CN111063658B - Method for producing flexible and extensible electronic device - Google Patents
Method for producing flexible and extensible electronic device Download PDFInfo
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- CN111063658B CN111063658B CN201911394674.3A CN201911394674A CN111063658B CN 111063658 B CN111063658 B CN 111063658B CN 201911394674 A CN201911394674 A CN 201911394674A CN 111063658 B CN111063658 B CN 111063658B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
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Abstract
The present disclosure relates to a method of manufacturing a flexibly malleable electronic device, comprising: preparing at least one functional unit in a functional area of an electronic device on a hard substrate; manufacturing first interconnection lines among the functional units and second interconnection lines among the functional areas on the hard substrate to obtain a functional layer; adhering a temporary substrate to the functional layer; transferring the functional layer from the hard substrate to a non-developable surface target area of the object by using the temporary substrate; and removing the temporary substrate, and then packaging the surface of the functional layer to form a packaging layer to obtain the electronic device integrated on the target area. The manufacturing method of the flexible and extensible electronic device provided by the embodiment of the disclosure can integrate the large-area electronic device on the target area with the non-extensible curved surface of the object, so as to realize the close fitting between the electronic device and the object, and has the advantages of simple manufacturing process, low cost, high efficiency, high speed and wide application range.
Description
Technical Field
The present disclosure relates to the field of flexible electronic technology, and more particularly, to a method for manufacturing a flexible and ductile electronic device.
Background
With the continuous progress of science and technology, flexible electronic devices are increasingly applied to various industries. The direct integration of large-area flexible electronic devices on non-developable surfaces is a more important class of applications for flexible electronic devices. For example, electronic devices are integrated on a spherical object to form a spherical antenna, a large-area electrocardio-electrode is wrapped on the surface of the heart of a living body, a large-area flexible electronic device array is integrated on a surgical balloon, and the like. In order to solve the problem of integrating a large-area flexible electronic device on the surface of an existing object with a non-developable curved surface, in the related technology, the integration of the large-area flexible electronic device and the surface of the object with the non-developable curved surface is realized by adopting modes such as 3D printing, balloon auxiliary transfer printing, 3D printing and mold building combination and the like. But it has the problems of complex processing technology, high price, limited area of the integrated flexible electronic device which can be realized, poor fitting degree of the flexible electronic device and the surface of an object, and the like.
Disclosure of Invention
In view of the above, the present disclosure provides a method for manufacturing a flexible and malleable electronic device to solve the above technical problems.
According to an aspect of the present disclosure, there is provided a method of manufacturing a flexibly-malleable electronic device, the method comprising:
preparing a plurality of functional units of the electronic device on a hard substrate, wherein the electronic device comprises a plurality of functional areas, and each functional area comprises at least one functional unit;
manufacturing a first interconnecting wire for realizing the connection between the functional units and a second interconnecting wire for realizing the connection between the functional areas on the hard substrate to obtain a functional layer, wherein the shape of the functional layer is matched with a target area of the surface of an object integrating the electronic device;
adhering a temporary substrate prepared in advance on the functional layer, wherein the shape of the temporary substrate is matched with that of the functional layer;
transferring the functional layer from the hard substrate to the target area using the temporary substrate;
removing the temporary substrate;
encapsulating the functional layer surface placed at the target area to form an encapsulation layer, resulting in an electronic device integrated on the target area of the object,
wherein at least the target region in the surface of the object is a non-malleable surface.
In one possible implementation, the method further includes:
preparing an adhesive layer at the target area to fixedly place the functional layer at the target area with the adhesive layer prior to transferring the functional layer to the target area.
In one possible implementation, a plurality of functional units of the electronic device are fabricated on a rigid substrate, including:
generating a sacrificial layer on the hard substrate;
preparing the plurality of functional units on the sacrificial layer,
wherein transferring the functional layer from the hard substrate to the target area using the temporary substrate comprises:
removing the sacrificial layer, and separating the functional layer from the hard substrate by using the temporary substrate;
transferring the functional layer to the target area using a temporary substrate.
In one possible implementation, the material of the temporary substrate comprises a temperature-sensitive adhesive material,
wherein removing the temporary substrate comprises:
and adjusting the temperature of the temporary substrate to separate the temporary substrate from the functional layer, and removing the temporary substrate.
