JP2011023595A5 - - Google Patents

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Publication number
JP2011023595A5
JP2011023595A5 JP2009168028A JP2009168028A JP2011023595A5 JP 2011023595 A5 JP2011023595 A5 JP 2011023595A5 JP 2009168028 A JP2009168028 A JP 2009168028A JP 2009168028 A JP2009168028 A JP 2009168028A JP 2011023595 A5 JP2011023595 A5 JP 2011023595A5
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JP
Japan
Prior art keywords
main surface
pixel circuit
circuit chip
disposed
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009168028A
Other languages
English (en)
Japanese (ja)
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JP2011023595A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009168028A priority Critical patent/JP2011023595A/ja
Priority claimed from JP2009168028A external-priority patent/JP2011023595A/ja
Publication of JP2011023595A publication Critical patent/JP2011023595A/ja
Publication of JP2011023595A5 publication Critical patent/JP2011023595A5/ja
Pending legal-status Critical Current

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JP2009168028A 2009-07-16 2009-07-16 固定撮像素子 Pending JP2011023595A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009168028A JP2011023595A (ja) 2009-07-16 2009-07-16 固定撮像素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009168028A JP2011023595A (ja) 2009-07-16 2009-07-16 固定撮像素子

Publications (2)

Publication Number Publication Date
JP2011023595A JP2011023595A (ja) 2011-02-03
JP2011023595A5 true JP2011023595A5 (fr) 2012-05-10

Family

ID=43633395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009168028A Pending JP2011023595A (ja) 2009-07-16 2009-07-16 固定撮像素子

Country Status (1)

Country Link
JP (1) JP2011023595A (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5941659B2 (ja) * 2011-11-02 2016-06-29 浜松ホトニクス株式会社 固体撮像装置
JP6056186B2 (ja) * 2012-05-08 2017-01-11 株式会社ニコン 撮像素子
JP6244662B2 (ja) * 2013-05-27 2017-12-13 株式会社ニコン 撮像装置及びカメラ
JP6295983B2 (ja) * 2015-03-05 2018-03-20 ソニー株式会社 半導体装置およびその製造方法、並びに電子機器
JP6693068B2 (ja) * 2015-03-12 2020-05-13 ソニー株式会社 固体撮像装置および製造方法、並びに電子機器
CN111627940B (zh) * 2019-02-27 2023-08-11 中芯集成电路（宁波）有限公司 Cmos图像传感器封装模块及其形成方法、摄像装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3207319B2 (ja) * 1993-05-28 2001-09-10 株式会社東芝 光電変換装置及びその製造方法
JPH08172177A (ja) * 1994-12-16 1996-07-02 Toshiba Corp 固体撮像モジュールおよび内視鏡装置
JPH1084509A (ja) * 1996-09-06 1998-03-31 Matsushita Electron Corp 撮像装置およびその製造方法
JP4170950B2 (ja) * 2003-10-10 2008-10-22 松下電器産業株式会社 光学デバイスおよびその製造方法
JP2005268567A (ja) * 2004-03-19 2005-09-29 Matsushita Electric Ind Co Ltd 基板およびその製造方法
JP4290134B2 (ja) * 2005-03-14 2009-07-01 パナソニック株式会社 固体撮像装置と固体撮像装置の製造方法
JP5045952B2 (ja) * 2009-02-12 2012-10-10 セイコーエプソン株式会社 光デバイス、光モジュール及び電子機器

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