JP2011073120A - Cutting device and detecting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting device free from fixing metal to a cutting blade, or locally damaging the cutting blade when detecting a reference height of the cutting blade such as a resin blade, and also to provide a detecting method of the reference height in a vertical directional position of the cutting blade. <P>SOLUTION: The cutting device is provided with a liquid storage means 28 and a detecting means 42. The liquid storage means 28 has a liquid storage recessed part 30 having an opening upper surface, and a conductive liquid 34 is supplied here, and a height of its liquid level is set to a reference value as a reference liquid level 36. The detecting means 42 detects that the cutting blade 22 electrically contacts with the reference liquid level 36 by lowering the cutting blade 22 toward the reference liquid level 36. The vertical directional position of the cutting blade 22 in such a detection, is set as a reference height. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention provides a workpiece holding means having a horizontally extending holding surface, and a vertically movable conductive rotation for processing the workpiece held on the holding surface of the workpiece holding means. A vertical reference height of a conductive rotary cutting blade for processing a workpiece held on a holding surface with respect to a horizontally extending holding surface of a cutting device having a cutting blade and a workpiece holding means The present invention relates to a detection method for detecting the thickness.

  For example, as a cutting apparatus capable of dividing a package substrate into individual package devices with high accuracy, a workpiece holding means having a holding surface extending horizontally and a holding surface of the workpiece holding means are held. A cutting apparatus including a conductive rotary cutting blade that is movable in the vertical direction for processing a workpiece is proposed and put into practical use. As a conductive rotary cutting blade for cutting a package substrate, a resin blade in which diamond abrasive grains are hardened with a resin containing metal powder is generally used. Since the cutting blade has electrical conductivity, the cutting blade rotated at high speed is brought into contact with the upper surface of the base made of metal surrounding the holding surface of the holding means, and is electrically connected to detect such connection. The vertical position of the cutting blade at the time of detection is used as a reference height (see, for example, Japanese Patent Application Laid-Open Nos. 11-254259 and 2005-142202).

JP 11-254259 A JP 2005-142202 A

  The frame of the conventional holding means is often made of a metal such as SUS. When a cutting blade rotating at high speed is brought into contact with the frame, the base metal is fixed to the tip of the blade or is in contact with the frame. Sometimes the cutting blade is locally damaged. When the package substrate is cut with such a cutting blade, there is a problem that the quality of the device is deteriorated, such as chipping on the side surface of the package device.

  The present invention has been made in view of such points, and the main technical problem thereof is that metal is fixed to the cutting blade when the reference height of the conductive rotary cutting blade such as a resin blade is detected, or the cutting blade is To provide a new and improved cutting device that is not damaged and a method for detecting a reference height in a vertical direction of a cutting blade.

  The present invention has been made in view of the above facts, and as a cutting method for achieving the main technical problem, a workpiece holding means having a horizontally extending holding surface, and the workpiece holding means, In a cutting apparatus comprising a conductive rotary cutting blade movable in a vertical direction for processing a workpiece held on a holding surface, a liquid storage means having a liquid storage recess having an open upper surface, A conductive liquid is supplied to the liquid storage recess of the liquid storage means, and a reference liquid surface having a predetermined relationship height with respect to the holding surface height of the workpiece holding means is formed in the liquid storage recess. Conductive liquid supply means, and the cutting blade is lowered toward the reference liquid level so that the cutting blade contacts the reference liquid level, and the cutting blade and the reference liquid level are electrically connected Will detect such a connection, That and a detection means for the vertical position reference height of the detection time of the cutting blade, is provided a cutting apparatus, characterized in that.