In one possible implementation, the material of the temporary substrate comprises a water-soluble adhesive material,
wherein removing the temporary substrate comprises:
and separating the temporary substrate from the functional layer by using water, and removing the temporary substrate.
In one possible implementation, the functional unit includes at least one of: a pressure sensing unit, a strain sensing unit, a temperature sensing unit, an energy conversion unit, an electrode, an antenna coil, an acceleration sensor and a humidity sensor,
the energy conversion unit comprises a piezoelectric conversion unit, a photoelectric conversion unit and an ultrasonic transduction unit.
In one possible implementation manner, the shape of the first interconnection line and/or the second interconnection line is a malleable shape, the malleable shape includes any one of a serpentine shape and a fractal shape, and a material encapsulating the surface of the functional layer is a flexible material.
In a possible implementation manner, the functional regions in the functional layer are at least one of arranged in a strip shape, arranged in a block shape, and arranged in a block shape without strip, and the planar shape of the temporary substrate includes at least one of a petal shape, a zigzag shape, a comb shape, and a spiral shape.
In one possible implementation, the method further includes:
and manufacturing input ends and/or output ends of the electronic device by using the second interconnection lines before packaging.
In one possible implementation, the method further includes:
and before packaging, mounting a preset device on the functional layer, wherein the device is connected with the second interconnection line.
The manufacturing method of the flexible and extensible electronic device provided by the embodiment of the disclosure can integrate the large-area electronic device on the target area with the non-extensible curved surface of the object, so as to realize the close fitting between the electronic device and the object, and has the advantages of simple manufacturing process, low cost, high efficiency, high speed and wide application range.
Other features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate exemplary embodiments, features, and aspects of the disclosure and, together with the description, serve to explain the principles of the disclosure.
Fig. 1 shows a flow diagram of a method of manufacturing a flexibly malleable electronic device, in accordance with an embodiment of the present disclosure.
Fig. 2 shows a flow diagram of a method of manufacturing a flexibly-malleable electronic device, according to an embodiment of the present disclosure.
Fig. 3, 4, 5 show schematic plan-view diagrams of a temporary substrate in a method of manufacturing a flexibly malleable electronic device according to an embodiment of the present disclosure.
FIG. 6 shows a schematic view of a flexibly malleable electronic device integrated with an object, in accordance with an embodiment of the present disclosure.
Detailed Description
Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. In the drawings, like reference numbers can indicate functionally identical or similar elements. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments.
Furthermore, in the following detailed description, numerous specific details are set forth in order to provide a better understanding of the present disclosure. It will be understood by those skilled in the art that the present disclosure may be practiced without some of these specific details. In some instances, methods, means, elements and circuits that are well known to those skilled in the art have not been described in detail so as not to obscure the present disclosure.
To further illustrate the realistic significance of the technical solutions provided by the present disclosure to the field, the manner provided by the related art to solve the above technical problems is described first, wherein, for convenience of explanation, a spherical object is taken as an example of an object having a non-developable surface. Non-developable surfaces mean that the surface of an object cannot be expanded into a plane, such as a spherical surface or an ellipsoid.
For the 3D printing technology, the surface of a spherical object can be directly printed by utilizing the 3D printing technology with five-axis freedom, so that the spherical antenna is prepared. However, the five-axis 3D technique is a complex and expensive machining technique, and requires a professional programming ability of an operator to set a spatial movement trajectory of a head used for printing. Moreover, for electronic devices which cannot be printed by printing technologies such as pressure sensors and the like, which need to be directly integrated on the surface of the spherical object, the 3D printing technology can no longer meet the actual requirements.
For the balloon auxiliary transfer printing technology, the electronic device can be transferred to the surface of the balloon firstly, then the balloon with the electronic device is pressed on a target area on the surface of the spherical object, and the electronic device on the surface of the balloon can be attached to the target area by utilizing the characteristic that the balloon is easy to deform, so that the electronic device is transferred to the surface of the spherical object. However, the balloon can only transfer small-area electronic devices each time, and the integration requirement of the whole spherical object surface or most of the spherical object surfaces cannot be met.
For the technology combining 3D printing and mold building, a 3D model which is the same as the target area on the surface of the spherical object can be printed by utilizing the 3D printing technology, then a layer of flexible film is formed on the surface of the model in a pouring mode, an electronic device is integrated on the flexible film, and then the flexible film with the electronic device is sleeved and coated on the target area of the spherical object by utilizing the characteristic that the flexible film has certain deformation capacity. However, the realization process is complicated, the surface adhesion degree of the flexible film and the spherical object is poor, and the integration of large-area electronic devices is difficult to realize in order to ensure the adhesion degree.
