JP2011009716A - Method of manufacturing substrate for light emitting element mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for light emitting element mounting such that when at least an insulating layer is laminated on a substrate having a projection part for a light emitting element mounting position, the projection part is easily exposed and there is neither a problem of positioning nor a problem of precision of opening processing.SOLUTION: The method of manufacturing the substrate for light emitting element mounting includes: a projection part forming step of forming the projection part on a surface of the substrate; a laminating step of laminating at least the insulating layer on the surface of the substrate not at the position where the projection part is formed on the surface; and a removing step of removing an excessive part of the insulating layer which protrudes from a projection end of the projection part.

Description

  The present invention relates to a method for manufacturing a light emitting element mounting substrate for mounting a light emitting element such as a light emitting diode chip on the surface of the substrate. The substrate for mounting a light-emitting element manufactured according to the present invention is particularly useful as a light-emitting plate or the like for a low-power light and thin lighting device.

  Conventionally, Patent Document 1 is known as a method of manufacturing a light emitting element mounting substrate for mounting a light emitting element on the surface of a substrate. The manufacturing method of the light emitting element mounting substrate of Patent Document 1 includes a step of selectively etching the surface metal layer laminated on the metal substrate to form a metal convex portion at the mounting position of the light emitting element; Forming a flat insulating layer substantially flush with the upper surface, and simultaneously forming a power supply pattern having an electrode portion in the vicinity of the heat dissipation pattern while forming a heat dissipation pattern on the upper surface of the metal convex portion; ,including. As a method of integrally forming the metal layer for forming this electrode portion with the insulating layer, a copper foil with resin is heated and pressed by a pressing surface, and the surface has a convex portion at a position corresponding to the metal convex portion. It is described that a laminate in which a layer is formed is obtained, and the protrusions of the laminate are removed to expose the metal protrusions.

Japanese Patent Laying-Open No. 2005-167086 (see claim 2, paragraph numbers 0054 and 0061, FIG. 7)

  In the above-mentioned Patent Document 1, a convex portion is formed by covering the upper surface of the metal convex portion with a copper foil with resin, and the convex portion is removed to expose the metallic convex portion. The processing for removing the convex portion tends to increase the processing time when the planar shape size of the metallic convex portion is large or the thickness of the copper foil with resin is large. On the other hand, there is a technique in which an opening is provided in an insulating layer or the like according to the planar shape of the metal convex portion, and this is laminated and integrated. However, with this method, it is difficult to form an opening that matches a complex-shaped metal convex part. In addition to the problem of the positioning accuracy of the opening, there is a problem that the resin protrudes from the opening when stacking and integrating. there were.

  Therefore, an object of the present invention is to easily expose the convex portion when at least an insulating layer is laminated on the substrate on which the convex portion at the light emitting element mounting position is formed, and to solve the problem of alignment and the opening. An object of the present invention is to provide a method for manufacturing a substrate for mounting a light emitting element, which is less likely to cause a problem in processing accuracy.

The manufacturing method of the light emitting element mounting substrate of the present invention is as follows.
A protrusion forming step of forming a protrusion on the surface of the substrate;
A laminating step of laminating at least an insulating layer on the surface other than the place where the convex portion is formed on the surface of the substrate;
And a removal step of removing an excess portion protruding from the protruding end of the convex portion of the insulating layer.

  According to the manufacturing method of this configuration, in addition to the location where the convex portions formed on the substrate surface are formed, at least the surplus portions protruding from the protruding ends of the convex portions of the insulating layer generated when the insulating layers are stacked are removed. Thus, the convex portion can be easily exposed. In addition, a light emitting element is mounted on the convex part, and in order to easily release heat generated from the light emitting element, it is preferable that the convex part and the substrate are made of, for example, a metal material having excellent thermal conductivity. Further, the “protruding end of the convex portion” is a concept including an edge portion of the convex portion when the upper surface of the convex portion is a plane. In addition, the “protruding” portion means a portion protruding from the height of the upper surface when the upper surface of the convex portion is a plane, and is a concept including a portion covering the upper surface of the convex portion and a portion not covering the same. . The object to be laminated on the substrate in the lamination step is only required to have at least an insulating layer, and other laminated ones are not particularly limited. For example, a metal layer, other conductive layer, and other insulation to be described later Layer and the like.

