JP2010539732A5 - - Google Patents

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Publication number
JP2010539732A5
JP2010539732A5 JP2010526010A JP2010526010A JP2010539732A5 JP 2010539732 A5 JP2010539732 A5 JP 2010539732A5 JP 2010526010 A JP2010526010 A JP 2010526010A JP 2010526010 A JP2010526010 A JP 2010526010A JP 2010539732 A5 JP2010539732 A5 JP 2010539732A5
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JP
Japan
Prior art keywords
nitride
iii
semipolar
group iii
nonpolar
Prior art date
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Pending
Application number
JP2010526010A
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English (en)
Japanese (ja)
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JP2010539732A (ja
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Publication date
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Priority claimed from PCT/US2008/077072 external-priority patent/WO2009039408A1/en
Publication of JP2010539732A publication Critical patent/JP2010539732A/ja
Publication of JP2010539732A5 publication Critical patent/JP2010539732A5/ja
Pending legal-status Critical Current

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JP2010526010A 2007-09-19 2008-09-19 無極性および半極性の窒化物基板の面積を増加させる方法 Pending JP2010539732A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US97365607P 2007-09-19 2007-09-19
PCT/US2008/077072 WO2009039408A1 (en) 2007-09-19 2008-09-19 Method for increasing the area of non-polar and semi-polar nitride substrates

Publications (2)

Publication Number Publication Date
JP2010539732A JP2010539732A (ja) 2010-12-16
JP2010539732A5 true JP2010539732A5 (OSRAM) 2012-11-01

Family

ID=40453547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010526010A Pending JP2010539732A (ja) 2007-09-19 2008-09-19 無極性および半極性の窒化物基板の面積を増加させる方法

Country Status (4)

Country Link
US (2) US8080469B2 (OSRAM)
JP (1) JP2010539732A (OSRAM)
KR (1) KR20100067114A (OSRAM)
WO (1) WO2009039408A1 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5743127B2 (ja) 2005-06-01 2015-07-01 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 半極性(Ga,Al,In,B)N薄膜、ヘテロ構造およびデバイスの成長と作製のための方法及び装置
JP2010512661A (ja) 2006-12-11 2010-04-22 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 高特性無極性iii族窒化物光デバイスの有機金属化学気相成長法(mocvd)による成長
JP2010512660A (ja) * 2006-12-11 2010-04-22 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 無極性および半極性の発光デバイス
WO2009039408A1 (en) * 2007-09-19 2009-03-26 The Regents Of The University Of California Method for increasing the area of non-polar and semi-polar nitride substrates
WO2009066466A1 (ja) * 2007-11-21 2009-05-28 Mitsubishi Chemical Corporation 窒化物半導体および窒化物半導体の結晶成長方法ならびに窒化物半導体発光素子
JP5573225B2 (ja) * 2010-02-26 2014-08-20 三菱化学株式会社 第13族金属窒化物結晶の製造方法、該製造方法により得られる第13族金属窒化物結晶および半導体デバイスの製造方法
KR101854419B1 (ko) 2010-03-04 2018-05-03 더 리전츠 오브 더 유니버시티 오브 캘리포니아 c-방향으로 +/-15도 미만의 미스컷들을 갖는 m-면 기판들 위의 준극성 Ⅲ―질화물 광전자 소자들
JP2012136418A (ja) * 2010-12-01 2012-07-19 Mitsubishi Chemicals Corp Iii族窒化物半導体基板とその製造方法
JP5830973B2 (ja) * 2010-12-01 2015-12-09 三菱化学株式会社 GaN自立基板および半導体発光デバイスの製造方法

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WO1999066565A1 (en) * 1998-06-18 1999-12-23 University Of Florida Method and apparatus for producing group-iii nitrides
JP3592553B2 (ja) * 1998-10-15 2004-11-24 株式会社東芝 窒化ガリウム系半導体装置
WO2000033388A1 (en) * 1998-11-24 2000-06-08 Massachusetts Institute Of Technology METHOD OF PRODUCING DEVICE QUALITY (Al)InGaP ALLOYS ON LATTICE-MISMATCHED SUBSTRATES
JP3968968B2 (ja) * 2000-07-10 2007-08-29 住友電気工業株式会社 単結晶GaN基板の製造方法
JP3761418B2 (ja) * 2001-05-10 2006-03-29 Hoya株式会社 化合物結晶およびその製造法
US7501023B2 (en) * 2001-07-06 2009-03-10 Technologies And Devices, International, Inc. Method and apparatus for fabricating crack-free Group III nitride semiconductor materials
US7105865B2 (en) * 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
JP4031628B2 (ja) * 2001-10-03 2008-01-09 松下電器産業株式会社 半導体多層膜結晶、およびそれを用いた発光素子、ならびに当該半導体多層膜結晶の成長方法
EP1495167A1 (en) * 2002-04-15 2005-01-12 The Regents Of The University Of California NON-POLAR (A1,B,In,Ga) QUANTUM WELL AND HETEROSTRUCTURE MATERIALS AND DEVICES
CN1894771B (zh) * 2003-04-15 2012-07-04 加利福尼亚大学董事会 非极性(Al,B,In,Ga)N量子阱
US7118813B2 (en) * 2003-11-14 2006-10-10 Cree, Inc. Vicinal gallium nitride substrate for high quality homoepitaxy
KR100718188B1 (ko) * 2004-05-07 2007-05-15 삼성코닝 주식회사 비극성 a면 질화물 반도체 단결정 기판 및 이의 제조방법
US7432142B2 (en) * 2004-05-20 2008-10-07 Cree, Inc. Methods of fabricating nitride-based transistors having regrown ohmic contact regions
CN101138091B (zh) * 2005-03-10 2010-05-19 加利福尼亚大学董事会 用于生长平坦半极性氮化镓的技术
JP5743127B2 (ja) * 2005-06-01 2015-07-01 ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア 半極性(Ga,Al,In,B)N薄膜、ヘテロ構造およびデバイスの成長と作製のための方法及び装置
US7342642B2 (en) * 2005-06-20 2008-03-11 Asml Netherlands B.V. Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method
JP5026271B2 (ja) * 2005-09-05 2012-09-12 パナソニック株式会社 六方晶系窒化物単結晶の製造方法、六方晶系窒化物半導体結晶及び六方晶系窒化物単結晶ウエハの製造方法
US7691658B2 (en) * 2006-01-20 2010-04-06 The Regents Of The University Of California Method for improved growth of semipolar (Al,In,Ga,B)N
US8193079B2 (en) * 2006-02-10 2012-06-05 The Regents Of The University Of California Method for conductivity control of (Al,In,Ga,B)N
US7727874B2 (en) * 2007-09-14 2010-06-01 Kyma Technologies, Inc. Non-polar and semi-polar GaN substrates, devices, and methods for making them
WO2009039408A1 (en) * 2007-09-19 2009-03-26 The Regents Of The University Of California Method for increasing the area of non-polar and semi-polar nitride substrates

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