JP2010503238A5 - - Google Patents
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- JP2010503238A5 JP2010503238A5 JP2009527564A JP2009527564A JP2010503238A5 JP 2010503238 A5 JP2010503238 A5 JP 2010503238A5 JP 2009527564 A JP2009527564 A JP 2009527564A JP 2009527564 A JP2009527564 A JP 2009527564A JP 2010503238 A5 JP2010503238 A5 JP 2010503238A5
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- 239000000758 substrate Substances 0.000 claims 81
- 229920001971 elastomer Polymers 0.000 claims 22
- 239000000806 elastomer Substances 0.000 claims 22
- 239000004065 semiconductor Substances 0.000 claims 18
- 239000000853 adhesive Substances 0.000 claims 12
- 230000001070 adhesive Effects 0.000 claims 12
- 239000000463 material Substances 0.000 claims 10
- 230000003287 optical Effects 0.000 claims 8
- 238000002508 contact lithography Methods 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 230000000875 corresponding Effects 0.000 claims 2
- 230000005670 electromagnetic radiation Effects 0.000 claims 2
- 238000003384 imaging method Methods 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N precursor Substances N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 claims 2
- 230000003213 activating Effects 0.000 claims 1
- 238000005452 bending Methods 0.000 claims 1
- 230000003247 decreasing Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 claims 1
- 239000003302 ferromagnetic material Substances 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 238000002955 isolation Methods 0.000 claims 1
- 239000011159 matrix material Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 230000000051 modifying Effects 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000005693 optoelectronics Effects 0.000 claims 1
- -1 poly (dimethylsiloxane) Polymers 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000002887 superconductor Substances 0.000 claims 1
- 230000035897 transcription Effects 0.000 claims 1
Claims (71)
第1の端部と、
第2の端部と、
前記第1の端部と前記第2の端部との間に配置された中心領域と
を備え、
当該伸縮性コンポーネントが基板によって支持され、
当該伸縮性コンポーネントの前記第1の端部及び前記第2の端部が、前記基板に接着されると共に、第1のデバイスコンポーネントを第2のデバイスコンポーネントに電気的に接続し、
当該伸縮性コンポーネントの前記中心領域の少なくとも一部分が、曲がり形態を持っており、この曲がり形態は、前記第1のデバイスコンポーネント及び前記第2のデバイスコンポーネントが互いに対して移動した時、電気的な接続を維持しつつデバイスの伸縮と曲げを可能とするように、湾曲されると共に、物理的に前記基板から分離されている、伸縮性コンポーネント。 An elastic component in the device,
A first end;
A second end;
A central region disposed between the first end and the second end;
The elastic component is supported by the substrate,
The first end and the second end of the stretchable component are bonded to the substrate and electrically connect the first device component to the second device component;
At least a portion of the central region of the stretchable component has a bend configuration that is electrically connected when the first device component and the second device component move relative to each other. A stretchable component that is curved and physically separated from the substrate so as to allow the device to stretch and bend while maintaining .
前記相互接続構造が、前記電子デバイスの2以上のデバイスコンポーネント間の電気接続を確立し、さらに圧縮又は伸張が可能である、請求項1に記載の伸縮性コンポーネント。 A stretch interconnect structure for electronic devices,
The stretchable component of claim 1, wherein the interconnect structure establishes an electrical connection between two or more device components of the electronic device and is further compressible or stretchable.
前記調整可能なデバイスコンポーネントが、前記曲がり形態によって与えられる前記中心領域の歪みのレベルに従って選択的に変化する少なくとも1つの電子特性を持っている、請求項1に記載の伸縮性コンポーネント。 The stretchable component is an adjustable device component of an electronic device;
The stretchable component of claim 1, wherein the adjustable device component has at least one electronic property that selectively varies according to a level of distortion of the central region provided by the bend configuration.
前記調整可能なデバイスコンポーネントが、前記曲がり形態によって与えられる前記中心領域の歪みのレベルに従って選択的に変化する少なくとも1つの光学特性を持っている、請求項1に記載の伸縮性コンポーネント。 The stretchable component is an adjustable device component of an optical device;
The stretchable component of claim 1, wherein the adjustable device component has at least one optical property that selectively varies according to a level of distortion of the central region provided by the bend configuration.