  In addition, as an embodiment of the invention described above, a configuration in which an insulating layer and a metal layer are stacked in the stacking step can be given. As a method of laminating, for example, after laminating an insulating layer on the substrate surface, a configuration in which a metal layer is laminated on the insulating layer, a configuration in which an insulating layer in which the metal layers are laminated in advance is laminated on the substrate surface, The structure which laminates | stacks a separate metal layer and an insulating layer on a board | substrate together is mentioned.

  Moreover, as one embodiment of the present invention, there is a configuration in which at least the insulating layer has a through portion that matches the shape of the convex portion before lamination on the substrate, and the through portion is laminated in accordance with the convex portion during the lamination process. is there. For example, when the metal layer is also laminated on the substrate, a through portion may be formed in the metal layer in the same manner as the insulating layer, and a configuration in which the through portion is not formed in the metal layer may be employed.

  According to this configuration, since the through portion is formed, the surplus portion to be removed is small and can be easily removed. Examples of the surplus portion include an insulating layer forming material protruding from the insulating layer, and an insulating layer forming material and a metal layer forming material formed so as to cover the convex portion. Further, together with the surplus part, it may be configured to remove a part of the convex part in order to flatten the upper surface of the convex part or so that the height of the convex part upper surface and the metal layer upper surface are substantially flush with each other. it can.

  Further, it is preferable that the height of the upper surface of the convex portion and the upper surface of the metal layer after the laminating step or the removing step is substantially flush. Since both can form a flat reflecting surface with respect to the light emitting element, providing a reflector on the outer peripheral portion makes it possible to irradiate light with high efficiency using reflected light. Moreover, when mounting a light emitting element provided with an electrode and a bonding part on the lower surface, it is important that the height of both is the same. As a result, the heat dissipation effect from the light emitting element is high, and the cost and accuracy can be reduced, and the light irradiation efficiency can be increased.

  Moreover, as one embodiment of the above invention, the planar shape size of the penetrating portion is configured to be smaller than the planar shape size of the convex portion, and the insulating layer is laminated when the penetrating portion is laminated to the convex portion in the stacking step. In addition, there is a configuration in which the deformed portion of the metal layer protrudes from the protruding end of the convex portion to form an excessive portion.

  According to this structure, the deformation | transformation part of an insulating layer and a metal layer protrudes from the protrusion of a convex part, forms a surplus part, and this surplus part is removed. The planar shape of the penetrating portion and the planar shape of the convex portion may be the same or different. That is, when the substrate, the insulating layer, and the metal layer are laminated and integrated, it is only necessary that the position of the convex portion and the position of the penetrating portion are substantially matched, and positioning is not performed with high accuracy. .

  Moreover, as one embodiment of the present invention, the planar shape size of the penetrating portion is configured to be larger than the planar shape size of the convex portion, and the insulating layer is formed when the penetrating portion is laminated with the convex portion in the stacking step. There is a configuration in which the deformed portion protrudes from the protruding end of the convex portion to form an excess portion.

  According to this configuration, the deformed portion of the insulating layer protrudes from the protruding end of the convex portion to form a surplus portion, and the surplus portion is removed. The planar shape of the penetrating portion and the planar shape of the convex portion may be the same or different. That is, when the substrate, the insulating layer, and the metal layer are laminated and integrated, it is only necessary that the position of the convex portion and the position of the penetrating portion are substantially matched, and positioning is not performed with high accuracy. .

  Moreover, as one embodiment of the present invention, a configuration in which the planar shape of the penetrating portion is circular and the planar shape of the convex portion is a shape selected from an elliptical shape, a bowl shape, a rectangular shape, and a polygonal shape. is there. As the planar shape of the convex portion, various shapes may be adopted depending on the product specifications of the light emitting element mounting substrate, and accordingly, the planar shape of the penetrating portion does not need to be the same. By forming a circular shape, it is possible to easily form the through portion.

It is a figure which shows an example of the board | substrate for light emitting element mounting. It is process drawing which shows an example of the manufacturing method of the light emitting element mounting substrate. It is a figure for demonstrating an example of the manufacturing method of the light emitting element mounting substrate. It is a figure for demonstrating the other example of a removal object part. It is a figure for demonstrating the planar shape from which a metal convex part and a penetration part differ. It is a figure of an example of the manufacturing method of the light emitting element mounting substrate of another embodiment. It is a figure of an example of the manufacturing method of the light emitting element mounting substrate of another embodiment.

