CN109968852A - A kind of direct transfer method of general two-dimensional surface to 3 D complex surface - Google Patents
A kind of direct transfer method of general two-dimensional surface to 3 D complex surface Download PDFInfo
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- CN109968852A CN109968852A CN201910152120.6A CN201910152120A CN109968852A CN 109968852 A CN109968852 A CN 109968852A CN 201910152120 A CN201910152120 A CN 201910152120A CN 109968852 A CN109968852 A CN 109968852A
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- adhesive tape
- cut
- paper
- curved surface
- releasable adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/025—Duplicating or marking methods; Sheet materials for use therein by transferring ink from the master sheet
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- Adhesive Tapes (AREA)
- Decoration By Transfer Pictures (AREA)
Abstract
The invention discloses a kind of direct transfer methods of general two-dimensional surface to 3 D complex surface, and the releasable adhesive tape of paper folding-paper-cut design is used to realize as transfer seal.The method that specific transfer step includes: 1, is approached using slight flat unit, three-dimensional receptor substrate curved surface is divided, obtains flat deployable structure after cutting；2, the almost plane deployed configuration obtained according to step 1, design element distribution patterns simultaneously prepare element, while cutting the releasable adhesive tape of folding and obtaining releasable adhesive tape folding-paper-cut；3, element is picked up from preparation substrate using releasable adhesive tape folding-paper-cut；4, releasable adhesive tape folding-paper-cut with element is coated on three-dimension curved surface receptor substrate；5, triggering releasable adhesive tape makes it lose viscosity, will be on element print to receptor substrate.This method has many advantages, such as that implementation process is simple and convenient, low in cost, versatility is good, the element prepared in plane can be transferred on the 3 D complex curved surface of arbitrary shape.
Description
Technical field
The present invention relates to a kind of trans-printing technology, more particularly to a kind of general two-dimensional surface is to 3 D complex surface
Direct transfer method, can be used for micro-nano element from plane to it is any it is complex-curved on transfer.
Background technique
Trans-printing technology, be it is a kind of by micro-nano element be assembled into spacial ordering two dimension or three-dimensional function module one
Kind technology.Variety classes, independently prepared discrete elements can be carried out large-scale integrated effectively by this technology, in turn
Form the function system of spacial ordering.Transfer is generally realized using transfer seal, by the member prepared on seal and alms giver's substrate
Strong adherency between part picks up element from alms giver's substrate；After being transferred on receptor substrate, weaken seal and element
Between adhesion strength, on element print to receptor substrate.It can transferring member material ranges it is very wide, from complicated molecule material
Material, such as the monolayer material (self-assembled monolayers, SAMs) of self assembly, functional polymer material, DNA, photoetching
Glue etc. arrives high-performance rigid material, such as inorganic monocrystalline silicon semiconductor, metal material, sull and fully-integrated
Equipment such as thin film transistor (TFT) (thin film transistors, TFTs), light emitting diode (light emitting
Diodes, LEDs), cmos circuit, sensor array, solar battery etc. can be assembled with transfer technique.
Curved surface integrated device is a kind of integrated device by function element preparation on special surface, causes section in recent years
It grinds boundary and industry is greatly paid close attention to, application range covers biomedicine, electronic information, display and wearable electronic and sets
It is standby to wait fields.Such as there is Fingertip tactile-sense sensor (reference can be made to Ko H C, Shin G, Wang in biological Integrated Light/field of electronic devices
S,et al.Curvilinear Electronics Formed Using Silicon Membrane Circuits and
Elastomeric Transfer Elements [J] .Small, 2009,5 (23): 2703-2709.), be coated on heart surface
Electronic device (reference can be made to Ko H C, Shin G, Wang S, et al.Curvilinear Electronics Formed
Using Silicon Membrane Circuits and Elastomeric Transfer Elements[J].Small,
2009,5 (23): 2703-2709.), the application such as electronics compound eye is (reference can be made to Song Y M, Xie Y, MALYARCHUK, et
al.Digital cameras with designs inspired by the arthropod eye[J].Nature,2013,
497 (7447): 95-9.), these application requirement devices are in contact with the biological tissue with complex-curved surface.
