JP2010541177A - 燃料電池用の電極の製造方法 - Google Patents
燃料電池用の電極の製造方法 Download PDFInfo
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- JP2010541177A JP2010541177A JP2010527525A JP2010527525A JP2010541177A JP 2010541177 A JP2010541177 A JP 2010541177A JP 2010527525 A JP2010527525 A JP 2010527525A JP 2010527525 A JP2010527525 A JP 2010527525A JP 2010541177 A JP2010541177 A JP 2010541177A
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- substrate
- lanthanum
- electrode substrate
- electrode
- metal
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Links
- 239000000446 fuel Substances 0.000 title claims abstract description 42
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 139
- 238000007747 plating Methods 0.000 claims abstract description 68
- 229910052751 metal Inorganic materials 0.000 claims abstract description 60
- 239000002184 metal Substances 0.000 claims abstract description 60
- 239000002245 particle Substances 0.000 claims abstract description 49
- 239000003638 chemical reducing agent Substances 0.000 claims abstract description 22
- 238000007772 electroless plating Methods 0.000 claims abstract description 19
- 239000002243 precursor Substances 0.000 claims abstract description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 93
- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 44
- 229910052759 nickel Inorganic materials 0.000 claims description 44
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical group [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 19
- 238000000151 deposition Methods 0.000 claims description 16
- 239000003054 catalyst Substances 0.000 claims description 11
- IGPAMRAHTMKVDN-UHFFFAOYSA-N strontium dioxido(dioxo)manganese lanthanum(3+) Chemical compound [Sr+2].[La+3].[O-][Mn]([O-])(=O)=O IGPAMRAHTMKVDN-UHFFFAOYSA-N 0.000 claims description 11
- 229910002086 ceria-stabilized zirconia Inorganic materials 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 230000008021 deposition Effects 0.000 claims description 8
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 7
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 7
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 6
- QAISYPNSOYCTPY-UHFFFAOYSA-N cerium(3+) gadolinium(3+) oxygen(2-) Chemical compound [O--].[O--].[O--].[Ce+3].[Gd+3] QAISYPNSOYCTPY-UHFFFAOYSA-N 0.000 claims description 6
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 6
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 6
- DTDCCPMQHXRFFI-UHFFFAOYSA-N dioxido(dioxo)chromium lanthanum(3+) Chemical group [La+3].[La+3].[O-][Cr]([O-])(=O)=O.[O-][Cr]([O-])(=O)=O.[O-][Cr]([O-])(=O)=O DTDCCPMQHXRFFI-UHFFFAOYSA-N 0.000 claims description 6
- HBAGRTDVSXKKDO-UHFFFAOYSA-N dioxido(dioxo)manganese lanthanum(3+) Chemical compound [La+3].[La+3].[O-][Mn]([O-])(=O)=O.[O-][Mn]([O-])(=O)=O.[O-][Mn]([O-])(=O)=O HBAGRTDVSXKKDO-UHFFFAOYSA-N 0.000 claims description 6
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 6
- 230000004913 activation Effects 0.000 claims description 5
- 229910052746 lanthanum Inorganic materials 0.000 claims description 5
- MRELNEQAGSRDBK-UHFFFAOYSA-N lanthanum oxide Inorganic materials [O-2].[O-2].[O-2].[La+3].[La+3] MRELNEQAGSRDBK-UHFFFAOYSA-N 0.000 claims description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 4
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims description 4
- WVNZVRAFCWWYAI-UHFFFAOYSA-N [Co]=O.[Ba] Chemical compound [Co]=O.[Ba] WVNZVRAFCWWYAI-UHFFFAOYSA-N 0.000 claims description 3
- YVCLIGOJWULNFL-UHFFFAOYSA-N [Co]=O.[Fe].[Sr].[La] Chemical compound [Co]=O.[Fe].[Sr].[La] YVCLIGOJWULNFL-UHFFFAOYSA-N 0.000 claims description 3
