light passes through the hollow envelope 60. Then it is radiated to the outside.

Thus, the third LED lamp 52 of the present invention is also applied to the entire inner surface of the translucent hollow envelope 60 that covers the LED chip 28, like the first LED lamp 10 and the second LED lamp 48. A phosphor layer 34 is formed which converts the emitted light of the LED chip 28 into visible light having a predetermined wavelength and emits it. The visible light wavelength-converted by the phosphor layer 34 is emitted in various directions. Visible light is emitted in various directions from the entire surface of the enclosure 60, and an LED lamp having a wide viewing angle that can be viewed not only from the front direction but also from the side direction and the rear direction can be realized.
In addition, the third LED lamp 52 has the phosphor layer 34, which is a visible light source, formed on the inner surface of the hollow envelope 60, so that the light source near the surface of the hollow envelope 60 from which visible light is emitted. Therefore, an LED lamp with high luminous intensity is realized.

  When the filler 64 is made of an inorganic material such as water glass or sol-gel glass, the inorganic material hardly absorbs high-energy short-wavelength light such as ultraviolet light or blue visible light emitted from the LED chip 28. Therefore, the phosphor layer 34 can be irradiated with almost no loss of short wavelength light such as ultraviolet light and blue visible light emitted from the LED chip 28 and exciting the phosphor layer 34.

It is a schematic sectional drawing which shows typically the 1st LED lamp which concerns on this invention. It is a top view in the state where the hollow envelope of the 1st LED lamp concerning the present invention was removed. It is a schematic sectional drawing which shows typically the LED element of the 1st LED lamp which concerns on this invention. It is a top view in the state where the hollow envelope of the LED element of the 1st LED lamp concerning the present invention was removed. It is a front view showing typically the heat dissipation member of the 1st LED lamp concerning the present invention. It is a top view which shows typically the heat radiating member of the 1st LED lamp which concerns on this invention. It is a side view which shows typically the heat radiating member of the 1st LED lamp which concerns on this invention. It is BB schematic sectional drawing of FIG. It is a top view which shows typically the frame member of the 1st LED lamp which concerns on this invention. It is a side view which shows typically the frame member of the 1st LED lamp which concerns on this invention. It is CC schematic sectional drawing of FIG. It is explanatory drawing which shows the integration method of the LED element of the 1st LED lamp which concerns on this invention, a frame member, and a heat radiating member. It is a schematic sectional drawing which shows typically the 2nd LED lamp which concerns on this invention. It is a schematic sectional drawing which shows typically the 3rd LED lamp which concerns on this invention. It is explanatory drawing which shows the manufacturing process of the 3rd LED lamp which concerns on this invention. It is explanatory drawing which shows the manufacturing process of the 3rd LED lamp which concerns on this invention. It is explanatory drawing which shows the manufacturing process of the 3rd LED lamp which concerns on this invention. It is explanatory drawing which shows the manufacturing process of the 3rd LED lamp which concerns on this invention.

10 First LED lamp
12 LED elements
14 Frame member
16 Heat dissipation member
18 High thermal conductivity insulating adhesive
20 holes
22 Frame
24 First lead frame
24a First lead frame tip
24b Rear end of first lead frame
26 Second lead frame
26a Tip of second lead frame
26b Rear end of second lead frame
28 LED chip
30 Bonding wire
32 Hollow enclosure
34 Phosphor layer
36 Heat sink body
Side surface of 36a body
Bottom of 36b body
38 Notch in heat dissipation member
40 Frame body
42 Hanging part of frame member
44 Notch in frame member
46 Step of frame member
48 Second LED lamp
50 Hollow enclosure
52 Third LED lamp
54 First lead frame
54a First lead frame tip
54b Terminal part of the first lead frame
56 Reflector
58 Second lead frame
58a Tip of second lead frame
58b Terminal area of second lead frame
60 Hollow enclosure
64 Filler
66 Fixing jig
Recess of 66a fixing jig

Claims (4)

  An LED lamp comprising an LED chip and a translucent hollow envelope covering the LED chip, wherein the light emitted from the LED chip is converted into visible light having a predetermined wavelength over the entire inner surface of the hollow envelope. An LED lamp characterized by forming a phosphor layer to radiate.   2. The LED lamp according to claim 1, wherein the LED chip is surrounded by a frame body, and a dome-shaped hollow outer body covering the LED chip is disposed on the frame body.   The LED chip is surrounded by a frame, and a substantially spherical hollow envelope that covers the LED chip and bulges outward from the outer end of the frame is disposed on the frame. The LED lamp according to claim 1.   2. The LED lamp according to claim 1, wherein the LED chip is covered with a bullet-shaped hollow envelope, and a filler having a light-transmitting property is enclosed in the hollow envelope.

Images