(Light-emitting element mounting substrate)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, the light emitting element mounting substrate is a light emitting element mounting substrate for mounting and supplying power to the light emitting element 30, and includes the metal substrate 10 and the light emitting element 30 of the metal substrate 10. The metal convex part 14 formed in the mounting position, the insulating layer 16 formed in the circumference | surroundings of the metal convex part 14, and the metal layer 17 laminated | stacked on the insulating layer 16 are provided. In the present embodiment, the protective metal layer 12 is formed between the metal substrate 10 and the metal protrusions 14, but in another embodiment, there is a configuration in which the protective metal layer 12 is not formed. Moreover, although embodiment using a metal substrate as a board | substrate is shown, a board | substrate can also be comprised with another material excellent in thermal conductivity. Moreover, although embodiment using a metal convex part as a convex part is shown, a convex part can also be comprised with the other material excellent in thermal conductivity. In such a case, a known forming method can be applied as a method for forming the convex portion.

(Light emitting element)
Examples of the light emitting element 30 include a light emitting diode chip, a bare chip (processed from an ultraviolet light emitting diode wafer), a bare chip packaged in a surface mount type, and a semiconductor laser chip. When a light emitting diode chip is used, there are two types of the back side, a cathode type and an anode type. In this embodiment, the bare chip type light emitting element 30 is superior in terms of heat dissipation and mounting area.

  As shown in FIG. 1, the light emitting element 30 is electrically connected to the metal layers 17 on both sides. This conductive connection can be performed by connecting the upper electrode of the light emitting element 30 and each metal layer 17 by wire bonding or the like using a metal thin wire 31. As wire bonding, ultrasonic waves or a combination of this and heating can be used. An electrode portion is formed on the metal layer 17.

  Further, as shown in FIG. 1, a reflector 22 having a reflecting surface may be formed around the mounting position of the light emitting element 30. Furthermore, it is preferable to coat the inner side of the reflector 22 with a transparent resin or the like, and a convex transparent resin lens may be provided thereabove. Since the transparent resin lens has a convex surface, light can be efficiently emitted upward from the substrate. The transparent resin lens may be colored.

  In this embodiment, the upper surface of the metal convex portion 14 and the upper surface of the metal layer 17 are substantially flush with each other, and both of them can form a flat reflective surface with respect to the light emitting element 30. For this reason, by providing the reflector 22 in the outer peripheral portion, it becomes possible to irradiate light with high efficiency using reflected light. Note that the light emitting element 30 may be mounted by any method such as conductive paste, double-sided tape, and solder bonding, but metal bonding is preferred from the viewpoint of heat dissipation.

(Production method)
A method for manufacturing the light emitting element mounting substrate of this embodiment will be described with reference to FIGS. First, the metal convex part 14 is formed in the metal substrate 10 (step S1 of FIG. 2, metal convex part formation process). As shown in FIGS. 3A to 3C, the surface metal layer 4 laminated on the metal substrate 10 is selectively etched to form the metal protrusion 14 at the mounting position of the light emitting element 30. In this embodiment, the surface metal layer 4 shows the example laminated | stacked on the metal substrate 10 through another protective metal layer 2 which shows tolerance at the time of the etching.

  In this embodiment, as shown in FIG. 3A, a laminated plate SP in which a metal substrate 10, a protective metal layer 2, and a surface metal layer 4 for forming a metal convex portion 14 are laminated is prepared. The laminated plate SP may be manufactured by any method, and for example, any of those manufactured using electrolytic plating, electroless plating, sputtering, vapor deposition, or a clad material can be used. Regarding the thickness of each layer of the laminated plate SP, for example, the thickness of the metal substrate 10 is 30 to 5000 μm, the thickness of the protective metal layer 2 is 1 to 20 μm, and the thickness of the surface metal layer 4 is 10 to 500 μm.

  The above-described electrolytic plating can be performed by a known method. In general, while the target substrate is immersed in a plating bath, it is used as a cathode, and a metal ion replenishment source of a metal to be plated is used as an anode. This is carried out by depositing a metal on the cathode side by an electrolysis reaction.

  On the other hand, for electroless plating, a plating solution such as copper, nickel, or tin can be used. Electroless plating solutions are well known for various metals, and various types are commercially available. In general, the liquid composition contains a metal ion source, an alkali source, a reducing agent, a chelating agent, a stabilizer, and the like. A plating catalyst such as palladium may be deposited prior to electroless plating.