In general, existing high-performance components preparation process is plane preparation process, i.e. element preparation is in rigid plane
It is completed in substrate (such as silicon wafer, sapphire substrates).It then becomes necessary to using transfer technique, the element that will be prepared in planar substrates
On trans-printing to three-dimension curved surface.
Main 1) the curved surface seal of current three-dimensional transfer technique flatten-restore transfer printing (reference can be made to Ko H C,
Stoykovich MP,Song J,et al.Ahemispherical electronic eye camera based on
Compressible silicon optoelectronics [J] .NATURE, 2008,454 (7205): 748-753.) and 2) bent
Face seal plated film-directly prints method (reference can be made to Xu X, Davanco M, Qi X, et al.Direct transfer
patterning on three dimensionally deformed surfaces at micrometer resolutions
and its application to hemispherical focal plane detector arrays[J].Organic
Electronics,2008,9(6):1122-1127.).Curved surface seal flattens-restores transfer printing and stretches spherical shell in the axial direction first
The PDMS transfer printing head (seal) of shape is flattened, and the axial tension that seal is discharged after the element prepared in pick-up plane substrate is made
With seal restores spherical, can be coated on spherical receptor substrate and realize printing, thus the element prepared in planar substrates
It is printed on spherical receptor substrate with circuit.This method needs the stringent deformation for calculating seal and according to deformation come design element
Distribution, calculate cumbersome, process is complicated, to the shape poor universality of receptor substrate；Curved surface seal plated film-, which directly prints method, is scheming
On the curved surface PDMS seal of case then direct plating made of metal turns metal pattern by way of cold welding for metal pattern element
It moves on to and is coated on the curved surface receptor substrate of metallic film.However, due to the out-of-flatness for preparing substrate, with the element of this method preparation
Performance is poor, can not be suitable for the preparation of other high performance materials；And versatility is poor, and a kind of mold can only correspond to a kind of substrate
Structure.
Summary of the invention
To solve the above problems, the present invention proposes the general two-dimensional surface of one kind to the direct transfer side on 3 D complex surface
Method uses according to releasable adhesive tape paper folding-paper-cut of the approximate expansion planar design of three-dimension curved surface as transfer seal and realizes.
It transfers process
1) paper folding-paper-cut thought, is used for reference, is planar structure by the Doubly curved surfaces of three-dimension curved surface receptor substrate；
2), according to the specific requirements design element distribution map of curved surface integrated device on the flat deployable structure that step 1) obtains
Case, and element is prepared according to element distribution patterns on a planar base；It is cut simultaneously according to the flat deployable structure that step 1) obtains
Releasable adhesive tape is cut, releasable adhesive tape folding-paper-cut identical with above-mentioned flat deployable structure is obtained；
3), element is picked up from substrate using releasable adhesive tape folding-paper-cut；
4), releasable adhesive tape folding-paper-cut with element is coated on three-dimension curved surface receptor substrate；
5), triggering releasable adhesive tape folding-paper-cut makes it lose viscosity, by element print to three-dimension curved surface receptor substrate, thus
Trans-printing of the realization planar substrates to any 3 D complex curved surface.
Described refers to Doubly curved surfaces for planar structure: the method approached using slight flat unit, by three-dimension curved surface
Receptor substrate curved surface carries out being divided into several polygons to adjoin one another i.e. slight flat unit, the slight flat unit in part
Joint carries out cutting and cuts off, and the joint of part slight flat unit is then used as folding line, to expand into planar structure；It should
Planar structure carries out folding the cladding that can be realized to three-dimension curved surface receptor substrate along folding line.
The releasable adhesive tape can first carry out rolling over-paper-cut design, pick up again after being cut into releasable adhesive tape folding-paper-cut
Element；It can also be cut again after first pickup device, obtain the releasable adhesive tape folding-paper-cut for having element.
It is viscous that the releasable adhesive tape can be heat release adhesive tape, water release adhesive tape, water-soluble adhesive tape or UV photodissociation
Film etc. can lose any one adhesive tape of viscosity under external heat liquid/light action triggering.Before activation, adhesive tape has
Strong adhesion strength can easily strip down element from preparation substrate；After triggering, adhesive tape just loses viscosity, Ke Yifei
Often reliably on element print to receptor substrate.
