CN108944110B - High speed high resolution selective transfer printing process - Google Patents
High speed high resolution selective transfer printing process Download PDFInfo
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- CN108944110B CN108944110B CN201810731559.XA CN201810731559A CN108944110B CN 108944110 B CN108944110 B CN 108944110B CN 201810731559 A CN201810731559 A CN 201810731559A CN 108944110 B CN108944110 B CN 108944110B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/38207—Contact thermal transfer or sublimation processes characterised by aspects not provided for in groups B41M5/385 - B41M5/395
- B41M5/38221—Apparatus features
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/26—Thermography ; Marking by high energetic means, e.g. laser otherwise than by burning, and characterised by the material used
- B41M5/382—Contact thermal transfer or sublimation processes
- B41M5/38257—Contact thermal transfer or sublimation processes characterised by the use of an intermediate receptor
Abstract
The invention discloses a high-speed high-resolution selective transfer printing method, which is characterized in that a thermal release adhesive tape is contacted with an element on a donor substrate, and the element is picked up from the donor substrate by means of strong adhesion of the thermal release adhesive tape and the element; selectively heating the heat-releasing adhesive tape to which the element is adhered using a high-resolution local heat source to cause the heated portion of the adhesive tape to lose its tackiness; selectively printing elements from the thermal release tape onto the receptor substrate is achieved by contacting the thermal release tape with the receptor substrate. The method of the invention has wide application range, and the picking process and the printing process can be realized in different forms for rigid or flexible substrates. The selective heating of the local heat source can be realized by adopting a high-spatial-resolution laser beam combined with scanning of a galvanometer field lens or a displacement platform, parallel light source mask heating or micro-heater array heating and the like. The method has the advantages of high reliability, high speed, high throughput, programmable transfer pattern and high transfer resolution.
Description
Technical Field
The invention relates to a transfer printing technology, in particular to a high-speed high-resolution selective transfer printing method which can be used for deterministic assembly of randomly patterned micro-nano structures.
Background
The transfer printing technology is a technology for integrating micro-nano materials into a two-dimensional or three-dimensional functional module with ordered space, and the transfer printing technology can be applied to the preparation of heterogeneous and uneven high-performance integrated functional systems, such as flexible optical/electronic devices, three-dimensional or curved optical/electronic devices and detection and measurement equipment of biocompatibility. The technology can effectively integrate different types of discrete elements which are independently prepared on a large scale, thereby forming a functional system with ordered space. The range of transferable materials is very wide, from complex molecular materials such as self-assembled monolayer materials (SAMs), functional polymer materials, DNA, photoresists, etc., to high performance hard materials such as inorganic single crystal silicon semiconductors, metal materials, oxide films, etc., and fully integrated devices such as Thin Film Transistors (TFTs), Light Emitting Diodes (LEDs), CMOS circuits, sensor arrays, solar cells, etc., can be assembled by transfer techniques. The functional systems and devices are made of more and more diverse materials and have more and more complex structures, and accordingly, the transfer printing technology is required to be capable of being performed globally and in high-speed parallel and to be capable of being performed selectively and accurately in programmability.
Transfer printing is generally effected using a transfer stamp, which relies on strong adhesion between the stamp and the element prepared on the donor substrate to pick the element off the donor substrate; after transfer to the receiver substrate, the adhesion between the stamp and the element is reduced, and the element is printed onto the receiver substrate.
In general, donor substrates are rigid and brittle materials, such as silicon, germanium, sapphire, and quartz glass, which are used in the inorganic electronics industry and conventional semiconductor manufacturing processes.
Furthermore, the donor substrate may be a flexible and bendable sheet, such as a glass sheet, a stainless steel sheet or a plastic such as PEN, PI, etc. used in the preparation of organic semiconductors, and a copper sheet used in the process of preparing graphene by vapor deposition.
Typically, the receptor substrate is a ductile, flexible polymeric material, such as rubber; or flexible and bendable thin sheets, such as glass thin sheets, stainless steel thin sheets or PEN, PI and other plastics; in addition, rigid materials such as glass plates and the like are also possible.
Generally, there are two modes of parallel transfer and serial transfer. The mass elements are processed in one step by parallel transfer printing, the transfer printing throughput is high, and the speed is high; the serial transfer printing processes a single or a plurality of elements at a time, and has strong control capability to the elements, high transfer printing precision and strong fault-tolerant capability.