  The conductive liquid supply means is a fixed quantity supply means for supplying a predetermined amount of conductive liquid, and includes a conductive liquid discharge means for discharging the conductive liquid present in the liquid storage recess of the liquid storage means. It is preferred that

  Further, as a detection method for achieving the main technical problem, a conductive rotary cutting blade for processing the workpiece held on the holding surface with respect to the holding surface extending horizontally of the workpiece holding means. As a detection method for detecting the height in the vertical direction, a conductive liquid is supplied into a liquid storage recess in which the upper surface of the liquid storage means is opened, and a predetermined height is set with respect to the holding surface height of the workpiece holding means. Forming a reference liquid surface having a relational height, then lowering the processing means toward the reference liquid surface, the processing means comes into contact with the reference liquid surface, and the processing means and the reference liquid surface are electrically A detection method is provided in which a point in time of electrical connection is electrically detected, and a vertical position of the cutting blade at the time of detection is used as a reference height.

  When the cutting blade is lowered, it is preferable to maintain the cutting blade in a non-rotating state.

  According to the present invention, since the reference surface at the time of detecting the reference position of the cutting blade is formed of water, metal is not fixed to the cutting blade, or the cutting blade is not damaged, and the cutting ability is not lowered.

The perspective view which shows the principal part and workpiece of a cutting device. The principal part perspective view which shows the cutting device which concerns on this invention. Schematic which shows the detection method which concerns on this invention. Schematic which shows the detection method (conductive liquid discharge means) which concerns on this invention. Schematic which shows the detection method (quantitative supply means) which concerns on this invention. The perspective view which shows other embodiment of the principal part of the cutting device which concerns on this invention.

  Hereinafter, preferred embodiments of a cutting apparatus and a detection method of the present invention will be described in more detail with reference to the accompanying drawings.

  FIG. 1 shows a main part of a typical example of the cutting apparatus of the present invention. The cutting apparatus is provided with a workpiece holding means 2 and a cutting means 4 shown in FIG. The workpiece holding means 2 includes a suction member 8 having a holding surface 6 extending horizontally and a base 10. The base 10 is made of a rigid member such as SUS, and is arranged to be rotatable in a horizontal plane and movable in the X-axis direction. An adsorbing member 8 formed of an elastic member such as a resin is fixed to the upper surface of the base 10 by an appropriate mode such as bonding with an adhesive. A plurality of suction holes 12 are opened in the holding surface 6 of the suction member 8. The suction holes 12 are formed corresponding to a plurality of devices D formed in the workpiece W to be described later. The plurality of suction holes 12 are selectively communicated with a suction source (not shown). The configuration of the cutting device itself may be a well-known form disclosed in, for example, Japanese Patent Application Laid-Open No. 2008-262983, and detailed description thereof is omitted in this specification.

  The workpiece W sucked and held on the holding surface 6 of the workpiece holding means 2 described above is a rectangular semiconductor package substrate such as a QFN substrate (Quad Flat Non-lead package) as an example. The package substrate W illustrated in FIG. 1 is formed of a substrate 14 and a resin 16 that collectively seals IC chips or the like (not illustrated) mounted on the back side of the substrate 14. The IC chip or the like is mounted in a region defined by a dividing line L formed on the surface of the substrate 14. By cutting along the dividing line L, the package substrate W is divided into individual devices D.

  The workpiece 2 held on the holding surface 6 of the workpiece holding means 2 is divided along the dividing line L by the cutting means 4. As shown in FIG. 1, the cutting means 4 is mounted via a tool mount 20 on a housing 18, a spindle (not shown) disposed on the housing 18 so as to be rotatable at high speed, and a tip of the spindle. A conductive rotary cutting blade 22 and a wheel cover 26 having a nozzle 24 for supplying a cutting fluid to the cutting blade 22 are configured. The cutting means 4 is disposed so as to be movable in the vertical direction in the Z-axis direction and the Y-axis direction.

  In general, when the workpiece is a QFN substrate, a resin blade obtained by hardening diamond abrasive grains with a resin containing metal powder is used as the cutting blade 22. The cutting blade 22 has conductivity by adding metal powder to the resin. The cutting blade 22 has a well-known annular structure.

  Continuing the description with reference to FIG. 2, the liquid storage means 28 is disposed in the vicinity of the workpiece holding means 2 described above. The liquid storage means 28 has a block shape formed of a metal member such as SUS, and a liquid storage recess 30 whose top is opened is formed on the upper surface. The opening of the liquid storage recess 30 is formed wider than the blade thickness of the cutting blade 22. The conductive liquid 34 may be any liquid that has conductivity such as mixed water having an electric resistivity of 1 MΩ or less, city water, etc. mixed with pure water and does not affect the cutting blade 22 chemically. .