The releasable adhesive tape, be existing low-cost industrial product, such as Nitto company, Japan REVALPHA or
The heat such as NWS-Y5V/NWS-TS322F release adhesive tape or 3841/3850 water of 3M release adhesive tape or 5414 water-soluble adhesive tape of 3M,
Or common UV photodissociation mucous membrane in semiconductor technology.
The beneficial effects of the present invention are: implementation process of the present invention is simple and convenient, low in cost, versatility is good, can be flat
The element prepared on face is transferred on the 3 D complex curved surface of arbitrary shape.
Detailed description of the invention
Fig. 1 is the direct transfer method flow chart suitable for three-dimension curved surface proposed in the present invention.
Fig. 2 be in the present invention one hemispherical curved surface is divided, approximate expansion be planar structure implementation column schematic diagram.
Fig. 3 is that releasable adhesive tape implementation column signal is cut in a planar development design according to hemispherical curved surface in the present invention
Figure.
Fig. 4 is that the implementation from planar substrates on trans-printing element to hemispherical receptor substrate illustrates in the present invention
It is intended to.
In figure: 1- three-dimension curved surface to be divided；2- slight flat unit；3- Doubly curved surfaces structure；The releasable adhesive tape of 4-；5- is bent
Face deployed configuration cut mark；6- cutter/laser；The releasable adhesive tape folding-paper-cut of 7-；8- folding line；9- element；10- planar substrates；11-
Uniform pressure；12- curved surface receptor substrate；The additional trigger action of 13-.
Specific embodiment
The contents of the present invention are further illustrated with reference to the accompanying drawings and examples.
Fig. 1 is the direct transfer method flow chart suitable for three-dimension curved surface proposed in the present invention.
As shown in Figure 1a, the method which is included the following steps: 1, approached using slight flat unit, will be three-dimensional
Receptor substrate curved surface divides, approximate expansion is plane paper folding paper-cut structure；2, according to the almost plane deployed configuration of curved surface, design
Element distribution form simultaneously prepares element；It cuts simultaneously and folds releasable adhesive tape；3, using releasable adhesive tape folding-paper-cut by element from
It is picked up in planar substrates；4, releasable adhesive tape folding-paper-cut with element is coated on three-dimension curved surface receptor substrate；5, it triggers
Releasable adhesive tape makes it lose viscosity, by element print to receptor substrate, to realize planar substrates to any 3 D complex
The trans-printing of curved surface.
The releasable adhesive tape can first carry out paper folding paper-cut design, pickup device again after shearing；It can also first pick up
It is sheared again after element.I.e. as shown in Figure 1 b, transfer process can also are as follows: 1, the method approached using slight flat unit, it will
Three-dimensional receptor substrate curved surface divides, approximate expansion is plane paper folding paper-cut structure；2, according to deployed configuration, design element is distributed shape
Formula simultaneously prepares element；3, element is picked up from planar substrates with releasable adhesive tape；4, the releasable adhesive tape with element is pressed
It is cut to obtain releasable adhesive tape folding-paper-cut according to deployed configuration design in 1；5, the releasable adhesive tape with element is rolled over-is cut
Paper bag overlays on three-dimension curved surface receptor substrate；6, triggering releasable adhesive tape makes it lose viscosity, by element print to three-dimension curved surface
On receptor substrate.
Fig. 2 be in the present invention one hemispherical curved surface is divided, approximate expansion be planar structure implementation column schematic diagram.
Firstly, (Fig. 2 a) is analyzed to given curved surface to be divided, the method approached using slight flat unit, song
Face is divided into the approximate shapes of multiple facets, and combines existing paper-cut paper folding technology, and segmentation (figure is planarized to it
2b).In the present embodiment, the shape of football has been copied, spherical shape is divided into 32 faces of regular pentagon and regular hexagon being spliced into
Body (Fig. 2 b) has obtained the division design of curved surface.
Further, it by 32 face, double of equal part of body, obtains the approximate of hemisphere and divides (Fig. 2 c), finally by the division of curved surface
Design is unfolded, and the almost plane deployed configuration (Fig. 2 d) of semiglobe has been obtained.