Industrial application of transfer techniques requires high throughput and high rates, i.e. a large number of components can be processed per transfer. Improving throughput and speed can be achieved by increasing the area of the transfer stamp in the parallel transfer mode, but the increased area of the transfer stamp can present challenges to the alignment of the stamp with the substrate; in addition, transfer defects, such as missing pick-up, missing print, component defects, increase with increasing transfer stamp area, and primary transfer defects cause more defects in a transfer in one pass, resulting in a sharp reduction in transfer fault tolerance; the increase in transfer area also results in reduced control over the individual elements, reducing the accuracy of the transfer.
In many cases, selective, programmable patterned printing of elements onto a receiver substrate is required. Such as solar cell, LED and silicon semiconductor element fabrication, the elements are typically fabricated in a very dense array on a donor substrate for material and cost savings due to the high cost of the elements, but in use, require the elements to be distributed in a sparse array or specific pattern on a receptor substrate; or a graphene electrode, a photoresist, etc., which is required to be printed on the receptor substrate in accordance with a functionalized pattern.
The selective and programmable transfer printing technology can selectively print the elements on a receptor base according to the requirements, and has the advantages of parallel transfer printing of large-area high-throughput processing elements; the serial transfer also has the advantage that the single elements can be integrated with high precision and high reliability, and the contradiction can be well solved.
Generally, the prior art selectively programmable transfer printing technology includes an inflatable seal transfer printing technology and a surface relief assisted shape memory polymer seal transfer printing technology. However, these transfer techniques have their own limitations, either the structure and fabrication of the stamp is complicated, or the reliability is poor.
Firstly, the transfer printing technology of the inflatable seal utilizes a micro-cavity encapsulated by a PDMS film to transfer printing. The packaging film is smooth during picking up, and the adhesive force is strong; and during printing, gas is filled into the micro-cavity, the packaging film is bulged, the element is ejected, the contact area with the element is reduced, and adhesion is reduced, so that printing is realized. A plurality of micro-cavities are manufactured at the bottom of the PDMS high polymer seal, each or a plurality of micro-cavities are communicated with a micro-channel in the seal, and programming transfer printing can be realized through the control of an external air pump.
The preparation of the inflatable seal needs a large amount of micro-channel preparation technology and is complex; and the laying of the micro-channel and the air channel limits the integration level of the seal cavity and the resolution of transfer printing.
Secondly, the surface floating decoration assisted shape memory polymer seal transfer printing technology adopts shape memory polymer as a seal material, a pyramid micro-cone is prepared at the bottom of the seal, and when picking up, the micro-cone is collapsed at high temperature, so that the contact area between the seal and an element is increased, the contact state is maintained by cooling, and strong adhesion picking up is realized; when printing, the shape memory polymer is heated, the microcone can pop up to restore the initial shape, the element and the seal only keep contact at the top end of the microcone, the contact area is small, the adhesion is weak, and the printing is realized. The programmable transfer can be achieved by laser local heating of the shape memory polymer.
However, shape memory polymer materials are in a low modulus, strongly adherent state after heating, resulting in difficulty in debonding the element during printing.
Disclosure of Invention
In order to solve the problems, the invention aims to provide a high-speed high-resolution selective transfer printing method which is realized by adopting a heat release adhesive tape and a high-resolution local heat source and is used for the deterministic assembly of a micro-nano structure. The specific method comprises the following steps: firstly, a thermal release adhesive tape is contacted with an element on a donor substrate, and the element is picked up from the donor substrate by means of strong adhesion of the thermal release adhesive tape and the element after uniform pressure is applied; selectively and programmatically heating the heat release adhesive tape adhered with the element by using a high-resolution local heat source, wherein the adhesive tape of the heated part loses viscosity; the thermal release adhesive tape is contacted with the acceptor substrate, so that printing elements on the thermal release adhesive tape can be selectively printed on the acceptor substrate, and the programmable and patterned printing is realized.
The heat release adhesive tape has strong adhesion, and an element can be easily peeled off from a donor substrate at normal temperature; heating above its transition temperature (typically about 100 c) causes the tape to lose its tack and the component can be transfer printed very reliably onto the receiver substrate.
The heat release adhesive tape is an existing low-cost industrial product, such as REVALPHA or NWS-Y5V/NWS-TS322F of Nitto corporation of Japan.
