JP2010511950A - 電気センサ・ウェブ、システムおよびその製造方法 - Google Patents
電気センサ・ウェブ、システムおよびその製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 204
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 23
- 238000012544 monitoring process Methods 0.000 claims abstract description 18
- 238000001514 detection method Methods 0.000 claims abstract description 3
- 230000005684 electric field Effects 0.000 claims abstract description 3
- 230000001681 protective effect Effects 0.000 claims description 24
- 239000011888 foil Substances 0.000 claims description 20
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 238000007639 printing Methods 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- 239000004033 plastic Substances 0.000 claims description 6
- 229920003023 plastic Polymers 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 4
- 239000004744 fabric Substances 0.000 claims description 3
- 229920001940 conductive polymer Polymers 0.000 claims description 2
- 239000000835 fiber Substances 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 239000002861 polymer material Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 42
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 12
- 239000004698 Polyethylene Substances 0.000 description 8
- 239000004743 Polypropylene Substances 0.000 description 8
- 239000011241 protective layer Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 238000003491 array Methods 0.000 description 3
- 238000007646 gravure printing Methods 0.000 description 3
- 238000007645 offset printing Methods 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004831 Hot glue Substances 0.000 description 2
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000000123 paper Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000002657 fibrous material Substances 0.000 description 1
- 229910000041 hydrogen chloride Inorganic materials 0.000 description 1
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001197 polyacetylene Polymers 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000128 polypyrrole Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000037303 wrinkles Effects 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K17/962—Capacitive touch switches
- H03K17/9622—Capacitive touch switches using a plurality of detectors, e.g. keyboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R21/00—Arrangements or fittings on vehicles for protecting or preventing injuries to occupants or pedestrians in case of accidents or other traffic risks
- B60R21/01—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents
- B60R21/015—Electrical circuits for triggering passive safety arrangements, e.g. airbags, safety belt tighteners, in case of vehicle accidents or impending vehicle accidents including means for detecting the presence or position of passengers, passenger seats or child seats, and the related safety parameters therefor, e.g. speed or timing of airbag inflation in relation to occupant position or seat belt use
