JP2010524201A - モジュラクラスタツール - Google Patents

モジュラクラスタツール Download PDF

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Publication number
JP2010524201A
JP2010524201A JP2009554791A JP2009554791A JP2010524201A JP 2010524201 A JP2010524201 A JP 2010524201A JP 2009554791 A JP2009554791 A JP 2009554791A JP 2009554791 A JP2009554791 A JP 2009554791A JP 2010524201 A JP2010524201 A JP 2010524201A
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JP
Japan
Prior art keywords
wafer
drive
linear
end effector
controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009554791A
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English (en)
Japanese (ja)
Other versions
JP2010524201A5 (https=
Inventor
ジェイ．ビー． プライス，
ジェド ケラー，
ローレンス ダルマージュ，
デイビッド アダムス，
エリック ウィンガー，
ローレンス ワイズ，
Original Assignee
クロッシング オートメイション， インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by クロッシング オートメイション， インコーポレイテッド filed Critical クロッシング オートメイション， インコーポレイテッド
Publication of JP2010524201A publication Critical patent/JP2010524201A/ja
Publication of JP2010524201A5 publication Critical patent/JP2010524201A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Automation & Control Theory (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP2009554791A 2007-03-22 2008-03-24 モジュラクラスタツール Pending JP2010524201A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US89637107P 2007-03-22 2007-03-22
PCT/US2008/058049 WO2008116222A2 (en) 2007-03-22 2008-03-24 A modular cluster tool

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013096861A Division JP5760034B2 (ja) 2007-03-22 2013-05-02 モジュラクラスタツール

Publications (2)

Publication Number Publication Date
JP2010524201A true JP2010524201A (ja) 2010-07-15
JP2010524201A5 JP2010524201A5 (https=) 2012-07-26

Family

ID=39766803

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2009554791A Pending JP2010524201A (ja) 2007-03-22 2008-03-24 モジュラクラスタツール
JP2013096861A Active JP5760034B2 (ja) 2007-03-22 2013-05-02 モジュラクラスタツール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2013096861A Active JP5760034B2 (ja) 2007-03-22 2013-05-02 モジュラクラスタツール

Country Status (3)

Country Link
US (1) US10163667B2 (https=)
JP (2) JP2010524201A (https=)
WO (1) WO2008116222A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022035472A1 (en) * 2020-08-13 2022-02-17 Applied Materials, Inc. Transfer chamber with integrated substrate pre-process chamber

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6918731B2 (en) 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
JP5592863B2 (ja) * 2011-11-02 2014-09-17 株式会社日立ハイテクノロジーズ 真空処理装置および被処理体の搬送方法
CN103199037A (zh) * 2012-01-06 2013-07-10 沈阳新松机器人自动化股份有限公司 一种半导体加工设备的efem控制系统
US9545724B2 (en) * 2013-03-14 2017-01-17 Brooks Automation, Inc. Tray engine with slide attached to an end effector base
US11587813B2 (en) 2013-12-17 2023-02-21 Brooks Automation Us, Llc Substrate transport apparatus
US10134621B2 (en) 2013-12-17 2018-11-20 Brooks Automation, Inc. Substrate transport apparatus
US9818633B2 (en) 2014-10-17 2017-11-14 Lam Research Corporation Equipment front end module for transferring wafers and method of transferring wafers
US9673071B2 (en) 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
US10886155B2 (en) * 2019-01-16 2021-01-05 Applied Materials, Inc. Optical stack deposition and on-board metrology
CN111801785B (zh) * 2019-02-07 2023-09-05 株式会社日立高新技术 真空处理装置的运转方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004214689A (ja) * 2004-01-16 2004-07-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2005019967A (ja) * 2003-05-30 2005-01-20 Tokyo Electron Ltd 基板搬送装置および基板搬送方法ならびに真空処理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5389793A (en) 1983-08-15 1995-02-14 Applied Materials, Inc. Apparatus and methods for ion implantation
US6103055A (en) 1986-04-18 2000-08-15 Applied Materials, Inc. System for processing substrates
US6174377B1 (en) * 1997-03-03 2001-01-16 Genus, Inc. Processing chamber for atomic layer deposition processes
JPH10309689A (ja) 1997-05-08 1998-11-24 Canon Inc 搬送装置
FR2778496B1 (fr) * 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
US6610150B1 (en) 1999-04-02 2003-08-26 Asml Us, Inc. Semiconductor wafer processing system with vertically-stacked process chambers and single-axis dual-wafer transfer system
CN1178274C (zh) 2000-06-16 2004-12-01 东京毅力科创株式会社 半导体制造装置及其控制系统的引导方法和联锁方法
US7334826B2 (en) * 2001-07-13 2008-02-26 Semitool, Inc. End-effectors for handling microelectronic wafers
JP4292573B2 (ja) 2003-05-13 2009-07-08 株式会社ニコン ステージ装置及び露光装置
WO2005022602A2 (en) * 2003-08-29 2005-03-10 Crossing Automation, Inc. A method and apparatus for semiconductor processing
US20050223837A1 (en) 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
JP4684679B2 (ja) 2005-02-23 2011-05-18 日本トムソン株式会社 リニアモータを内蔵したスライド装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005019967A (ja) * 2003-05-30 2005-01-20 Tokyo Electron Ltd 基板搬送装置および基板搬送方法ならびに真空処理装置
JP2004214689A (ja) * 2004-01-16 2004-07-29 Dainippon Screen Mfg Co Ltd 基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022035472A1 (en) * 2020-08-13 2022-02-17 Applied Materials, Inc. Transfer chamber with integrated substrate pre-process chamber

Also Published As

Publication number Publication date
WO2008116222A3 (en) 2009-01-08
US10163667B2 (en) 2018-12-25
WO2008116222A2 (en) 2008-09-25
JP5760034B2 (ja) 2015-08-05
JP2013201438A (ja) 2013-10-03
US20080232934A1 (en) 2008-09-25

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