The pick-up and print steps may take the form of Batch processing (Batch) suitable for transferring elements on a rigid/flexible donor substrate to a rigid/flexible receiver substrate.
The pick-up and printing step, which may be in the form of a Roll-to-Plate (Roll-to-Plate), is suitable for the continuous pick-up and printing of components on a rigid substrate.
The pick-up and printing steps, which may be in Roll-to-Roll form, are suitable for continuous pick-up and printing of components on flexible substrates.
The step of selectively heating the local heat source can be realized by adopting a mode of combining a laser beam with high spatial resolution with a galvanometer and a field lens and scanning by means of deflected laser of the galvanometer.
The step of the selective heating of the local heat source uses a laser beam with high spatial resolution, and combines a mode of scanning by a galvanometer and a field lens, so that the method has the advantages of extremely high scanning speed (such as 10000mm/s), extremely high spatial resolution (usually laser spots are less than 50um) and uniform heating.
The step of selectively heating by the localized heat source may be accomplished using a high spatial resolution laser beam (typically 500um or less) in combination with scanning by the translation stage.
The step of the programmable local heat source patterned heating adopts a mode of using a laser beam with high spatial resolution and combining a displacement platform for scanning, and has the advantages of simple structure, high positioning precision and low cost.
The step of selectively heating by the high-resolution local heat source can be realized by using a parallel heating light source mask patterning heating mode. The method can realize whole patterning heating at one time.
In addition, the step of selectively heating by the high-resolution local heat source can also be realized by using a micro-heater array heating mode.
The invention has the beneficial effects that: the transfer printing method of the invention has the advantages of simplicity, wide application range, high reliability, high speed, high throughput, programmable transfer pattern and high transfer resolution.
Drawings
Fig. 1 is a flow chart of the programmable transfer proposed in the present invention.
Fig. 2 is a schematic diagram of batch transfer proposed in the present invention.
Fig. 3 is a schematic diagram of the roll-to-roll and roll-to-roll transfer proposed in the present invention.
Fig. 4 is a schematic diagram of the laser combined with the galvanometer field lens to realize selective heating.
Fig. 5 is a schematic diagram of the selective heating of the laser combined with the displacement platform proposed in the present invention.
Fig. 6 is an implementation of reducing the laser scan dimension in transfer using roll form as proposed in the present invention.
Fig. 7 is a schematic diagram of selective heating achieved by parallel heating of a light source mask as proposed in the present invention.
Fig. 8 is a schematic diagram of the selective heating of the micro-heater array proposed in the present invention.
FIG. 1-thermal release tape backing; 2-heat release glue; 1, 2-heat release tape; 3-element; 4-a donor substrate; 5-uniform pressure; 6-acceptor substrate; 7-a laser beam; 8-a roller; 9-a rigid donor substrate; 10-a flexible donor substrate; 11-a rigid receptor substrate; 12-a flexible receptor substrate; 13-a laser; 14-a galvanometer; 15-field lens; a 16-X displacement stage; 17-Y displacement stage; 18-parallel heating light; 19-mask plate; 20-micro heater array.
Detailed Description
The invention is further described with reference to the following figures and examples.
Fig. 1 is a flow chart of the programmable transfer proposed in the present invention. Firstly, a thermal release adhesive tape is contacted with an element on a donor substrate, and the element is picked up from the donor substrate by means of strong adhesion of the thermal release adhesive tape and the element after uniform pressure is applied; then selectively heating the heat release adhesive tape adhered with the element by using a high-resolution local heat source, wherein the part of the adhesive tape loses viscosity; finally, the element is printed on the receptor substrate, so that the element is selectively printed on the receptor substrate from the thermal release adhesive tape.
As an example, and not to limit the scope of the invention, FIG. 2 is a schematic illustration of batch programmatic transfer as set forth in the present invention. The stamp transfers a batch of elements from a donor substrate at one time, suitable for element transfer on rigid/flexible donor substrates.
The flow of batch selective transfer is as follows: the method comprises the steps of bringing a thermal release tape close to a donor substrate (fig. 2a), contacting the donor substrate and an element and applying uniform pressure (fig. 2b), then tearing the stamp, picking up the element by means of strong adhesion of the tape (fig. 2c), then contacting the stamp with the element with a receptor substrate and applying uniform pressure (fig. 2d), ensuring good contact of the element with the receptor substrate, then selectively heating the thermal release tape using a local heat source (fig. 2e), causing the heated part to lose its adhesiveness, and finally tearing the thermal release tape, and selectively printing the element on the receptor substrate (fig. 2 f).
