JP2010524314A5 - - Google Patents

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Publication number
JP2010524314A5
JP2010524314A5 JP2010501469A JP2010501469A JP2010524314A5 JP 2010524314 A5 JP2010524314 A5 JP 2010524314A5 JP 2010501469 A JP2010501469 A JP 2010501469A JP 2010501469 A JP2010501469 A JP 2010501469A JP 2010524314 A5 JP2010524314 A5 JP 2010524314A5
Authority
JP
Japan
Prior art keywords
transducer
ultrasonic
ultrasonic vibration
piezoelectric drive
horn
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010501469A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010524314A (ja
JP5055423B2 (ja
Filing date
Publication date
Priority claimed from CH00583/07A external-priority patent/CH700015B1/de
Application filed filed Critical
Publication of JP2010524314A publication Critical patent/JP2010524314A/ja
Publication of JP2010524314A5 publication Critical patent/JP2010524314A5/ja
Application granted granted Critical
Publication of JP5055423B2 publication Critical patent/JP5055423B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010501469A 2007-04-04 2008-03-20 超音波トランスデューサ Expired - Fee Related JP5055423B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH00583/07 2007-04-04
CH00583/07A CH700015B1 (de) 2007-04-04 2007-04-04 Ultraschall Transducer.
PCT/EP2008/053359 WO2008122499A2 (de) 2007-04-04 2008-03-20 Ein längliches horn umfassender ultraschall-transducer

Publications (3)

Publication Number Publication Date
JP2010524314A JP2010524314A (ja) 2010-07-15
JP2010524314A5 true JP2010524314A5 (enExample) 2012-03-15
JP5055423B2 JP5055423B2 (ja) 2012-10-24

Family

ID=39831460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010501469A Expired - Fee Related JP5055423B2 (ja) 2007-04-04 2008-03-20 超音波トランスデューサ

Country Status (8)

Country Link
US (1) US8106564B2 (enExample)
JP (1) JP5055423B2 (enExample)
KR (1) KR101475541B1 (enExample)
CN (1) CN101678400B (enExample)
CH (1) CH700015B1 (enExample)
MY (1) MY147838A (enExample)
TW (1) TWI387500B (enExample)
WO (1) WO2008122499A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009003312A1 (de) * 2008-10-14 2010-04-15 Hesse & Knipps Gmbh Bondvorrichtung, Ultraschall-Transducer und Bondverfahren
SG10201404843RA (en) 2009-08-12 2014-10-30 Kulicke & Soffa Ind Inc Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
US8919631B2 (en) * 2012-03-15 2014-12-30 Asm Technology Singapore Pte Ltd Wire bonder including a transducer, a bond head, and a mounting apparatus
EP2843188A1 (en) * 2013-09-03 2015-03-04 Welltec A/S A downhole communication module
JP5930419B2 (ja) * 2014-03-14 2016-06-08 株式会社カイジョー ボンディング装置
CN107107252A (zh) * 2014-08-25 2017-08-29 日产自动车株式会社 超声波接合装置
DE102015120824A1 (de) * 2015-12-01 2017-06-01 Hesse Gmbh Betriebsverfahren für einen Ultraschalldrahtbonder
DE102017216988A1 (de) * 2017-09-25 2019-03-28 Schunk Sonosystems Gmbh Verfahren zur Positionierung von Schweißgut in einer Ultraschall-Schweißeinrichtung sowie Ultraschall-Schweißeinrichtung
EP3603826B1 (en) * 2018-07-31 2023-05-10 Infineon Technologies AG Method for calibrating an ultrasonic bonding machine
TWI741705B (zh) 2020-07-28 2021-10-01 國立中興大學 主軸之外電源供應器
US11798911B1 (en) * 2022-04-25 2023-10-24 Asmpt Singapore Pte. Ltd. Force sensor in an ultrasonic wire bonding device