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03K—PULSE TECHNIQUE
- H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
- H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
- H03K17/96—Touch switches
- H03K2017/9602—Touch switches characterised by the type or shape of the sensing electrodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
- Position Input By Displaying (AREA)
Abstract
Description
− 原材料が、より安価である、
− 製造方法が、例えばエッチングと比較してより安価である、
− 製造方法が、1つの生産ラインだけで済む、および
− 結果として得られるセンサ・ウェブが、より薄い、即ちセンサ・ウェブの厚さが、50μmより薄くてもよい、
ということを含む。
1.連続的な導体線および導電性センサ領域のパターンが、例えば、銅/PETまたはアルミニウム/PET積層体上にUVエッチ・レジスト(例えばCoates XV1000)で最初に印刷される。
2.レジスト領域の外側の金属が、エッチングによって除去される。(その後、レジスト層もまた除去されてもよい。)
3.保護層が、被覆または積層される(例えばPET、PPまたはPE膜)。
4.コネクタおよび/または電子回路が、貼り付けられる。
2.保護層が、被覆または積層される(例えばPET、PPまたはPE膜)。
3.コネクタおよび/または電子回路が、貼り付けられる。
2.保護層が、被覆または積層される(例えばPET、PPまたはPE膜)。
3.コネクタおよび/または電子回路が、貼り付けられる。
Claims (19)
- 電場検知のためのセンサ・ウェブであって、
縦方向を有する基板と、
前記縦方向に沿って連続する仕方でお互いの後に続くように形成され、前記基板の片側に配置される導電性センサ領域の少なくとも1つのアレイと、
前記基板の同じ側に形成される導体の群とを含み、
検知目的のために使用されるべきそれぞれの導電性センサ領域は、1つの導体に電気的に接続されており、前記導体は、前記基板の前記縦方向に進む前記導体の前記群に1つずつ加わるように構成されており、前記群の他の導体は、加わる導体のためにスペースを空けるように構成されている、センサ・ウェブ。 - 前記導体が、出力部の方へ延びる第1の部分を有し、前記導体の前記第1の部分が、前記基板の前記縦方向に対して角度を形成し、前記角度の絶対値が、0°より大きいが90°より小さい、請求項1に記載のセンサ・ウェブ。
- 前記角度の絶対値が、0.1°より大きいが5°より小さい、請求項1に記載のセンサ・ウェブ。
- 前記群の前記他の導体が、前記加わる導体のためにスペースを空けるために、横に一歩寄るように構成される、請求項1に記載のセンサ・ウェブ。
- 前記センサ・ウェブが、共通信号のための連続的な二次センサ素子を含む、請求項1に記載のセンサ・ウェブ。
- 前記導電性領域または導体が、印刷された、被覆された、電着された、蒸着された、スパッタされた、エッチングされた、または積層された層を含む、請求項1に記載のセンサ・ウェブ。
- 前記導電性領域または導体が、金属層、導電性プラスチック層、または導電性繊維層を含む、請求項1に記載のセンサ・ウェブ。
- 前記導電性領域または導体が、導電性カーボン、または導電性ポリマーを含む、請求項1に記載のセンサ・ウェブ。
- 前記基板が、ポリマー材料、紙、または板、不織布もしくは布材料を含む膜である、請求項1に記載のセンサ・ウェブ。
- 前記センサ・ウェブが、プラスチック材料、紙、もしくは板の膜、または誘電体被覆物を含む上部層を含む、請求項1に記載のセンサ・ウェブ。
- 請求項1に記載のセンサ・ウェブの製造方法であって、
導電性領域およびそれらの導体を形成するために、取外しウェブの表面に貼り付けられた金属箔を打ち抜くことと、
第1の保護膜を、それが前記導電性領域およびそれらの導体を覆うように、前記取外しウェブに貼り付けることと、
前記取外しウェブを裏当て膜と取り替えることとを含む、方法。 - RFループおよびそれらの導体が、前記導電性領域およびそれらの導体と同じプロセス・ステップで形成されるように、前記RFループおよびそれらの導体を形成するために、前記取外しウェブの表面に貼り付けられた前記金属箔を打ち抜くことと、
前記第1の保護膜を、それが前記導電性領域およびそれらの導体ならびに前記RFループおよびそれらの導体を覆うように、前記取外しウェブに貼り付けることとを含む、請求項11に記載の方法。 - RFループおよびそれらの導体が、前記導電性領域およびそれらの導体とは異なるプロセス・ステップで形成されるように、前記RFループおよびそれらの導体を形成するために、第2の取外しウェブの表面に貼り付けられた金属箔を打ち抜くことと、
第2の保護膜を、それが前記RFループおよびそれらの導体を覆うように、前記第2の取外しウェブに貼り付けることとを含む、請求項11に記載の方法。 - 前記取外しウェブのうちの1つを除去することと、
前記第1の保護膜および前記第2の保護膜を重ね合わせることとを含む、請求項13に記載の方法。 - 前記第1の保護膜および前記第2の保護膜が、一緒に積層される、請求項14に記載の方法。
- 前記第1の保護膜または前記裏当て膜が、ビアを備える、請求項15に記載の方法。
- 前記ビアが、導電性ブリッジの印刷中に導電性インクで充填される、請求項16に記載の方法。
- 空間を監視するためのシステムであって、
縦方向を有する基板と、前記縦方向に沿って連続する仕方でお互いの後に続くように形成され、前記基板の片側に配置される導電性センサ領域の少なくとも1つのアレイと、前記基板の同じ側に形成される導体の群とを含み、検知目的のために使用されるべきそれぞれの導電性センサ領域は、1つの導体に電気的に接続されており、前記導体は、前記基板の前記縦方向に進む前記導体の前記群に1つずつ加わるように構成されており、前記群の他の導体は、加わる導体のためにスペースを空けるように構成されている、センサ・ウェブからの少なくとも1つの長さと、