  FIG. 2 shows a quantitative supply means 32 for supplying a predetermined amount of the conductive liquid 34, which is an embodiment of the conductive liquid supply means for supplying the conductive liquid 34 to the liquid storage recess 30 of the liquid storage means 28. . The metering supply means 32 is formed above the liquid storage recess 30 and is formed by a metering valve such as a poppet valve that can be metered and dropped through a pipe (not shown) through which the conductive liquid 34 is supplied. As shown in FIG. 2, the predetermined amount is an amount by which the liquid level is formed at a predetermined position of the liquid storage recess 30 of the liquid storage means 28. The liquid level formed in the liquid containing recess 30 by the quantitative conductive liquid 34 dropped from the conductive liquid supply means 32 is always formed at the same position. Such a liquid level is set as a reference liquid level 36 (see FIG. 3), and the arrangement position of the liquid storage recess 30 and the quantitative supply means 32 are set so as to have a predetermined relationship height with respect to the holding surface 6 of the workpiece holding means 2. And a predetermined amount of the conductive liquid 34 dropped from.

  As shown in FIG. 2, conductive liquid discharge means 35 for discharging the conductive liquid 34 in the liquid storage recess 30 of the liquid storage means 28 is provided. The conductive liquid discharge means 35 is, for example, an air nozzle 35a that supplies air at a high pressure. The air nozzle 35a is disposed at a location that does not obstruct the dropping of the liquid 34 dripped from the quantitative supply means 32 above the liquid containing means 28 with the opening of the air nozzle 35a facing the liquid containing recess 30. The conductive liquid discharge means 35 is configured to be able to discharge all of the conductive liquid 34 existing in the liquid storage recess 30 by providing a plurality of air nozzles as necessary, or being configured to be movable as appropriate. .

  As shown in FIG. 3, the liquid storage recess 30 is connected to the rear end portion of the spindle 19 of the cutting means 4 via a wiring 38. A DC power supply 40 and detection means 42 for detecting that a current has flowed through the wiring 38 are disposed on the wiring 38. When the cutting blade 22 is lowered toward the reference liquid level 36 of the predetermined amount of the conductive liquid 34 in the liquid storage recess 30 and the lower end of the cutting blade 22 comes into contact with the reference liquid level 36, a current flows through the wiring 38 and is detected. Current is detected by means 42. The vertical position of the cutting blade 22 at the time of detection is set as a reference height.

  Subsequently, in the cutting apparatus configured as described above, the conductivity for processing the workpiece W held on the holding surface 6 with respect to the holding surface 6 extending horizontally of the workpiece holding means 2. A detection method for detecting the vertical height of the rotary cutting blade 22 will be described. First, the cutting blade 22 is mounted on the spindle 19 via the tool mount 20 in a state where the rotation of the spindle 19 is stopped. Next, as shown in FIG. 4, the conductive liquid 34 supplied at the time of the previous reference height detection in the liquid storage recess 30 of the liquid storage means 28 by jetting compressed air from the conductive liquid discharge means 35 is removed. Remove virtually all.

  After that, as shown in FIG. 5, a predetermined amount of conductive liquid 34 is dropped from the constant supply means 32 into the liquid containing recess 30 and thus the height of the holding surface 6 of the workpiece holding means 2 as shown in FIG. A reference liquid level 36 having a predetermined height relative to the height is formed. Next, the cutting means 4 is lowered toward the reference liquid level 36 while the cutting blade 22 is maintained in the non-rotating state. The detecting means 42 detects when the lower end of the cutting blade 22 contacts the reference liquid level 36 and the cutting means 4 and the reference liquid level 36 are electrically connected. The vertical position of the cutting blade 22 at the time of detection is set as a reference height. Since the cutting blade 22 is maintained in the non-rotating state, it is reliably avoided that the wavy reference liquid level 36 fluctuates due to the wind pressure generated from the cutting blade 22 rotating at high speed. Further, every time the reference height is detected, substantially all of the conductive liquid 34 in the previous reference height detection is removed, and then a predetermined amount of the conductive liquid 34 is supplied. As a result, the reference liquid level 36 is reliably prevented from fluctuating.