  The metal substrate 10 may be either a single layer or a laminated body, and any metal may be used as a constituent metal. For example, copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, and the like can be used. Of these, copper and aluminum are preferable from the viewpoint of thermal conductivity and electrical conductivity. With the structure including the metal substrate 10 with good heat dissipation as described above, the temperature rise of the light emitting element 30 can be prevented, so that a larger amount of drive current can be supplied and the amount of light emission can be increased.

  As the metal constituting the surface metal layer 4, copper, a copper alloy, nickel, tin or the like can be used, and copper is particularly preferable from the viewpoint of thermal conductivity and electrical conductivity.

  As the metal constituting the protective metal layer 2, a metal different from the metal substrate 10 and the surface metal layer 4 is used, and another metal exhibiting resistance when etching these metals can be used. Specifically, when these metals are copper, another metal constituting the protective metal layer 2 is gold, silver, zinc, palladium, ruthenium, nickel, rhodium, lead-tin solder alloy, or nickel. -A gold alloy or the like is used. However, not only a combination of these metals, but also any combination with another metal exhibiting resistance when the metal is etched can be used. In the present embodiment, an example in which the protective metal layer 2 is formed on the metal substrate 10 is shown. However, the protective metal layer 2 is not essential, and in other embodiments, the protective metal layer 2 is formed on the metal substrate 10. Some configurations do not.

  Next, as shown in FIG. 3B, the surface metal layer 4 is selectively etched using the etching resist M. Thereby, the metal convex part 14 is formed in the mounting position of the light emitting element 30. The planar shape of the metal convex portion 14 is not particularly limited, and may be any of, for example, a circle, an ellipse, and a rectangle, but it is preferable to increase the area as much as possible from the viewpoint of heat dissipation. By this etching, the protective metal layer 2 is exposed.

  In the present embodiment, a substantially circular metal convex portion 14 is formed, and a metal layer 17 having a semicircular arc-shaped electrode portion is formed around the metal convex portion 14, and this is electrically connected to the power feeding pattern. It is connected to the. Thus, the substantially circular metal protrusion 14 and the metal layer 17 formed around the metal protrusion 14 can reflect light from the light emitting element 30 efficiently.

  As the etching resist M, a photosensitive resin, a dry film resist (photoresist), or the like can be used. In addition, when the metal substrate 10 is etched simultaneously with the surface metal layer 4, it is preferable to provide the mask material for preventing this on the lower surface of the metal substrate 10 (not shown).

  Examples of the etching method include etching methods using various etching solutions according to the types of each metal constituting the protective metal layer 2 and the surface metal layer 4. For example, when the surface metal layer 4 is copper and the protective metal layer 2 is the aforementioned metal (including a metal resist), a commercially available alkaline etching solution, ammonium persulfate, hydrogen peroxide / sulfuric acid, or the like can be used. After the etching, the etching resist is removed.

  Next, as shown in FIG. 3D, the exposed protective metal layer 2 is removed. In another embodiment, the insulating layer 16 can be laminated without removing the protective metal layer 2. The protective metal layer 2 can be removed by etching. Specifically, when the surface metal layer 4 is copper and the protective metal layer 2 is the above-described metal, nitric acid that is commercially available for removing solder. It is preferable to use an acid-based etching solution such as an acid-based, sulfuric acid-based, or cyan-based acid.

  After removing the exposed protective metal layer 2, the surface of the metal substrate 10 is exposed from the removed portion. In order to improve the adhesion between this and the insulating layer 16, the exposed surface of the metal substrate 10 is blackened. It is preferable to perform a surface treatment such as a roughening treatment.

  Next, the insulating layer 16 and the metal layer 17 are laminated on the surface of the metal substrate 10 other than the place where the metal protrusions 14 are formed (step S2 in FIG. 2, laminating process). As shown in FIG. 3D, the insulating layer 16 and the metal layer 17 in which the penetrating portion 18 is formed are prepared. The through portion 18 is formed to correspond to the position of the metal convex portion 14 of the metal substrate 10 to be laminated. The penetrating portion 18 is formed at a position corresponding to the metal convex portion 14, but the planar shape size of the penetrating portion 18 may be smaller than the planar shape size of the metal convex portion 14, and the planar shape size of the penetrating portion 18. May be larger than the planar shape size of the metal protrusion 14. In addition, the planar shape of the penetrating portion 18 may coincide with or substantially coincide with the planar shape of the metal convex portion 14, or may be configured in a completely different shape. FIGS. 5A to 5C show examples in which the planar shape of the metal convex portion 14 and the planar shape of the penetrating portion 18 are different.