前記中心領域が、湾曲し、さらに、前記伸縮性コンポーネントを圧縮又は伸張することによって、又は前記中心領域に電位を加えることによって、調節が可能な振幅を持っている、請求項1に記載の伸縮性コンポーネント。 The elastic component is an actuator of a mechanical device;
The stretch of claim 1, wherein the central region is curved and further has an adjustable amplitude by compressing or stretching the stretchable component or by applying an electrical potential to the central region. Sex component.
前記封入層が前記基板により支持されている、請求項1に記載の伸縮性コンポーネント。 The stretchable component according to claim 1, wherein the encapsulating layer is supported by the substrate.
前記伸縮性コンポーネントを持っている前記デバイスを設けるステップであり、前記伸縮性コンポーネントが、第1の端部と、第2の端部と、前記第1の端部と前記第2の端部との間に配置された中心領域とを備え、前記伸縮性コンポーネントが基板によって支持され、前記伸縮性コンポーネントの前記第1の端部及び前記第2の端部が前記基板に接着され、前記伸縮性コンポーネントの前記中心領域の少なくとも一部分が曲がり形態を持ち、前記中心部分があるレベルの歪みを受けているものである、ステップと、
前記伸縮性コンポーネントを圧縮又は伸張することによって、前記伸縮性コンポーネントの歪みの前記レベルを調節し、もって、前記デバイスの前記伸縮性コンポーネントの前記特性を調整するステップと
を含む方法。 A method for adjusting the properties of a stretchable component of a device,
Providing the device having the stretchable component, the stretchable component comprising: a first end; a second end; the first end; and the second end. A central region disposed between the elastic component, the elastic component is supported by a substrate, the first and second ends of the elastic component are bonded to the substrate, and the elastic property At least a portion of the central region of the component has a curved configuration and the central portion is subjected to a level of distortion;
Adjusting the level of distortion of the stretchable component by compressing or stretching the stretchable component, thereby adjusting the properties of the stretchable component of the device.
受容表面を持っているエラストマ基板を設けるステップであり、前記基板が第1のレベルの歪みを受けている状態で設けられるステップと、
前記1つ又は複数のデバイスコンポーネントを、前記第1のレベルの歪みを受ける前記エラストマ基板の前記受容表面に接着するステップと、
前記第1のレベルから前記第1のレベルと異なる歪みの第2のレベルに前記基板の歪みのレベルの変化を引き起こす力を前記エラストマ基板に加えるステップと
を含み、
前記第1のレベルから前記第2のレベルへの前記基板の歪みのレベルの前記変化によって、前記1つ又は複数のコンポーネントを曲げ、もって、前記基板に接着された第1の端部及び第2の端部と、前記基板から物理的に分離された曲がり形態で生成された中心領域とを各々持っている前記1つ又は複数の伸縮性コンポーネントを生成する、方法。 A method of making one or more stretchable components of a device comprising:
Providing an elastomeric substrate having a receiving surface, the substrate being provided with a first level of strain;
Adhering the one or more device components to the receiving surface of the elastomer substrate subject to the first level of strain;
Applying a force to the elastomer substrate that causes a change in the level of strain of the substrate from the first level to a second level of strain different from the first level;
The change in the level of distortion of the substrate from the first level to the second level causes the one or more components to bend and thereby a first end bonded to the substrate and a second Generating the one or more stretchable components each having a central region generated in a bent form physically separated from the substrate .
b)前記受容表面に少なくとも部分的に共形的に接触するようにデバイスコンポーネントを堆積させるステップと、
c)前記少なくとも部分的に共形的に接触された基板に重合体スタンプを押し付けて成形するステップと、
d)前記基板から前記重合体スタンプを取り除き、それによって、前記デバイスコンポーネントを前記スタンプに転写するステップと
を含む伸縮性デバイス又はデバイスコンポーネントを作製する方法であって、
前記スタンプに転写された前記デバイスコンポーネントが、前記デバイスコンポーネントを前記スタンプに接着する接着部位のパターンを持っている方法。 a) providing a substrate having a receiving surface with one or more relief features;
b) depositing a device component in at least partially conformal contact with the receiving surface;
c) pressing and molding a polymer stamp against the at least partially conformally contacted substrate;
d) removing the polymer stamp from the substrate, thereby transferring the device component to the stamp, the method of making a stretchable device or device component comprising:
The method wherein the device component transferred to the stamp has a pattern of adhesive sites that adheres the device component to the stamp.