Fig. 1 shows a flow diagram of a method of manufacturing a flexibly malleable electronic device, in accordance with an embodiment of the present disclosure. Fig. 2 shows a schematic flow chart of a method for manufacturing a flexibly-malleable electronic device according to an embodiment of the present disclosure, as shown in fig. 1 and 2, the method includes steps S11 to S16.
In step S11, as shown in a portion a of fig. 2, a plurality of functional units 2 of the electronic device are prepared on a hard substrate 7, the electronic device including a plurality of functional regions 9, each functional region 9 including at least one functional unit 2, respectively.
In this embodiment, the hard substrate may be a hard, non-deformable sheet-like object such as a glass sheet or a silicon wafer, which is convenient for micro-processing in the subsequent steps.
In one possible implementation, the functional unit may include at least one of: the device comprises a pressure sensing unit, a strain sensing unit, a temperature sensing unit, an energy conversion unit, an electrode, an antenna coil, an acceleration sensor and a humidity sensor. The energy conversion unit may include a piezoelectric conversion unit, a photoelectric conversion unit, and an ultrasonic transduction unit.
In this embodiment, each functional area may include one or more functional units, and the functions of the functional units in each functional area may be the same or different. According to the working principle and process of the functional unit to be prepared, micromachining processes such as film growth, photoetching and etching are adopted to prepare the functional unit on the hard substrate.
In step S12, as shown in part a of fig. 2, the first interconnection lines 3 for achieving the connection between the functional units 2 and the second interconnection lines 6 for achieving the connection between the functional regions 9 are fabricated on the hard substrate 7, resulting in a functional layer whose shape matches a target region of the surface of the object 1 into which the electronic device is integrated. Wherein at least the target area in the surface of the object 1 is a non-developable surface.
In this embodiment, depending on the difference between the planar shape of the temporary substrate and the shape of the functional layer, the functional layer may further include a traffic region 10 (as shown in fig. 2) in addition to the functional region 9, the functional region including the corresponding functional unit and the first interconnect, and the traffic region 10 including a plurality of second interconnect. The first interconnection line can enable the functional units connected to the two ends of the line to be electrically conducted, and the functional units can be connected in series and/or in parallel. The second interconnection line may enable electrical conduction between all the functional units connected between the functional regions at both ends of the line. The dimensions (thickness, width, length, etc.) of the first interconnection line and the second interconnection line may be set according to the positional relationship between two targets to which they are connected, energy transmission requirements, etc., and the present disclosure does not limit this.
In this embodiment, according to the position size and the like of the first interconnection line and the second interconnection line to be prepared, the first interconnection line and the second interconnection line may be prepared by using a micro-processing process such as thin film growth, photolithography, etching and the like to obtain the required functional layer.
In this embodiment, part or all of the surface of the object may be a non-developable surface, and the target region of the object is a non-developable surface. The size of the electronic device that the object needs to integrate is large, for example, the target area occupies a larger proportion of the surface of the spherical object than three quarters of the surface area of the spherical object. The object can be a pre-manufactured spherical or ellipsoidal equipment product, such as a biological organ model, or an organ such as heart, stomach, liver, kidney, eyeball, ovary, and gallbladder of a living body such as a human body.
In one possible implementation, the shape of the first interconnect line and/or the second interconnect line may be a malleable shape, the malleable shape includes any one of a serpentine shape and a fractal shape, and the material encapsulating the surface of the functional layer is a flexible material.
In this implementation, the shape of the first interconnect lines and/or the second interconnect lines may also be a straight line in a malleable shape. The shape of the first interconnection lines and/or the second interconnection lines may be set according to the size of the target area of the object, the degree of flexibility of the object, and the like. For example, the shape of the first interconnect lines and/or the second interconnect lines may be a malleable shape when the target region of the object is relatively soft and/or a change in motion of a subsequent object, etc., changes the shape of the target region. The shape of the first interconnect lines and/or the second interconnect lines as malleable shapes may also be straight lines when the target region of the object is rigid and non-deforming. The shape of the first interconnection line and the second interconnection line can be set by those skilled in the art according to actual needs, and the present disclosure does not limit this.