As an example, but not limiting the scope of the invention, fig. 3 is a schematic diagram of the roll-to-roll and roll-to-roll transfer proposed in the present invention, and the roll form transfer technique can achieve continuous transfer, enabling further improvement in throughput and speed. The elements are transferred from the donor substrate to the thermal release tape by means of a roll-to-roll (fig. 3a) or a roll-to-roll (fig. 3b), followed by patterned heating of the thermal release tape with a localized heat source (fig. 3c), and finally the heated part of the element is transferred to the receiver substrate by means of a roll-to-roll (fig. 3d) or a roll-to-roll (fig. 3 e).
Fig. 3a shows a schematic diagram of a roll-to-roll sheet pick-up process, suitable for rigid donor substrates. In the process of picking up the coiling plate, the thermal release adhesive tape is wound on the roller, and the rigid donor substrate is driven to horizontally move and the thermal release adhesive tape is driven to continuously move by the rotation of the roller. The extrusion between the roller pairs applies pressure to the contact position of the heat release adhesive tape and the element to ensure the element to be fully contacted with the heat release adhesive tape, and after the roller pairs are wound out, the element is transferred to the heat release adhesive tape due to the strong adhesion of the adhesive tape.
Figure 3b shows a roll-to-roll pick-up suitable for flexible donor substrates. In the roll-to-roll picking process, the heat release adhesive tape and the donor substrate are wound on the roller and are driven to move continuously by the rotation of the roller. The extrusion between the roller pairs applies pressure to the contact position of the heat release adhesive tape and the element to ensure the element to be fully contacted with the heat release adhesive tape, and after the roller pairs are wound out, the element is transferred to the heat release adhesive tape due to the strong adhesion of the adhesive tape.
Figure 3d shows a roll-to-roll printing scheme suitable for rigid receptor substrates. The heat release adhesive tape is wound on the roller, and the roller rotates to drive the heat release adhesive tape and the receptor substrate to move continuously. The extrusion between the roller pairs applies pressure to the contact position of the heat release adhesive tape and the element to ensure the element to be fully contacted with the heat release adhesive tape, and after the roller is wound out, the element at the position of the heat release adhesive tape, which loses viscosity due to heating, is transferred to the base of the receptor, thereby realizing selective printing.
Figure 3e illustrates roll-to-roll printing for a flexible receptor substrate. The heat release adhesive tape and the flexible receiving main substrate are wound on the roller and driven to move continuously by the rotation of the roller. The extrusion between the roller pairs applies pressure to the contact position of the heat release adhesive tape and the element to ensure the element to be fully contacted with the heat release adhesive tape, and after the roller is wound out, the element at the position of the heat release adhesive tape, which loses viscosity due to heating, is transferred to the base of the receptor, thereby realizing selective printing.
As an example, but not limiting the scope of the invention, fig. 4 is a schematic diagram of the laser combined with the galvanometer field lens proposed in the present invention to achieve selective heating. After being reflected by a two-dimensional vibrating mirror system, laser is focused on a heat release adhesive tape with an element or an adhesive tape/element interface by a field lens, and the heat release adhesive tape is subjected to ultrahigh-speed selective heating through deflection of the vibrating mirror.
Preferably, the deflection of the galvanometer and the laser switch are controlled synchronously through a program, and the programming of any heating pattern is realized.
As an example, but not limiting the scope of the invention, fig. 5 is a schematic illustration of the laser combined with the displacement stage proposed in the present invention to achieve selective heating. The laser is arranged on a high-precision two-dimensional displacement platform, is focused on the thermal release adhesive tape with the element or the interface of the adhesive tape/the element, and selectively heats the thermal release adhesive tape by means of the movement of the displacement platform.
Preferably, the movement of the displacement platform and the switch of the laser are synchronously controlled by a program, so that the programming of any heating pattern is realized.
As an example, but not limiting the scope of the invention, fig. 6 is an implementation of reducing the laser scan dimension in transfer using roll form as proposed in the present invention. The gyro wheel drives the removal of heat release sticky tape, provides the displacement control of a dimension, and correspondingly, the scanning of a dimension only need be realized to the laser to reduce the use of high accuracy displacement platform and galvanometer in addition.