- MKHJGHUDFOCXTH-UHFFFAOYSA-N [Cu]=O.[Co].[Sr].[La] Chemical compound [Cu]=O.[Co].[Sr].[La] MKHJGHUDFOCXTH-UHFFFAOYSA-N 0.000 claims description 3
- OQKOQEWPYHIUMN-UHFFFAOYSA-N [Sr].[Co]=O.[Sm] Chemical compound [Sr].[Co]=O.[Sm] OQKOQEWPYHIUMN-UHFFFAOYSA-N 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 3
- 229910017052 cobalt Inorganic materials 0.000 claims description 3
- 239000010941 cobalt Substances 0.000 claims description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 3
- 238000005238 degreasing Methods 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 claims description 3
- 230000001235 sensitizing effect Effects 0.000 claims description 3
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 2
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- LNTHITQWFMADLM-UHFFFAOYSA-N gallic acid Chemical compound OC(=O)C1=CC(O)=C(O)C(O)=C1 LNTHITQWFMADLM-UHFFFAOYSA-N 0.000 claims description 2
- 230000000873 masking effect Effects 0.000 claims description 2
- 229910052697 platinum Inorganic materials 0.000 claims description 2
- 229920000307 polymer substrate Polymers 0.000 claims description 2
- 229910052702 rhenium Inorganic materials 0.000 claims description 2
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 claims description 2
- 229910052703 rhodium Inorganic materials 0.000 claims description 2
- 239000010948 rhodium Substances 0.000 claims description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 2
- 229910052707 ruthenium Inorganic materials 0.000 claims description 2
- 235000011150 stannous chloride Nutrition 0.000 claims description 2
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 claims description 2
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- UORVGPXVDQYIDP-UHFFFAOYSA-N borane Chemical compound B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 description 4
- 239000011195 cermet Substances 0.000 description 4
- 239000003153 chemical reaction reagent Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
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- 239000000463 material Substances 0.000 description 4
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
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- 150000002739 metals Chemical group 0.000 description 3
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- 238000001228 spectrum Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
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- 239000000654 additive Substances 0.000 description 2
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- 238000007654 immersion Methods 0.000 description 2
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- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical group Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
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- 239000012041 precatalyst Substances 0.000 description 2
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- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 2
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- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- 238000004876 x-ray fluorescence Methods 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910002204 La0.8Sr0.2MnO3 Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 206010070834 Sensitisation Diseases 0.000 description 1
- 229910002812 Sm0.6Sr0.4CoO3 Inorganic materials 0.000 description 1
- 241001422033 Thestylus Species 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