b)湾曲ジオメトリを持っているエラストマスタンプを設けるステップと、
c)i)実質的に平らなスタンプ表面を生成するように前記スタンプに変形力を加え、
ii)前記歪んだスタンプを前記基板上の前記コンポーネントと接触させ、
iii)前記基板から遠ざかる方向に前記スタンプを持ち上げることによって前記基板から前記コンポーネントを取り除き、もって、前記基板表面から前記エラストマスタンプ表面に前記コンポーネントを転写することによって、前記基板から前記スタンプに前記コンポーネントを転写するステップと、
d)前記スタンプを前記湾曲ジオメトリに弛緩させるように前記変形力を取り除き、それによって、ポップアップコンポーネントを作るステップと
を含むスタンプ表面上にポップアップコンポーネントを作製する方法。 a) providing a component on the substrate surface;
b) providing an elastomeric stamp having a curved geometry;
c) i) applying a deforming force to the stamp to produce a substantially flat stamp surface;
ii) contacting the distorted stamp with the component on the substrate;
iii) removing the component from the substrate by lifting the stamp away from the substrate, thereby transferring the component from the substrate to the stamp by transferring the component from the substrate surface to the elastomeric stamp surface. A transcription step;
d) removing the deformation force to relax the stamp into the curved geometry, thereby creating a pop-up component on the stamp surface.
a)前記スタンプの湾曲ジオメトリに対応する湾曲表面形状を持っているデバイス基板を設けること、
b)接着剤又は接着剤先駆物質の液状膜層を前記デバイス基板表面上に生成するように前記デバイス基板湾曲表面に接着剤又は接着剤先駆物質を塗布すること、及び、
c)前記ポップアップコンポーネントを持っている前記スタンプ表面を前記デバイス基板上の前記接着剤層と接触させること
を含み、前記接触と同時に、前記接着剤液状層を、前記ポップアップコンポーネントの形に適合し前記コンポーネントを前記デバイス基板に接着するように流動させる、請求項59に記載の方法。 Transferring the pop-up component onto a device substrate, the transferring step comprising:
a) providing a device substrate having a curved surface shape corresponding to the curved geometry of the stamp;
b) applying an adhesive or adhesive precursor to the curved surface of the device substrate to produce a liquid film layer of adhesive or adhesive precursor on the surface of the device substrate; and
c) contacting the stamp surface having the pop-up component with the adhesive layer on the device substrate, and simultaneously with the contacting, the adhesive liquid layer is adapted to the shape of the pop-up component and 60. The method of claim 59 , wherein a component is flowed to adhere to the device substrate.
b)エラストマ基板を設けるステップと、
c)前記エラストマ基板の1つの表面を活性化するステップと、
d)前記エラストマ基板に二軸歪みを加え、もって前記エラストマ基板を2方向に伸張させるステップと、
e)前記活性化され伸張されたエラストマ基板を基板上の前記半導体材料と接触させるステップと、
f)前記半導体を支持する前記基板から前記エラストマ基板を剥がし、もって前記半導体ナノメンブレンを前記エラストマ基板に転写するステップと、
g)前記エラストマ基板の前記二軸歪みを緩和し、もって2次元波形構造を持つナノメンブレンを生成するステップと
を含む二軸伸縮性半導体メンブレンを作製する方法。 a) providing a semiconductor nanomembrane material on a substrate, wherein the thickness of the material is in the range of about 40 nm to 600 nm;
b) providing an elastomer substrate;
c) activating one surface of the elastomer substrate;
d) applying biaxial strain to the elastomer substrate, thereby extending the elastomer substrate in two directions;
e) contacting the activated stretched elastomer substrate with the semiconductor material on the substrate;
f) peeling the elastomer substrate from the substrate supporting the semiconductor, thereby transferring the semiconductor nanomembrane to the elastomer substrate;
g) Relieving the biaxial strain of the elastomer substrate, thereby producing a nanomembrane having a two-dimensional corrugated structure, and producing a biaxial stretchable semiconductor membrane.
基板の受容表面で支持された1つ又は複数のデバイスコンポーネントが予めパターン形成されている前記基板を設けるステップと、
前記基板の前記受容表面又はその上に形成された1つ又は複数の構造上に印刷可能半導体要素を接触印刷することによって、複数の前記印刷可能半導体要素を前記基板上に組み立てるステップと
を含み、前記印刷可能半導体要素の少なくとも一部分が、前記基板で支持された1つ又は複数の前記デバイスコンポーネントと、又は両方と電気的に接触した状態で空間的に整列されるように位置付けされる方法。 A method of making a device comprising:
Providing the substrate pre-patterned with one or more device components supported on a receiving surface of the substrate;
Assembling a plurality of printable semiconductor elements on the substrate by contact printing the printable semiconductor elements on the receiving surface of the substrate or one or more structures formed thereon; A method wherein at least a portion of the printable semiconductor element is positioned to be spatially aligned in electrical contact with one or more of the device components supported by the substrate, or both.