  Although the insulating layer 16 in which the penetrating part 18 is formed and the metal layer 17 in which the penetrating part 18 is formed can be separately laminated on the metal substrate 10, the insulating layer 16 and the metal layer 17 are laminated and integrated in advance. It is preferable that the penetrating portion 18 is formed in the metal layer with an insulating layer and the metal layer with the insulating layer is laminated on the metal substrate 10.

  In the present embodiment, a copper foil with an insulating resin will be described as an example of the metal layer with an insulating layer. A through-hole 18 is formed in the copper foil with insulating resin so as to correspond to the metal protrusion 14. The insulating layer 16 and the metal layer 17 can be formed simultaneously with this copper foil with insulating resin. For example, a copper foil with insulating resin is heated and pressed by a pressing surface (not shown), and the insulating layer 16 and the metal layer 17 are simultaneously laminated on the metal substrate 10 so that the metal convex portion 14 is inserted into the through portion 18. Is done. At this time, it is preferable to arrange at least a sheet material between the press surface and the laminated body. With this sheet material, it is possible to cope with the surplus portions 41 and 42 that are deformations of the insulating resin forming material and the metal layer forming material that are generated when the metal convex portion 14 is inserted into the through portion 18. It is preferable that the metal protrusions 14 and the metal layer 17 are laminated so that the upper surface thereof is substantially flush with the upper surface of the metal layer 17. Moreover, it is preferable that the insulating layer 16 is laminated | stacked on the metal substrate 10 so that the circumference | surroundings of the metal convex part 14 may be contacted.

  Various types of copper foil with insulating resin are commercially available, and any of them can be used. Further, the metal layer forming material forming the metal layer 17 and the insulating layer forming material forming the insulating layer 16 may be separately arranged.

  As a heating press method, a heating / pressurizing apparatus (thermal laminator, heating press) or the like may be used. In this case, the atmosphere may be set to a vacuum (vacuum laminator or the like) in order to avoid air contamination. Conditions such as heating temperature and pressure may be appropriately set according to the material and thickness of the insulating layer forming material and the metal layer forming material, but the pressure is preferably 0.5 to 30 MPa. By the heat press, the insulating layer forming material and the metal layer forming material are deformed according to the surface of the metal substrate 10 to form the hardened insulating layer 16 and the metal layer 17. You may cool after this heat press. Moreover, as a press means, a plane press, a roll press, and those combination press are mentioned, for example.

  As the insulating layer forming material for forming the insulating layer 16, any material may be used as long as it is deformed at the time of lamination and solidified by heating or the like and has heat resistance required for the wiring board. Specific examples include various reaction curable resins such as polyimide resins, phenol resins, and epoxy resins, and composites (prepregs) of the same with glass fibers, ceramic fibers, aramid fibers, and the like. The thickness of the insulating layer forming material that forms the insulating layer 16 is set in consideration of the thickness of the metal protrusion 14 and the thickness of the metal layer 17.

  As the metal layer forming material for forming the metal layer 17, copper, copper alloy, nickel, tin and the like can be used, and copper is particularly preferable from the viewpoint of thermal conductivity and electrical conductivity. The thickness of the metal layer forming material forming the metal layer 17 is, for example, about 5 to 50 μm.

  The sheet material only needs to be a material that allows deformation of the metal layer forming material or the insulating layer forming material at the time of heating press, such as cushion paper, rubber sheet, elastomer sheet, nonwoven fabric, woven fabric, porous sheet, foam sheet, Examples thereof include metal foils and composites thereof. In particular, those that can be elastically deformed, such as cushion paper, rubber sheets, elastomer sheets, foam sheets, and composites thereof, are preferable. Further, the thickness of the sheet material can be set according to the thickness of the metal layer 17 or the insulating layer 16.

  A release sheet may be additionally arranged together with the sheet material. Examples of the release sheet include a fluororesin film, a silicone resin film, various release papers, a fiber reinforced fluororesin film, and a fiber reinforced silicone resin film.