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- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 1
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- ZXMVMNJYECENGY-UHFFFAOYSA-N strontium lanthanum(3+) oxygen(2-) Chemical compound [O-2].[Sr+2].[La+3] ZXMVMNJYECENGY-UHFFFAOYSA-N 0.000 description 1
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- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1879—Use of metal, e.g. activation, sensitisation with noble metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/88—Processes of manufacture
- H01M4/8817—Treatment of supports before application of the catalytic active composition
- H01M4/8821—Wet proofing
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- H—ELECTRICITY
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Abstract
【選択図】図1a
Description
(a)電極基板を提供すること;
(b)前記電極基板の少なくとも一部を、還元剤、金属前駆物質、および浮遊する分散粒子を含む無電解めっき液と接触させること;および
(c)前記電極基板の前記接触部上に前記金属前駆物質から金属を無電解でめっきすること、これにより、前記電極を提供するために前記電極基板の前記接触部上に前記分散粒子を同時堆積させること。
25×20×1mmの寸法の磨かれた真鍮製電極基板(エーエムティー社(AMT Limited))は、スロトシアン・エフエスエー(シュレッター社)(Slotociean FSA (Schloetter Company Limited))の溶液中にて60℃で15分間脱脂すること、電解清浄すること、および室温で脱イオン水中にてすすぐこと、によって前処理された。
市販のYSZコートされたポリマー皮膜電極基板(ネイピア大学(Napier University))およびYSZ燃料電池電極基板(スコットランド燃料電池(Fuel Cell Scotland))は、スロートクリーン・エフエスエー(シュレッター社)(Slotoclean FSA (Schloetter Company Limited))の溶液中にて60℃で15分間脱脂すること、続いて、室温で脱イオン水中にてすすぐこと、によって前処理された。絶縁電極基板は、それから、高感度化(sensitized)基板を提供するために、200グラム/リットルのユニフェーズ・ピーエイチピー・プレ触媒(アルファ・キミシ)(Uniphase PHP pre−catalyst (AlfaChimici))および20ミリグラム/リットルの塩酸の溶液中に20℃で15分間浸漬することを含む二段ステップ・プロセスによって活性化された。20ミリグラム/リットルのユニフェーズ・ピーエイチピー・触媒(アルファ・キミシ)(Uniphase PHP catalyst (AlfaChimici))の溶液が、それから、電極基板を収容しているプレ触媒溶液に加えられて、そして、感度を高めて(sensitized)かつ触媒作用を及ぼした(catalysed)電極基板を提供するために、15分間にわたり温度が35℃まで上げられた。感度を高めてかつ触媒作用を及ぼした電極基板は、それから、前処理溶液から取り出されて、室温で脱イオン水にてすすがれた。
一連のYSZ電極基板(スコットランド燃料電池(Fuel Cell Scotland))の表面粗さは、テイラー−ホブソン5−60テイラーサーフ機器(Taylor−Hobson 5−60 Talysurf instrument)を使用して、BS EN ISO 4288:1998に従って決定された。ダイヤモンドが先端をなすスタイラス(1.3μm×3.8μmの角錐台状の)が、それが電極基板全体に進行するにつれて、スタイラスの垂直変位に対応する増幅された電気信号を提供するために、6mmの設定距離に対して0.5mm/sの一定速度で電極基板の表面全体に引かれた。表面の平均粗さ(Ra)の値は、測定する距離全体にわたる信号の起点からのプロフィールの逸脱率の算術平均から生成される。
Claims (15)
- 燃料電池用の電極の製造方法であって、少なくとも以下のステップを含む方法:
(a)電極基板を提供すること;
(b)前記電極基板の少なくとも一部を、還元剤、金属前駆物質、および浮遊する分散粒子を含む無電解めっき液と接触させること;および
(c)前記電極基板の前記接触部上に前記金属前駆物質から金属を無電解でめっきすること、これにより、前記電極を提供するために前記電極基板の前記接触部上に前記分散粒子を同時堆積させること。 - 前記還元剤が次亜リン酸塩を含む、請求項1に記載の方法。
- めっきステップ(c)の間、前記めっき液が、前記還元剤、前記金属前駆物質、前記分散粒子、およびそれらの混合物からなる群の1つ以上を添加される、請求項1または請求項2に記載の方法。
- 前記めっき液中の前記還元剤、前記分散粒子および前記金属前駆物質からなる群の1つ以上の濃度が、前記めっきステップの間変化する、請求項3に記載の方法。
- ステップ(b)の前に前記基板を前処理するステップをさらに含む、請求項1〜4のいずれか1項に記載の方法。
- 前記前処理が、脱脂、電解清浄、エッチング、マスキング、活性化、およびすすぎからなる群から選択される1つ以上のステップを含む、請求項5に記載の方法。
- 前記活性化ステップが、前記基板上に無電解めっき触媒を堆積させることを含む、請求項6に記載の方法。
- 前記無電解めっき触媒がパラジウムである、請求項7に記載の方法。
- 前記無電解めっき触媒の堆積の前または同時に、前記基板を高感度化するステップをさらに含む、請求項7または請求項8に記載の方法。
- 前記高感度化ステップが、前記基板を塩化スズ(II)溶液で処理することを含む、請求項9に記載の方法。
- 前記金属前駆物質の前記金属が、ニッケル、コバルト、プラチナ、ロジウム、ルテニウム、レニウム、およびパラジウムからなる群の1つ以上から選択される、請求項1〜10のいずれか1項に記載の方法。
- 前記分散粒子が、イットリア安定化ジルコニア、セリア安定化ジルコニア、セリウムガドリニウム酸化物、サマリウム−ドープト・セリア、混合ランタンおよびガリウム酸化物、マンガン酸ランタンストロンチウム、イットリア安定化ジルコニア−安定化マンガン酸ランタンストロンチウム、バリウムコバルト酸化物、ランタン−ストロンチウム鉄−コバルト酸化物、ランタン−ストロンチウムコバルト酸化銅、サマリウム−ストロンチウムコバルト酸化物、およびそれらの混合物からなる群から選択される、請求項1〜11のいずれか1項に記載の方法。
- 前記電極基板が、クロム酸ランタン、ドープト・クロム酸ランタン、ドープト・没食子酸ランタン、マンガン酸ランタン、ドープト・マンガン酸ランタン、イットリア安定化ジルコニア、セリア安定化ジルコニア、セリウムガドリニウム酸化物、サマリウム−ドープト・セリアおよび混合ランタン、ガリウム酸化物、およびそれらの混合物からなる群から選択される、請求項1〜12のいずれか1項に記載の方法。
- 前記電極基板が金属基板である、請求項1〜13のいずれか1項に記載の方法。
- 前記電極基板がポリマー基板である、請求項1〜13のいずれか1項に記載の方法。