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Publication number Priority date Publication date Assignee Title
JPS6034433B2 (ja) * 1977-03-07 1985-08-08 株式会社豊田中央研究所 超音波変換器
JPS63214381A (ja) * 1987-03-03 1988-09-07 多賀電気株式会社 超音波振動子とその駆動制御方法
DE3888102D1 (de) * 1987-11-25 1994-04-07 Esec Sa Einrichtung zur Durchführung der Zustellbewegung eines Arbeitsorgans zu einer Arbeitsstation.
US5305556A (en) * 1989-06-19 1994-04-26 Kopp Verfahrenstechnik Gmbh Method and apparatus for shaping the interior surfaces of bores
US5180093A (en) * 1991-09-05 1993-01-19 Cray Research, Inc. Apparatus for ultrasonic bonding
JPH0574874A (ja) * 1991-09-11 1993-03-26 Hitachi Ltd 金属細線の超音波接合方法および装置
JP2527399B2 (ja) * 1992-09-29 1996-08-21 完テクノソニックス株式会社 ワイヤ―・ボンダ―・システム
JP3151691B2 (ja) * 1992-11-24 2001-04-03 株式会社新川 超音波ホーンのキヤピラリ保持構造
US5364005A (en) * 1993-11-08 1994-11-15 Verity Instruments Inc. Ultrasonic transducer and mount
US5469011A (en) * 1993-12-06 1995-11-21 Kulicke & Soffa Investments, Inc. Unibody ultrasonic transducer
US5603445A (en) * 1994-02-24 1997-02-18 Hill; William H. Ultrasonic wire bonder and transducer improvements
US5578888A (en) * 1994-12-05 1996-11-26 Kulicke And Soffa Investments, Inc. Multi resonance unibody ultrasonic transducer
US5595328A (en) * 1994-12-23 1997-01-21 Kulicke And Soffa Investments, Inc. Self isolating ultrasonic transducer
JPH10303240A (ja) * 1997-04-25 1998-11-13 Mitsubishi Electric Corp ワイヤボンディング装置の超音波ホーン
SG71189A1 (en) * 1998-01-26 2000-03-21 Esec Sa Ultrasonic transducer with a flange for mounting on an ultrasonic welding device in particular on a wire bonder
CN2364981Y (zh) * 1999-03-15 2000-02-23 李智群 一种串联谐振式超声信号源
DE10028774A1 (de) 1999-06-17 2001-09-13 Hesse & Knipps Gmbh Ultraschall-Transducer
SG92747A1 (en) * 1999-11-02 2002-11-19 Esec Trading Sa Bonhead for a wire bonder
JP3730467B2 (ja) 1999-12-27 2006-01-05 多賀電気株式会社 超音波振動子及び複合振動発生超音波振動子
KR100417643B1 (ko) * 2001-03-13 2004-02-05 한국생산기술연구원 초음파 진동공구를 이용한 금형 다듬질 자동화장치
DE10114672A1 (de) 2001-03-23 2002-09-26 Hesse & Knipps Gmbh Ultraschallschwinger
KR200249520Y1 (ko) * 2001-07-05 2001-11-16 주식회사 몰코 연속 초음파용 자기 왜곡 변환기의 구조
DE10160228A1 (de) 2001-12-07 2003-06-18 Hesse & Knipps Gmbh Kreuztransducer
US7297238B2 (en) * 2003-03-31 2007-11-20 3M Innovative Properties Company Ultrasonic energy system and method including a ceramic horn
US7303110B2 (en) * 2004-06-23 2007-12-04 Asm Technology Singapore Pte Ltd. Flange-mounted transducer
CN2701537Y (zh) * 2004-06-29 2005-05-25 山东强力超声波设备有限公司 超声波振动处理机
US20060060631A1 (en) 2004-09-22 2006-03-23 Kulicke And Soffa Industries, Inc. Motion control device for wire bonder bondhead
JP4271674B2 (ja) * 2005-07-26 2009-06-03 超音波工業株式会社 ワイヤボンディング装置
JP4657964B2 (ja) * 2005-10-07 2011-03-23 株式会社新川 超音波ホーン
JP4254896B2 (ja) * 2005-12-19 2009-04-15 コニカミノルタオプト株式会社 振動切削ユニット及び加工装置

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