  Next, the surplus portions 41 and 42 that protrude from the protruding ends of the metal protrusions 14 in the insulating layer 16 and the metal layer 17 are removed (step S3 in FIG. 2, removal step). As shown in FIG. 3 (f), the surplus portions 41, 42 are deformed portions or insulating portions of the metal layer 17 that protrude from the protruding end of the metal convex portion 14 when the metal convex portion 14 is inserted into the penetrating portion 18. This is a deformed portion of the layer 16. When the planar shape size of the penetrating portion 18 is set smaller than the planar shape size of the metal convex portion 14, surplus portions 41 and 42 shown in FIG. Further, the surplus portions 41 and 42 are generated due to an error in the planar shape size of the penetrating portion 18 and the metal convex portion 14, an alignment error at the time of stacking, and the like. Therefore, it is not necessary to perform alignment or the like with high accuracy.

  Further, in consideration of the above-described planar shape size error and alignment error, the planar shape size of the penetrating portion 18 is made larger than the planar shape size of the metal convex portion 14 as shown in FIG. The forming material may be deformed to form the surplus portion 42 protruding from the protruding end of the metal convex portion 14.

  Further, as already shown in FIGS. 5A to 5C, the planar shape (opening shape) of the penetrating portion 18 and the planar shape of the metal convex portion 14 do not need to be the same. When the shape is complicated, the planar shape of the penetrating portion 18 can be formed into a simple shape, for example, a circle.

  As shown in FIG. 3G, the surplus portions 41 and 42 are removed. At this time, the portion where the upper surface of the metal convex portion 14 is higher than the upper surface of the metal layer 17 may be simultaneously removed and planarized.

  As this removal method, a method by grinding or polishing is preferable, a method using a grinding device having a hard rotating blade in which a plurality of hard blades made of diamond or the like are arranged in the radial direction of the rotating plate, a sander, a belt sander, a grinder, Examples thereof include a method using a surface grinder, a hard abrasive molded product, and the like. When the grinding apparatus is used, the upper surface can be flattened by moving the hard rotary blade along the upper surface of the fixedly supported wiring board while rotating the hard rotary blade. Moreover, as a grinding | polishing method, the method of lightly grind | polishing by a belt sander, buff grinding | polishing etc. is mentioned.

  Next, the metal layer 17 is etched using an etching resist to form a semicircular arc electrode portion. Thereafter, plating or the like may be performed in order to increase the thickness of the power supply pattern having electrode portions.

  Further, it is preferable to perform plating with a noble metal such as gold, nickel or silver on the upper surface of the metal convex portion 14 or the metal layer 17 in order to increase the reflection efficiency. In addition, a solder resist may be formed on the upper surface of the metal convex portion 14 or the metal layer 17 in the same manner as a conventional wiring substrate, or solder plating may be partially performed.

(Another embodiment of a light-emitting element mounting substrate)
In the above-described embodiment, an example in which grinding or the like is performed after heat-pressing the copper foil with insulating resin is shown. However, as another embodiment, after the copper foil with insulating resin is heat-pressed, an excess portion of the metal layer 17 is etched. 41 can be removed, and then grinding or the like can be performed.

  As another embodiment, FIG. 6A shows an insulating layer 16 having two penetrations 18 and a metal substrate 10 on which two metal projections 14 are inserted into the two penetrations 18. An example of stacking is shown. In this embodiment, unlike the above embodiment, the metal protective layer 2 is not formed on the metal substrate 10. It is preferable to stack a metal layer (not shown) on the insulating layer 16 after removing an excess portion (not shown) generated after the insulating layer 16 is stacked. Moreover, when an excess part arises by laminating | stacking a metal layer (not shown), it removes it. In addition, the metal layer in this case may have a configuration in which a through portion is formed, or may have a configuration in which no through portion is formed. Also, as shown in FIG. 6B, the metal substrate 10 is etched to form two metal substrate patterns 10a and 10b, and the light emitting element 30 is formed on the metal substrate pattern 10a via the metal protrusions 14. The mounted metal substrate pattern 10 b is conductively connected to the upper electrode of the light emitting element 30 and the thin metal wire 31 through the metal protrusion 14.

  Furthermore, as another embodiment, FIG. 7 shows that an insulating layer 16 in which a through portion 18 is formed and a metal layer 17 in which no through portion is formed are formed into a metal convex portion 14 that is inserted into the through portion 18. An example of stacking on the metal substrate 10 is shown. Excess portions (not shown) generated by laminating the insulating layer 16 and the metal layer 17 are removed. In FIG. 7, the insulating layer 16 and the metal layer 17 may be laminated in advance.