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0719260.2 | 2007-10-03 | ||
| GBGB0719260.2A GB0719260D0 (en) | 2007-10-03 | 2007-10-03 | Method for the manufacturing of an anode for fuel cell |
| PCT/GB2008/003342 WO2009044144A2 (en) | 2007-10-03 | 2008-10-03 | Method of manufacture of an electrode for a fuel cell |
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| JP2010541177A true JP2010541177A (ja) | 2010-12-24 |
| JP5646329B2 JP5646329B2 (ja) | 2014-12-24 |
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| JP (1) | JP5646329B2 (ja) |
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| AT (1) | ATE554200T1 (ja) |
| AU (1) | AU2008306705B2 (ja) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020515405A (ja) * | 2017-03-29 | 2020-05-28 | フォルシュングスツェントルム ユーリッヒ ゲーエムベーハー | アルカリ水電解中の酸素発生のための耐化学性の酸化物電極触媒 |
| JP7190602B1 (ja) | 2022-03-31 | 2022-12-15 | 株式会社ノリタケカンパニーリミテド | 電気化学セルおよびその利用 |
| JP2023098439A (ja) * | 2021-12-28 | 2023-07-10 | 東洋鋼鈑株式会社 | 集電体用表面処理金属箔 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20110236565A1 (en) * | 2008-12-05 | 2011-09-29 | Omg Americas, Inc. | Electroless palladium plating solution and method of use |
| US9295165B2 (en) * | 2010-08-07 | 2016-03-22 | Ldf Coatings, Llc. | Selective application by electroless plating of a tin-whisker impenetrable metal cap to metals on electronic assemblies |
| GB201203425D0 (en) * | 2012-02-28 | 2012-04-11 | Court Of Edinburgh Napier University The | Method for the manufacture of a coated substrate |
| KR20140015705A (ko) | 2012-07-12 | 2014-02-07 | 삼성전자주식회사 | 연료 전지용 전극 촉매, 이의 제조 방법, 및 이를 포함한 막 전극 접합체 및 연료 전지 |
| KR20140096702A (ko) * | 2013-01-29 | 2014-08-06 | 지브이퓨얼셀 주식회사 | 나노파우더를 이용한 박막형 고체 산화물 연료전지의 스택 제조방법 |
| US9640497B1 (en) * | 2016-06-30 | 2017-05-02 | Semiconductor Components Industries, Llc | Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods |
| CN109755596A (zh) * | 2019-01-09 | 2019-05-14 | 华北电力大学 | 改性镀层丝瓜络电极材料及微生物燃料电池 |
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| JPS5792753A (en) * | 1980-10-06 | 1982-06-09 | Gen Electric | Electrode material for molten carbonate fule battery and method of producing same |
| JPH0699070A (ja) * | 1992-09-21 | 1994-04-12 | Hitachi Ltd | 銅系酸化触媒とその用途 |
| JPH09115525A (ja) * | 1995-10-17 | 1997-05-02 | Fujikura Ltd | 固体電解質型燃料電池の燃料電極の改善法 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2020515405A (ja) * | 2017-03-29 | 2020-05-28 | フォルシュングスツェントルム ユーリッヒ ゲーエムベーハー | アルカリ水電解中の酸素発生のための耐化学性の酸化物電極触媒 |
| JP7121037B2 (ja) | 2017-03-29 | 2022-08-17 | フォルシュングスツェントルム ユーリッヒ ゲーエムベーハー | アルカリ水電解中の酸素発生のための耐化学性の酸化物電極触媒 |
| JP2023098439A (ja) * | 2021-12-28 | 2023-07-10 | 東洋鋼鈑株式会社 | 集電体用表面処理金属箔 |
| JP7190602B1 (ja) | 2022-03-31 | 2022-12-15 | 株式会社ノリタケカンパニーリミテド | 電気化学セルおよびその利用 |
| JP2023150559A (ja) * | 2022-03-31 | 2023-10-16 | 株式会社ノリタケカンパニーリミテド | 電気化学セルおよびその利用 |
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| Publication number | Publication date |
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| AU2008306705B2 (en) | 2012-08-23 |
| US8318241B2 (en) | 2012-11-27 |
| KR20100103788A (ko) | 2010-09-28 |
| WO2009044144A3 (en) | 2009-11-05 |
| ATE554200T1 (de) | 2012-05-15 |
| EP2215284B1 (en) | 2012-04-18 |
| WO2009044144A2 (en) | 2009-04-09 |
| US20110017702A1 (en) | 2011-01-27 |
| EP2215284A2 (en) | 2010-08-11 |
| JP5646329B2 (ja) | 2014-12-24 |
| CA2701227C (en) | 2016-04-12 |
| GB0719260D0 (en) | 2007-11-14 |
| AU2008306705A1 (en) | 2009-04-09 |
| CA2701227A1 (en) | 2009-04-09 |
| DK2215284T3 (da) | 2012-07-30 |
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