  FIG. 6 illustrates another embodiment of the liquid supply means. The liquid supply means 44 illustrated in FIG. 6 includes a block member 46 formed of a rectangular metal material such as SUS. A liquid storage recess 47 formed along the long side of the block member 46 is formed on the upper surface of the block member 46. Inclined surfaces 48 are formed on both sides of the liquid storage recess 47 so as to be inclined outward. The liquid storage recess 47 is formed in an elongated groove shape, and the width W of the liquid storage recess 47 is larger than the blade thickness of the cutting blade 22 for detecting the reference position.

  An opening 50 for supplying the conductive liquid 49 is formed on the bottom surface of one end in the longitudinal direction of the liquid containing recess 47, and the conductive liquid pipe 52 formed through the block member 46 in the opening 50. (Represented simply by a two-dot chain line). Further, the block member 46 is formed with a discharge groove 54 for discharging the conductive liquid 49 communicating with the other longitudinal end of the liquid containing recess 47. The conductive liquid 49 is supplied from the conductive liquid pipe 52 at a predetermined supply amount so that the upper surface 47a of the groove of the liquid containing recess 47 and the water surface of the conductive liquid 49 have the same height. The conductive liquid 49 that has passed over the upper surface 47 a of the groove of the liquid containing recess 47 flows down on the inclined surface 48. By supplying the conductive liquid 49 in a predetermined amount and discharging it through the inclined surface 48 and the discharge groove 54, fluctuations in the height of the water surface 51 can be sufficiently avoided. The liquid level of the conductive liquid 49 is set as a reference liquid level.

2 Workpiece holding means 4 Cutting means 22 Cutting blade 28 Liquid storage means 30 Liquid storage recess 32 Conductive liquid supply means 34 Conductive liquid 35 Conductive liquid discharge means 36 Reference liquid level 42 Detection means 44 Liquid storage means (Other Embodiment)
W Workpiece

Claims (4)

Workpiece holding means having a holding surface extending horizontally, and a conductive rotary cutting blade movable in the vertical direction for processing the work piece held on the holding surface of the work piece holding means In a cutting device comprising:
A liquid storage means having a liquid storage recess having an open upper surface;
A conductive liquid is supplied to the liquid storage recess of the liquid storage means, and a reference liquid level having a predetermined relationship height with respect to the holding surface height of the workpiece holding means is formed in the liquid storage recess. Conductive liquid supply means for
When the cutting blade is lowered toward the reference liquid surface and the cutting blade is brought into contact with the reference liquid surface, and the cutting blade and the reference liquid surface are electrically connected, the connection is detected and applied. A cutting apparatus comprising: a detecting unit that sets a vertical position of the cutting blade at the time of detection as a reference height.   The conductive liquid supply means is a quantitative supply means for supplying a predetermined amount of conductive liquid, and the conductive liquid discharge means for discharging all of the conductive liquid existing in the liquid storage recess of the liquid storage means. The cutting device according to claim 1, further comprising: A detection method for detecting the vertical reference height of the conductive rotary cutting blade for processing the workpiece held on the holding surface with respect to the holding surface extending horizontally of the workpiece holding means,
Supplying a conductive liquid into a liquid containing recess in which the upper surface of the liquid containing means is opened to form a reference liquid level having a predetermined relational height with respect to the holding surface height of the workpiece holding means;
Next, the processing means is lowered toward the reference liquid level, and the time when the processing means comes into contact with the reference liquid level and the processing means and the reference liquid level are electrically connected is electrically detected, A detection method characterized in that a vertical position of the cutting blade at the time of detection is set as a reference height.   The detection method according to claim 3, wherein when the cutting blade is lowered, the cutting blade is maintained in a non-rotating state.

Images