基板の受容表面によって支持された1つ又は複数のデバイスコンポーネントが予めパターン形成されている基板を設けるステップと、
前記基板の前記受容表面又はその上に設けられた1つ又は複数の構造上に印刷可能半導体要素を接触印刷することによって、前記基板上に第1の組の前記印刷可能半導体要素を組み立て、もって第1のデバイス層を生成するステップと、
前記第1の組の印刷可能半導体要素上に中間層を設けるステップであって、前記中間層が受容表面を持っているステップと、
前記中間層の前記受容表面又はその上に設けられた1つ又は複数の構造上に印刷可能半導体要素を接触印刷することによって第2の組の前記印刷可能半導体要素を中間層上に組み立て、もって第2のデバイス層を生成するステップと
を含む方法。 A method for making a multilayer device structure comprising:
Providing a substrate pre-patterned with one or more device components supported by a receiving surface of the substrate;
Assembling a first set of the printable semiconductor elements on the substrate by contact printing the printable semiconductor elements on the receiving surface of the substrate or on one or more structures provided thereon; Generating a first device layer;
Providing an intermediate layer on the first set of printable semiconductor elements, the intermediate layer having a receiving surface;
Assembling a second set of the printable semiconductor elements on the intermediate layer by contact printing the printable semiconductor elements on the receiving surface of the intermediate layer or on one or more structures provided thereon; Generating a second device layer.
b.前記基板の接触表面の少なくとも一部分に接着されたコンポーネントと、を備える2次元伸縮性且つ湾曲性デバイスであって、前記コンポーネントが、少なくとも1つのレリーフ特徴領域及び少なくとも1つの実質的に平らな領域を持ち、前記レリーフ特徴領域が、前記基板から分離された部分を持ち、前記実質的に平らな領域が前記基板に少なくとも部分的に接着されている2次元伸縮性且つ湾曲性デバイス。 a. A substrate having a contact surface;
b. A two-dimensional stretchable and bendable device comprising a component bonded to at least a portion of the contact surface of the substrate, the component comprising at least one relief feature region and at least one substantially flat region. A two-dimensional stretchable and bendable device, wherein the relief feature region has a portion separated from the substrate and the substantially flat region is at least partially bonded to the substrate.
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US82468306P | 2006-09-06 | 2006-09-06 | |
US60/824,683 | 2006-09-06 | ||
US94462607P | 2007-06-18 | 2007-06-18 | |
US60/944,626 | 2007-06-18 | ||
PCT/US2007/077759 WO2008030960A2 (en) | 2006-09-06 | 2007-09-06 | Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2013131022A Division JP5735585B2 (en) | 2006-09-06 | 2013-06-21 | 2D device array |
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Publication Number | Publication Date |
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JP2010503238A JP2010503238A (en) | 2010-01-28 |
JP2010503238A5 true JP2010503238A5 (en) | 2010-10-21 |
JP5578509B2 JP5578509B2 (en) | 2014-08-27 |
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ID=39158048
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Application Number | Title | Priority Date | Filing Date |
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JP2009527564A Active JP5578509B2 (en) | 2006-09-06 | 2007-09-06 | Method for bonding stretchable components to an elastomeric substrate |
JP2013131022A Active JP5735585B2 (en) | 2006-09-06 | 2013-06-21 | 2D device array |
JP2015084234A Pending JP2015216365A (en) | 2006-09-06 | 2015-04-16 | Two-dimensional stretchable and bendable device |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
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JP2013131022A Active JP5735585B2 (en) | 2006-09-06 | 2013-06-21 | 2D device array |
JP2015084234A Pending JP2015216365A (en) | 2006-09-06 | 2015-04-16 | Two-dimensional stretchable and bendable device |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2064710A4 (en) |
JP (3) | JP5578509B2 (en) |
KR (5) | KR101814683B1 (en) |
CN (2) | CN101681695B (en) |
MY (2) | MY172115A (en) |
TW (3) | TWI485863B (en) |
WO (1) | WO2008030960A2 (en) |
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