JP2010506983A5 - - Google Patents

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Publication number
JP2010506983A5
JP2010506983A5 JP2009532706A JP2009532706A JP2010506983A5 JP 2010506983 A5 JP2010506983 A5 JP 2010506983A5 JP 2009532706 A JP2009532706 A JP 2009532706A JP 2009532706 A JP2009532706 A JP 2009532706A JP 2010506983 A5 JP2010506983 A5 JP 2010506983A5
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JP
Japan
Prior art keywords
polyethylene
polypropylene
materials
terephthalate
hot melt
Prior art date
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Granted
Application number
JP2009532706A
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English (en)
Japanese (ja)
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JP5565937B2 (ja
JP2010506983A (ja
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Publication date
Priority claimed from DE102006049089A external-priority patent/DE102006049089A1/de
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Publication of JP2010506983A publication Critical patent/JP2010506983A/ja
Publication of JP2010506983A5 publication Critical patent/JP2010506983A5/ja
Application granted granted Critical
Publication of JP5565937B2 publication Critical patent/JP5565937B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009532706A 2006-10-18 2007-10-06 ホットメルト接着剤 Active JP5565937B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102006049089A DE102006049089A1 (de) 2006-10-18 2006-10-18 Heißschmelzklebemasse
DE102006049089.4 2006-10-18
PCT/EP2007/008691 WO2008046536A1 (de) 2006-10-18 2007-10-06 Heissschmelzklebemasse

Publications (3)

Publication Number Publication Date
JP2010506983A JP2010506983A (ja) 2010-03-04
JP2010506983A5 true JP2010506983A5 (cg-RX-API-DMAC7.html) 2010-11-25
JP5565937B2 JP5565937B2 (ja) 2014-08-06

Family

ID=38826453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009532706A Active JP5565937B2 (ja) 2006-10-18 2007-10-06 ホットメルト接着剤

Country Status (10)

Country Link
US (2) US8487026B2 (cg-RX-API-DMAC7.html)
EP (1) EP2081609B1 (cg-RX-API-DMAC7.html)
JP (1) JP5565937B2 (cg-RX-API-DMAC7.html)
DE (1) DE102006049089A1 (cg-RX-API-DMAC7.html)
DK (1) DK2081609T3 (cg-RX-API-DMAC7.html)
ES (1) ES2382366T3 (cg-RX-API-DMAC7.html)
PL (1) PL2081609T3 (cg-RX-API-DMAC7.html)
PT (1) PT2081609E (cg-RX-API-DMAC7.html)
SI (1) SI2081609T1 (cg-RX-API-DMAC7.html)
WO (1) WO2008046536A1 (cg-RX-API-DMAC7.html)

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JP6352360B2 (ja) * 2016-10-18 2018-07-04 ヘンケルジャパン株式会社 ホットメルト接着剤
JP6961014B2 (ja) 2017-05-22 2021-11-05 エイチ．ビー．フラー カンパニー ホットメルト接着剤組成物
JP6671415B2 (ja) * 2018-06-06 2020-03-25 ヘンケルジャパン株式会社 ホットメルト接着剤
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