JP2011014837A - 電子機器 - Google Patents

電子機器 Download PDF

Info

Publication number
JP2011014837A
JP2011014837A JP2009159953A JP2009159953A JP2011014837A JP 2011014837 A JP2011014837 A JP 2011014837A JP 2009159953 A JP2009159953 A JP 2009159953A JP 2009159953 A JP2009159953 A JP 2009159953A JP 2011014837 A JP2011014837 A JP 2011014837A
Authority
JP
Japan
Prior art keywords
heat
generating component
electronic device
circuit board
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009159953A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011014837A5 (enExample
Inventor
Toshio Nagao
敏男 長尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yaskawa Electric Corp
Original Assignee
Yaskawa Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yaskawa Electric Corp filed Critical Yaskawa Electric Corp
Priority to JP2009159953A priority Critical patent/JP2011014837A/ja
Publication of JP2011014837A publication Critical patent/JP2011014837A/ja
Publication of JP2011014837A5 publication Critical patent/JP2011014837A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2009159953A 2009-07-06 2009-07-06 電子機器 Pending JP2011014837A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009159953A JP2011014837A (ja) 2009-07-06 2009-07-06 電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009159953A JP2011014837A (ja) 2009-07-06 2009-07-06 電子機器

Publications (2)

Publication Number Publication Date
JP2011014837A true JP2011014837A (ja) 2011-01-20
JP2011014837A5 JP2011014837A5 (enExample) 2012-05-10

Family

ID=43593420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009159953A Pending JP2011014837A (ja) 2009-07-06 2009-07-06 電子機器

Country Status (1)

Country Link
JP (1) JP2011014837A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106654645A (zh) * 2016-12-30 2017-05-10 上海航天科工电器研究院有限公司 一种互联转接的板卡集成与散热一体化控制盒
CN106793693A (zh) * 2016-12-22 2017-05-31 广东技术师范学院 一种智能伺服驱动器系统散热装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11354955A (ja) * 1998-06-11 1999-12-24 Mitsubishi Electric Corp 電子機器の冷却構造
JP2006024948A (ja) * 2005-07-08 2006-01-26 Nec Corp 放熱構造、パッケージ組立体、及び放熱用シート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11354955A (ja) * 1998-06-11 1999-12-24 Mitsubishi Electric Corp 電子機器の冷却構造
JP2006024948A (ja) * 2005-07-08 2006-01-26 Nec Corp 放熱構造、パッケージ組立体、及び放熱用シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106793693A (zh) * 2016-12-22 2017-05-31 广东技术师范学院 一种智能伺服驱动器系统散热装置
CN106654645A (zh) * 2016-12-30 2017-05-10 上海航天科工电器研究院有限公司 一种互联转接的板卡集成与散热一体化控制盒

Similar Documents

Publication Publication Date Title
CN105308742B (zh) 半导体组件用冷却器的制造方法、半导体组件用冷却器、半导体组件和电驱动车辆
JP4391366B2 (ja) ヒートパイプを備えたヒートシンクおよびその製造方法
KR101605666B1 (ko) 냉각 장치 및 이것을 이용한 냉각 장치가 부착된 파워 모듈
JP5070014B2 (ja) 放熱装置
JP3119117U (ja) 熱管散熱器の構造
JP7118186B2 (ja) 放熱装置
US7957143B2 (en) Motor controller
JP5472955B2 (ja) 放熱モジュール
CN208173581U (zh) 散热器和散热器组件
JP6534873B2 (ja) 液冷式冷却装置
CN202977400U (zh) 功率半导体模块冷却装置
WO2016173286A1 (zh) 液冷散热器及电子设备
JP2011091088A (ja) 発熱体の放熱構造、および該放熱構造を用いた半導体装置
JP4438526B2 (ja) パワー部品冷却装置
JP4391351B2 (ja) 冷却装置
JP2011014837A (ja) 電子機器
JP4968150B2 (ja) 半導体素子冷却装置
JP4150647B2 (ja) 電子部品の冷却装置
JP4229738B2 (ja) ヒートパイプ式放熱ユニット
US20250393164A1 (en) Liquid cooling system
CN222705503U (zh) 一种功率器件、散热系统和功率半导体设备
JP6044157B2 (ja) 冷却部品
TWI422315B (zh) 散熱裝置
JP2017183590A (ja) ヒートシンク
JP2024128397A (ja) 冷却器

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120229

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20120316

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120319

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130220

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130226

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130423

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20131001