JP2010539705A5 - - Google Patents

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Publication number
JP2010539705A5
JP2010539705A5 JP2010524918A JP2010524918A JP2010539705A5 JP 2010539705 A5 JP2010539705 A5 JP 2010539705A5 JP 2010524918 A JP2010524918 A JP 2010524918A JP 2010524918 A JP2010524918 A JP 2010524918A JP 2010539705 A5 JP2010539705 A5 JP 2010539705A5
Authority
JP
Japan
Prior art keywords
layer
polymer layer
polyimide
polyimide adhesive
polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010524918A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010539705A (ja
Filing date
Publication date
Priority claimed from US11/855,038 external-priority patent/US7829794B2/en
Application filed filed Critical
Publication of JP2010539705A publication Critical patent/JP2010539705A/ja
Publication of JP2010539705A5 publication Critical patent/JP2010539705A5/ja
Pending legal-status Critical Current

Links

JP2010524918A 2007-09-13 2008-08-29 部分的に剛性のフレキシブル回路及びそれらの作製方法 Pending JP2010539705A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/855,038 US7829794B2 (en) 2007-09-13 2007-09-13 Partially rigid flexible circuits and method of making same
PCT/US2008/074830 WO2009035867A1 (en) 2007-09-13 2008-08-29 Partially rigid flexible circuits and method of making same

Publications (2)

Publication Number Publication Date
JP2010539705A JP2010539705A (ja) 2010-12-16
JP2010539705A5 true JP2010539705A5 (OSRAM) 2011-08-25

Family

ID=40452403

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010524918A Pending JP2010539705A (ja) 2007-09-13 2008-08-29 部分的に剛性のフレキシブル回路及びそれらの作製方法

Country Status (6)

Country Link
US (1) US7829794B2 (OSRAM)
EP (1) EP2198680B1 (OSRAM)
JP (1) JP2010539705A (OSRAM)
KR (1) KR20100058633A (OSRAM)
CN (1) CN101803484B (OSRAM)
WO (1) WO2009035867A1 (OSRAM)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9674938B2 (en) 2010-11-03 2017-06-06 3M Innovative Properties Company Flexible LED device for thermal management
CN102747343A (zh) * 2012-07-24 2012-10-24 深圳市兴经纬科技开发有限公司 用于聚酰亚胺表面粗化的处理液及其制备方法
DE102013000077A1 (de) * 2013-01-08 2014-07-10 Carl Freudenberg Kg Anordnung mit einer flexiblen Leiterplatte
JP2017123459A (ja) * 2016-01-08 2017-07-13 サムソン エレクトロ−メカニックス カンパニーリミテッド． プリント回路基板
US10880995B2 (en) 2017-12-15 2020-12-29 2449049 Ontario Inc. Printed circuit board with stress relief zones for component and solder joint protection
JP6674075B1 (ja) * 2018-10-24 2020-04-01 三菱製紙株式会社 樹脂組成物のエッチング液及びエッチング方法
CN112912466A (zh) * 2018-10-24 2021-06-04 三菱制纸株式会社 树脂组合物的蚀刻液及蚀刻方法
KR102376557B1 (ko) * 2019-01-28 2022-03-18 미쓰비시 세이시 가부시키가이샤 수지 조성물의 에칭액 및 에칭 방법
TWI701982B (zh) * 2019-05-14 2020-08-11 欣興電子股份有限公司 電路板結構及其製造方法

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3271214A (en) * 1960-10-19 1966-09-06 Sanders Associates Inc Method of making flexible multiconductor wiring units
US3526504A (en) 1966-07-07 1970-09-01 Du Pont Photocrosslinkable elements and processes
US3448098A (en) 1966-09-27 1969-06-03 Merck & Co Inc Production of guanylic acid
US3469982A (en) 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists
US3867153A (en) 1972-09-11 1975-02-18 Du Pont Photohardenable element
US4543295A (en) * 1980-09-22 1985-09-24 The United States Of America As Represented By The Director Of The National Aeronautics And Space Administration High temperature polyimide film laminates and process for preparation thereof
WO1988002591A1 (fr) 1986-09-29 1988-04-07 Nippon Steel Chemical Co., Ltd. Carte de circuit imprime flexible et procede de production
US4847353A (en) 1986-11-20 1989-07-11 Nippon Steel Chemical Co., Ltd. Resins of low thermal expansivity
US4937133A (en) 1988-03-28 1990-06-26 Nippon Steel Chemical Co., Ltd. Flexible base materials for printed circuits
US5091251A (en) * 1989-05-29 1992-02-25 Tomoegawa Paper Co., Ltd. Adhesive tapes and semiconductor devices
DE4003345C1 (OSRAM) 1990-02-05 1991-08-08 Fa. Carl Freudenberg, 6940 Weinheim, De
JP2926509B2 (ja) * 1990-05-21 1999-07-28 鐘淵化学工業株式会社 樹脂フィルム及びその製造方法
DE69115171T2 (de) * 1990-08-27 1996-05-15 Du Pont Flexible Polyimid-Mehrschichtlaminate und ihre Herstellung.
US5219640A (en) * 1991-02-08 1993-06-15 Rogers Corporation Flexible circuit having flexing section of reduced stiffness, and method of manufacture thereof
US5288542A (en) 1992-07-14 1994-02-22 International Business Machines Corporation Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
US5578696A (en) * 1993-04-07 1996-11-26 Nitto Denko Corporation Heat resistant adhesive film, an adhesion structure, and method of adhesion
US5428190A (en) 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
JPH07307572A (ja) * 1994-05-13 1995-11-21 Cmk Corp フレキシブルプリント配線板およびリジッド・フレックスプリント配線板
US6350387B2 (en) 1997-02-14 2002-02-26 Teledyne Industries, Inc. Multilayer combined rigid/flex printed circuit board containing flexible soldermask
US6316734B1 (en) * 2000-03-07 2001-11-13 3M Innovative Properties Company Flexible circuits with static discharge protection and process for manufacture
US7348045B2 (en) * 2002-09-05 2008-03-25 3M Innovative Properties Company Controlled depth etched dielectric film
US6611046B2 (en) * 2001-06-05 2003-08-26 3M Innovative Properties Company Flexible polyimide circuits having predetermined via angles
JP3935353B2 (ja) * 2001-12-26 2007-06-20 シャープ株式会社 フレキシブルビルドアップ配線板の製造方法
DE10243637B4 (de) 2002-09-19 2007-04-26 Ruwel Ag Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von starr-flexiblen Leiterplatten
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
US7364666B2 (en) * 2004-12-21 2008-04-29 3M Innovative Properties Company Flexible circuits and method of making same

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