When expansion, the selection of cutting path should make deployed configuration compact as far as possible, to reach maximally utilizing for material.
According to the specific element distribution on hemispherical curved surface integrated device, the design element on the flat deployable structure of acquisition
The distribution patterns of part, and element is prepared according to element distribution patterns on a planar base.
Fig. 3 is that releasable adhesive tape implementation column signal is cut in a planar development design according to hemispherical curved surface in the present invention
Figure.
After obtaining three-dimension curved surface approximate expansion structure, (figure is cut to releasable adhesive tape along deployed configuration outer profile
3a)；The releasable adhesive tape paper-cut (Fig. 2 b) with deployed configuration same profile is obtained after cutting.
The equipment cuttings such as common mechanical cutting or laser cutting can be used in the cutting process.
Preferably, at the deployed configuration folding line of releasable adhesive tape, adhesive tape is not cut through, and adhesive tape is complete when to keep transfer
Whole property.
Fig. 4 is an embodiment signal from planar substrates on trans-printing element to hemispherical curved surface in the present invention
Figure.Wherein deployed configuration is designed according to Fig. 2 Fig. 3.
Firstly, releasable adhesive tape folding-paper-cut seal is close to planar substrates (Fig. 4 a)；After touching the element in planar substrates
Apply uniform pressure and guarantees that adhesive tape and element come into full contact with (Fig. 4 b)；Releasable adhesive tape folding-paper-cut seal is then torn up, by can
Element is picked up (Fig. 4 c) from planar substrates by the strong adhesive force of release glue；The releasable adhesive tape with element is rolled over-cut later
Paper seal fits on three-dimension curved surface receptor substrate, applies pressure, keeps element on adhesive tape and three-dimension curved surface receptor substrate close
Fitting forms certain adherency (Fig. 4 d)；Then apply external action and trigger releasable adhesive tape seal, it is made to lose sticky (Fig. 4 e)；
It is finally peeled away adhesive tape, (Fig. 4 f) on element print to receptor substrate.
Claims (5)
1. a kind of general two-dimensional surface is to the direct transfer method on 3 D complex surface, which comprises the steps of:
1) paper folding-paper-cut thought, is used for reference, is planar structure by the Doubly curved surfaces of three-dimension curved surface receptor substrate；
2), according to the distribution map of the specific requirements design element of curved surface integrated device on the flat deployable structure that step 1) obtains
Case, and element is prepared according to element distribution patterns on a planar base；It is cut simultaneously according to the flat deployable structure that step 1) obtains
Releasable adhesive tape is cut, releasable adhesive tape folding-paper-cut identical with above-mentioned flat deployable structure is obtained；
3), element is picked up from substrate using releasable adhesive tape folding-paper-cut；
4), releasable adhesive tape folding-paper-cut with element is coated on three-dimension curved surface receptor substrate；
5), triggering releasable adhesive tape folding-paper-cut makes it lose viscosity, by element print to three-dimension curved surface receptor substrate, thus
Trans-printing of the realization planar substrates to any 3 D complex curved surface.
2. direct transfer method according to claim 1, which is characterized in that described to be for planar structure by Doubly curved surfaces
Refer to the method approached using slight flat unit, the curved surface of three-dimension curved surface receptor substrate be divided into several adjoin one another
Polygon, that is, slight flat unit, in part, the joint of slight flat unit cut and cuts off, part slight flat unit
Joint be then used as folding line, to expand into planar structure；The planar structure, which fold along folding line, can realize pair
The cladding of three-dimension curved surface receptor substrate.
3. direct transfer method according to claim 1, which is characterized in that releasable adhesive tape can first carry out cutting acquisition
Releasable adhesive tape folding-paper-cut, pickup device again later, can also carry out again after first pickup device cutting obtain with element can
Discharge adhesive tape folding-paper-cut.
4. direct transfer method according to claim 1, which is characterized in that the releasable adhesive tape be external heat,
Any one adhesive tape of viscosity is triggered and lost under liquid or light action.
