JP2011074208A5 - - Google Patents

Download PDF

Info

Publication number
JP2011074208A5
JP2011074208A5 JP2009226842A JP2009226842A JP2011074208A5 JP 2011074208 A5 JP2011074208 A5 JP 2011074208A5 JP 2009226842 A JP2009226842 A JP 2009226842A JP 2009226842 A JP2009226842 A JP 2009226842A JP 2011074208 A5 JP2011074208 A5 JP 2011074208A5
Authority
JP
Japan
Prior art keywords
epoxy
resin
particle
epoxy resin
based particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009226842A
Other languages
English (en)
Japanese (ja)
Other versions
JP5177110B2 (ja
JP2011074208A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009226842A priority Critical patent/JP5177110B2/ja
Priority claimed from JP2009226842A external-priority patent/JP5177110B2/ja
Publication of JP2011074208A publication Critical patent/JP2011074208A/ja
Publication of JP2011074208A5 publication Critical patent/JP2011074208A5/ja
Application granted granted Critical
Publication of JP5177110B2 publication Critical patent/JP5177110B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009226842A 2009-09-30 2009-09-30 エポキシ系粒子組成物 Expired - Fee Related JP5177110B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009226842A JP5177110B2 (ja) 2009-09-30 2009-09-30 エポキシ系粒子組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009226842A JP5177110B2 (ja) 2009-09-30 2009-09-30 エポキシ系粒子組成物

Publications (3)

Publication Number Publication Date
JP2011074208A JP2011074208A (ja) 2011-04-14
JP2011074208A5 true JP2011074208A5 (cg-RX-API-DMAC10.html) 2012-04-26
JP5177110B2 JP5177110B2 (ja) 2013-04-03

Family

ID=44018535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009226842A Expired - Fee Related JP5177110B2 (ja) 2009-09-30 2009-09-30 エポキシ系粒子組成物

Country Status (1)

Country Link
JP (1) JP5177110B2 (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5479530B2 (ja) * 2011-06-23 2014-04-23 ダウ グローバル テクノロジーズ エルエルシー 再分散可能なエポキシ粉体
JP5385424B2 (ja) * 2011-06-23 2014-01-08 ダウ グローバル テクノロジーズ エルエルシー 界面反応による再分散可能なエポキシ粉体
CN115926205A (zh) * 2023-01-31 2023-04-07 哈尔滨工业大学 一种反应性环氧树脂球形颗粒的制备方法及应用

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59170114A (ja) * 1983-03-18 1984-09-26 Toray Ind Inc エポキシ系微粒子およびその製造方法
JPH06908B2 (ja) * 1988-01-19 1994-01-05 東レ株式会社 球状粉末接着剤およびその製造方法
JPH01297452A (ja) * 1988-05-24 1989-11-30 Toray Ind Inc エポキシ樹脂組成物

Similar Documents

Publication Publication Date Title
JP2012517503A5 (cg-RX-API-DMAC10.html)
JP2011006710A5 (cg-RX-API-DMAC10.html)
JP2011516694A5 (cg-RX-API-DMAC10.html)
JP2012518717A5 (cg-RX-API-DMAC10.html)
JP2011509921A5 (cg-RX-API-DMAC10.html)
JP2011524465A5 (cg-RX-API-DMAC10.html)
JP2009191156A5 (cg-RX-API-DMAC10.html)
PH12014502374A1 (en) Composition for film adhesives, method for producing same, film adhesive, semiconductor package using film adhesive and method for manufacturing semiconductor package using film adhesive
JP2015206009A5 (ja) 成形材料及びそれを用いた液体吐出ヘッド
TW200738770A (en) Active energy ray-curable resin composition and use thereof
JP2009084398A5 (cg-RX-API-DMAC10.html)
JP2016094511A5 (cg-RX-API-DMAC10.html)
JP2013510429A5 (cg-RX-API-DMAC10.html)
JP2018511670A5 (cg-RX-API-DMAC10.html)
WO2013142750A3 (en) Crash-durable adhesive with enhanced stress durability
WO2014019657A8 (en) Epoxy resins and silane aqueous co-dispersions and the uses thereof
JP2009067891A5 (cg-RX-API-DMAC10.html)
JP2020070326A5 (cg-RX-API-DMAC10.html)
WO2010118081A3 (en) Curing compositions having low-free amounts of methylenedianiline
IN2015DN01248A (cg-RX-API-DMAC10.html)
JP2012511601A5 (cg-RX-API-DMAC10.html)
JP2012131849A5 (cg-RX-API-DMAC10.html)
JP2007231213A5 (cg-RX-API-DMAC10.html)
JP2013510224A5 (cg-RX-API-DMAC10.html)
WO2011073422A3 (de) Bördelfalzverklebung