In step S13, a temporary substrate 8 (shown as part b in fig. 2) prepared in advance, the shape of which matches that of the functional layer, is adhered to the functional layer as shown in part c in fig. 2.
Fig. 3, 4, 5 show schematic plan-view diagrams of a temporary substrate in a method of manufacturing a flexibly malleable electronic device according to an embodiment of the present disclosure.
In a possible implementation manner, the functional units in the functional layer are in at least one of a strip-shaped arrangement, a block-shaped strip arrangement and a block-shaped non-strip arrangement, and the planar shape of the temporary substrate includes at least one of a petal shape, a sawtooth shape, a comb shape and a spiral shape.
In this embodiment, the matching of the planar shape of the temporary substrate with the shape of the functional layer may include at least one of the following conditions: the temporary substrate can cover the functional layer, and the shape of the temporary substrate is convenient for tearing the functional layer from the hard substrate or the sacrificial layer.
When the functional units in the functional layer are arranged in a strip shape, the planar shape of the temporary substrate may be a spiral shape (as shown in fig. 3), at this time, the functional layer may include a functional region and a non-communication region, and the functional layer no longer includes a second interconnection line for realizing electrical conduction between functional regions. Taking the spherical surface (as shown in fig. 3) with the spherical shape as the object and the half spherical surface as the object as the target area, after the temporary substrate is adhered on the functional layer, the shape of the functional layer is changed from the original strip shape to the spiral shape, and further different sections of the functional layer are transferred to different circumferences of the object by means of the size difference of the radius of different spirals in the spiral shape, so as to achieve the purpose that the functional layer is wound around the half spherical surface integrated on the spherical object.
When the functional units in the functional layer are in a block shape and the blocks are arranged in a strip shape (that is, the block-shaped strip arrangement), the planar shape of the temporary substrate may be comb-tooth-shaped (as shown in fig. 4), and at this time, the functional layer may include a plurality of functional regions and traffic regions, and the second interconnection line is located in the traffic region. The more the number of teeth of the comb teeth is, the better the adhesion of the functional layer to the target area is, the higher the matching degree of the functional layer to the target area is, and the lower the probability of occurrence of adverse factors such as wrinkles and folds. Taking the middle stripe region corresponding to the maximum cross section of the object (as shown in fig. 4) with the object shape being spherical and the target region being the target region as an example, after the temporary substrate is adhered to the functional layer, the shape of the functional layer is converted into the temporary substrate shape, which facilitates the transfer to the middle stripe region of the object.
When the functional units in the functional layer are in a block shape and the blocks are arranged in a non-strip shape (i.e., in a block-shaped non-strip arrangement), the planar shape of the temporary substrate may be a petal shape (as shown in fig. 5), and at this time, the functional layer may include a plurality of functional regions and traffic regions, and the second interconnection line is located in the traffic region. The more petals of the petals are, the better the adhesiveness of the functional layer and the target area is, the higher the matching degree of the functional layer and the target area is, and the lower the probability of adverse factors such as folds and folds is. Taking the object as a spherical shape and the target area as a large part of the object (as shown in fig. 2) as an example, after the temporary substrate is adhered to the functional layer, the shape of the functional layer is converted into the temporary substrate shape, which facilitates transfer to the target area of the object.
In this embodiment, the temporary substrate may be made of a temperature-sensitive adhesive material (e.g., a thermal release tape, the adhesiveness of which changes when the temperature changes), a water-soluble adhesive material (e.g., a water-soluble adhesive film, which can be dissolved in water), or other materials that can be easily removed after the functional layer is transferred. The thin film made of the above-described material may be cut using laser cutting, mechanical cutting, or the like to obtain a temporary substrate. Alternatively, the temporary substrate may be prepared by physical vapor deposition, chemical vapor deposition, or the like, which is not limited by the present disclosure. The prepared temporary substrate may have a planar shape matching the shape of the functional layer.
In step S14, the functional layer is transferred from the hard substrate to the target area using the temporary substrate 8, as shown in portions d and e of fig. 2.
In this embodiment, the functional layer may be separated from the hard substrate by using the temporary substrate (S14-1 shown in fig. 2) to obtain a "temporary substrate and functional layer" shown in part d of fig. 2, and then the functional layer may be transferred to the target area by using the temporary substrate (S14-2 shown in fig. 2) to obtain "the target area of the object has the functional layer, temporary substrate placed therein" shown in part e of fig. 2. In order to more clearly show the manufacturing process of the present disclosure, the functional layer is not shown in the portion e of fig. 2, and the temporary substrate is not attached to the target area of the object, but actually the functional layer exists, and both the temporary substrate and the functional layer are attached to the target area of the object.