5. direct transfer method according to claim 1, which is characterized in that the releasable adhesive tape can be hot release
Adhesive tape, water release adhesive tape, water-soluble adhesive tape either UV photodissociation mucous membrane etc..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910152120.6A CN109968852B (en) | 2019-02-28 | 2019-02-28 | Universal direct transfer printing method from two-dimensional plane to three-dimensional complex surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910152120.6A CN109968852B (en) | 2019-02-28 | 2019-02-28 | Universal direct transfer printing method from two-dimensional plane to three-dimensional complex surface |
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| CN109968852A true CN109968852A (en) | 2019-07-05 |
| CN109968852B CN109968852B (en) | 2020-04-14 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111002734A (en) * | 2019-12-27 | 2020-04-14 | 蒋聘 | Pattern jet printing method for multi-curved-surface product |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990013063A1 (en) * | 1989-04-16 | 1990-11-01 | Manfred Grueninger | Process for transferring images motifs |
| US20020162472A1 (en) * | 2001-03-05 | 2002-11-07 | Tlcd Corp. | Print product on demand |
| CN1543403A (en) * | 2001-06-01 | 2004-11-03 | A method for patterning of three-dimensional surfaces | |
| CN101271274A (en) * | 2007-03-19 | 2008-09-24 | 株式会社理光 | Minute structure and information recording medium |
| TWI309999B (en) * | 2005-05-04 | 2009-05-21 | ||
| CN101820240A (en) * | 2009-06-26 | 2010-09-01 | 天津大学 | Spherical planning-based permanent magnetic spherical motor stator winding electrifying method |
| US20110030796A1 (en) * | 2009-08-04 | 2011-02-10 | Precursor Energetics, Inc. | Methods and articles for caigs silver-containing photovoltaics |
| CN102378692A (en) * | 2009-04-01 | 2012-03-14 | 株式会社秀峰 | Printing method and object to be printed |
| CN207088817U (en) * | 2017-07-26 | 2018-03-13 | 大勤化成股份有限公司 | Transfer membrane structure and three-dimensional transfer article |
| CN207663209U (en) * | 2017-12-27 | 2018-07-27 | 青岛天仁微纳科技有限责任公司 | A kind of nanoscale imprinting apparatus for three-dimension curved surface |
-
2019
- 2019-02-28 CN CN201910152120.6A patent/CN109968852B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1990013063A1 (en) * | 1989-04-16 | 1990-11-01 | Manfred Grueninger | Process for transferring images motifs |
| US20020162472A1 (en) * | 2001-03-05 | 2002-11-07 | Tlcd Corp. | Print product on demand |
| CN1543403A (en) * | 2001-06-01 | 2004-11-03 | A method for patterning of three-dimensional surfaces | |
| TWI309999B (en) * | 2005-05-04 | 2009-05-21 | ||
| CN101271274A (en) * | 2007-03-19 | 2008-09-24 | 株式会社理光 | Minute structure and information recording medium |
| CN102378692A (en) * | 2009-04-01 | 2012-03-14 | 株式会社秀峰 | Printing method and object to be printed |
| CN101820240A (en) * | 2009-06-26 | 2010-09-01 | 天津大学 | Spherical planning-based permanent magnetic spherical motor stator winding electrifying method |
| US20110030796A1 (en) * | 2009-08-04 | 2011-02-10 | Precursor Energetics, Inc. | Methods and articles for caigs silver-containing photovoltaics |
| CN207088817U (en) * | 2017-07-26 | 2018-03-13 | 大勤化成股份有限公司 | Transfer membrane structure and three-dimensional transfer article |
| CN207663209U (en) * | 2017-12-27 | 2018-07-27 | 青岛天仁微纳科技有限责任公司 | A kind of nanoscale imprinting apparatus for three-dimension curved surface |
Non-Patent Citations (1)
| Title |
|---|
| XU X,DAVANCO M,QI X: "Direct transferpatterning on three dimensionally deformed surfaces at micrometer resolutionsand its application to hemispherical focal plane detector arrays", 《ORGANICELECTRONICS》 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111002734A (en) * | 2019-12-27 | 2020-04-14 | 蒋聘 | Pattern jet printing method for multi-curved-surface product |
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