As an example, but not limiting the scope of the invention, fig. 7 is a schematic diagram of a parallel heated light source mask as proposed in the present invention to achieve programmable patterned heating. After the parallel heating light source passes through the mask plate, the selective heating of the heat release adhesive tape is realized.
As an example, but not limiting the scope of the invention, fig. 8 is a schematic diagram of a micro-heater array as proposed in the present invention to implement programmable patterned heating. The heat release adhesive tape is placed on the micro-heater array, and the heat release adhesive tape is selectively heated by selectively electrifying the heaters in the micro-heater array.
Claims (6)
1. A high-speed high-resolution selective transfer printing method is characterized in that the method is realized by adopting a heat release adhesive tape and a high-resolution local heat source; the specific method comprises the following steps: contacting the element on the donor substrate with a thermal release tape, and picking up the element from the donor substrate by means of strong adhesion of the thermal release tape to the element; selectively heating the element-adhered thermal release tape using a high resolution local heat source, the heated portion of the tape losing tackiness; selectively printing elements from the thermal release tape onto the receptor substrate is achieved by contacting the thermal release tape with the receptor substrate.
2. A high speed, high resolution selective transfer printing method according to claim 1, wherein when the donor substrate and the recipient substrate are rigid or flexible substrates, both said pick-up and printing processes can be performed in batch mode.
3. A high speed high resolution selective transfer printing method according to claim 1 wherein when the donor substrate is a rigid substrate, said picking up is performed in roll-to-roll format; when the donor substrate is a flexible substrate, the picking up process is performed in a roll-to-roll format.
4. A high speed, high resolution selective transfer printing method according to claim 1, wherein when the receiver substrate is a rigid substrate, said printing process is performed in a roll-to-roll format; when the receptor substrate is a flexible substrate, the printing process is realized in a roll-to-roll manner.
5. The high speed high resolution selective transfer printing method of claim 1, wherein the high resolution local heat source selective heating thermal release tape is implemented by high spatial resolution laser beam in combination with galvanometer field lens scanning.
6. The high speed high resolution selective transfer printing method according to claim 1, wherein the high resolution local heat source selective heating thermal release tape is implemented by using high spatial resolution laser beam in combination with a displacement stage, or parallel light source mask heating or micro-heater array heating.
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| CN201810731559.XA CN108944110B (en) | 2018-07-05 | 2018-07-05 | High speed high resolution selective transfer printing process |
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| CN201810731559.XA CN108944110B (en) | 2018-07-05 | 2018-07-05 | High speed high resolution selective transfer printing process |
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| CN108944110B true CN108944110B (en) | 2020-02-07 |
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| CN112992722B (en) * | 2020-07-27 | 2023-04-25 | 重庆康佳光电技术研究院有限公司 | Adapter plate, mass transfer method and Micro-LED display |
| CN113097119A (en) * | 2021-03-08 | 2021-07-09 | 浙江清华柔性电子技术研究院 | Device and method for peeling element |
| CN113264499A (en) * | 2021-04-09 | 2021-08-17 | 东南大学 | Micro-nano substrate transfer printing method based on water-soluble polyacrylic acid |
| CN114496744B (en) * | 2022-01-25 | 2023-07-28 | 武汉大学 | Diamond film transfer device and transfer process, and indirect prestretching-based diamond film strain device and construction method |
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| JP2847450B2 (en) * | 1991-12-30 | 1999-01-20 | 三英ケミカル株式会社 | Thermal transfer applique and method for producing the same |
| JP2002337370A (en) * | 2001-05-17 | 2002-11-27 | Fuji Photo Film Co Ltd | Laser thermal transfer recording method and image receiving sheet |
| DE10246425A1 (en) * | 2002-10-04 | 2004-04-15 | Technische Universität Braunschweig | Microstructuring by location-selective sublimation of low-molecular emission material to make organic electroluminescence components, employs film carrier in vacuum deposition process |
| KR100635579B1 (en) * | 2004-12-20 | 2006-10-17 | 삼성에스디아이 주식회사 | laser induced thermal imaging apparatus, laser induced thermal imaging method using the apparatus and fabrication method of OLED using the apparatus |
| WO2013010113A1 (en) * | 2011-07-14 | 2013-01-17 | The Board Of Trustees Of The University Of Illinois | Non-contact transfer printing |
| CN106744660A (en) * | 2016-12-26 | 2017-05-31 | 电子科技大学 | A kind of preparation method of stretchable flexible electronic device |
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