少なくとも1つの導電性領域から出力信号を検出するための手段とを含む、システム。 - 前記センサ・ウェブのいくつかの長さが、所与の空間内のより大きな領域を覆うように配置され、前記空間を電子的に監視するように配置される、請求項18に記載のシステム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US87278706P | 2006-12-05 | 2006-12-05 | |
US60/872,787 | 2006-12-05 | ||
PCT/FI2007/050667 WO2008068387A1 (en) | 2006-12-05 | 2007-12-05 | An electric sensor web, system and a method for its manufacture |
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JP2010511950A true JP2010511950A (ja) | 2010-04-15 |
JP5466014B2 JP5466014B2 (ja) | 2014-04-09 |
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JP2009539775A Active JP5466014B2 (ja) | 2006-12-05 | 2007-12-05 | 電気センサ・ウェブ、システムおよびその製造方法 |
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US (2) | US8643379B2 (ja) |
EP (1) | EP2089728B1 (ja) |
JP (1) | JP5466014B2 (ja) |
KR (1) | KR101410093B1 (ja) |
CN (1) | CN101617236B (ja) |
AU (1) | AU2007330702B2 (ja) |
CA (1) | CA2671163C (ja) |
DK (1) | DK2089728T3 (ja) |
EG (1) | EG25666A (ja) |
ES (1) | ES2586726T3 (ja) |
IL (1) | IL199090A (ja) |
NO (1) | NO342283B1 (ja) |
PL (1) | PL2089728T3 (ja) |
PT (1) | PT2089728T (ja) |
RU (1) | RU2453989C2 (ja) |
WO (1) | WO2008068387A1 (ja) |
Cited By (1)
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JP2014531579A (ja) * | 2011-09-05 | 2014-11-27 | イーエルエスアイ テクノロジース オーワイ | 平面センサー及びその製造方法 |
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FI122808B (fi) * | 2009-02-24 | 2012-07-13 | Marimils Oy | Tasoelektrodijärjestelmä |
FI123585B (fi) * | 2009-03-25 | 2013-07-31 | Marimils Oy | Käyttöliittymä tasoanturijärjestelmään ja sen ohjaus |
FI121421B (fi) | 2009-07-28 | 2010-11-15 | Marimils Oy | Järjestelmä hissien ohjaamiseksi hissijärjestelmässä |
KR101864893B1 (ko) * | 2011-06-03 | 2018-06-05 | 삼성전자주식회사 | 소수 채널을 이용하는 전자기 공진 센싱 장치 |
WO2012174204A2 (en) | 2011-06-17 | 2012-12-20 | Fiberweb, Inc. | Vapor permeable, substantially water impermeable multilayer article |
CN103747955B (zh) | 2011-06-23 | 2017-03-22 | 纤维网公司 | 可透蒸气而基本不可透水的多层制品 |
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Also Published As
Publication number | Publication date |
---|---|
CN101617236A (zh) | 2009-12-30 |
CA2671163A1 (en) | 2008-06-12 |
WO2008068387A1 (en) | 2008-06-12 |
KR20090094127A (ko) | 2009-09-03 |
US20130213928A1 (en) | 2013-08-22 |
US20110050202A1 (en) | 2011-03-03 |
EG25666A (en) | 2012-05-13 |
EP2089728B1 (en) | 2016-05-25 |
RU2009125532A (ru) | 2011-01-20 |
PT2089728T (pt) | 2016-08-17 |
ES2586726T3 (es) | 2016-10-18 |
PL2089728T3 (pl) | 2016-11-30 |
KR101410093B1 (ko) | 2014-06-27 |
IL199090A (en) | 2014-02-27 |
DK2089728T3 (en) | 2016-08-29 |
NO20092511L (no) | 2009-08-10 |
RU2453989C2 (ru) | 2012-06-20 |
AU2007330702B2 (en) | 2012-04-19 |
US8643379B2 (en) | 2014-02-04 |
NO342283B1 (no) | 2018-04-30 |
JP5466014B2 (ja) | 2014-04-09 |
AU2007330702A1 (en) | 2008-06-12 |
EP2089728A1 (en) | 2009-08-19 |
CA2671163C (en) | 2016-01-26 |
CN101617236B (zh) | 2013-08-21 |
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