In one possible implementation, before step S14, the method further includes: preparing an adhesive layer at the target area to fixedly place the functional layer at the target area with the adhesive layer prior to transferring the functional layer to the target area.
In this implementation manner, the material of the adhesion layer may be a silicone glue, an uncured Polydimethylsiloxane (PDMS), a liquid bandage, or other materials that are easy to fix the functional layer and the target area of the object together, and the adhesion layer may be prepared on the target area of the object by spin coating, spray coating, blade coating, dipping, dispensing, or other methods, which is not limited in this disclosure.
In one possible implementation, step S11 may include: generating a sacrificial layer on the hard substrate; preparing the plurality of functional units on the sacrificial layer. Wherein, the step S14 may include: removing the sacrificial layer by means of etching liquid and the like, and separating the functional layer from the hard substrate by means of the temporary substrate; transferring the functional layer to the target area using a temporary substrate.
In the implementation mode, when the functional layer and the hard substrate have relatively high viscosity and are not beneficial to completely tearing the functional layer from the hard substrate by utilizing the temporary substrate, a sacrificial layer can be prepared on the hard substrate in advance, and the sacrificial layer is removed before the functional layer is torn up, so that the functional layer is separated from the hard substrate, and the tearing up is facilitated.
In this implementation, the material of the sacrificial layer may be polymethyl methacrylate (PMMA), silicon dioxide, aluminum gallium arsenide (AlGaAs), or the like. The sacrificial layer may be prepared by physical vapor deposition, chemical vapor deposition, and the like, such as spin coating, spray coating, blade coating, dipping, dispensing, MOCVD (a novel vapor phase epitaxy technology developed on the basis of Vapor Phase Epitaxy (VPE)), and the like, which is not limited by the disclosure. For example, a sacrificial layer is prepared by spin-coating PMMA on a hard substrate, aluminum gallium arsenic is prepared as a sacrificial layer on a hard substrate by MOCVD, and the like.
In step S15, the temporary substrate is removed, as shown in part f of fig. 2, with the functional layer (including the functional units 2, the first interconnect lines 3, and the second interconnect lines 6) remaining only at the target area of the object 1.
In one possible implementation, the material of the temporary substrate includes a temperature-sensitive adhesive material, wherein removing the temporary substrate may include: and adjusting the temperature of the temporary substrate to separate the temporary substrate from the functional layer, and removing the temporary substrate. When the temporary substrate is a heat release adhesive tape film, the temporary substrate can be heated to reduce the viscosity so as to tear the heat release adhesive tape film from the functional layer.
In one possible implementation, the material of the temporary substrate includes a water-soluble adhesive material, wherein removing the temporary substrate may include: and separating the temporary substrate from the functional layer by using water, and removing the temporary substrate. When the temporary substrate is a water-soluble adhesive film, the temporary substrate may be immersed in water or water may be sprayed to the temporary substrate so that the temporary substrate may be separated from the functional layer.
In step S16, as shown in part g of fig. 2, the functional layer surface placed at the target area is encapsulated to form an encapsulation layer 5, resulting in an electronic device integrated on the target area of the object 1. In order to more clearly show the manufacturing process of the present disclosure, the functional layer is not shown in the portion g of fig. 2, and the encapsulation layer is not attached to the target area of the object, but actually the functional layer exists, and the encapsulation layer and the functional layer are both attached to the target area of the object.
FIG. 6 shows a schematic view of a flexibly malleable electronic device integrated with an object, in accordance with an embodiment of the present disclosure. As shown in fig. 6, the electronic device (including the functional unit 2, the first interconnection line 3, the encapsulation layer 5) and the target area of the object 1 are fixedly attached together by the adhesive layer 4.
In this embodiment, the encapsulation layer is used to protect the functional layer, isolate the functional layer from the external environment, and insulate the functional unit, the first interconnection line, and the second interconnection line.
In one possible implementation, the method further includes: and manufacturing input ends and/or output ends of the electronic device by using the second interconnection lines before packaging. So as to subsequently utilize the input and/or output and external devices for data transmission and electrical transmission.