  Moreover, in the above-mentioned embodiment, the metal convex part 14 formed in the mounting position of the light emitting element 30 showed the example joined to the metal substrate 10 via the another protective metal layer 2 which shows tolerance at the time of the etching. However, it is also possible to omit the protective metal layer 2 by configuring the metal convex portion 14 and the metal substrate 10 with the same metal. In that case, the metal convex part 14 can be formed by half-etching a metal plate having a thickness obtained by combining the metal convex part 14 and the metal substrate 10.

  Moreover, the formation method of the metal convex part 14 is not limited to the above-mentioned formation method, A well-known metal convex part formation method is applicable.

  Moreover, in the above-mentioned embodiment, although the removal process which removes the surplus parts 41 and 42 which arose by the lamination process was provided, it is not limited to this, The surplus parts 41 and 42 are the quality of the light emitting element mounting substrate. When there is no problem, the removal process of the surplus parts 41 and 42 can be omitted.

  In the above-described embodiment, an example in which the light emitting element mounting substrate is configured by a power feeding pattern having an electrode portion is shown, but other electronic circuits may be formed on the same substrate. For example, it is preferable to form a drive circuit for a light emitting diode. In this case, wiring, lands, pads for bonding, pads for electrical connection to the outside, etc. are patterned in the periphery of the substrate, particularly in the corner and the vicinity thereof, and components such as chip capacitors, chip resistors and printing resistors, A transistor, a diode, an IC, or the like may be provided.

  In the above-described embodiment, the example of the light emitting element mounting substrate in which the wiring layer is a single layer has been described. However, the present invention is not limited to this, and the configuration of the light emitting element mounting substrate having two or more wiring layers is described. You can also. In that case, it is also possible to form the conductive connection structure between the wiring layers in the same process as the process of forming the metal protrusions 14. Details of the method of forming such a conductive connection structure are described in International Publication No. WO 00/52977, and any of these can be applied.

  In the above-described embodiment, as shown in FIG. 1, the example in which the light emitting element 30 and the reflector 22 are separately mounted on the light emitting element mounting substrate has been described. The integrally formed light emitting element unit may be mounted on the light emitting element mounting substrate. Various types of such light emitting element units are commercially available, and any of these can be used.

  In the above-described embodiment, an example in which a face-up light emitting element is mounted has been described. However, a face-down light emitting element having a pair of electrodes on the bottom surface may be mounted. In that case, the electrode part for supplying electric power is formed in the metal convex part 14.

DESCRIPTION OF SYMBOLS 10 Metal substrate 14 Metal convex part 16 Insulating layer 17 Metal layer 18 Through part 41, 42 Surplus part

Claims (6)

A protrusion forming step of forming a protrusion on the surface of the substrate;
A laminating step of laminating at least an insulating layer on the surface other than the place where the convex portion is formed on the surface of the substrate;
A method for manufacturing a substrate for mounting a light emitting element, comprising: removing a surplus portion protruding from a protruding end of the protruding portion of the insulating layer.   The method for manufacturing a light-emitting element mounting substrate according to claim 1, wherein in the stacking step, the insulating layer and the metal layer are stacked.   The light emitting element mounting substrate according to claim 1 or 2, wherein at least the insulating layer has a penetrating portion matched with the shape of the convex portion before lamination on the substrate, and the penetrating portion is laminated according to the convex portion during the lamination step. Manufacturing method.   The planar shape size of the penetrating portion is configured to be smaller than the planar shape size of the convex portion, and when the through portion is laminated to the convex portion during the stacking process, the deformed portion of the insulating layer and the metal layer is the tip of the convex portion. The manufacturing method of the light emitting element mounting substrate of Claim 3 which protrudes more and forms a surplus part.   The planar shape size of the penetrating portion is configured to be larger than the planar shape size of the projecting portion, and when the penetrating portion is laminated to the projecting portion during the lamination process, the deformed portion of the insulating layer protrudes from the projecting end of the projecting portion. The manufacturing method of the light emitting element mounting substrate of Claim 3 which forms a surplus part. The planar shape of the penetrating portion is circular, and the planar shape of the convex portion is a shape selected from an elliptical shape, a bowl shape, a rectangular shape, and a polygonal shape. Manufacturing method of substrate for mounting light emitting element.

Images