In one possible implementation, the method further includes: and before packaging, mounting a preset device on the functional layer, wherein the device is connected with the second interconnection line. The preset device may be a chip or the like that performs data processing. The preset means may be set and selected according to the function to be implemented by the functional layer, which is not limited by the present disclosure.
The manufacturing method of the flexible and extensible electronic device provided by the embodiment of the disclosure can integrate the large-area electronic device on the target area with the non-extensible curved surface of the object, so as to realize the close fitting between the electronic device and the object, and has the advantages of simple manufacturing process, low cost, high efficiency, high speed and wide application range.
It should be noted that, although the manufacturing method of the flexibly extensible electronic device is described above by taking the above embodiments as examples, those skilled in the art will understand that the present disclosure should not be limited thereto. In fact, the user can flexibly set each step according to personal preference and/or actual application scene, as long as the technical scheme of the disclosure is met.
Having described embodiments of the present disclosure, the foregoing description is intended to be exemplary, not exhaustive, and not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The terms used herein were chosen in order to best explain the principles of the embodiments, the practical application, or technical improvements to the techniques in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein.
Claims (10)
1. A method of manufacturing a flexibly-malleable electronic device, the method comprising:
preparing a plurality of functional units of the electronic device on a hard substrate, wherein the electronic device comprises a plurality of functional areas, and each functional area comprises at least one functional unit;
manufacturing a first interconnecting wire for realizing the connection between the functional units and a second interconnecting wire for realizing the connection between the functional areas on the hard substrate to obtain a functional layer, wherein the shape of the functional layer is matched with a target area of the surface of an object integrating the electronic device;
adhering a temporary substrate prepared in advance on the functional layer, wherein the shape of the temporary substrate is matched with that of the functional layer;
transferring the functional layer from the hard substrate to the target area by using the temporary substrate, so that the functional units in the functional layer are respectively attached to the target area;
removing the temporary substrate;
encapsulating the functional layer surface placed at the target area to form an encapsulation layer, resulting in an electronic device integrated on the target area of the object,
wherein at least the target region in the surface of the object is a non-developable surface.
2. The method of claim 1, further comprising:
preparing an adhesive layer at the target area to fixedly place the functional layer at the target area with the adhesive layer prior to transferring the functional layer to the target area.
3. The method of claim 1, wherein fabricating a plurality of functional units of the electronic device on a rigid substrate comprises:
generating a sacrificial layer on the hard substrate;
preparing the plurality of functional units on the sacrificial layer,
wherein transferring the functional layer from the hard substrate to the target area using the temporary substrate comprises:
removing the sacrificial layer, and separating the functional layer from the hard substrate by using the temporary substrate;
transferring the functional layer to the target area using a temporary substrate.
4. The method of claim 1, wherein the material of the temporary substrate comprises a temperature sensitive adhesive material,
wherein removing the temporary substrate comprises:
and adjusting the temperature of the temporary substrate to separate the temporary substrate from the functional layer, and removing the temporary substrate.
5. The method of claim 1, wherein the material of the temporary substrate comprises a water-soluble adhesive material,
wherein removing the temporary substrate comprises:
and separating the temporary substrate from the functional layer by using water, and removing the temporary substrate.
6. The method of claim 1, wherein the functional unit comprises at least one of: a pressure sensing unit, a strain sensing unit, a temperature sensing unit, an energy conversion unit, an electrode, an antenna coil, an acceleration sensor and a humidity sensor,
the energy conversion unit comprises a piezoelectric conversion unit, a photoelectric conversion unit and an ultrasonic transduction unit.
7. The method of claim 1, wherein the shape of the first interconnect lines and/or the second interconnect lines is a malleable shape, the malleable shape including any of a serpentine shape and a fractal shape, and a material encapsulating the surface of the functional layer is a flexible material.
8. The method of claim 1, wherein the functional regions in the functional layer are at least one of arranged in a stripe shape, arranged in a block shape, and arranged in a block shape without stripe, and the planar shape of the temporary substrate includes at least one of a petal shape, a zigzag shape, a comb shape, and a spiral shape.
9. The method of claim 1, further comprising:
and manufacturing input ends and/or output ends of the electronic device by using the second interconnection lines before packaging.
10. The method of claim 1, further comprising:
and before packaging, mounting a preset device on the functional layer, wherein the device is connected with the second interconnection line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911394674.3A CN111063658B (en) | 2019-12-30 | 2019-12-30 | Method for producing flexible and extensible electronic device |
Applications Claiming Priority (1)
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